KR101761108B1 - 반도체 장치 - Google Patents
반도체 장치 Download PDFInfo
- Publication number
- KR101761108B1 KR101761108B1 KR1020167022259A KR20167022259A KR101761108B1 KR 101761108 B1 KR101761108 B1 KR 101761108B1 KR 1020167022259 A KR1020167022259 A KR 1020167022259A KR 20167022259 A KR20167022259 A KR 20167022259A KR 101761108 B1 KR101761108 B1 KR 101761108B1
- Authority
- KR
- South Korea
- Prior art keywords
- thin film
- wiring
- region
- film transistor
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- H01L27/0266—
-
- H01L27/1214—
-
- H01L27/1225—
-
- H01L29/7869—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
- H10D89/811—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Semiconductor Integrated Circuits (AREA)
- Electroluminescent Light Sources (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Electrodes Of Semiconductors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2008-259063 | 2008-10-03 | ||
| JP2008259063 | 2008-10-03 | ||
| PCT/JP2009/067118 WO2010038819A1 (en) | 2008-10-03 | 2009-09-24 | Display device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020117010133A Division KR101652693B1 (ko) | 2008-10-03 | 2009-09-24 | 표시 장치 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020177019951A Division KR101803720B1 (ko) | 2008-10-03 | 2009-09-24 | 표시 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160101725A KR20160101725A (ko) | 2016-08-25 |
| KR101761108B1 true KR101761108B1 (ko) | 2017-07-25 |
Family
ID=42073577
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020177019951A Active KR101803720B1 (ko) | 2008-10-03 | 2009-09-24 | 표시 장치 |
| KR1020167022259A Active KR101761108B1 (ko) | 2008-10-03 | 2009-09-24 | 반도체 장치 |
| KR1020117015512A Active KR101273972B1 (ko) | 2008-10-03 | 2009-09-24 | 반도체장치 |
| KR1020117010133A Expired - Fee Related KR101652693B1 (ko) | 2008-10-03 | 2009-09-24 | 표시 장치 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020177019951A Active KR101803720B1 (ko) | 2008-10-03 | 2009-09-24 | 표시 장치 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020117015512A Active KR101273972B1 (ko) | 2008-10-03 | 2009-09-24 | 반도체장치 |
| KR1020117010133A Expired - Fee Related KR101652693B1 (ko) | 2008-10-03 | 2009-09-24 | 표시 장치 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US7989815B2 (enExample) |
| JP (4) | JP2010107976A (enExample) |
| KR (4) | KR101803720B1 (enExample) |
| TW (2) | TWI469302B (enExample) |
| WO (1) | WO2010038819A1 (enExample) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010032619A1 (en) | 2008-09-19 | 2010-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| KR101803264B1 (ko) | 2008-09-19 | 2017-12-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| EP2172804B1 (en) | 2008-10-03 | 2016-05-11 | Semiconductor Energy Laboratory Co, Ltd. | Display device |
| KR101803720B1 (ko) | 2008-10-03 | 2017-12-01 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
| CN101719493B (zh) | 2008-10-08 | 2014-05-14 | 株式会社半导体能源研究所 | 显示装置 |
| KR101642620B1 (ko) | 2009-07-10 | 2016-07-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
| WO2011048925A1 (en) * | 2009-10-21 | 2011-04-28 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US8786582B2 (en) * | 2009-10-27 | 2014-07-22 | Sharp Kabushiki Kaisha | Display panel and display apparatus |
| WO2011052437A1 (en) | 2009-10-30 | 2011-05-05 | Semiconductor Energy Laboratory Co., Ltd. | Non-linear element, display device including non-linear element, and electronic device including display device |
| WO2011065209A1 (en) * | 2009-11-27 | 2011-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Non-linear element, display device including non-linear element, and electronic device including display device |
| WO2011086905A1 (ja) * | 2010-01-13 | 2011-07-21 | シャープ株式会社 | アクティブマトリクス基板及びその製造方法 |
| JP5494115B2 (ja) * | 2010-03-29 | 2014-05-14 | ソニー株式会社 | 表示装置及び電子機器 |
| TWI410722B (zh) * | 2010-09-02 | 2013-10-01 | Au Optronics Corp | 液晶顯示單元 |
| US8766253B2 (en) * | 2010-09-10 | 2014-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8835917B2 (en) * | 2010-09-13 | 2014-09-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, power diode, and rectifier |
