EP1069211A3 - Electroplating solutions - Google Patents

Electroplating solutions Download PDF

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Publication number
EP1069211A3
EP1069211A3 EP00305941A EP00305941A EP1069211A3 EP 1069211 A3 EP1069211 A3 EP 1069211A3 EP 00305941 A EP00305941 A EP 00305941A EP 00305941 A EP00305941 A EP 00305941A EP 1069211 A3 EP1069211 A3 EP 1069211A3
Authority
EP
European Patent Office
Prior art keywords
compound
acid
electroplating solutions
organic
leveller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00305941A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1069211A2 (en
Inventor
Qing Min Wang
Weiji Huang
Miu Ling Lau
Carol Hsiuchin Liu
Ce Ma
Edward K. Chang
Wenpin Ho
Richard C. Paciej
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linde LLC
Original Assignee
BOC Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOC Group Inc filed Critical BOC Group Inc
Publication of EP1069211A2 publication Critical patent/EP1069211A2/en
Publication of EP1069211A3 publication Critical patent/EP1069211A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
EP00305941A 1999-07-15 2000-07-13 Electroplating solutions Withdrawn EP1069211A3 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14415999P 1999-07-15 1999-07-15
US144159P 1999-07-15
US58359900A 2000-05-31 2000-05-31
US583599 2000-05-31

Publications (2)

Publication Number Publication Date
EP1069211A2 EP1069211A2 (en) 2001-01-17
EP1069211A3 true EP1069211A3 (en) 2003-12-17

Family

ID=26841728

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00305941A Withdrawn EP1069211A3 (en) 1999-07-15 2000-07-13 Electroplating solutions

Country Status (4)

Country Link
US (1) US20040187731A1 (ja)
EP (1) EP1069211A3 (ja)
JP (1) JP2001073182A (ja)
KR (1) KR20010015342A (ja)

