|
JPH0613655Y2
(ja)
|
1987-09-04 |
1994-04-13 |
三菱農機株式会社 |
作業車輌におけるレバー装置
|
|
JPH0710003B2
(ja)
|
1988-03-11 |
1995-02-01 |
信越半導体株式会社 |
混色発光半導体素子
|
|
US5268590A
(en)
*
|
1989-12-27 |
1993-12-07 |
Motorola, Inc. |
CMOS device and process
|
|
JP3259931B2
(ja)
|
1992-04-17 |
2002-02-25 |
シャープ株式会社 |
半導体発光素子および半導体表示装置
|
|
JPH07254732A
(ja)
|
1994-03-15 |
1995-10-03 |
Toshiba Corp |
半導体発光装置
|
|
JP3620877B2
(ja)
|
1994-09-16 |
2005-02-16 |
豊田合成株式会社 |
3族窒化物半導体平面発光素子
|
|
JPH0884407A
(ja)
|
1994-09-12 |
1996-03-26 |
Nissin Electric Co Ltd |
スイッチギヤの扉開閉装置
|
|
FR2726126A1
(fr)
*
|
1994-10-24 |
1996-04-26 |
Mitsubishi Electric Corp |
Procede de fabrication de dispositifs a diodes electroluminescentes a lumiere visible
|
|
JPH08213657A
(ja)
|
1994-10-24 |
1996-08-20 |
Mitsubishi Electric Corp |
可視光led装置,及びその製造方法
|
|
US5703436A
(en)
|
1994-12-13 |
1997-12-30 |
The Trustees Of Princeton University |
Transparent contacts for organic devices
|
|
US5707745A
(en)
|
1994-12-13 |
1998-01-13 |
The Trustees Of Princeton University |
Multicolor organic light emitting devices
|
|
JPH08274376A
(ja)
|
1995-03-15 |
1996-10-18 |
Texas Instr Inc <Ti> |
シリコンに格子整合したiii−v化合物半導体エミッター
|
|
US5583349A
(en)
|
1995-11-02 |
1996-12-10 |
Motorola |
Full color light emitting diode display
|
|
US5583350A
(en)
|
1995-11-02 |
1996-12-10 |
Motorola |
Full color light emitting diode display assembly
|
|
US6046543A
(en)
|
1996-12-23 |
2000-04-04 |
The Trustees Of Princeton University |
High reliability, high efficiency, integratable organic light emitting devices and methods of producing same
|
|
KR100298205B1
(ko)
|
1998-05-21 |
2001-08-07 |
오길록 |
고집적삼색발광소자및그제조방법
|
|
US6459100B1
(en)
|
1998-09-16 |
2002-10-01 |
Cree, Inc. |
Vertical geometry ingan LED
|
|
US6853411B2
(en)
|
2001-02-20 |
2005-02-08 |
Eastman Kodak Company |
Light-producing high aperture ratio display having aligned tiles
|
|
JP3643328B2
(ja)
|
2001-08-21 |
2005-04-27 |
ファナック株式会社 |
2次元ldアレイ発光装置
|
|
US6888305B2
(en)
|
2001-11-06 |
2005-05-03 |
Universal Display Corporation |
Encapsulation structure that acts as a multilayer mirror
|
|
CN100392873C
(zh)
|
2001-12-07 |
2008-06-04 |
张修恒 |
叠置晶片全彩色发光二极管的封装结构及方法
|
|
JP2003197968A
(ja)
|
2001-12-18 |
2003-07-11 |
Shuko Cho |
透明導電層及び反射層で直接結合されたチップの積み重ねによるフルカラー発光ダイオード光源のパッケージ構造
|
|
TW523942B
(en)
|
2002-03-05 |
2003-03-11 |
Hsiu-Hen Chang |
package socket and package legs structure for LED and manufacturing of the same
|
|
TW567618B
(en)
*
|
2002-07-15 |
2003-12-21 |
Epistar Corp |
Light emitting diode with adhesive reflection layer and manufacturing method thereof
|
|
AU2003252359A1
(en)
|
2002-08-01 |
2004-02-23 |
Nichia Corporation |
Semiconductor light-emitting device, method for manufacturing same and light-emitting apparatus using same
|
|
US6717358B1
(en)
|
2002-10-09 |
2004-04-06 |
Eastman Kodak Company |
Cascaded organic electroluminescent devices with improved voltage stability
|
|
TWI246240B
(en)
|
2003-03-11 |
2005-12-21 |
Pioneer Corp |
Multi-wavelength semiconductor laser device and manufacturing method thereof
|
|
EP1482566A3
(en)
|
2003-05-28 |
2004-12-08 |
Chang Hsiu Hen |