| CN103299448B (zh) * | 2010-09-29 | 2016-09-07 | Posco公司 | 使用辊形状母基板的柔性电子器件的制造方法、柔性电子器件及柔性基板 |
| TWI624878B (zh) | 2011-03-11 | 2018-05-21 | 半導體能源研究所股份有限公司 | 半導體裝置的製造方法 |
| CN103688303B (zh) | 2011-07-22 | 2016-08-17 | 株式会社半导体能源研究所 | 发光装置及其驱动方法 |
| TWI470808B (zh) | 2011-12-28 | 2015-01-21 | Au Optronics Corp | 半導體元件及其製作方法 |
| US9176069B2 (en) * | 2012-02-10 | 2015-11-03 | Kla-Tencor Corporation | System and method for apodization in a semiconductor device inspection system |
| DE102012205415B4 (de) * | 2012-04-03 | 2024-11-14 | Bayerische Motoren Werke Aktiengesellschaft | Fahrzeug |
| KR20140059576A (ko) * | 2012-11-08 | 2014-05-16 | 삼성디스플레이 주식회사 | 박막 트랜지스터 및 이를 포함하는 유기 발광 디스플레이 장치 |
| KR102105485B1 (ko) * | 2012-11-23 | 2020-04-29 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 그 제조 방법 |
| TWI882464B (zh) | 2012-11-28 | 2025-05-01 | 日商半導體能源研究所股份有限公司 | 顯示裝置 |
| TWI627483B (zh) | 2012-11-28 | 2018-06-21 | 半導體能源研究所股份有限公司 | 顯示裝置及電視接收機 |
| KR102241249B1 (ko) | 2012-12-25 | 2021-04-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 저항 소자, 표시 장치, 및 전자기기 |
| KR102798241B1 (ko) | 2012-12-25 | 2025-04-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| TWI611566B (zh) | 2013-02-25 | 2018-01-11 | 半導體能源研究所股份有限公司 | 顯示裝置和電子裝置 |
| JP6083089B2 (ja) * | 2013-03-27 | 2017-02-22 | 株式会社Joled | 半導体装置、表示装置および電子機器 |
| JP6300589B2 (ja) | 2013-04-04 | 2018-03-28 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US9915848B2 (en) | 2013-04-19 | 2018-03-13 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
| KR102053410B1 (ko) * | 2013-04-24 | 2019-12-09 | 삼성디스플레이 주식회사 | 박막 트랜지스터 및 유기 발광 표시 장치 |
| US9704894B2 (en) | 2013-05-10 | 2017-07-11 | Semiconductor Energy Laboratory Co., Ltd. | Display device including pixel electrode including oxide |
| TWI687748B (zh) | 2013-06-05 | 2020-03-11 | 日商半導體能源研究所股份有限公司 | 顯示裝置及電子裝置 |
| JP6326798B2 (ja) * | 2013-12-11 | 2018-05-23 | 凸版印刷株式会社 | 静電気保護素子及びそれを用いた静電気保護回路の製造方法 |
| CN103995407B (zh) * | 2014-05-08 | 2016-08-24 | 京东方科技集团股份有限公司 | 阵列基板和显示面板 |
| WO2016063169A1 (en) | 2014-10-23 | 2016-04-28 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting element |
| US10680017B2 (en) | 2014-11-07 | 2020-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting element including EL layer, electrode which has high reflectance and a high work function, display device, electronic device, and lighting device |
| CN105470388B (zh) * | 2015-11-18 | 2018-09-28 | 深圳市华星光电技术有限公司 | 有机半导体薄膜晶体管及其制作方法 |
| KR102517092B1 (ko) * | 2017-08-02 | 2023-04-04 | 삼성전자주식회사 | 가요성 디스플레이 패널을 포함하는 전자 장치 |
| CN107274851A (zh) * | 2017-08-14 | 2017-10-20 | 京东方科技集团股份有限公司 | 显示面板及其驱动方法和显示装置 |
| US11287707B2 (en) * | 2018-11-15 | 2022-03-29 | Sharp Kabushiki Kaisha | Array substrate, array substrate body component, and display device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007250982A (ja) | 2006-03-17 | 2007-09-27 | Canon Inc | 酸化物半導体を用いた薄膜トランジスタ及び表示装置 |
Family Cites Families (195)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3819952A (en) | 1973-01-29 | 1974-06-25 | Mitsubishi Electric Corp | Semiconductor device |
| JPS63220289A (ja) * | 1987-03-10 | 1988-09-13 | 日本電気株式会社 | 薄膜トランジスタアレイ |
| EP0445535B1 (en) * | 1990-02-06 | 1995-02-01 | Sel Semiconductor Energy Laboratory Co., Ltd. | Method of forming an oxide film |
| JP3071851B2 (ja) | 1991-03-25 | 2000-07-31 | 株式会社半導体エネルギー研究所 | 電気光学装置 |
| JP3375659B2 (ja) * | 1991-03-28 | 2003-02-10 | テキサス インスツルメンツ インコーポレイテツド | 静電放電保護回路の形成方法 |
| JPH0588198A (ja) * | 1991-09-27 | 1993-04-09 | Nec Corp | 液晶表示装置 |
| US5233448A (en) * | 1992-05-04 | 1993-08-03 | Industrial Technology Research Institute | Method of manufacturing a liquid crystal display panel including photoconductive electrostatic protection |
| US5464990A (en) * | 1992-09-25 | 1995-11-07 | Fuji Xerox Co., Ltd. | Voltage non-linear device and liquid crystal display device incorporating same |
| US6424321B1 (en) | 1993-10-22 | 2002-07-23 | Kopin Corporation | Head-mounted matrix display |
