KR102801350B1 - 디스플레이용 발광 다이오드 및 이를 갖는 디스플레이 장치 - Google Patents

디스플레이용 발광 다이오드 및 이를 갖는 디스플레이 장치 Download PDF

Info

Publication number
KR102801350B1
KR102801350B1 KR1020207015646A KR20207015646A KR102801350B1 KR 102801350 B1 KR102801350 B1 KR 102801350B1 KR 1020207015646 A KR1020207015646 A KR 1020207015646A KR 20207015646 A KR20207015646 A KR 20207015646A KR 102801350 B1 KR102801350 B1 KR 102801350B1
Authority
KR
South Korea
Prior art keywords
led stack
light
stack
type semiconductor
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020207015646A
Other languages
English (en)
Korean (ko)
Other versions
KR20200087174A (ko
Inventor
채종현
김창연
이정훈
이호준
장성규
조대성
Original Assignee
서울바이오시스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 서울바이오시스 주식회사 filed Critical 서울바이오시스 주식회사
Publication of KR20200087174A publication Critical patent/KR20200087174A/ko
Application granted granted Critical
Publication of KR102801350B1 publication Critical patent/KR102801350B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0756Stacked arrangements of devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H10H20/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018Bonding of wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/832Electrodes characterised by their material
    • H10H20/835Reflective materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142Two-dimensional arrangements, e.g. asymmetric LED layout
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
KR1020207015646A 2017-11-27 2018-11-27 디스플레이용 발광 다이오드 및 이를 갖는 디스플레이 장치 Active KR102801350B1 (ko)

Applications Claiming Priority (17)

Application Number Priority Date Filing Date Title
US201762590830P 2017-11-27 2017-11-27
US62/590,830 2017-11-27
US201762595415P 2017-12-06 2017-12-06
US62/595,415 2017-12-06
US201762597614P 2017-12-12 2017-12-12
US62/597,614 2017-12-12
US201762598223P 2017-12-13 2017-12-13
US62/598,223 2017-12-13
US201862621492P 2018-01-24 2018-01-24
US62/621,492 2018-01-24
US201862624639P 2018-01-31 2018-01-31
US201862624667P 2018-01-31 2018-01-31
US62/624,639 2018-01-31
US62/624,667 2018-01-31
US16/200,036 2018-11-26
US16/200,036 US12100696B2 (en) 2017-11-27 2018-11-26 Light emitting diode for display and display apparatus having the same
PCT/KR2018/014672 WO2019103567A1 (en) 2017-11-27 2018-11-27 Light emitting diode for display and display apparatus having the same

Publications (2)

Publication Number Publication Date
KR20200087174A KR20200087174A (ko) 2020-07-20
KR102801350B1 true KR102801350B1 (ko) 2025-05-02

Family

ID=66630735

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207015646A Active KR102801350B1 (ko) 2017-11-27 2018-11-27 디스플레이용 발광 다이오드 및 이를 갖는 디스플레이 장치

Country Status (7)

Country Link
US (4) US12100696B2 (enExample)
EP (1) EP3718141A4 (enExample)
JP (2) JP2021504959A (enExample)
KR (1) KR102801350B1 (enExample)
CN (7) CN110993592A (enExample)
SA (1) SA520412044B1 (enExample)
WO (1) WO2019103567A1 (enExample)