Light emitting diode electrode structure and full color light emitting diode formed by overlap cascaded die bonding
|
|
JP4699681B2
(ja)
|
2003-06-27 |
2011-06-15 |
パナソニック株式会社 |
Ledモジュール、および照明装置
|
|
JP2005072323A
(ja)
|
2003-08-26 |
2005-03-17 |
Oki Data Corp |
半導体装置
|
|
CN1275337C
(zh)
|
2003-09-17 |
2006-09-13 |
北京工大智源科技发展有限公司 |
高效高亮度多有源区隧道再生白光发光二极管
|
|
TWI223460B
(en)
|
2003-09-23 |
2004-11-01 |
United Epitaxy Co Ltd |
Light emitting diodes in series connection and method of making the same
|
|
US8097924B2
(en)
*
|
2003-10-31 |
2012-01-17 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Ultra-shallow junction MOSFET having a high-k gate dielectric and in-situ doped selective epitaxy source/drain extensions and a method of making same
|
|
JP2005190768A
(ja)
|
2003-12-25 |
2005-07-14 |
Toyota Industries Corp |
照明装置
|
|
ATE433132T1
(de)
|
2004-02-09 |
2009-06-15 |
Toyota Ind Corp |
Transflektive anzeige mit einer farbigen oled- rückbeleuchtung
|
|
WO2005094130A1
(ja)
|
2004-03-26 |
2005-10-06 |
Matsushita Electric Works, Ltd. |
有機発光素子
|
|
US7419912B2
(en)
|
2004-04-01 |
2008-09-02 |
Cree, Inc. |
Laser patterning of light emitting devices
|
|
US7528810B2
(en)
|
2004-05-25 |
2009-05-05 |
Victor Company Of Japan, Limited |
Display with multiple emission layers
|
|
US7271420B2
(en)
|
2004-07-07 |
2007-09-18 |
Cao Group, Inc. |
Monolitholic LED chip to emit multiple colors
|
|
US20070170444A1
(en)
*
|
2004-07-07 |
2007-07-26 |
Cao Group, Inc. |
Integrated LED Chip to Emit Multiple Colors and Method of Manufacturing the Same
|
|
US20080128728A1
(en)
|
2004-09-10 |
2008-06-05 |
Luminus Devices, Inc. |
Polarized light-emitting devices and methods
|
|
US8017955B2
(en)
|
2004-11-19 |
2011-09-13 |
Koninklijke Philips Electronics N.V. |
Composite LED modules
|
|
KR100665120B1
(ko)
|
2005-02-28 |
2007-01-09 |
삼성전기주식회사 |
수직구조 질화물 반도체 발광소자
|
|
WO2006100711A1
(ja)
|
2005-03-18 |
2006-09-28 |
Fujitsu Limited |
表示装置およびその製造方法
|
|
JP4636501B2
(ja)
*
|
2005-05-12 |
2011-02-23 |
株式会社沖データ |
半導体装置、プリントヘッド及び画像形成装置
|
|
KR100691177B1
(ko)
|
2005-05-31 |
2007-03-09 |
삼성전기주식회사 |
백색 발광소자
|
|
JP4802556B2
(ja)
|
2005-06-06 |
2011-10-26 |
ソニー株式会社 |
チップ状電子部品の製造方法
|
|
KR100672535B1
(ko)
|
2005-07-25 |
2007-01-24 |
엘지전자 주식회사 |
유기 el 소자 및 그 제조방법
|
|
JP4869661B2
(ja)
|
2005-08-23 |
2012-02-08 |
株式会社Jvcケンウッド |
表示装置
|
|
JP2007095844A
(ja)
|
2005-09-27 |
2007-04-12 |
Oki Data Corp |
半導体発光複合装置
|
|
EP1935038B1
(en)
*
|
2005-09-30 |
2017-07-26 |
Seoul Viosys Co., Ltd |
Light emitting device having vertically stacked light emitting diodes
|
|
JP2007114278A
(ja)
|
2005-10-18 |
2007-05-10 |
Fuji Xerox Co Ltd |
光アドレス型空間光変調素子の駆動方法、および光アドレス型空間光変調素子駆動装置
|
|
EP1974590B1
(en)
|
2006-01-18 |
2020-03-04 |
LG Display Co., Ltd. |
Oled having stacked organic light-emitting units
|
|
US7737451B2
(en)
|
2006-02-23 |
2010-06-15 |
Cree, Inc. |
High efficiency LED with tunnel junction layer
|
|
US20070222922A1
(en)
|
2006-03-22 |
2007-09-27 |
Eastman Kodak Company |
Graded contrast enhancing layer for use in displays
|
|
CN101123252B
(zh)
*
|
2006-08-10 |
2011-03-16 |
松下电器产业株式会社 |
半导体装置及其制造方法