| JPH09504120A (ja) * | 1993-10-22 | 1997-04-22 | コピン・コーポレーシヨン | 頭部装着形表示システム |
| US5815126A (en) | 1993-10-22 | 1998-09-29 | Kopin Corporation | Monocular portable communication and display system |
| US7310072B2 (en) | 1993-10-22 | 2007-12-18 | Kopin Corporation | Portable communication display device |
| JP2701738B2 (ja) | 1994-05-17 | 1998-01-21 | 日本電気株式会社 | 有機薄膜el素子 |
| JPH08179359A (ja) * | 1994-12-20 | 1996-07-12 | Casio Comput Co Ltd | アクティブマトリックスパネル |
| JPH08179360A (ja) * | 1994-12-20 | 1996-07-12 | Casio Comput Co Ltd | アクティブマトリックスパネル |
| JPH08254693A (ja) * | 1995-03-16 | 1996-10-01 | Hitachi Ltd | 液晶表示基板およびその製造方法 |
| JPH11505377A (ja) * | 1995-08-03 | 1999-05-18 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | 半導体装置 |
| JP3007025B2 (ja) * | 1995-08-25 | 2000-02-07 | シャープ株式会社 | アクティブマトリクス型液晶表示装置及びその製造方法 |
| JP3183390B2 (ja) * | 1995-09-05 | 2001-07-09 | キヤノン株式会社 | 光電変換装置及びそれを用いた撮像装置 |
| US5930607A (en) * | 1995-10-03 | 1999-07-27 | Seiko Epson Corporation | Method to prevent static destruction of an active element comprised in a liquid crystal display device |
| US5847410A (en) | 1995-11-24 | 1998-12-08 | Semiconductor Energy Laboratory Co. | Semiconductor electro-optical device |
| JP3625598B2 (ja) * | 1995-12-30 | 2005-03-02 | 三星電子株式会社 | 液晶表示装置の製造方法 |
| JP3629798B2 (ja) * | 1996-02-20 | 2005-03-16 | カシオ計算機株式会社 | 配線パターン |
| JPH1020336A (ja) * | 1996-07-02 | 1998-01-23 | Sharp Corp | アクティブマトリクス基板およびその製造方法 |
| JPH10123574A (ja) * | 1996-10-17 | 1998-05-15 | Hitachi Ltd | アクティブマトリクス基板 |
| KR100252308B1 (ko) | 1997-01-10 | 2000-04-15 | 구본준, 론 위라하디락사 | 박막트랜지스터 어레이 |
| JPH11174970A (ja) * | 1997-12-16 | 1999-07-02 | Hitachi Ltd | 薄膜デバイス |
| JPH11183876A (ja) * | 1997-12-24 | 1999-07-09 | Casio Comput Co Ltd | 液晶表示装置及びその駆動方法 |
| JP4170454B2 (ja) | 1998-07-24 | 2008-10-22 | Hoya株式会社 | 透明導電性酸化物薄膜を有する物品及びその製造方法 |
| JP4264675B2 (ja) | 1998-08-17 | 2009-05-20 | 栄 田中 | 液晶表示装置とその製造方法 |
| US6043971A (en) * | 1998-11-04 | 2000-03-28 | L.G. Philips Lcd Co., Ltd. | Electrostatic discharge protection device for liquid crystal display using a COG package |
| JP2000150861A (ja) * | 1998-11-16 | 2000-05-30 | Tdk Corp | 酸化物薄膜 |
| JP3276930B2 (ja) | 1998-11-17 | 2002-04-22 | 科学技術振興事業団 | トランジスタ及び半導体装置 |
| TW444257B (en) * | 1999-04-12 | 2001-07-01 | Semiconductor Energy Lab | Semiconductor device and method for fabricating the same |
| US7379039B2 (en) * | 1999-07-14 | 2008-05-27 | Sony Corporation | Current drive circuit and display device using same pixel circuit, and drive method |
| JP4126909B2 (ja) * | 1999-07-14 | 2008-07-30 | ソニー株式会社 | 電流駆動回路及びそれを用いた表示装置、画素回路、並びに駆動方法 |
| JP2001053283A (ja) * | 1999-08-12 | 2001-02-23 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
| TW457690B (en) * | 1999-08-31 | 2001-10-01 | Fujitsu Ltd | Liquid crystal display |
| JP4390991B2 (ja) * | 1999-08-31 | 2009-12-24 | シャープ株式会社 | 液晶表示装置 |
| TW460731B (en) | 1999-09-03 | 2001-10-21 | Ind Tech Res Inst | Electrode structure and production method of wide viewing angle LCD |
| US7098084B2 (en) | 2000-03-08 | 2006-08-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP2001324725A (ja) * | 2000-05-12 | 2001-11-22 | Hitachi Ltd | 液晶表示装置およびその製造方法 |
| JP2002026333A (ja) | 2000-07-11 | 2002-01-25 | Nec Corp | アクティブマトリクス基板の製造方法 |
| JP4089858B2 (ja) | 2000-09-01 | 2008-05-28 | 国立大学法人東北大学 | 半導体デバイス |
| KR20020038482A (ko) * | 2000-11-15 | 2002-05-23 | 모리시타 요이찌 | 박막 트랜지스터 어레이, 그 제조방법 및 그것을 이용한표시패널 |
| JP3997731B2 (ja) * | 2001-03-19 | 2007-10-24 | 富士ゼロックス株式会社 | 基材上に結晶性半導体薄膜を形成する方法 |
| JP2002289859A (ja) | 2001-03-23 | 2002-10-04 | Minolta Co Ltd | 薄膜トランジスタ |
| KR100386849B1 (ko) * | 2001-07-10 | 2003-06-09 | 엘지.필립스 엘시디 주식회사 | 박막 트랜지스터 표시장치의 정전방전 방지회로 |
| GB0119299D0 (en) * | 2001-08-08 | 2001-10-03 | Koninkl Philips Electronics Nv | Electrostatic discharge protection for pixellated electronic device |
| JP2003069028A (ja) | 2001-08-27 | 2003-03-07 | Casio Comput Co Ltd | 薄膜トランジスタパネル |
| JP4090716B2 (ja) * | 2001-09-10 | 2008-05-28 | 雅司 川崎 | 薄膜トランジスタおよびマトリクス表示装置 |
| JP3925839B2 (ja) | 2001-09-10 | 2007-06-06 | シャープ株式会社 | 半導体記憶装置およびその試験方法 |