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI672466B (zh) * 2018-04-11 2019-09-21 台灣愛司帝科技股份有限公司 微型發光二極體顯示器及其製作方法
US10879419B2 (en) 2018-08-17 2020-12-29 Seoul Viosys Co., Ltd. Light emitting device
JP7009627B2 (ja) * 2018-11-13 2022-01-25 廈門市三安光電科技有限公司 発光ダイオード
WO2020100298A1 (ja) * 2018-11-16 2020-05-22 堺ディスプレイプロダクト株式会社 マイクロledデバイスおよびその製造方法
WO2020100299A1 (ja) * 2018-11-16 2020-05-22 堺ディスプレイプロダクト株式会社 マイクロledデバイスおよびその製造方法
KR102694329B1 (ko) * 2018-12-10 2024-08-13 삼성전자주식회사 디스플레이 모듈, 이를 포함하는 디스플레이 장치 및 디스플레이 모듈 제조 방법
US11450648B2 (en) * 2019-03-19 2022-09-20 Seoul Viosys Co., Ltd. Light emitting device package and application thereof
KR20220024710A (ko) 2019-06-19 2022-03-03 제이드 버드 디스플레이(상하이) 리미티드 다색 led 픽셀 유닛을 위한 시스템들 및 방법들
EP4465355A3 (en) * 2019-06-19 2025-03-19 Jade Bird Display (Shanghai) Limited Systems and methods for coaxial multi-color led
US10971650B2 (en) * 2019-07-29 2021-04-06 Lextar Electronics Corporation Light emitting device
GB2586580B (en) * 2019-08-06 2022-01-12 Plessey Semiconductors Ltd LED array and method of forming a LED array
TWI891064B (zh) * 2019-08-22 2025-07-21 晶元光電股份有限公司 發光裝置、其製造方法及顯示模組
DE102019122945A1 (de) * 2019-08-27 2021-03-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterchip und verfahren zur herstellung eines halbleiterchips
US11114419B2 (en) * 2019-09-11 2021-09-07 Jade Bird Display (shanghai) Limited Multi-color LED pixel unit and micro-LED display panel
US10930814B1 (en) * 2019-09-11 2021-02-23 Jade Bird Display (shanghai) Limited Method of manufacturing multi-color light emitting pixel unit
US12426428B2 (en) * 2019-09-11 2025-09-23 Jade Bird Display (shanghai) Limited Multi-color LED pixel unit and micro-LED display panel
US11398462B2 (en) * 2019-09-18 2022-07-26 Seoul Viosys Co., Ltd. Light emitting device for display and light emitting package having the same
US11670666B2 (en) * 2019-10-08 2023-06-06 Luminus, Inc. Light-emitting systems with close-packed LEDs and/or electrically isolated substrates and methods of making and/or operating the same
US11038088B2 (en) 2019-10-14 2021-06-15 Lextar Electronics Corporation Light emitting diode package
CN114600240A (zh) * 2019-10-28 2022-06-07 首尔伟傲世有限公司 显示用发光元件及具有其的led显示装置
US11658275B2 (en) * 2019-10-28 2023-05-23 Seoul Viosys Co., Ltd. Light emitting device for display and LED display apparatus having the same
CN110767670B (zh) * 2019-10-31 2022-11-15 成都辰显光电有限公司 显示面板、显示装置和显示面板的制作方法
CN211700319U (zh) * 2019-12-23 2020-10-16 天津三安光电有限公司 一种半导体发光元件
US20210193866A1 (en) * 2019-12-24 2021-06-24 Mikro Mesa Technology Co., Ltd. Method of forming display device with light-emitting diode
KR102767559B1 (ko) * 2019-12-26 2025-02-12 엘지디스플레이 주식회사 Led 표시장치 및 이의 제조방법
WO2021177591A1 (ko) * 2020-03-03 2021-09-10 한국과학기술원 저전류 영역에서의 효율 증대 마이크로 발광 다이오드 소자와 그의 제조 방법 및 그를 포함하는 디스플레이
CN121078879A (zh) * 2020-03-30 2025-12-05 上海显耀显示科技有限公司 用于具有键合结构的led的系统和方法
EP4143894A4 (en) * 2020-04-30 2024-07-24 Lumileds LLC COLORED LEDS WITH INTEGRATED OPTICAL FILTER ELEMENTS
JP2021179492A (ja) * 2020-05-12 2021-11-18 セイコーエプソン株式会社 電気光学装置および電子機器
JP2021179495A (ja) 2020-05-12 2021-11-18 セイコーエプソン株式会社 電気光学装置および電子機器
KR102871447B1 (ko) 2020-05-25 2025-10-14 삼성전자주식회사 발광 소자를 포함하는 광원 모듈
US11476299B2 (en) * 2020-08-31 2022-10-18 Hong Kong Beida Jade Bird Display Limited Double color micro LED display panel
US11738505B2 (en) * 2020-10-29 2023-08-29 Seurat Technologies, Inc. Large area arrayed light valves
US11631786B2 (en) * 2020-11-12 2023-04-18 Lumileds Llc III-nitride multi-wavelength LED arrays with etch stop layer
US20220181516A1 (en) * 2020-12-04 2022-06-09 Seoul Viosys Co., Ltd. Mixed color light emitting device
KR20220083939A (ko) * 2020-12-11 2022-06-21 삼성디스플레이 주식회사 발광 소자, 발광 소자의 제조 방법, 및 이를 포함하는 표시 장치
US11469345B2 (en) * 2021-01-21 2022-10-11 Excellence Opto. Inc. Vertical light emitting diode structure with high current dispersion and high reliability
KR20230153990A (ko) * 2021-03-10 2023-11-07 보에 테크놀로지 그룹 컴퍼니 리미티드 어레이 기판, 발광 기판 및 디스플레이 장치
WO2022265283A1 (ko) * 2021-06-18 2022-12-22 조대성 발광 디바이스 및 이를 이용한 발광 모듈
CN113990997A (zh) * 2021-10-09 2022-01-28 武汉华星光电半导体显示技术有限公司 一种显示面板及其制备方法
TWI774600B (zh) * 2021-11-02 2022-08-11 國立陽明交通大學 微發光二極體陣列裝置的製法及其製品
CN114093905A (zh) * 2021-11-18 2022-02-25 安徽熙泰智能科技有限公司 一种叠层Micro LED全彩显示器件及其制备方法
JP7397348B2 (ja) * 2021-11-22 2023-12-13 日亜化学工業株式会社 発光素子
CN116979000A (zh) * 2021-11-23 2023-10-31 厦门市三安光电科技有限公司 一种发光二极管芯片及发光装置
CN116190361A (zh) * 2021-11-29 2023-05-30 厦门市芯颖显示科技有限公司 白光发光器件和彩色显示装置
US12062746B2 (en) * 2022-01-18 2024-08-13 Excellence Opto. Inc. Small-sized vertical light emitting diode chip with high energy efficiency
KR102599275B1 (ko) * 2022-01-25 2023-11-07 주식회사 썬다이오드코리아 수직 적층 구조를 가지는 마이크로 디스플레이의 화소
US12155010B2 (en) * 2022-02-15 2024-11-26 Excellence Opto. Inc. Small-size vertical-type light emitting diode chip with high luminous in central region
US20230369304A1 (en) * 2022-05-11 2023-11-16 Seoul Viosys Co., Ltd. Pixel device and display apparatus having the same
KR102676345B1 (ko) * 2022-06-07 2024-06-18 한국광기술원 Tco 투명 접합을 이용한 다중 접합 다이오드 제조 방법
TWI853605B (zh) * 2022-06-24 2024-08-21 美商亮銳公司 色彩可調式像素之緊湊陣列
TWI847767B (zh) * 2022-06-24 2024-07-01 美商亮銳公司 發光二極體晶粒及其製造方法
TWI819712B (zh) * 2022-07-18 2023-10-21 友達光電股份有限公司 微型發光二極體顯示裝置
CN115274945B (zh) * 2022-09-30 2022-12-23 江西兆驰半导体有限公司 一种Micro-LED芯片封装方法
US20240113150A1 (en) * 2022-09-30 2024-04-04 Seoul Viosys Co., Ltd. Light emitting device and light emitting module having the same
TWI819863B (zh) * 2022-10-26 2023-10-21 友達光電股份有限公司 顯示面板
KR20250130190A (ko) * 2022-12-23 2025-09-01 제이드 버드 디스플레이(상하이) 리미티드 마이크로 led 구조 및 풀 컬러 마이크로 led 패널
KR102784965B1 (ko) * 2023-02-09 2025-03-25 한국광기술원 픽셀화된 미세 led 램프 및 그의 제조방법
WO2024192637A1 (zh) * 2023-03-20 2024-09-26 京东方科技集团股份有限公司 发光二极管及制备方法、发光基板、背光模组和显示装置
WO2024206354A1 (en) * 2023-03-29 2024-10-03 Vixar, Inc. Multi wavelength diode device
CN116564947A (zh) * 2023-07-07 2023-08-08 南昌凯捷半导体科技有限公司 一种纵列全彩显示Micro-LED芯片及其制作方法
JP7695975B2 (ja) * 2023-08-10 2025-06-19 Dowaエレクトロニクス株式会社 光半導体素子およびその製造方法
KR102852314B1 (ko) * 2023-11-07 2025-08-29 한국광기술원 다중 직렬 접합구조를 가져 광 특성을 향상시킨 질화갈륨 발광다이오드 및 그의 제조방법
DE102023132870A1 (de) * 2023-11-24 2025-05-28 Ams-Osram International Gmbh Optoelektronisches bauelement und verfahren
WO2025179513A1 (zh) * 2024-02-29 2025-09-04 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置
EP4626188A1 (en) * 2024-03-27 2025-10-01 Nichia Corporation Light source, light-emitting module, and mobile terminal

