KR101623224B1 - 반도체 장치 및 반도체 장치의 제조 방법 - Google Patents
반도체 장치 및 반도체 장치의 제조 방법 Download PDFInfo
- Publication number
- KR101623224B1 KR101623224B1 KR1020117008275A KR20117008275A KR101623224B1 KR 101623224 B1 KR101623224 B1 KR 101623224B1 KR 1020117008275 A KR1020117008275 A KR 1020117008275A KR 20117008275 A KR20117008275 A KR 20117008275A KR 101623224 B1 KR101623224 B1 KR 101623224B1
- Authority
- KR
- South Korea
- Prior art keywords
- electrode layer
- layer
- source
- region
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/062—Light-emitting semiconductor devices having field effect type light-emitting regions, e.g. light-emitting High-Electron Mobility Transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Electrodes Of Semiconductors (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2008-234603 | 2008-09-12 | ||
| JP2008234603 | 2008-09-12 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167012664A Division KR20160063402A (ko) | 2008-09-12 | 2009-08-21 | 디스플레이 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20110063828A KR20110063828A (ko) | 2011-06-14 |
| KR101623224B1 true KR101623224B1 (ko) | 2016-05-20 |
Family
ID=42005117
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020117008275A Expired - Fee Related KR101623224B1 (ko) | 2008-09-12 | 2009-08-21 | 반도체 장치 및 반도체 장치의 제조 방법 |
| KR1020177005751A Active KR101812935B1 (ko) | 2008-09-12 | 2009-08-21 | 디스플레이 장치 |
| KR1020167012664A Ceased KR20160063402A (ko) | 2008-09-12 | 2009-08-21 | 디스플레이 장치 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020177005751A Active KR101812935B1 (ko) | 2008-09-12 | 2009-08-21 | 디스플레이 장치 |
| KR1020167012664A Ceased KR20160063402A (ko) | 2008-09-12 | 2009-08-21 | 디스플레이 장치 |
Country Status (5)
| Country | Link |
|---|---|
| US (4) | US9257594B2 (enExample) |
| JP (9) | JP2010093238A (enExample) |
| KR (3) | KR101623224B1 (enExample) |
| TW (6) | TWI711146B (enExample) |
| WO (1) | WO2010029859A1 (enExample) |
Families Citing this family (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4968258B2 (ja) | 2006-06-02 | 2012-07-04 | 日立化成工業株式会社 | 光半導体素子搭載用パッケージおよびこれを用いた光半導体装置 |
| KR101644406B1 (ko) * | 2008-09-12 | 2016-08-01 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
| KR101545460B1 (ko) * | 2008-09-12 | 2015-08-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 생산 방법 |
| KR101507324B1 (ko) * | 2008-09-19 | 2015-03-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
| CN101719493B (zh) | 2008-10-08 | 2014-05-14 | 株式会社半导体能源研究所 | 显示装置 |
| JP5484853B2 (ja) | 2008-10-10 | 2014-05-07 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| TWI606593B (zh) | 2008-11-28 | 2017-11-21 | 半導體能源研究所股份有限公司 | 半導體裝置和其製造方法 |
| KR101218090B1 (ko) * | 2009-05-27 | 2013-01-18 | 엘지디스플레이 주식회사 | 산화물 박막 트랜지스터 및 그 제조방법 |
| CN102484135B (zh) * | 2009-09-04 | 2016-01-20 | 株式会社东芝 | 薄膜晶体管及其制造方法 |
| WO2011043164A1 (en) * | 2009-10-09 | 2011-04-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the semiconductor device |
| WO2011043162A1 (en) * | 2009-10-09 | 2011-04-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the semiconductor device |
| WO2011048925A1 (en) | 2009-10-21 | 2011-04-28 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| KR101747158B1 (ko) | 2009-11-06 | 2017-06-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치를 제작하기 위한 방법 |
| KR101299255B1 (ko) | 2009-11-06 | 2013-08-22 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| CN102598279B (zh) | 2009-11-06 | 2015-10-07 | 株式会社半导体能源研究所 | 半导体装置 |
| KR101805378B1 (ko) * | 2010-01-24 | 2017-12-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치와 이의 제조 방법 |
| CN104465408B (zh) | 2010-04-23 | 2017-09-15 | 株式会社半导体能源研究所 | 半导体装置及半导体装置的制造方法 |