|
|
US9070759B2
(en)
*
|
2006-09-25 |
2015-06-30 |
Infineon Technologies Ag |
Semiconductor device and method of making same
|
|
US7808013B2
(en)
|
2006-10-31 |
2010-10-05 |
Cree, Inc. |
Integrated heat spreaders for light emitting devices (LEDs) and related assemblies
|
|
JP5030742B2
(ja)
|
2006-11-30 |
2012-09-19 |
株式会社半導体エネルギー研究所 |
発光素子
|
|
KR20080054626A
(ko)
|
2006-12-13 |
2008-06-18 |
엘지디스플레이 주식회사 |
유기 전계발광표시소자 및 그 제조방법
|
|
KR20080061766A
(ko)
|
2006-12-28 |
2008-07-03 |
엘지디스플레이 주식회사 |
유기전계발광표시장치 및 그 제조방법
|
|
EP3848970A1
(en)
|
2007-01-22 |
2021-07-14 |
Cree, Inc. |
Multiple light emitting diode emitter
|
|
NO20070425L
(no)
|
2007-01-23 |
2008-07-24 |
Tom Jensen |
Anordning og fremgangsmate for bruk av mikrokraftverk
|
|
JP2010525555A
(ja)
|
2007-03-08 |
2010-07-22 |
スリーエム イノベイティブ プロパティズ カンパニー |
発光素子のアレイ
|
|
JP2008263127A
(ja)
|
2007-04-13 |
2008-10-30 |
Toshiba Corp |
Led装置
|
|
US7521330B2
(en)
*
|
2007-06-04 |
2009-04-21 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Methods for forming capacitor structures
|
|
US20080308819A1
(en)
|
2007-06-15 |
2008-12-18 |
Tpo Displays Corp. |
Light-Emitting Diode Arrays and Methods of Manufacture
|
|
US7687812B2
(en)
|
2007-06-15 |
2010-03-30 |
Tpo Displays Corp. |
Light-emitting diode arrays and methods of manufacture
|
|
US9136498B2
(en)
|
2007-06-27 |
2015-09-15 |
Qd Vision, Inc. |
Apparatus and method for modulating photon output of a quantum dot light emitting device
|
|
DE102007030129A1
(de)
|
2007-06-29 |
2009-01-02 |
Osram Opto Semiconductors Gmbh |
Verfahren zur Herstellung einer Mehrzahl optoelektronischer Bauelemente und optoelektronisches Bauelement
|
|
US8022421B2
(en)
*
|
2007-11-06 |
2011-09-20 |
Industrial Technology Institute |
Light emitting module having LED pixels and method of forming the same
|
|
US7732803B2
(en)
|
2008-05-01 |
2010-06-08 |
Bridgelux, Inc. |
Light emitting device having stacked multiple LEDS
|
|
KR100937866B1
(ko)
|
2008-05-15 |
2010-01-21 |
삼성모바일디스플레이주식회사 |
유기발광 표시장치
|
|
KR101458958B1
(ko)
|
2008-06-10 |
2014-11-13 |
삼성전자주식회사 |
반도체 칩, 반도체 패키지 및 반도체 칩의 제조 방법
|
|
JP2009302201A
(ja)
|
2008-06-11 |
2009-12-24 |
Toyoda Gosei Co Ltd |
Iii族窒化物半導体発光素子
|
|
DE102008030584A1
(de)
|
2008-06-27 |
2009-12-31 |
Osram Opto Semiconductors Gmbh |
Verfahren zur Herstellung eines optoelektronischen Bauelementes und optoelektronisches Bauelement
|
|
KR101332794B1
(ko)
|
2008-08-05 |
2013-11-25 |
삼성전자주식회사 |
발광 장치, 이를 포함하는 발광 시스템, 상기 발광 장치 및발광 시스템의 제조 방법
|
|
TW201014452A
(en)
|
2008-08-19 |
2010-04-01 |
Plextronics Inc |
Organic light emitting diode lighting devices
|
|
US8519424B2
(en)
|
2008-08-19 |
2013-08-27 |
Plextronics, Inc. |
User configurable mosaic light emitting apparatus
|
|
JP2010052555A
(ja)
|
2008-08-27 |
2010-03-11 |
Kanzaki Kokyukoki Mfg Co Ltd |
車軸駆動装置
|
|
JP5097057B2
(ja)
|
2008-08-29 |
2012-12-12 |
株式会社沖データ |
表示装置
|
|
JP4555880B2
(ja)
|
2008-09-04 |
2010-10-06 |
株式会社沖データ |
積層半導体発光装置及び画像形成装置
|
|
JP5024247B2
(ja)
|
2008-09-12 |
2012-09-12 |
日立電線株式会社 |
発光素子
|
|
US7977872B2
(en)
|
2008-09-16 |
2011-07-12 |
Global Oled Technology Llc |
High-color-temperature tandem white OLED