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197968A (ja) * 2001-12-18 2003-07-11 Shuko Cho 透明導電層及び反射層で直接結合されたチップの積み重ねによるフルカラー発光ダイオード光源のパッケージ構造
US20090078955A1 (en) * 2007-09-26 2009-03-26 Iii-N Technlogy, Inc Micro-Emitter Array Based Full-Color Micro-Display
US20150325555A1 (en) * 2013-03-07 2015-11-12 Kabushiki Kaisha Toshiba Semiconductor light emitting element and method for manufacturing the same

Family Cites Families (238)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0710003B2 (ja) 1988-03-11 1995-02-01 信越半導体株式会社 混色発光半導体素子
US5268590A (en) * 1989-12-27 1993-12-07 Motorola, Inc. CMOS device and process
JP3259931B2 (ja) 1992-04-17 2002-02-25 シャープ株式会社 半導体発光素子および半導体表示装置
JPH07254732A (ja) 1994-03-15 1995-10-03 Toshiba Corp 半導体発光装置
JP3620877B2 (ja) 1994-09-16 2005-02-16 豊田合成株式会社 3族窒化物半導体平面発光素子
JPH0884407A (ja) 1994-09-12 1996-03-26 Nissin Electric Co Ltd スイッチギヤの扉開閉装置
JPH08213657A (ja) 1994-10-24 1996-08-20 Mitsubishi Electric Corp 可視光led装置,及びその製造方法
FR2726126A1 (fr) * 1994-10-24 1996-04-26 Mitsubishi Electric Corp Procede de fabrication de dispositifs a diodes electroluminescentes a lumiere visible
US5707745A (en) 1994-12-13 1998-01-13 The Trustees Of Princeton University Multicolor organic light emitting devices
US5703436A (en) 1994-12-13 1997-12-30 The Trustees Of Princeton University Transparent contacts for organic devices
JPH08274376A (ja) 1995-03-15 1996-10-18 Texas Instr Inc <Ti> シリコンに格子整合したiii−v化合物半導体エミッター
US5583350A (en) 1995-11-02 1996-12-10 Motorola Full color light emitting diode display assembly
US5583349A (en) 1995-11-02 1996-12-10 Motorola Full color light emitting diode display
US6046543A (en) 1996-12-23 2000-04-04 The Trustees Of Princeton University High reliability, high efficiency, integratable organic light emitting devices and methods of producing same
KR100298205B1 (ko) 1998-05-21 2001-08-07 오길록 고집적삼색발광소자및그제조방법
US6459100B1 (en) 1998-09-16 2002-10-01 Cree, Inc. Vertical geometry ingan LED
US6853411B2 (en) 2001-02-20 2005-02-08 Eastman Kodak Company Light-producing high aperture ratio display having aligned tiles
JP3643328B2 (ja) 2001-08-21 2005-04-27 ファナック株式会社 2次元ldアレイ発光装置
TW522534B (en) 2001-09-11 2003-03-01 Hsiu-Hen Chang Light source of full color LED using die bonding and packaging technology
US6888305B2 (en) 2001-11-06 2005-05-03 Universal Display Corporation Encapsulation structure that acts as a multilayer mirror
CN100392873C (zh) 2001-12-07 2008-06-04 张修恒 叠置晶片全彩色发光二极管的封装结构及方法
TW523942B (en) 2002-03-05 2003-03-11 Hsiu-Hen Chang package socket and package legs structure for LED and manufacturing of the same
TW567618B (en) * 2002-07-15 2003-12-21 Epistar Corp Light emitting diode with adhesive reflection layer and manufacturing method thereof
KR101095753B1 (ko) 2002-08-01 2011-12-21 니치아 카가쿠 고교 가부시키가이샤 반도체 발광 소자 및 그 제조 방법과 그것을 이용한 발광장치
US6717358B1 (en) 2002-10-09 2004-04-06 Eastman Kodak Company Cascaded organic electroluminescent devices with improved voltage stability
TWI246240B (en) 2003-03-11 2005-12-21 Pioneer Corp Multi-wavelength semiconductor laser device and manufacturing method thereof
EP1482566A3 (en) 2003-05-28 2004-12-08 Chang Hsiu Hen Light emitting diode electrode structure and full color light emitting diode formed by overlap cascaded die bonding
JP4699681B2 (ja) 2003-06-27 2011-06-15 パナソニック株式会社 Ledモジュール、および照明装置
JP2005072323A (ja) 2003-08-26 2005-03-17 Oki Data Corp 半導体装置
CN1275337C (zh) 2003-09-17 2006-09-13 北京工大智源科技发展有限公司 高效高亮度多有源区隧道再生白光发光二极管
TWI223460B (en) 2003-09-23 2004-11-01 United Epitaxy Co Ltd Light emitting diodes in series connection and method of making the same
US8097924B2 (en) * 2003-10-31 2012-01-17 Taiwan Semiconductor Manufacturing Company, Ltd. Ultra-shallow junction MOSFET having a high-k gate dielectric and in-situ doped selective epitaxy source/drain extensions and a method of making same
JP2005190768A (ja) 2003-12-25 2005-07-14 Toyota Industries Corp 照明装置
JP4608637B2 (ja) 2004-02-09 2011-01-12 株式会社豊田自動織機 フルカラーoledバックライトを有する半透過型ディスプレイ
ES2394073T3 (es) 2004-03-26 2013-01-16 Panasonic Corporation Elemento orgánico emisor de luz
US7419912B2 (en) 2004-04-01 2008-09-02 Cree, Inc. Laser patterning of light emitting devices
US7528810B2 (en) 2004-05-25 2009-05-05 Victor Company Of Japan, Limited Display with multiple emission layers
US7271420B2 (en) 2004-07-07 2007-09-18 Cao Group, Inc. Monolitholic LED chip to emit multiple colors
US20070170444A1 (en) * 2004-07-07 2007-07-26 Cao Group, Inc. Integrated LED Chip to Emit Multiple Colors and Method of Manufacturing the Same
US20080128728A1 (en) 2004-09-10 2008-06-05 Luminus Devices, Inc. Polarized light-emitting devices and methods