| KR101540039B1 (ko) | 2010-04-23 | 2015-07-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치의 제작 방법 |
| WO2011132591A1 (en) * | 2010-04-23 | 2011-10-27 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| WO2011155302A1 (en) * | 2010-06-11 | 2011-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8519387B2 (en) * | 2010-07-26 | 2013-08-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing |
| US8422272B2 (en) | 2010-08-06 | 2013-04-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method thereof |
| TWI562285B (en) * | 2010-08-06 | 2016-12-11 | Semiconductor Energy Lab Co Ltd | Semiconductor device and method for manufacturing the same |
| US8816425B2 (en) | 2010-11-30 | 2014-08-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP5636304B2 (ja) * | 2011-02-08 | 2014-12-03 | 株式会社ジャパンディスプレイ | 薄膜トランジスタ回路基板及びその製造方法 |
| TWI658516B (zh) | 2011-03-11 | 2019-05-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置的製造方法 |
| US8797303B2 (en) | 2011-03-21 | 2014-08-05 | Qualcomm Mems Technologies, Inc. | Amorphous oxide semiconductor thin film transistor fabrication method |
| US8541266B2 (en) * | 2011-04-01 | 2013-09-24 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US9960278B2 (en) * | 2011-04-06 | 2018-05-01 | Yuhei Sato | Manufacturing method of semiconductor device |
| US9379254B2 (en) | 2011-11-18 | 2016-06-28 | Qualcomm Mems Technologies, Inc. | Amorphous oxide semiconductor thin film transistor fabrication method |
| US9742378B2 (en) * | 2012-06-29 | 2017-08-22 | Semiconductor Energy Laboratory Co., Ltd. | Pulse output circuit and semiconductor device |
| JP6310194B2 (ja) * | 2012-07-06 | 2018-04-11 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| TWI627483B (zh) | 2012-11-28 | 2018-06-21 | 半導體能源研究所股份有限公司 | 顯示裝置及電視接收機 |
| US8835236B2 (en) | 2013-02-08 | 2014-09-16 | Chunghwa Picture Tubes, Ltd. | Oxide semiconductor thin film transistor and method for manufacturing the same |
| JP6391917B2 (ja) * | 2013-07-03 | 2018-09-19 | 株式会社ジャパンディスプレイ | 発光素子表示装置及びその製造方法 |
| JP2017201651A (ja) * | 2016-05-02 | 2017-11-09 | 株式会社神戸製鋼所 | 酸化物半導体の製造方法 |
| WO2018004629A1 (en) * | 2016-06-30 | 2018-01-04 | Intel Corporation | Integrated circuit die having back-end-of-line transistors |
| CN106229347B (zh) * | 2016-08-24 | 2019-06-07 | 武汉华星光电技术有限公司 | 一种低温多晶硅薄膜晶体管及其制造方法 |
| KR102691132B1 (ko) * | 2016-10-31 | 2024-08-01 | 엘지디스플레이 주식회사 | 액정표시장치 |
| WO2018150620A1 (ja) | 2017-02-16 | 2018-08-23 | 三菱電機株式会社 | 薄膜トランジスタ、薄膜トランジスタ基板、液晶表示装置、及び、薄膜トランジスタ基板の製造方法 |
| WO2018211351A1 (en) * | 2017-05-19 | 2018-11-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display device, and method for manufacturing semiconductor device |
| CN110692125B (zh) * | 2017-05-31 | 2023-10-27 | 夏普株式会社 | 有源矩阵基板及其制造方法 |
| KR102441566B1 (ko) * | 2017-08-07 | 2022-09-07 | 삼성디스플레이 주식회사 | 발광 장치 및 발광 장치의 제조 방법 |
| CN107768307A (zh) * | 2017-11-21 | 2018-03-06 | 深圳市华星光电半导体显示技术有限公司 | 背沟道蚀刻型tft基板及其制作方法 |
| KR102126553B1 (ko) * | 2017-12-19 | 2020-06-24 | 엘지디스플레이 주식회사 | 표시 장치 |
| KR102418612B1 (ko) | 2018-01-03 | 2022-07-08 | 엘지전자 주식회사 | 이동 단말기 |
| CN108321152B (zh) * | 2018-04-04 | 2024-10-18 | 京东方科技集团股份有限公司 | 指纹识别传感器及其制备方法以及指纹识别设备 |
| GB2574265B (en) * | 2018-06-01 | 2022-04-06 | Flexenable Ltd | Transistor Arrays |
| JP2020141001A (ja) * | 2019-02-27 | 2020-09-03 | キオクシア株式会社 | 半導体装置および半導体装置の製造方法 |
| TWI813217B (zh) * | 2021-12-09 | 2023-08-21 | 友達光電股份有限公司 | 半導體裝置及其製造方法 |
| KR102749453B1 (ko) * | 2022-06-21 | 2024-12-31 | 국민대학교산학협력단 | 초박형 핀 led 소자 및 이를 포함하는 잉크조성물 |
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2009
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