| JP3810725B2 (ja) * | 2001-09-21 | 2006-08-16 | 株式会社半導体エネルギー研究所 | 発光装置及び電子機器 |
| WO2003040441A1 (fr) * | 2001-11-05 | 2003-05-15 | Japan Science And Technology Agency | Film mince monocristallin homologue a super-reseau naturel, procede de preparation et dispositif dans lequel est utilise ledit film mince monocristallin |
| JP4164562B2 (ja) | 2002-09-11 | 2008-10-15 | 独立行政法人科学技術振興機構 | ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ |
| JP3810681B2 (ja) | 2001-12-20 | 2006-08-16 | シャープ株式会社 | 薄膜トランジスタ基板および液晶表示装置 |
| JP4083486B2 (ja) * | 2002-02-21 | 2008-04-30 | 独立行政法人科学技術振興機構 | LnCuO(S,Se,Te)単結晶薄膜の製造方法 |
| CN1445821A (zh) * | 2002-03-15 | 2003-10-01 | 三洋电机株式会社 | ZnO膜和ZnO半导体层的形成方法、半导体元件及其制造方法 |
| JP3933591B2 (ja) * | 2002-03-26 | 2007-06-20 | 淳二 城戸 | 有機エレクトロルミネッセント素子 |
| US6933528B2 (en) * | 2002-04-04 | 2005-08-23 | Nec Lcd Technologies, Ltd. | In-plane switching mode active matrix type liquid crystal display device and method of fabricating the same |
| US7339187B2 (en) | 2002-05-21 | 2008-03-04 | State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University | Transistor structures |
| US7002176B2 (en) | 2002-05-31 | 2006-02-21 | Ricoh Company, Ltd. | Vertical organic transistor |
| JP2004022625A (ja) * | 2002-06-13 | 2004-01-22 | Murata Mfg Co Ltd | 半導体デバイス及び該半導体デバイスの製造方法 |
| US7105868B2 (en) * | 2002-06-24 | 2006-09-12 | Cermet, Inc. | High-electron mobility transistor with zinc oxide |
| JP4565799B2 (ja) * | 2002-07-01 | 2010-10-20 | 大林精工株式会社 | 横電界方式液晶表示装置、その製造方法、走査露光装置およびミックス走査露光装置 |
| TWI338366B (en) * | 2002-09-20 | 2011-03-01 | Semiconductor Energy Lab | Display device and manufacturing method thereof |
| US7067843B2 (en) * | 2002-10-11 | 2006-06-27 | E. I. Du Pont De Nemours And Company | Transparent oxide semiconductor thin film transistors |
| TW200415393A (en) * | 2003-01-15 | 2004-08-16 | Toshiba Matsushita Display Tec | LCD device |
| JP2004246202A (ja) | 2003-02-14 | 2004-09-02 | Koninkl Philips Electronics Nv | 静電放電保護回路を有する電子装置 |
| JP4166105B2 (ja) | 2003-03-06 | 2008-10-15 | シャープ株式会社 | 半導体装置およびその製造方法 |
| JP2004273732A (ja) | 2003-03-07 | 2004-09-30 | Sharp Corp | アクティブマトリクス基板およびその製造方法 |
| KR100528697B1 (ko) * | 2003-05-06 | 2005-11-16 | 엘지.필립스 엘시디 주식회사 | 액정표시장치의 검사방법 및 장치 |
| JP4108633B2 (ja) | 2003-06-20 | 2008-06-25 | シャープ株式会社 | 薄膜トランジスタおよびその製造方法ならびに電子デバイス |
| US7262463B2 (en) * | 2003-07-25 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Transistor including a deposited channel region having a doped portion |
| JP2005108912A (ja) * | 2003-09-29 | 2005-04-21 | Quanta Display Japan Inc | 液晶表示装置とその製造方法 |
| JP4574158B2 (ja) | 2003-10-28 | 2010-11-04 | 株式会社半導体エネルギー研究所 | 半導体表示装置及びその作製方法 |
| US7282782B2 (en) * | 2004-03-12 | 2007-10-16 | Hewlett-Packard Development Company, L.P. | Combined binary oxide semiconductor device |
| US7297977B2 (en) | 2004-03-12 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Semiconductor device |
| US7145174B2 (en) * | 2004-03-12 | 2006-12-05 | Hewlett-Packard Development Company, Lp. | Semiconductor device |
| CN1998087B (zh) | 2004-03-12 | 2014-12-31 | 独立行政法人科学技术振兴机构 | 非晶形氧化物和薄膜晶体管 |
| KR101116816B1 (ko) | 2004-06-05 | 2012-02-28 | 엘지디스플레이 주식회사 | 반투과형 박막 트랜지스터 기판 및 그 제조 방법 |
| US7211825B2 (en) * | 2004-06-14 | 2007-05-01 | Yi-Chi Shih | Indium oxide-based thin film transistors and circuits |
| TWI229933B (en) | 2004-06-25 | 2005-03-21 | Novatek Microelectronics Corp | High voltage device for electrostatic discharge protective circuit and high voltage device |
| JP2006030627A (ja) | 2004-07-16 | 2006-02-02 | Sharp Corp | 表示装置用基板及びそれを用いた液晶表示装置 |
| JP4193805B2 (ja) * | 2004-07-27 | 2008-12-10 | セイコーエプソン株式会社 | 発光装置および画像形成装置 |
| JP2006100760A (ja) * | 2004-09-02 | 2006-04-13 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
| US7285501B2 (en) * | 2004-09-17 | 2007-10-23 | Hewlett-Packard Development Company, L.P. | Method of forming a solution processed device |
| US7298084B2 (en) * | 2004-11-02 | 2007-11-20 | 3M Innovative Properties Company | Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes |
| US7829444B2 (en) * | 2004-11-10 | 2010-11-09 | Canon Kabushiki Kaisha | Field effect transistor manufacturing method |