JP2008521239A (ja) 2004-11-19 2008-06-19 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 複合ledモジュール
KR100665120B1 (ko) 2005-02-28 2007-01-09 삼성전기주식회사 수직구조 질화물 반도체 발광소자
JP4738407B2 (ja) 2005-03-18 2011-08-03 富士通株式会社 表示装置
JP4636501B2 (ja) 2005-05-12 2011-02-23 株式会社沖データ 半導体装置、プリントヘッド及び画像形成装置
KR100691177B1 (ko) 2005-05-31 2007-03-09 삼성전기주식회사 백색 발광소자
JP4802556B2 (ja) 2005-06-06 2011-10-26 ソニー株式会社 チップ状電子部品の製造方法
KR100672535B1 (ko) 2005-07-25 2007-01-24 엘지전자 주식회사 유기 el 소자 및 그 제조방법
JP4869661B2 (ja) 2005-08-23 2012-02-08 株式会社Jvcケンウッド 表示装置
JP2007095844A (ja) 2005-09-27 2007-04-12 Oki Data Corp 半導体発光複合装置
EP1935038B1 (en) * 2005-09-30 2017-07-26 Seoul Viosys Co., Ltd Light emitting device having vertically stacked light emitting diodes
JP2007114278A (ja) 2005-10-18 2007-05-10 Fuji Xerox Co Ltd 光アドレス型空間光変調素子の駆動方法、および光アドレス型空間光変調素子駆動装置
US8680693B2 (en) 2006-01-18 2014-03-25 Lg Chem. Ltd. OLED having stacked organic light-emitting units
US7737451B2 (en) 2006-02-23 2010-06-15 Cree, Inc. High efficiency LED with tunnel junction layer
US20070222922A1 (en) 2006-03-22 2007-09-27 Eastman Kodak Company Graded contrast enhancing layer for use in displays
CN101123252B (zh) * 2006-08-10 2011-03-16 松下电器产业株式会社 半导体装置及其制造方法
US9070759B2 (en) * 2006-09-25 2015-06-30 Infineon Technologies Ag Semiconductor device and method of making same
US7808013B2 (en) 2006-10-31 2010-10-05 Cree, Inc. Integrated heat spreaders for light emitting devices (LEDs) and related assemblies
JP5030742B2 (ja) 2006-11-30 2012-09-19 株式会社半導体エネルギー研究所 発光素子
KR20080054626A (ko) 2006-12-13 2008-06-18 엘지디스플레이 주식회사 유기 전계발광표시소자 및 그 제조방법
KR20080061766A (ko) 2006-12-28 2008-07-03 엘지디스플레이 주식회사 유기전계발광표시장치 및 그 제조방법
CN102683376A (zh) 2007-01-22 2012-09-19 科锐公司 高压发光体、发光体及照明装置
NO20070425L (no) 2007-01-23 2008-07-24 Tom Jensen Anordning og fremgangsmate for bruk av mikrokraftverk
EP2122695A4 (en) 2007-03-08 2013-09-11 3M Innovative Properties Co NETWORK OF LUMINESCENT ELEMENTS
JP2008263127A (ja) * 2007-04-13 2008-10-30 Toshiba Corp Led装置
US7521330B2 (en) * 2007-06-04 2009-04-21 Taiwan Semiconductor Manufacturing Co., Ltd. Methods for forming capacitor structures
US20080308819A1 (en) 2007-06-15 2008-12-18 Tpo Displays Corp. Light-Emitting Diode Arrays and Methods of Manufacture
US7687812B2 (en) 2007-06-15 2010-03-30 Tpo Displays Corp. Light-emitting diode arrays and methods of manufacture
US9136498B2 (en) 2007-06-27 2015-09-15 Qd Vision, Inc. Apparatus and method for modulating photon output of a quantum dot light emitting device
DE102007030129A1 (de) 2007-06-29 2009-01-02 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Mehrzahl optoelektronischer Bauelemente und optoelektronisches Bauelement
US8022421B2 (en) * 2007-11-06 2011-09-20 Industrial Technology Institute Light emitting module having LED pixels and method of forming the same
US7732803B2 (en) 2008-05-01 2010-06-08 Bridgelux, Inc. Light emitting device having stacked multiple LEDS
KR100937866B1 (ko) 2008-05-15 2010-01-21 삼성모바일디스플레이주식회사 유기발광 표시장치
KR101458958B1 (ko) 2008-06-10 2014-11-13 삼성전자주식회사 반도체 칩, 반도체 패키지 및 반도체 칩의 제조 방법
JP2009302201A (ja) 2008-06-11 2009-12-24 Toyoda Gosei Co Ltd Iii族窒化物半導体発光素子
DE102008030584A1 (de) 2008-06-27 2009-12-31 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauelementes und optoelektronisches Bauelement
KR101332794B1 (ko) 2008-08-05 2013-11-25 삼성전자주식회사 발광 장치, 이를 포함하는 발광 시스템, 상기 발광 장치 및발광 시스템의 제조 방법
US8414304B2 (en) 2008-08-19 2013-04-09 Plextronics, Inc. Organic light emitting diode lighting devices
TWI537900B (zh) 2008-08-19 2016-06-11 索爾維美國有限公司 使用者可組態之鑲嵌發光裝置
JP2010052555A (ja) 2008-08-27 2010-03-11 Kanzaki Kokyukoki Mfg Co Ltd 車軸駆動装置
JP5097057B2 (ja) 2008-08-29 2012-12-12 株式会社沖データ 表示装置
JP4555880B2 (ja) 2008-09-04 2010-10-06 株式会社沖データ 積層半導体発光装置及び画像形成装置
JP5024247B2 (ja) 2008-09-12 2012-09-12 日立電線株式会社 発光素子
US7977872B2 (en) 2008-09-16 2011-07-12 Global Oled Technology Llc High-color-temperature tandem white OLED
TW201017863A (en) 2008-10-03 2010-05-01 Versitech Ltd Semiconductor color-tunable broadband light sources and full-color microdisplays
EP2357679B1 (en) 2008-11-14 2018-08-29 Samsung Electronics Co., Ltd. Vertical/horizontal light-emitting diode for semiconductor
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
EP2406821A2 (en) 2009-03-13 2012-01-18 Tessera, Inc. Stacked microelectronic assemblies having vias extending through bond pads
US8946204B2 (en) 2009-05-07 2015-02-03 Gruenenthal Gmbh Substituted phenylureas and phenylamides as vanilloid receptor ligands
JP5393790B2 (ja) 2009-08-07 2014-01-22 昭和電工株式会社 植物育成用の多色発光ダイオードランプ、照明装置および植物育成方法
KR101077789B1 (ko) 2009-08-07 2011-10-28 한국과학기술원 Led 디스플레이 제조 방법 및 이에 의하여 제조된 led 디스플레이