|
|
TW201017863A
(en)
|
2008-10-03 |
2010-05-01 |
Versitech Ltd |
Semiconductor color-tunable broadband light sources and full-color microdisplays
|
|
EP2357679B1
(en)
|
2008-11-14 |
2018-08-29 |
Samsung Electronics Co., Ltd. |
Vertical/horizontal light-emitting diode for semiconductor
|
|
US9184410B2
(en)
|
2008-12-22 |
2015-11-10 |
Samsung Display Co., Ltd. |
Encapsulated white OLEDs having enhanced optical output
|
|
TWI446498B
(zh)
|
2009-03-13 |
2014-07-21 |
泰斯拉公司 |
具有延伸穿越銲墊之通孔的堆疊微電子總成
|
|
US8946204B2
(en)
|
2009-05-07 |
2015-02-03 |
Gruenenthal Gmbh |
Substituted phenylureas and phenylamides as vanilloid receptor ligands
|
|
US9485919B2
(en)
|
2009-08-07 |
2016-11-08 |
Showa Denko K.K. |
Multicolor light emitting diode lamp for plant growth, illumination apparatus, and plant growth method
|
|
KR101077789B1
(ko)
|
2009-08-07 |
2011-10-28 |
한국과학기술원 |
Led 디스플레이 제조 방법 및 이에 의하여 제조된 led 디스플레이
|
|
EP2504675A4
(en)
|
2009-11-24 |
2016-08-17 |
Univ Florida |
METHOD AND DEVICE FOR DETECTING AN INFRARED RADIATION
|
|
US8642363B2
(en)
|
2009-12-09 |
2014-02-04 |
Nano And Advanced Materials Institute Limited |
Monolithic full-color LED micro-display on an active matrix panel manufactured using flip-chip technology
|
|
US9236532B2
(en)
|
2009-12-14 |
2016-01-12 |
Seoul Viosys Co., Ltd. |
Light emitting diode having electrode pads
|
|
JP5443286B2
(ja)
|
2009-12-24 |
2014-03-19 |
スタンレー電気株式会社 |
フェイスアップ型光半導体装置
|
|
KR101631652B1
(ko)
|
2009-12-29 |
2016-06-20 |
삼성전자주식회사 |
광민감성 투명 산화물 반도체 재료를 이용한 이미지 센서
|
|
JP2011159674A
(ja)
|
2010-01-29 |
2011-08-18 |
Fujitsu Ltd |
温度解析プログラム、温度解析装置及び温度解析方法
|
|
JP2011159671A
(ja)
|
2010-01-29 |
2011-08-18 |
Oki Data Corp |
半導体発光装置および画像表示装置
|
|
US20110204376A1
(en)
|
2010-02-23 |
2011-08-25 |
Applied Materials, Inc. |
Growth of multi-junction led film stacks with multi-chambered epitaxy system
|
|
EP2366753B1
(en)
|
2010-03-02 |
2015-06-17 |
Semiconductor Energy Laboratory Co., Ltd. |
Light-Emitting Element and Lighting Device
|
|
WO2011125090A1
(ja)
|
2010-04-02 |
2011-10-13 |
株式会社 日立製作所 |
有機発光装置およびこれを用いた光源装置
|
|
KR101252032B1
(ko)
|
2010-07-08 |
2013-04-10 |
삼성전자주식회사 |
반도체 발광소자 및 이의 제조방법
|
|
US9178107B2
(en)
|
2010-08-03 |
2015-11-03 |
Industrial Technology Research Institute |
Wafer-level light emitting diode structure, light emitting diode chip, and method for forming the same
|
|
JP5333382B2
(ja)
|
2010-08-27 |
2013-11-06 |
豊田合成株式会社 |
発光素子
|
|
KR101142965B1
(ko)
*
|
2010-09-24 |
2012-05-08 |
서울반도체 주식회사 |
웨이퍼 레벨 발광 다이오드 패키지 및 그것을 제조하는 방법
|
|
US9070851B2
(en)
|
2010-09-24 |
2015-06-30 |
Seoul Semiconductor Co., Ltd. |
Wafer-level light emitting diode package and method of fabricating the same
|
|
US8163581B1
(en)
|
2010-10-13 |
2012-04-24 |
Monolith IC 3D |
Semiconductor and optoelectronic devices
|
|
US9941319B2
(en)
|
2010-10-13 |
2018-04-10 |
Monolithic 3D Inc. |
Semiconductor and optoelectronic methods and devices
|
|
US8283215B2
(en)
|
2010-10-13 |
2012-10-09 |
Monolithic 3D Inc. |
Semiconductor and optoelectronic devices
|
|
KR20120040011A
(ko)
|
2010-10-18 |
2012-04-26 |
한국전자통신연구원 |
발광 다이오드