| KR100998527B1 (ko) * | 2004-11-10 | 2010-12-07 | 고쿠리츠다이가쿠호진 토쿄고교 다이가꾸 | 비정질 산화물 및 전계 효과 트랜지스터 |
| US7863611B2 (en) * | 2004-11-10 | 2011-01-04 | Canon Kabushiki Kaisha | Integrated circuits utilizing amorphous oxides |
| US7453065B2 (en) * | 2004-11-10 | 2008-11-18 | Canon Kabushiki Kaisha | Sensor and image pickup device |
| WO2006051995A1 (en) * | 2004-11-10 | 2006-05-18 | Canon Kabushiki Kaisha | Field effect transistor employing an amorphous oxide |
| US7791072B2 (en) * | 2004-11-10 | 2010-09-07 | Canon Kabushiki Kaisha | Display |
| EP1810335B1 (en) * | 2004-11-10 | 2020-05-27 | Canon Kabushiki Kaisha | Light-emitting device |
| US7579224B2 (en) * | 2005-01-21 | 2009-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a thin film semiconductor device |
| TWI562380B (en) * | 2005-01-28 | 2016-12-11 | Semiconductor Energy Lab Co Ltd | Semiconductor device, electronic device, and method of manufacturing semiconductor device |
| TWI481024B (zh) * | 2005-01-28 | 2015-04-11 | 半導體能源研究所股份有限公司 | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
| US7858451B2 (en) * | 2005-02-03 | 2010-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device, semiconductor device and manufacturing method thereof |
| US7948171B2 (en) * | 2005-02-18 | 2011-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
| JP2006245093A (ja) | 2005-03-01 | 2006-09-14 | Renei Kagi Kofun Yugenkoshi | 高電圧デバイス並びに静電気保護回路用高電圧デバイス |
| US20060197092A1 (en) * | 2005-03-03 | 2006-09-07 | Randy Hoffman | System and method for forming conductive material on a substrate |
| US8681077B2 (en) * | 2005-03-18 | 2014-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, and display device, driving method and electronic apparatus thereof |
| US7544967B2 (en) * | 2005-03-28 | 2009-06-09 | Massachusetts Institute Of Technology | Low voltage flexible organic/transparent transistor for selective gas sensing, photodetecting and CMOS device applications |
| US7645478B2 (en) * | 2005-03-31 | 2010-01-12 | 3M Innovative Properties Company | Methods of making displays |
| US8300031B2 (en) * | 2005-04-20 | 2012-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element |
| CN100538794C (zh) | 2005-05-02 | 2009-09-09 | 株式会社半导体能源研究所 | 发光器件及其驱动方法、显示模块以及电子器具 |
| JP2006344849A (ja) | 2005-06-10 | 2006-12-21 | Casio Comput Co Ltd | 薄膜トランジスタ |
| TWI260094B (en) | 2005-06-13 | 2006-08-11 | Au Optronics Corp | Active device matrix substrate |
| US7402506B2 (en) * | 2005-06-16 | 2008-07-22 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US7691666B2 (en) | 2005-06-16 | 2010-04-06 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US7507618B2 (en) | 2005-06-27 | 2009-03-24 | 3M Innovative Properties Company | Method for making electronic devices using metal oxide nanoparticles |
| US7732330B2 (en) | 2005-06-30 | 2010-06-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method using an ink-jet method of the same |
| US7655566B2 (en) | 2005-07-27 | 2010-02-02 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| KR100711890B1 (ko) * | 2005-07-28 | 2007-04-25 | 삼성에스디아이 주식회사 | 유기 발광표시장치 및 그의 제조방법 |
| JP4039446B2 (ja) * | 2005-08-02 | 2008-01-30 | エプソンイメージングデバイス株式会社 | 電気光学装置及び電子機器 |
| JP2007059128A (ja) * | 2005-08-23 | 2007-03-08 | Canon Inc | 有機el表示装置およびその製造方法 |
| JP5116225B2 (ja) * | 2005-09-06 | 2013-01-09 | キヤノン株式会社 | 酸化物半導体デバイスの製造方法 |
| JP4850457B2 (ja) | 2005-09-06 | 2012-01-11 | キヤノン株式会社 | 薄膜トランジスタ及び薄膜ダイオード |
| JP4280736B2 (ja) * | 2005-09-06 | 2009-06-17 | キヤノン株式会社 | 半導体素子 |
| JP2007073705A (ja) * | 2005-09-06 | 2007-03-22 | Canon Inc | 酸化物半導体チャネル薄膜トランジスタおよびその製造方法 |
| JP5064747B2 (ja) | 2005-09-29 | 2012-10-31 | 株式会社半導体エネルギー研究所 | 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法 |
| JP5078246B2 (ja) * | 2005-09-29 | 2012-11-21 | 株式会社半導体エネルギー研究所 | 半導体装置、及び半導体装置の作製方法 |
| EP1998373A3 (en) | 2005-09-29 | 2012-10-31 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device having oxide semiconductor layer and manufacturing method thereof |
| WO2007040194A1 (ja) | 2005-10-05 | 2007-04-12 | Idemitsu Kosan Co., Ltd. | Tft基板及びtft基板の製造方法 |