KR101815072B1 (ko) 2009-11-24 2018-01-30 유니버시티 오브 플로리다 리서치 파운데이션, 인크. 적외선 검출 방법 및 장치
US8642363B2 (en) 2009-12-09 2014-02-04 Nano And Advanced Materials Institute Limited Monolithic full-color LED micro-display on an active matrix panel manufactured using flip-chip technology
US9236532B2 (en) 2009-12-14 2016-01-12 Seoul Viosys Co., Ltd. Light emitting diode having electrode pads
JP5443286B2 (ja) 2009-12-24 2014-03-19 スタンレー電気株式会社 フェイスアップ型光半導体装置
KR101631652B1 (ko) 2009-12-29 2016-06-20 삼성전자주식회사 광민감성 투명 산화물 반도체 재료를 이용한 이미지 센서
JP2011159674A (ja) 2010-01-29 2011-08-18 Fujitsu Ltd 温度解析プログラム、温度解析装置及び温度解析方法
JP2011159671A (ja) 2010-01-29 2011-08-18 Oki Data Corp 半導体発光装置および画像表示装置
US20110204376A1 (en) 2010-02-23 2011-08-25 Applied Materials, Inc. Growth of multi-junction led film stacks with multi-chambered epitaxy system
EP2366753B1 (en) 2010-03-02 2015-06-17 Semiconductor Energy Laboratory Co., Ltd. Light-Emitting Element and Lighting Device
DE102010002966B4 (de) 2010-03-17 2020-07-30 Osram Opto Semiconductors Gmbh Laserdiodenanordnung und Verfahren zum Herstellen einer Laserdiodenanordnung
WO2011125090A1 (ja) 2010-04-02 2011-10-13 株式会社 日立製作所 有機発光装置およびこれを用いた光源装置
WO2011126248A2 (en) * 2010-04-06 2011-10-13 Seoul Opto Device Co., Ltd. Light emitting diode and method of fabricating the same
JP5725927B2 (ja) * 2010-05-18 2015-05-27 ソウル バイオシス カンパニー リミテッドSeoul Viosys Co.,Ltd. 高効率発光ダイオード及びその製造方法
KR101252032B1 (ko) 2010-07-08 2013-04-10 삼성전자주식회사 반도체 발광소자 및 이의 제조방법
US9178107B2 (en) 2010-08-03 2015-11-03 Industrial Technology Research Institute Wafer-level light emitting diode structure, light emitting diode chip, and method for forming the same
JP5333382B2 (ja) 2010-08-27 2013-11-06 豊田合成株式会社 発光素子
US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
KR101142965B1 (ko) * 2010-09-24 2012-05-08 서울반도체 주식회사 웨이퍼 레벨 발광 다이오드 패키지 및 그것을 제조하는 방법
US8163581B1 (en) 2010-10-13 2012-04-24 Monolith IC 3D Semiconductor and optoelectronic devices
US8283215B2 (en) 2010-10-13 2012-10-09 Monolithic 3D Inc. Semiconductor and optoelectronic devices
US9941319B2 (en) 2010-10-13 2018-04-10 Monolithic 3D Inc. Semiconductor and optoelectronic methods and devices
KR20120040011A (ko) 2010-10-18 2012-04-26 한국전자통신연구원 발광 다이오드
JP5777879B2 (ja) 2010-12-27 2015-09-09 ローム株式会社 発光素子、発光素子ユニットおよび発光素子パッケージ
CN102593303A (zh) 2011-01-05 2012-07-18 晶元光电股份有限公司 具有栓塞的发光元件
US20120236532A1 (en) 2011-03-14 2012-09-20 Koo Won-Hoe Led engine for illumination
JP5854419B2 (ja) 2011-03-18 2016-02-09 国立大学法人山口大学 多波長発光素子及びその製造方法
FR2964498A1 (fr) 2011-03-21 2012-03-09 Soitec Silicon On Insulator Empilement de led de couleur
US8802461B2 (en) * 2011-03-22 2014-08-12 Micron Technology, Inc. Vertical light emitting devices with nickel silicide bonding and methods of manufacturing
WO2012128188A1 (en) 2011-03-23 2012-09-27 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and lighting device
JP5095840B2 (ja) 2011-04-26 2012-12-12 株式会社東芝 半導体発光素子
WO2012147759A1 (ja) 2011-04-27 2012-11-01 Jx日鉱日石エネルギー株式会社 有機el素子用の光取出し透明基板及びそれを用いた有機el素子
TW201248945A (en) 2011-05-31 2012-12-01 Chi Mei Lighting Tech Corp Light-emitting diode device and method for manufacturing the same
US8884316B2 (en) 2011-06-17 2014-11-11 Universal Display Corporation Non-common capping layer on an organic device
US9129856B2 (en) * 2011-07-08 2015-09-08 Broadcom Corporation Method for efficiently fabricating memory cells with logic FETs and related structure
US9309223B2 (en) 2011-07-08 2016-04-12 Semiconductor Energy Laboratory Co., Ltd. Heterocyclic compound, light-emitting element, light-emitting device, electronic device, and lighting device
JP2013070030A (ja) 2011-09-06 2013-04-18 Sony Corp 撮像素子、電子機器、並びに、情報処理装置
US9070613B2 (en) 2011-09-07 2015-06-30 Lg Innotek Co., Ltd. Light emitting device
DE102011116232B4 (de) 2011-10-17 2020-04-09 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung
KR101902392B1 (ko) 2011-10-26 2018-10-01 엘지이노텍 주식회사 발광 소자
DE102011056888A1 (de) 2011-12-22 2013-06-27 Osram Opto Semiconductors Gmbh Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung
CN102593290B (zh) 2012-01-18 2014-08-13 鄂尔多斯市荣泰光电科技有限责任公司 白光led外延片及其制作工艺以及白光led芯片的制作方法
KR20130104612A (ko) 2012-03-14 2013-09-25 서울바이오시스 주식회사 발광 다이오드 및 그것을 제조하는 방법
US20130264587A1 (en) 2012-04-04 2013-10-10 Phostek, Inc. Stacked led device using oxide bonding
US8835948B2 (en) * 2012-04-19 2014-09-16 Phostek, Inc. Stacked LED device with diagonal bonding pads
JP5888096B2 (ja) 2012-04-26 2016-03-16 コニカミノルタ株式会社 表示装置
TW201344955A (zh) 2012-04-27 2013-11-01 華夏光股份有限公司 發光二極體裝置
US9257665B2 (en) 2012-09-14 2016-02-09 Universal Display Corporation Lifetime OLED display
