AU2001294204A1 - Copper electroplating using insoluble anode - Google Patents

Copper electroplating using insoluble anode

Info

Publication number
AU2001294204A1
AU2001294204A1 AU2001294204A AU9420401A AU2001294204A1 AU 2001294204 A1 AU2001294204 A1 AU 2001294204A1 AU 2001294204 A AU2001294204 A AU 2001294204A AU 9420401 A AU9420401 A AU 9420401A AU 2001294204 A1 AU2001294204 A1 AU 2001294204A1
Authority
AU
Australia
Prior art keywords
copper electroplating
insoluble anode
insoluble
anode
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001294204A
Inventor
Masaru Kusaka
Masaru Seita
Hideki Tsuchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LeaRonal Japan Inc
Original Assignee
LeaRonal Japan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LeaRonal Japan Inc filed Critical LeaRonal Japan Inc
Publication of AU2001294204A1 publication Critical patent/AU2001294204A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/8305—Miscellaneous [e.g., treated surfaces, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
AU2001294204A 2000-10-10 2001-10-09 Copper electroplating using insoluble anode Abandoned AU2001294204A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-309456 2000-10-10
JP2000309456 2000-10-10
PCT/JP2001/008853 WO2002031228A1 (en) 2000-10-10 2001-10-09 Copper electroplating using insoluble anode

Publications (1)

Publication Number Publication Date
AU2001294204A1 true AU2001294204A1 (en) 2002-04-22

Family

ID=18789611

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001294204A Abandoned AU2001294204A1 (en) 2000-10-10 2001-10-09 Copper electroplating using insoluble anode

Country Status (8)

Country Link
US (1) US20040050706A1 (en)
EP (1) EP1325972A4 (en)
JP (1) JPWO2002031228A1 (en)
KR (1) KR20030055278A (en)
CN (1) CN1469940A (en)
AU (1) AU2001294204A1 (en)
TW (1) TWI264481B (en)
WO (1) WO2002031228A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040101665A1 (en) * 2001-02-14 2004-05-27 Shipley Company, L.L.C. Direct patterning method
US20040253450A1 (en) * 2001-05-24 2004-12-16 Shipley Company, L.L.C. Formaldehyde-free electroless copper plating process and solution for use in the process
JP4510369B2 (en) * 2002-11-28 2010-07-21 日本リーロナール有限会社 Electrolytic copper plating method
US20040118691A1 (en) * 2002-12-23 2004-06-24 Shipley Company, L.L.C. Electroplating method
US20050072683A1 (en) * 2003-04-03 2005-04-07 Ebara Corporation Copper plating bath and plating method
JP2006294725A (en) * 2005-04-07 2006-10-26 Fujikura Ltd Wiring board, multilayered wiring board, and manufacturing method of these
KR20130108978A (en) * 2010-06-11 2013-10-07 알쉬메 Copper-electroplating composition and process for filling a cavity in a semiconductor substrate using this composition
JP5851233B2 (en) 2011-12-22 2016-02-03 ローム・アンド・ハース電子材料株式会社 Electrolytic copper plating solution and electrolytic copper plating method
JP5843606B2 (en) * 2011-12-27 2016-01-13 ローム・アンド・ハース電子材料株式会社 Electrolytic copper plating solution and electrolytic copper plating method
JP5952093B2 (en) * 2012-05-31 2016-07-13 ローム・アンド・ハース電子材料株式会社 Electrolytic copper plating solution and electrolytic copper plating method
JP6031319B2 (en) * 2012-10-04 2016-11-24 ローム・アンド・ハース電子材料株式会社 Electrolytic copper plating solution and electrolytic copper plating method
CN103320820B (en) * 2013-06-18 2015-08-19 河南江河机械有限责任公司 Acid bright copper plating electroplating technology

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
JPH0452296A (en) * 1990-06-20 1992-02-20 Permelec Electrode Ltd Copper plating method
JPH07316875A (en) * 1994-05-23 1995-12-05 C Uyemura & Co Ltd Additive for copper electroplating and copper electroplating bath
BR0007639A (en) * 1999-01-21 2001-11-06 Atotech Deutschland Gmbh Process for galvanic formation of conductive structures of high purity copper in the production of integrated circuits
JP4394234B2 (en) * 2000-01-20 2010-01-06 日鉱金属株式会社 Copper electroplating solution and copper electroplating method
KR100877923B1 (en) * 2001-06-07 2009-01-12 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 Electrolytic copper plating method
JP6101616B2 (en) * 2013-10-04 2017-03-22 株式会社日立産機システム Transformer

Also Published As

Publication number Publication date
KR20030055278A (en) 2003-07-02
US20040050706A1 (en) 2004-03-18
EP1325972A1 (en) 2003-07-09
WO2002031228A1 (en) 2002-04-18
JPWO2002031228A1 (en) 2004-02-19
TWI264481B (en) 2006-10-21
EP1325972A4 (en) 2007-01-24
CN1469940A (en) 2004-01-21

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