|
|
JP5777879B2
(ja)
|
2010-12-27 |
2015-09-09 |
ローム株式会社 |
発光素子、発光素子ユニットおよび発光素子パッケージ
|
|
CN102593303A
(zh)
|
2011-01-05 |
2012-07-18 |
晶元光电股份有限公司 |
具有栓塞的发光元件
|
|
US20120236532A1
(en)
|
2011-03-14 |
2012-09-20 |
Koo Won-Hoe |
Led engine for illumination
|
|
JP5854419B2
(ja)
|
2011-03-18 |
2016-02-09 |
国立大学法人山口大学 |
多波長発光素子及びその製造方法
|
|
FR2964498A1
(fr)
|
2011-03-21 |
2012-03-09 |
Soitec Silicon On Insulator |
Empilement de led de couleur
|
|
US8802461B2
(en)
*
|
2011-03-22 |
2014-08-12 |
Micron Technology, Inc. |
Vertical light emitting devices with nickel silicide bonding and methods of manufacturing
|
|
CN105309047B
(zh)
|
2011-03-23 |
2017-05-17 |
株式会社半导体能源研究所 |
发光装置以及照明装置
|
|
JP5095840B2
(ja)
|
2011-04-26 |
2012-12-12 |
株式会社東芝 |
半導体発光素子
|
|
WO2012147759A1
(ja)
|
2011-04-27 |
2012-11-01 |
Jx日鉱日石エネルギー株式会社 |
有機el素子用の光取出し透明基板及びそれを用いた有機el素子
|
|
TW201248945A
(en)
|
2011-05-31 |
2012-12-01 |
Chi Mei Lighting Tech Corp |
Light-emitting diode device and method for manufacturing the same
|
|
US8884316B2
(en)
|
2011-06-17 |
2014-11-11 |
Universal Display Corporation |
Non-common capping layer on an organic device
|
|
US9309223B2
(en)
|
2011-07-08 |
2016-04-12 |
Semiconductor Energy Laboratory Co., Ltd. |
Heterocyclic compound, light-emitting element, light-emitting device, electronic device, and lighting device
|
|
US9129856B2
(en)
*
|
2011-07-08 |
2015-09-08 |
Broadcom Corporation |
Method for efficiently fabricating memory cells with logic FETs and related structure
|
|
JP2013070030A
(ja)
|
2011-09-06 |
2013-04-18 |
Sony Corp |
撮像素子、電子機器、並びに、情報処理装置
|
|
US9070613B2
(en)
|
2011-09-07 |
2015-06-30 |
Lg Innotek Co., Ltd. |
Light emitting device
|
|
DE102011116232B4
(de)
|
2011-10-17 |
2020-04-09 |
Osram Opto Semiconductors Gmbh |
Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung
|
|
KR101902392B1
(ko)
|
2011-10-26 |
2018-10-01 |
엘지이노텍 주식회사 |
발광 소자
|
|
DE102011056888A1
(de)
|
2011-12-22 |
2013-06-27 |
Osram Opto Semiconductors Gmbh |
Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung
|
|
CN102593290B
(zh)
|
2012-01-18 |
2014-08-13 |
鄂尔多斯市荣泰光电科技有限责任公司 |
白光led外延片及其制作工艺以及白光led芯片的制作方法
|
|
KR20130104612A
(ko)
|
2012-03-14 |
2013-09-25 |
서울바이오시스 주식회사 |
발광 다이오드 및 그것을 제조하는 방법
|
|
US20130264587A1
(en)
|
2012-04-04 |
2013-10-10 |
Phostek, Inc. |
Stacked led device using oxide bonding
|
|
US8835948B2
(en)
*
|
2012-04-19 |
2014-09-16 |
Phostek, Inc. |
Stacked LED device with diagonal bonding pads
|
|
JP5888096B2
(ja)
|
2012-04-26 |
2016-03-16 |
コニカミノルタ株式会社 |
表示装置
|
|
TW201344955A
(zh)
|
2012-04-27 |
2013-11-01 |
華夏光股份有限公司 |
發光二極體裝置
|
|
US9257665B2
(en)
|
2012-09-14 |
2016-02-09 |
Universal Display Corporation |
Lifetime OLED display
|
|
DE102012108763B4
(de)
|
2012-09-18 |
2023-02-09 |
OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung |
Optoelektronischer halbleiterchip und lichtquelle mit dem optoelektronischen halbleiterchip
|
|
US8946052B2
(en)
|
2012-09-26 |
2015-02-03 |
Sandia Corporation |
Processes for multi-layer devices utilizing layer transfer
|
|
KR20140078977A
(ko)
|
2012-12-18 |
2014-06-26 |
서울바이오시스 주식회사 |
고효율 발광 다이오드
|
|
DE102013112602B4