DE102012108763B4 (de) 2012-09-18 2023-02-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer halbleiterchip und lichtquelle mit dem optoelektronischen halbleiterchip
US8946052B2 (en) 2012-09-26 2015-02-03 Sandia Corporation Processes for multi-layer devices utilizing layer transfer
DE102013112602B4 (de) 2012-12-18 2020-11-12 Lg Display Co., Ltd. Weiße organische Lichtemissionsvorrichtung
KR20140078977A (ko) 2012-12-18 2014-06-26 서울바이오시스 주식회사 고효율 발광 다이오드
US20140184062A1 (en) * 2012-12-27 2014-07-03 GE Lighting Solutions, LLC Systems and methods for a light emitting diode chip
US20140191243A1 (en) 2013-01-08 2014-07-10 University Of Florida Research Foundation, Inc. Patterned articles and light emitting devices therefrom
US9443833B2 (en) 2013-01-31 2016-09-13 Nthdegree Technologies Worldwide Inc. Transparent overlapping LED die layers
TW201438188A (zh) 2013-03-25 2014-10-01 美祿科技股份有限公司 堆疊式發光二極體陣列結構
DE102013104132A1 (de) 2013-04-24 2014-10-30 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und optoelektronisches Halbleiterbauteil
JP6308475B2 (ja) 2013-05-17 2018-04-11 パナソニックIpマネジメント株式会社 有機エレクトロルミネッセンス素子及び照明装置
DE112014002453B4 (de) 2013-05-17 2017-05-18 Panasonic Intellectual Property Management Co., Ltd. Organisches Elektrolumineszenz-Bauelement
JP2015012044A (ja) * 2013-06-26 2015-01-19 株式会社東芝 半導体発光素子
KR102050461B1 (ko) 2013-06-28 2019-11-29 엘지디스플레이 주식회사 유기 발광 소자
JP2015012244A (ja) 2013-07-01 2015-01-19 株式会社東芝 半導体発光素子
TWI727366B (zh) 2013-08-09 2021-05-11 日商半導體能源研究所股份有限公司 發光元件、顯示模組、照明模組、發光裝置、顯示裝置、電子裝置、及照明裝置
DE102013109451B9 (de) 2013-08-30 2017-07-13 Osram Oled Gmbh Verfahren zur Herstellung eines optoelektronischen Bauelements
EP3069403B1 (en) 2013-11-15 2020-06-17 Lockheed Martin Energy, LLC Methods for determining state of charge and calibrating reference electrodes in a redox flow battery
JP6497647B2 (ja) 2013-12-24 2019-04-10 パナソニックIpマネジメント株式会社 表示装置及び表示装置の製造方法
JP2015185548A (ja) * 2014-03-20 2015-10-22 豊田合成株式会社 半導体発光素子とその製造方法および発光装置
KR101452801B1 (ko) 2014-03-25 2014-10-22 광주과학기술원 발광다이오드 및 이의 제조방법
WO2015150976A1 (en) 2014-04-03 2015-10-08 Strato Scale Ltd. Cluster-wide memory management using similarity-preserving signatures
KR20150121306A (ko) 2014-04-18 2015-10-29 포항공과대학교 산학협력단 질화물 반도체 발광소자 및 이의 제조방법
KR20150131522A (ko) 2014-05-15 2015-11-25 엘지디스플레이 주식회사 유기 발광 표시 소자 디스플레이 패널
US9831387B2 (en) 2014-06-14 2017-11-28 Hiphoton Co., Ltd. Light engine array
JP2016027361A (ja) 2014-07-01 2016-02-18 株式会社リコー エレクトロクロミック表示装置およびその製造方法、駆動方法
GB201413578D0 (en) 2014-07-31 2014-09-17 Infiniled Ltd A colour iled display on silicon
JP6351520B2 (ja) 2014-08-07 2018-07-04 株式会社東芝 半導体発光素子
JP6413460B2 (ja) 2014-08-08 2018-10-31 日亜化学工業株式会社 発光装置及び発光装置の製造方法
KR20160027875A (ko) 2014-08-28 2016-03-10 서울바이오시스 주식회사 발광소자
US9799719B2 (en) 2014-09-25 2017-10-24 X-Celeprint Limited Active-matrix touchscreen
KR101888608B1 (ko) 2014-10-17 2018-09-20 엘지이노텍 주식회사 발광 소자 패키지 및 조명 장치
US9847051B2 (en) 2014-11-04 2017-12-19 Apple Inc. Organic light-emitting diode display with minimized subpixel crosstalk
US9508891B2 (en) * 2014-11-21 2016-11-29 Epistar Corporation Method for making light-emitting device
US9698134B2 (en) 2014-11-27 2017-07-04 Sct Technology, Ltd. Method for manufacturing a light emitted diode display
US20160163940A1 (en) 2014-12-05 2016-06-09 Industrial Technology Research Institute Package structure for light emitting device
KR102322841B1 (ko) * 2014-12-24 2021-11-08 엘지이노텍 주식회사 발광소자 및 이를 포함하는 발광소자 어레이
KR102402260B1 (ko) 2015-01-08 2022-05-27 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
JPWO2016152321A1 (ja) 2015-03-20 2018-01-11 ソニーセミコンダクタソリューションズ株式会社 表示装置および照明装置ならびに発光素子および半導体デバイス
KR102038443B1 (ko) 2015-03-26 2019-10-30 엘지이노텍 주식회사 발광 소자 및 발광 소자 패키지
KR102434778B1 (ko) 2015-03-26 2022-08-23 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
KR101771461B1 (ko) 2015-04-24 2017-08-25 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
JP6637674B2 (ja) 2015-04-30 2020-01-29 信越化学工業株式会社 プリント配線板、プリント配線板の製造方法、及び半導体装置
CN104952995B (zh) 2015-05-05 2017-08-25 湘能华磊光电股份有限公司 一种iii族半导体发光器件的倒装结构
US20160336482A1 (en) 2015-05-12 2016-11-17 Epistar Corporation Light-emitting device
DE102015108545A1 (de) 2015-05-29 2016-12-01 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
DE102015108532A1 (de) 2015-05-29 2016-12-01 Osram Opto Semiconductors Gmbh Anzeigevorrichtung mit einer Mehrzahl getrennt voneinander betreibbarer Bildpunkte
JP2016225221A (ja) 2015-06-02 2016-12-28 コニカミノルタ株式会社 電界発光素子
JP2017011202A (ja) 2015-06-25 2017-01-12 京セラ株式会社 発光装置
TWI577042B (zh) 2015-07-15 2017-04-01 南臺科技大學 發光二極體晶片及數據發射及接收裝置