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KR20020092444A (ko) * 2001-02-23 2002-12-11 가부시키 가이샤 에바라 세이사꾸쇼 구리-도금 용액, 도금 방법 및 도금 장치
JP4793530B2 (ja) * 2001-07-02 2011-10-12 上村工業株式会社 硫酸銅めっき浴
US6736954B2 (en) * 2001-10-02 2004-05-18 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
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JP3789107B2 (ja) * 2002-07-23 2006-06-21 株式会社日鉱マテリアルズ 特定骨格を有するアミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
JP4115240B2 (ja) * 2002-10-21 2008-07-09 日鉱金属株式会社 特定骨格を有する四級アミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
JP4534460B2 (ja) * 2002-11-11 2010-09-01 凸版印刷株式会社 銅めっき硬度維持剤及び銅めっき方法並びにそれを用いたグラビア版、レンズ金型
JP4510369B2 (ja) 2002-11-28 2010-07-21 日本リーロナール有限会社 電解銅めっき方法
WO2004059040A1 (ja) * 2002-12-25 2004-07-15 Nikko Materials Co., Ltd. 特定骨格を有する四級アミン化合物重合体及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
EP1477588A1 (en) * 2003-02-19 2004-11-17 Rohm and Haas Electronic Materials, L.L.C. Copper Electroplating composition for wafers
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JP4976725B2 (ja) * 2005-03-31 2012-07-18 三井金属鉱業株式会社 銅電解液及びその銅電解液を用いた電析銅皮膜の形成方法
US7662981B2 (en) 2005-07-16 2010-02-16 Rohm And Haas Electronic Materials Llc Leveler compounds
TWI328622B (en) * 2005-09-30 2010-08-11 Rohm & Haas Elect Mat Leveler compounds
JP2007146289A (ja) * 2005-10-31 2007-06-14 Mitsui Mining & Smelting Co Ltd 電解銅箔の製造方法、該製造方法で得られる電解銅箔、該電解銅箔を用いて得られる表面処理銅箔及び該電解銅箔又は該表面処理銅箔を用いて得られる銅張積層板
JP4816901B2 (ja) * 2005-11-21 2011-11-16 上村工業株式会社 電気銅めっき浴
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JP4895734B2 (ja) * 2006-09-08 2012-03-14 荏原ユージライト株式会社 めっき用レベリング剤、酸性銅めっき浴用添加剤組成物、酸性銅めっき浴および該めっき浴を用いるめっき方法
CN101517131B (zh) * 2006-10-03 2011-02-16 三井金属矿业株式会社 硫酸酸性铜电解液制备方法及使用该制备方法制备的硫酸酸性铜电解液及电析铜薄膜
JP2008088524A (ja) * 2006-10-04 2008-04-17 Ebara Udylite Kk プリント基板用硫酸銅めっき液
US20080181813A1 (en) * 2007-01-26 2008-07-31 Baker Hughes Incorporated Novel Mercaptan-Based Corrosion Inhibitors
EP2161355A4 (en) * 2007-05-21 2012-01-25 Uyemura C & Co Ltd ELECTROLYTIC COPPER BATH
US20090188805A1 (en) * 2008-01-25 2009-07-30 Government Of The United States Of America, As Represented By The Superconformal electrodeposition of nickel iron and cobalt magnetic alloys
ES2624637T3 (es) * 2008-05-30 2017-07-17 Atotech Deutschland Gmbh Aditivo de electrogalvanoplastia para la deposición de una aleación de un metal del grupo IB/binaria o ternaria del grupo IB-grupo IIIA/ternaria, cuaternaria o quinaria del grupo IB, el grupo IIIA-grupo VIA
JP5525762B2 (ja) * 2008-07-01 2014-06-18 上村工業株式会社 無電解めっき液及びそれを用いた無電解めっき方法、並びに配線基板の製造方法
US8388824B2 (en) 2008-11-26 2013-03-05 Enthone Inc. Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
EP2199315B1 (en) 2008-12-19 2013-12-11 Basf Se Composition for metal electroplating comprising leveling agent
JP5578697B2 (ja) * 2009-04-03 2014-08-27 公立大学法人大阪府立大学 銅充填方法
JP5568250B2 (ja) * 2009-05-18 2014-08-06 公立大学法人大阪府立大学 銅を充填する方法
EP2504396B1 (en) 2009-11-27 2021-02-24 Basf Se Composition for copper electroplating comprising leveling agent
US9834677B2 (en) 2010-03-18 2017-12-05 Basf Se Composition for metal electroplating comprising leveling agent
TWI572750B (zh) 2010-05-24 2017-03-01 安頌股份有限公司 直通矽穿孔之銅充填
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EP2537962A1 (en) * 2011-06-22 2012-12-26 Atotech Deutschland GmbH Method for copper plating
EP2735627A1 (en) 2012-11-26 2014-05-28 ATOTECH Deutschland GmbH Copper plating bath composition
US20140238868A1 (en) * 2013-02-25 2014-08-28 Dow Global Technologies Llc Electroplating bath
CN103469260A (zh) * 2013-09-27 2013-12-25 昆山纯柏精密五金有限公司 一种五金件的酸性镀铜的方法
EP2865787A1 (en) * 2013-10-22 2015-04-29 ATOTECH Deutschland GmbH Copper electroplating method
KR102312018B1 (ko) * 2013-12-09 2021-10-13 아베니 전기화학적 불활성 양이온을 함유하는 구리 전착 배쓰
TWI710671B (zh) * 2014-09-15 2020-11-21 美商麥德美樂思公司 微電子技術中銅沈積用之平整劑
US10450667B2 (en) 2014-10-27 2019-10-22 International Business Machines Corporation System for treating solution for use in electroplating application and method for treating solution for use in electroplating application
TWI689630B (zh) 2014-11-05 2020-04-01 美商康寧公司 底部向上電解質通孔鍍覆方法
US9783905B2 (en) 2014-12-30 2017-10-10 Rohm and Haas Electronic Mateirals LLC Reaction products of amino acids and epoxies
US9725816B2 (en) 2014-12-30 2017-08-08 Rohm And Haas Electronic Materials Llc Amino sulfonic acid based polymers for copper electroplating
US9611560B2 (en) 2014-12-30 2017-04-04 Rohm And Haas Electronic Materials Llc Sulfonamide based polymers for copper electroplating
CN107771227B (zh) 2015-04-20 2019-04-02 埃托特克德国有限公司 电解铜镀液组合物及其用法
CN107636209B (zh) * 2015-06-26 2021-07-02 住友金属矿山股份有限公司 导电性基板
EP3135709B1 (en) 2015-08-31 2018-01-10 ATOTECH Deutschland GmbH Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
EP3344800B1 (en) 2015-08-31 2019-03-13 ATOTECH Deutschland GmbH Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate
CN105239109A (zh) * 2015-10-28 2016-01-13 福州瑞华印制线路板有限公司 一种哈林槽镀铜方法
CN105200467B (zh) * 2015-11-02 2019-01-29 江苏梦得新材料科技有限公司 一种凹版硬铜添加剂及镀液
WO2017090161A1 (ja) * 2015-11-26 2017-06-01 近藤　和夫 酸性銅めっき液、酸性銅めっき物および半導体デバイスの製造方法
EP3360988B1 (en) 2017-02-09 2019-06-26 ATOTECH Deutschland GmbH Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
PT3508620T (pt) 2018-01-09 2021-07-12 Atotech Deutschland Gmbh Aditivo de ureileno, a sua utilização e um método de preparação para esse fim
US10917966B2 (en) 2018-01-29 2021-02-09 Corning Incorporated Articles including metallized vias
JP6645609B2 (ja) 2018-07-27 2020-02-14 三菱マテリアル株式会社 錫合金めっき液
CN112236548B (zh) * 2018-07-27 2022-03-04 三菱综合材料株式会社 锡合金镀液
US11746433B2 (en) 2019-11-05 2023-09-05 Macdermid Enthone Inc. Single step electrolytic method of filling through holes in printed circuit boards and other substrates
CN110938848B (zh) * 2019-12-26 2021-05-11 江苏艾森半导体材料股份有限公司 一种用于电解沉积铜的组合物及酸铜电镀液
EP3933073B1 (en) 2020-06-29 2023-11-29 Atotech Deutschland GmbH & Co. KG Copper electroplating bath
CN112144083B (zh) * 2020-09-22 2021-12-10 广州三孚新材料科技股份有限公司 一种太阳能电池用无氰镀铜电镀液及制备方法
WO2022158277A1 (ja) * 2021-01-20 2022-07-28 富士フイルム株式会社 めっき液、および、金属充填構造体の製造方法
EP4032930B1 (en) 2021-01-22 2023-08-30 Atotech Deutschland GmbH & Co. KG Biuret-based quaternized polymers and their use in metal or metal alloy plating baths
CN113430598B (zh) * 2021-08-27 2021-11-16 深圳市板明科技股份有限公司 一种线路板盲孔填充电镀铜溶液及其应用
CN113956479B (zh) * 2021-11-26 2022-12-02 电子科技大学 电镀铜加速剂及合成方法和应用
CN116751362B (zh) * 2023-08-21 2024-01-09 广东腐蚀科学与技术创新研究院 一种水溶性二胺基脲聚合物及其制备方法和应用

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Also Published As

Publication number Publication date
KR20010015342A (ko) 2001-02-26
EP1069211A2 (en) 2001-01-17
JP2001073182A (ja) 2001-03-21
US20040187731A1 (en) 2004-09-30

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