(de)
|
2012-12-18 |
2020-11-12 |
Lg Display Co., Ltd. |
Weiße organische Lichtemissionsvorrichtung
|
|
US20140184062A1
(en)
*
|
2012-12-27 |
2014-07-03 |
GE Lighting Solutions, LLC |
Systems and methods for a light emitting diode chip
|
|
US20140191243A1
(en)
|
2013-01-08 |
2014-07-10 |
University Of Florida Research Foundation, Inc. |
Patterned articles and light emitting devices therefrom
|
|
US9443833B2
(en)
|
2013-01-31 |
2016-09-13 |
Nthdegree Technologies Worldwide Inc. |
Transparent overlapping LED die layers
|
|
JP2014175427A
(ja)
*
|
2013-03-07 |
2014-09-22 |
Toshiba Corp |
半導体発光素子及びその製造方法
|
|
TW201438188A
(zh)
|
2013-03-25 |
2014-10-01 |
美祿科技股份有限公司 |
堆疊式發光二極體陣列結構
|
|
DE102013104132A1
(de)
|
2013-04-24 |
2014-10-30 |
Osram Opto Semiconductors Gmbh |
Optoelektronischer Halbleiterchip und optoelektronisches Halbleiterbauteil
|
|
US9748313B2
(en)
|
2013-05-17 |
2017-08-29 |
Panasonic Intellectual Property Management Co., Ltd. |
Organic electroluminescent element
|
|
KR101716701B1
(ko)
|
2013-05-17 |
2017-03-15 |
파나소닉 아이피 매니지먼트 가부시키가이샤 |
유기 전계 발광 소자 및 조명 장치
|
|
JP2015012044A
(ja)
|
2013-06-26 |
2015-01-19 |
株式会社東芝 |
半導体発光素子
|
|
KR102050461B1
(ko)
|
2013-06-28 |
2019-11-29 |
엘지디스플레이 주식회사 |
유기 발광 소자
|
|
JP2015012244A
(ja)
|
2013-07-01 |
2015-01-19 |
株式会社東芝 |
半導体発光素子
|
|
TWI790559B
(zh)
|
2013-08-09 |
2023-01-21 |
日商半導體能源研究所股份有限公司 |
發光元件、顯示模組、照明模組、發光裝置、顯示裝置、電子裝置、及照明裝置
|
|
DE102013109451B9
(de)
|
2013-08-30 |
2017-07-13 |
Osram Oled Gmbh |
Verfahren zur Herstellung eines optoelektronischen Bauelements
|
|
US10388978B2
(en)
|
2013-11-15 |
2019-08-20 |
Lockheed Martin Energy, Llc |
Methods for determining state of charge and calibrating reference electrodes in a redox flow battery
|
|
JP6497647B2
(ja)
|
2013-12-24 |
2019-04-10 |
パナソニックIpマネジメント株式会社 |
表示装置及び表示装置の製造方法
|
|
JP2015185548A
(ja)
*
|
2014-03-20 |
2015-10-22 |
豊田合成株式会社 |
半導体発光素子とその製造方法および発光装置
|
|
KR101452801B1
(ko)
|
2014-03-25 |
2014-10-22 |
광주과학기술원 |
발광다이오드 및 이의 제조방법
|
|
WO2015150976A1
(en)
|
2014-04-03 |
2015-10-08 |
Strato Scale Ltd. |
Cluster-wide memory management using similarity-preserving signatures
|
|
KR20150121306A
(ko)
|
2014-04-18 |
2015-10-29 |
포항공과대학교 산학협력단 |
질화물 반도체 발광소자 및 이의 제조방법
|
|
KR20150131522A
(ko)
|
2014-05-15 |
2015-11-25 |
엘지디스플레이 주식회사 |
유기 발광 표시 소자 디스플레이 패널
|
|
US9831387B2
(en)
|
2014-06-14 |
2017-11-28 |
Hiphoton Co., Ltd. |
Light engine array
|
|
JP2016027361A
(ja)
|
2014-07-01 |
2016-02-18 |
株式会社リコー |
エレクトロクロミック表示装置およびその製造方法、駆動方法
|
|
GB201413578D0
(en)
|
2014-07-31 |
2014-09-17 |
Infiniled Ltd |
A colour iled display on silicon
|
|
JP6351520B2
(ja)
|
2014-08-07 |
2018-07-04 |
株式会社東芝 |
半導体発光素子
|
|
JP6413460B2
(ja)
|
2014-08-08 |
2018-10-31 |
日亜化学工業株式会社 |
発光装置及び発光装置の製造方法
|
|
KR20160027875A
(ko)
|
2014-08-28 |
2016-03-10 |
서울바이오시스 주식회사 |
발광소자
|
|
US9799719B2
(en)
|
2014-09-25 |
2017-10-24 |
X-Celeprint Limited |
Active-matrix touchscreen
|
|
KR101888608B1
(ko)
|
2014-10-17 |
2018-09-20 |
엘지이노텍 주식회사 |
발광 소자 패키지 및 조명 장치
|
|
US9847051B2
(en)
|
2014-11-04 |
2017-12-19 |
Apple Inc. |
Organic light-emitting diode display with minimized subpixel crosstalk
|