| JP5037808B2 (ja) * | 2005-10-20 | 2012-10-03 | キヤノン株式会社 | アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置 |
| JP5089139B2 (ja) | 2005-11-15 | 2012-12-05 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| KR101103374B1 (ko) | 2005-11-15 | 2012-01-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 |
| JP4846348B2 (ja) * | 2005-11-18 | 2011-12-28 | 株式会社 日立ディスプレイズ | 表示装置 |
| KR100754126B1 (ko) * | 2005-11-23 | 2007-08-30 | 삼성에스디아이 주식회사 | 액정표시장치 어레이 기판 및 그 제조방법 |
| JP5250929B2 (ja) | 2005-11-30 | 2013-07-31 | 凸版印刷株式会社 | トランジスタおよびその製造方法 |
| US20070146564A1 (en) * | 2005-12-23 | 2007-06-28 | Innolux Display Corp. | ESD protection circuit and driving circuit for LCD |
| TWI292281B (en) * | 2005-12-29 | 2008-01-01 | Ind Tech Res Inst | Pixel structure of active organic light emitting diode and method of fabricating the same |
| US7867636B2 (en) * | 2006-01-11 | 2011-01-11 | Murata Manufacturing Co., Ltd. | Transparent conductive film and method for manufacturing the same |
| JP4977478B2 (ja) * | 2006-01-21 | 2012-07-18 | 三星電子株式会社 | ZnOフィルム及びこれを用いたTFTの製造方法 |
| US7576394B2 (en) * | 2006-02-02 | 2009-08-18 | Kochi Industrial Promotion Center | Thin film transistor including low resistance conductive thin films and manufacturing method thereof |
| JP2007212699A (ja) * | 2006-02-09 | 2007-08-23 | Idemitsu Kosan Co Ltd | 反射型tft基板及び反射型tft基板の製造方法 |
| US7977169B2 (en) * | 2006-02-15 | 2011-07-12 | Kochi Industrial Promotion Center | Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof |
| JP2007220818A (ja) * | 2006-02-15 | 2007-08-30 | Kochi Prefecture Sangyo Shinko Center | 薄膜トランジスタ及びその製法 |
| US8222116B2 (en) * | 2006-03-03 | 2012-07-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP2007272203A (ja) | 2006-03-06 | 2007-10-18 | Nec Corp | 表示装置 |
| JP5110803B2 (ja) * | 2006-03-17 | 2012-12-26 | キヤノン株式会社 | 酸化物膜をチャネルに用いた電界効果型トランジスタ及びその製造方法 |
| KR20070101595A (ko) | 2006-04-11 | 2007-10-17 | 삼성전자주식회사 | ZnO TFT |
| US20070246778A1 (en) | 2006-04-21 | 2007-10-25 | Meng-Chi Liou | Electrostatic discharge panel protection structure |
| US20070252928A1 (en) | 2006-04-28 | 2007-11-01 | Toppan Printing Co., Ltd. | Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof |
| KR100847640B1 (ko) * | 2006-05-23 | 2008-07-21 | 가시오게산키 가부시키가이샤 | 표시장치 |
| JP2007316105A (ja) * | 2006-05-23 | 2007-12-06 | Casio Comput Co Ltd | 表示装置 |
| JP5028033B2 (ja) | 2006-06-13 | 2012-09-19 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
| KR101478810B1 (ko) | 2006-07-28 | 2015-01-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 축전 장치 |
| JP4609797B2 (ja) * | 2006-08-09 | 2011-01-12 | Nec液晶テクノロジー株式会社 | 薄膜デバイス及びその製造方法 |
| JP4404881B2 (ja) * | 2006-08-09 | 2010-01-27 | 日本電気株式会社 | 薄膜トランジスタアレイ、その製造方法及び液晶表示装置 |
| JP4999400B2 (ja) * | 2006-08-09 | 2012-08-15 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
| JP5127183B2 (ja) | 2006-08-23 | 2013-01-23 | キヤノン株式会社 | アモルファス酸化物半導体膜を用いた薄膜トランジスタの製造方法 |
| JP4332545B2 (ja) * | 2006-09-15 | 2009-09-16 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
| JP4274219B2 (ja) * | 2006-09-27 | 2009-06-03 | セイコーエプソン株式会社 | 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置 |
| JP5164357B2 (ja) * | 2006-09-27 | 2013-03-21 | キヤノン株式会社 | 半導体装置及び半導体装置の製造方法 |
| TWI857906B (zh) | 2006-09-29 | 2024-10-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| JP5116277B2 (ja) * | 2006-09-29 | 2013-01-09 | 株式会社半導体エネルギー研究所 | 半導体装置、表示装置、液晶表示装置、表示モジュール及び電子機器 |
| JP5468196B2 (ja) * | 2006-09-29 | 2014-04-09 | 株式会社半導体エネルギー研究所 | 半導体装置、表示装置及び液晶表示装置 |
| JP4932415B2 (ja) * | 2006-09-29 | 2012-05-16 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US7622371B2 (en) * | 2006-10-10 | 2009-11-24 | Hewlett-Packard Development Company, L.P. | Fused nanocrystal thin film semiconductor and method |
| KR20080034704A (ko) * | 2006-10-17 | 2008-04-22 | 삼성에스디아이 주식회사 | 유기 박막 트랜지스터 표시 기판 및 그 제조 방법 |
| US7772021B2 (en) * | 2006-11-29 | 2010-08-10 | Samsung Electronics Co., Ltd. | Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays |
| JP2008140684A (ja) * | 2006-12-04 | 2008-06-19 | Toppan Printing Co Ltd | カラーelディスプレイおよびその製造方法 |
| JP5305630B2 (ja) | 2006-12-05 | 2013-10-02 | キヤノン株式会社 | ボトムゲート型薄膜トランジスタの製造方法及び表示装置の製造方法 |
| KR101146574B1 (ko) | 2006-12-05 | 2012-05-16 | 캐논 가부시끼가이샤 | 산화물 반도체를 이용한 박막 트랜지스터의 제조방법 및 표시장치 |
| KR101363714B1 (ko) | 2006-12-11 | 2014-02-14 | 엘지디스플레이 주식회사 | 유기 박막트랜지스터, 그 제조 방법, 이를 이용한 정전기방지 소자, 액정표시장치 및 그 제조 방법 |
| JP5325415B2 (ja) * | 2006-12-18 | 2013-10-23 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US8514165B2 (en) | 2006-12-28 | 2013-08-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR100993420B1 (ko) | 2006-12-29 | 2010-11-09 | 엘지디스플레이 주식회사 | 액정표시장치 |
| KR101303578B1 (ko) * | 2007-01-05 | 2013-09-09 | 삼성전자주식회사 | 박막 식각 방법 |
| US8207063B2 (en) * | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
| KR100858088B1 (ko) * | 2007-02-28 | 2008-09-10 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법 |
| KR100851215B1 (ko) * | 2007-03-14 | 2008-08-07 | 삼성에스디아이 주식회사 | 박막 트랜지스터 및 이를 이용한 유기 전계 발광표시장치 |
| JP4727684B2 (ja) * | 2007-03-27 | 2011-07-20 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタおよびそれを用いた表示装置 |
| US7795613B2 (en) | 2007-04-17 | 2010-09-14 | Toppan Printing Co., Ltd. | Structure with transistor |
| KR101325053B1 (ko) * | 2007-04-18 | 2013-11-05 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
| KR20080094300A (ko) | 2007-04-19 | 2008-10-23 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법과 박막 트랜지스터를포함하는 평판 디스플레이 |
| KR101334181B1 (ko) | 2007-04-20 | 2013-11-28 | 삼성전자주식회사 | 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법 |
| CN101663762B (zh) * | 2007-04-25 | 2011-09-21 | 佳能株式会社 | 氧氮化物半导体 |
| JP5261979B2 (ja) | 2007-05-16 | 2013-08-14 | 凸版印刷株式会社 | 画像表示装置 |
| KR101345376B1 (ko) | 2007-05-29 | 2013-12-24 | 삼성전자주식회사 | ZnO 계 박막 트랜지스터 및 그 제조방법 |
| KR101508643B1 (ko) * | 2007-11-29 | 2015-04-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 및 전자기기 |
| US8202365B2 (en) * | 2007-12-17 | 2012-06-19 | Fujifilm Corporation | Process for producing oriented inorganic crystalline film, and semiconductor device using the oriented inorganic crystalline film |
| CN101911166B (zh) * | 2008-01-15 | 2013-08-21 | 株式会社半导体能源研究所 | 发光器件 |
| TWI469354B (zh) * | 2008-07-31 | 2015-01-11 | Semiconductor Energy Lab | 半導體裝置及其製造方法 |
| WO2010029866A1 (en) | 2008-09-12 | 2010-03-18 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| KR101829673B1 (ko) | 2008-09-12 | 2018-02-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
| JP4623179B2 (ja) * | 2008-09-18 | 2011-02-02 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法 |
| KR101803264B1 (ko) | 2008-09-19 | 2017-12-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| WO2010032619A1 (en) | 2008-09-19 | 2010-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| EP2172804B1 (en) * | 2008-10-03 | 2016-05-11 | Semiconductor Energy Laboratory Co, Ltd. | Display device |
| KR101803720B1 (ko) | 2008-10-03 | 2017-12-01 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
| CN101719493B (zh) | 2008-10-08 | 2014-05-14 | 株式会社半导体能源研究所 | 显示装置 |
| JP5451280B2 (ja) * | 2008-10-09 | 2014-03-26 | キヤノン株式会社 | ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置 |
-
2009
- 2009-09-24 KR KR1020177019951A patent/KR101803720B1/ko active Active
- 2009-09-24 WO PCT/JP2009/067118 patent/WO2010038819A1/en not_active Ceased
- 2009-09-24 KR KR1020167022259A patent/KR101761108B1/ko active Active
- 2009-09-24 KR KR1020117015512A patent/KR101273972B1/ko active Active
- 2009-09-24 KR KR1020117010133A patent/KR101652693B1/ko not_active Expired - Fee Related
- 2009-09-29 TW TW100123837A patent/TWI469302B/zh not_active IP Right Cessation
- 2009-09-29 TW TW98132970A patent/TWI469298B/zh not_active IP Right Cessation
- 2009-10-01 JP JP2009229378A patent/JP2010107976A/ja not_active Withdrawn
- 2009-10-01 US US12/571,552 patent/US7989815B2/en active Active
-
2011
- 2011-06-30 US US13/173,559 patent/US8334540B2/en active Active
-
2012
- 2012-12-06 US US13/706,589 patent/US8674371B2/en active Active
-
2013
- 2013-09-18 JP JP2013192573A patent/JP5766246B2/ja active Active
-
2015