US20170014824A1 (en) 2015-07-17 2017-01-19 Lawrence M. Boyd Apparatus and method for sorting of cells
US9685457B2 (en) * 2015-07-22 2017-06-20 Globalfoundries Inc. Method including a formation of a transistor and semiconductor structure including a first transistor and a second transistor
WO2017030396A1 (ko) 2015-08-18 2017-02-23 엘지이노텍(주) 발광 소자, 이 소자를 포함하는 발광 소자 패키지 및 이 패키지를 포함하는 발광 장치
KR102415331B1 (ko) 2015-08-26 2022-06-30 삼성전자주식회사 발광 소자 패키지, 및 이를 포함하는 장치
US9722076B2 (en) * 2015-08-29 2017-08-01 Taiwan Semiconductor Manufacturning Co., Ltd. Method for manufacturing semiconductor device with contamination improvement
KR102443035B1 (ko) 2015-09-02 2022-09-16 삼성전자주식회사 Led 구동 장치 및 그를 포함하는 조명 장치
US10032757B2 (en) 2015-09-04 2018-07-24 Hong Kong Beida Jade Bird Display Limited Projection display system
US10304811B2 (en) 2015-09-04 2019-05-28 Hong Kong Beida Jade Bird Display Limited Light-emitting diode display panel with micro lens array
US9966501B2 (en) * 2015-09-07 2018-05-08 Seoul Viosys Co., Ltd. Light emitting device with high efficiency
KR102460072B1 (ko) 2015-09-10 2022-10-31 삼성전자주식회사 반도체 발광 소자
KR102406606B1 (ko) 2015-10-08 2022-06-09 삼성디스플레이 주식회사 유기 발광 소자, 이를 포함하는 유기 발광 표시 장치, 및 이의 제조 방법
KR101739851B1 (ko) 2015-10-30 2017-05-25 주식회사 썬다이오드코리아 파장변환구조체를 포함하는 발광 소자
US10304813B2 (en) 2015-11-05 2019-05-28 Innolux Corporation Display device having a plurality of bank structures
KR102546307B1 (ko) 2015-12-02 2023-06-21 삼성전자주식회사 발광 소자 및 이를 포함하는 표시 장치
KR20170082187A (ko) 2016-01-05 2017-07-14 삼성전자주식회사 백색 발광장치 및 디스플레이 장치
TWI581455B (zh) 2016-01-29 2017-05-01 友達光電股份有限公司 發光裝置及發光裝置之製造方法
KR102524805B1 (ko) 2016-02-12 2023-04-25 삼성전자주식회사 광원 모듈, 디스플레이 패널 및 이를 구비한 디스플레이 장치
WO2017145026A1 (en) 2016-02-23 2017-08-31 Silanna UV Technologies Pte Ltd Resonant optical cavity light emitting device
KR102328852B1 (ko) 2016-02-24 2021-11-22 삼성디스플레이 주식회사 유기발광소자
WO2017146477A1 (ko) 2016-02-26 2017-08-31 서울반도체주식회사 디스플레이 장치 및 그의 제조 방법
DE102016104280A1 (de) 2016-03-09 2017-09-14 Osram Opto Semiconductors Gmbh Bauelement und Verfahren zur Herstellung eines Bauelements
KR20170108321A (ko) 2016-03-17 2017-09-27 주식회사 루멘스 발광 다이오드
KR102517336B1 (ko) 2016-03-29 2023-04-04 삼성전자주식회사 디스플레이 패널 및 이를 구비한 멀티비전 장치
CN205944139U (zh) 2016-03-30 2017-02-08 首尔伟傲世有限公司 紫外线发光二极管封装件以及包含此的发光二极管模块
KR102513080B1 (ko) 2016-04-04 2023-03-24 삼성전자주식회사 Led 광원 모듈 및 디스플레이 장치
CN105789237A (zh) 2016-04-25 2016-07-20 京东方科技集团股份有限公司 Led显示模组、显示装置及显示模组的制作方法
JP6683003B2 (ja) 2016-05-11 2020-04-15 日亜化学工業株式会社 半導体素子、半導体装置及び半導体素子の製造方法
KR20170129983A (ko) 2016-05-17 2017-11-28 삼성전자주식회사 발광소자 패키지, 이를 이용한 디스플레이 장치 및 그 제조방법
US10388691B2 (en) 2016-05-18 2019-08-20 Globalfoundries Inc. Light emitting diodes (LEDs) with stacked multi-color pixels for displays
CN107437551B (zh) 2016-05-25 2020-03-24 群创光电股份有限公司 显示装置及其制造方法
EP3297044A1 (en) 2016-09-19 2018-03-21 Nick Shepherd Improved led emitter, led emitter array and method for manufacturing the same
TWI584491B (zh) * 2016-11-03 2017-05-21 友達光電股份有限公司 發光裝置與其製作方法
CN106449659B (zh) 2016-11-11 2019-06-07 京东方科技集团股份有限公司 阵列基板及其制造方法、显示器
KR102642304B1 (ko) 2016-11-28 2024-02-28 삼성전자주식회사 광전자 소자 및 전자 장치
US11287563B2 (en) 2016-12-01 2022-03-29 Ostendo Technologies, Inc. Polarized light emission from micro-pixel displays and methods of fabrication thereof
US10400958B2 (en) 2016-12-30 2019-09-03 Lumileds Llc Addressable color changeable LED structure
CN106898601A (zh) 2017-02-15 2017-06-27 佛山市国星光电股份有限公司 三角形组合的led线路板、三角形led器件及显示屏
JP2020508582A (ja) 2017-02-24 2020-03-19 マサチューセッツ インスティテュート オブ テクノロジー 垂直に積層された多色発光ダイオード(led)ディスプレイのための方法および装置
CN106848043A (zh) 2017-03-28 2017-06-13 光创空间(深圳)技术有限公司 一种led器件的封装方法及led器件
TWI699496B (zh) 2017-03-31 2020-07-21 億光電子工業股份有限公司 發光裝置和照明模組
TWI613806B (zh) 2017-05-16 2018-02-01 錼創科技股份有限公司 微型發光二極體裝置及顯示面板
KR20190001050A (ko) 2017-06-26 2019-01-04 주식회사 루멘스 칩 적층 구조를 갖는 led 픽셀 소자
KR102503578B1 (ko) 2017-06-30 2023-02-24 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치
TWI672808B (zh) 2017-07-07 2019-09-21 鴻海精密工業股份有限公司 微型led顯示面板及其製備方法
KR102476136B1 (ko) 2017-09-05 2022-12-09 삼성전자주식회사 Led를 이용한 디스플레이 장치
CN109801965B (zh) * 2017-11-17 2022-06-14 联华电子股份有限公司 具有双层间隙壁的晶体管及其形成方法
US11282981B2 (en) 2017-11-27 2022-03-22 Seoul Viosys Co., Ltd. Passivation covered light emitting unit stack
KR102509639B1 (ko) 2017-12-12 2023-03-15 삼성전자주식회사 발광소자 패키지 제조방법
WO2019147738A1 (en) 2018-01-23 2019-08-01 Light Share, LLC Full-color monolithic micro-led pixels
JP7115037B2 (ja) * 2018-05-25 2022-08-09 ユナイテッド・セミコンダクター・ジャパン株式会社 半導体装置
US11508876B2 (en) 2018-12-31 2022-11-22 Seoul Viosys Co., Ltd. Light emitting device package and display device having the same
CN110259303A (zh) 2019-06-18 2019-09-20 浙江吉利控股集团有限公司 一种防疲劳损伤主动式铰链系统