|
US9508891B2
(en)
*
|
2014-11-21 |
2016-11-29 |
Epistar Corporation |
Method for making light-emitting device
|
|
US9698134B2
(en)
|
2014-11-27 |
2017-07-04 |
Sct Technology, Ltd. |
Method for manufacturing a light emitted diode display
|
|
US20160163940A1
(en)
|
2014-12-05 |
2016-06-09 |
Industrial Technology Research Institute |
Package structure for light emitting device
|
|
KR102322841B1
(ko)
*
|
2014-12-24 |
2021-11-08 |
엘지이노텍 주식회사 |
발광소자 및 이를 포함하는 발광소자 어레이
|
|
KR102402260B1
(ko)
|
2015-01-08 |
2022-05-27 |
쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 |
발광 소자 패키지
|
|
CN107408364B
(zh)
|
2015-03-20 |
2020-06-30 |
索尼半导体解决方案公司 |
显示装置、照明装置、发光元件以及半导体装置
|
|
KR102038443B1
(ko)
|
2015-03-26 |
2019-10-30 |
엘지이노텍 주식회사 |
발광 소자 및 발광 소자 패키지
|
|
KR102434778B1
(ko)
|
2015-03-26 |
2022-08-23 |
쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 |
발광 소자 패키지
|
|
KR101771461B1
(ko)
|
2015-04-24 |
2017-08-25 |
엘지전자 주식회사 |
반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
|
|
JP6637674B2
(ja)
|
2015-04-30 |
2020-01-29 |
信越化学工業株式会社 |
プリント配線板、プリント配線板の製造方法、及び半導体装置
|
|
CN104952995B
(zh)
|
2015-05-05 |
2017-08-25 |
湘能华磊光电股份有限公司 |
一种iii族半导体发光器件的倒装结构
|
|
US20160336482A1
(en)
|
2015-05-12 |
2016-11-17 |
Epistar Corporation |
Light-emitting device
|
|
DE102015108532A1
(de)
|
2015-05-29 |
2016-12-01 |
Osram Opto Semiconductors Gmbh |
Anzeigevorrichtung mit einer Mehrzahl getrennt voneinander betreibbarer Bildpunkte
|
|
DE102015108545A1
(de)
|
2015-05-29 |
2016-12-01 |
Osram Opto Semiconductors Gmbh |
Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
|
|
JP2016225221A
(ja)
|
2015-06-02 |
2016-12-28 |
コニカミノルタ株式会社 |
電界発光素子
|
|
JP2017011202A
(ja)
|
2015-06-25 |
2017-01-12 |
京セラ株式会社 |
発光装置
|
|
TWI577042B
(zh)
|
2015-07-15 |
2017-04-01 |
南臺科技大學 |
發光二極體晶片及數據發射及接收裝置
|
|
EP3325964A1
(en)
|
2015-07-17 |
2018-05-30 |
Lawrence M. Boyd |
Apparatus and method for sorting of cells
|
|
US9685457B2
(en)
*
|
2015-07-22 |
2017-06-20 |
Globalfoundries Inc. |
Method including a formation of a transistor and semiconductor structure including a first transistor and a second transistor
|
|
CN107924968B
(zh)
|
2015-08-18 |
2022-08-23 |
苏州立琻半导体有限公司 |
发光元件、包括发光元件的发光元件封装和包括发光元件封装的发光装置
|
|
KR102415331B1
(ko)
|
2015-08-26 |
2022-06-30 |
삼성전자주식회사 |
발광 소자 패키지, 및 이를 포함하는 장치
|
|
US9722076B2
(en)
*
|
2015-08-29 |
2017-08-01 |
Taiwan Semiconductor Manufacturning Co., Ltd. |
Method for manufacturing semiconductor device with contamination improvement
|
|
KR102443035B1
(ko)
|
2015-09-02 |
2022-09-16 |
삼성전자주식회사 |
Led 구동 장치 및 그를 포함하는 조명 장치
|
|
US10304811B2
(en)
|
2015-09-04 |
2019-05-28 |
Hong Kong Beida Jade Bird Display Limited |
Light-emitting diode display panel with micro lens array
|
|
US10032757B2
(en)
|
2015-09-04 |
2018-07-24 |
Hong Kong Beida Jade Bird Display Limited |
Projection display system
|
|
US9966501B2
(en)
*
|
2015-09-07 |
2018-05-08 |
Seoul Viosys Co., Ltd. |
Light emitting device with high efficiency
|
|
KR102460072B1
(ko)
|
2015-09-10 |
2022-10-31 |
삼성전자주식회사 |
반도체 발광 소자
|
|
KR102406606B1
(ko)
|
2015-10-08 |
2022-06-09 |
삼성디스플레이 주식회사 |
유기 발광 소자, 이를 포함하는 유기 발광 표시 장치, 및 이의 제조 방법