- 2015-06-16 JP JP2015120826A patent/JP6010188B2/ja active Active
-
2016
- 2016-09-15 JP JP2016180092A patent/JP6317406B2/ja active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007250982A (ja) | 2006-03-17 | 2007-09-27 | Canon Inc | 酸化物半導体を用いた薄膜トランジスタ及び表示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160101725A (ko) | 2016-08-25 |
| WO2010038819A1 (en) | 2010-04-08 |
| KR101273972B1 (ko) | 2013-06-12 |
| JP6317406B2 (ja) | 2018-04-25 |
| TWI469302B (zh) | 2015-01-11 |
| US8334540B2 (en) | 2012-12-18 |
| US20110260159A1 (en) | 2011-10-27 |
| KR101803720B1 (ko) | 2017-12-01 |
| JP6010188B2 (ja) | 2016-10-19 |
| JP2017041639A (ja) | 2017-02-23 |
| JP2015213179A (ja) | 2015-11-26 |
| JP5766246B2 (ja) | 2015-08-19 |
| JP2010107976A (ja) | 2010-05-13 |
| JP2014042036A (ja) | 2014-03-06 |
| US20100084653A1 (en) | 2010-04-08 |
| KR20110086017A (ko) | 2011-07-27 |
| US7989815B2 (en) | 2011-08-02 |
| US20130092934A1 (en) | 2013-04-18 |
| US8674371B2 (en) | 2014-03-18 |
| KR101652693B1 (ko) | 2016-09-01 |
| TW201030923A (en) | 2010-08-16 |
| TWI469298B (zh) | 2015-01-11 |
| KR20110083760A (ko) | 2011-07-20 |
| KR20170086144A (ko) | 2017-07-25 |
| TW201143010A (en) | 2011-12-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7748598B1 (ja) | 表示装置 | |
| KR101761108B1 (ko) | 반도체 장치 | |
| KR101794754B1 (ko) | 표시 장치 | |
| KR101764623B1 (ko) | 반도체 장치 | |
| KR101507324B1 (ko) | 표시 장치 | |
| JP2025186396A (ja) | 半導体装置 | |
| KR101657957B1 (ko) | 표시 장치 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A107 | Divisional application of patent | ||
| A201 | Request for examination | ||
| PA0104 | Divisional application for international application |
Comment text: Divisional Application for International Patent Patent event code: PA01041R01D Patent event date: 20160816 Application number text: 1020117010133 Filing date: 20110503 |
|
| PA0201 | Request for examination | ||
| A302 | Request for accelerated examination | ||
| PA0302 | Request for accelerated examination |
Patent event date: 20160818 Patent event code: PA03022R01D Comment text: Request for Accelerated Examination |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20160822 Patent event code: PE09021S01D |
|
| PG1501 | Laying open of application | ||
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20170227 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20160822 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
| AMND | Amendment | ||
| PX0901 | Re-examination |
Patent event code: PX09011S01I Patent event date: 20170227 Comment text: Decision to Refuse Application |
|
| PX0701 | Decision of registration after re-examination |
Patent event date: 20170419 Comment text: Decision to Grant Registration Patent event code: PX07013S01D Patent event date: 20170331 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I Patent event date: 20170227 Comment text: Decision to Refuse Application Patent event code: PX07011S01I |
|
| X701 | Decision to grant (after re-examination) | ||
| A107 | Divisional application of patent | ||
| PA0104 | Divisional application for international application |
Comment text: Divisional Application for International Patent Patent event code: PA01041R01D Patent event date: 20170718 Application number text: 1020117010133 Filing date: 20110503 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20170719 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20170719 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| PR1001 | Payment of annual fee |
Payment date: 20200618 Start annual number: 4 End annual number: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20210617 Start annual number: 5 End annual number: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20220615 Start annual number: 6 End annual number: 6 |
|
| PR1001 | Payment of annual fee |
Payment date: 20230615 Start annual number: 7 End annual number: 7 |
|
| PR1001 | Payment of annual fee |
Payment date: 20240619 Start annual number: 8 End annual number: 8 |
|
| PR1001 | Payment of annual fee |
Payment date: 20250616 Start annual number: 9 End annual number: 9 |