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197968A (ja) * 2001-12-18 2003-07-11 Shuko Cho 透明導電層及び反射層で直接結合されたチップの積み重ねによるフルカラー発光ダイオード光源のパッケージ構造
US20090078955A1 (en) * 2007-09-26 2009-03-26 Iii-N Technlogy, Inc Micro-Emitter Array Based Full-Color Micro-Display
US20150325555A1 (en) * 2013-03-07 2015-11-12 Kabushiki Kaisha Toshiba Semiconductor light emitting element and method for manufacturing the same

Also Published As

Publication number Publication date
CN110911532A (zh) 2020-03-24
JP2021504959A (ja) 2021-02-15
US20220165718A1 (en) 2022-05-26
EP3718141A4 (en) 2021-08-11
CN110828437A (zh) 2020-02-21
SA520412044B1 (ar) 2025-07-06
BR112020010653A2 (pt) 2021-01-26
US12100696B2 (en) 2024-09-24
CN111312701B (zh) 2024-12-06
JP2024020283A (ja) 2024-02-14
WO2019103567A1 (en) 2019-05-31
EP3718141A1 (en) 2020-10-07
US12494461B2 (en) 2025-12-09
CN110828437B (zh) 2024-07-12
CN111312701A (zh) 2020-06-19
US20250070100A1 (en) 2025-02-27
US20220392879A1 (en) 2022-12-08
CN110603639A (zh) 2019-12-20
US20190164945A1 (en) 2019-05-30
US12142602B2 (en) 2024-11-12
CN111312700A (zh) 2020-06-19
CN111312700B (zh) 2024-10-22
KR20200087174A (ko) 2020-07-20
CN110931473A (zh) 2020-03-27
CN110993592A (zh) 2020-04-10

Similar Documents

Publication Publication Date Title
KR102801350B1 (ko) 디스플레이용 발광 다이오드 및 이를 갖는 디스플레이 장치
US12107081B2 (en) LED unit for display and display apparatus having the same
US12183773B2 (en) Light emitting stacked structure and display device having the same
US12456716B2 (en) LED unit for display and display apparatus having the same
US11114499B2 (en) Display device having light emitting stacked structure
KR20200087168A (ko) 디스플레이용 led 유닛 및 이를 갖는 디스플레이 장치
BR112020010653B1 (pt) Diodo emissor de luz para display e dispositivo de exibição tendo o mesmo

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20200601

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20211117

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20231020

Patent event code: PE09021S01D

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20240605

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20250122

PG1601 Publication of registration