|
|
KR101739851B1
(ko)
|
2015-10-30 |
2017-05-25 |
주식회사 썬다이오드코리아 |
파장변환구조체를 포함하는 발광 소자
|
|
US10304813B2
(en)
|
2015-11-05 |
2019-05-28 |
Innolux Corporation |
Display device having a plurality of bank structures
|
|
KR102546307B1
(ko)
|
2015-12-02 |
2023-06-21 |
삼성전자주식회사 |
발광 소자 및 이를 포함하는 표시 장치
|
|
KR20170082187A
(ko)
|
2016-01-05 |
2017-07-14 |
삼성전자주식회사 |
백색 발광장치 및 디스플레이 장치
|
|
TWI581455B
(zh)
|
2016-01-29 |
2017-05-01 |
友達光電股份有限公司 |
發光裝置及發光裝置之製造方法
|
|
KR102524805B1
(ko)
|
2016-02-12 |
2023-04-25 |
삼성전자주식회사 |
광원 모듈, 디스플레이 패널 및 이를 구비한 디스플레이 장치
|
|
WO2017145026A1
(en)
|
2016-02-23 |
2017-08-31 |
Silanna UV Technologies Pte Ltd |
Resonant optical cavity light emitting device
|
|
KR102328852B1
(ko)
|
2016-02-24 |
2021-11-22 |
삼성디스플레이 주식회사 |
유기발광소자
|
|
WO2017146477A1
(ko)
|
2016-02-26 |
2017-08-31 |
서울반도체주식회사 |
디스플레이 장치 및 그의 제조 방법
|
|
DE102016104280A1
(de)
|
2016-03-09 |
2017-09-14 |
Osram Opto Semiconductors Gmbh |
Bauelement und Verfahren zur Herstellung eines Bauelements
|
|
KR20170108321A
(ko)
|
2016-03-17 |
2017-09-27 |
주식회사 루멘스 |
발광 다이오드
|
|
KR102517336B1
(ko)
|
2016-03-29 |
2023-04-04 |
삼성전자주식회사 |
디스플레이 패널 및 이를 구비한 멀티비전 장치
|
|
CN205944139U
(zh)
|
2016-03-30 |
2017-02-08 |
首尔伟傲世有限公司 |
紫外线发光二极管封装件以及包含此的发光二极管模块
|
|
CN105789237A
(zh)
|
2016-04-25 |
2016-07-20 |
京东方科技集团股份有限公司 |
Led显示模组、显示装置及显示模组的制作方法
|
|
JP6683003B2
(ja)
|
2016-05-11 |
2020-04-15 |
日亜化学工業株式会社 |
半導体素子、半導体装置及び半導体素子の製造方法
|
|
KR20170129983A
(ko)
|
2016-05-17 |
2017-11-28 |
삼성전자주식회사 |
발광소자 패키지, 이를 이용한 디스플레이 장치 및 그 제조방법
|
|
US10388691B2
(en)
|
2016-05-18 |
2019-08-20 |
Globalfoundries Inc. |
Light emitting diodes (LEDs) with stacked multi-color pixels for displays
|
|
CN107437551B
(zh)
|
2016-05-25 |
2020-03-24 |
群创光电股份有限公司 |
显示装置及其制造方法
|
|
EP3297044A1
(en)
|
2016-09-19 |
2018-03-21 |
Nick Shepherd |
Improved led emitter, led emitter array and method for manufacturing the same
|
|
TWI584491B
(zh)
*
|
2016-11-03 |
2017-05-21 |
友達光電股份有限公司 |
發光裝置與其製作方法
|
|
CN106449659B
(zh)
|
2016-11-11 |
2019-06-07 |
京东方科技集团股份有限公司 |
阵列基板及其制造方法、显示器
|
|
KR102642304B1
(ko)
|
2016-11-28 |
2024-02-28 |
삼성전자주식회사 |
광전자 소자 및 전자 장치
|
|
US11287563B2
(en)
|
2016-12-01 |
2022-03-29 |
Ostendo Technologies, Inc. |
Polarized light emission from micro-pixel displays and methods of fabrication thereof
|
|
US10400958B2
(en)
|
2016-12-30 |
2019-09-03 |
Lumileds Llc |
Addressable color changeable LED structure
|
|
CN106898601A
(zh)
|
2017-02-15 |
2017-06-27 |
佛山市国星光电股份有限公司 |
三角形组合的led线路板、三角形led器件及显示屏
|
|
WO2018156876A1
(en)
|
2017-02-24 |
2018-08-30 |
Kim, Jeehwan |
Methods and apparatus for vertically stacked multicolor light-emitting diode (led) display
|
|
CN106848043A
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|
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|
|
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|
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|
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|
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|
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|
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