KR101533222B1 - 표시 장치 - Google Patents

표시 장치 Download PDF

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Publication number
KR101533222B1
KR101533222B1 KR1020090093761A KR20090093761A KR101533222B1 KR 101533222 B1 KR101533222 B1 KR 101533222B1 KR 1020090093761 A KR1020090093761 A KR 1020090093761A KR 20090093761 A KR20090093761 A KR 20090093761A KR 101533222 B1 KR101533222 B1 KR 101533222B1
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South Korea
Prior art keywords
layer
wiring
oxide semiconductor
semiconductor layer
gate electrode
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Expired - Fee Related
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KR1020090093761A
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English (en)
Korean (ko)
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KR20100038155A (ko
Inventor
순페이 야마자키
켄고 아키모토
시게키 코모리
히데키 유오치
토모야 후타무라
타카히로 카사하라
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가부시키가이샤 한도오따이 에네루기 켄큐쇼
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Publication of KR20100038155A publication Critical patent/KR20100038155A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/751—Insulated-gate field-effect transistors [IGFET] having composition variations in the channel regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/62—Electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0221—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H10D86/443—Interconnections, e.g. scanning lines adapted for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices

Landscapes

  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Liquid Crystal Display Device Control (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Control Of El Displays (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
KR1020090093761A 2008-10-03 2009-10-01 표시 장치 Expired - Fee Related KR101533222B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-259060 2008-10-03
JP2008259060 2008-10-03

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020140045199A Division KR20140062007A (ko) 2008-10-03 2014-04-16 표시 장치

Publications (2)

Publication Number Publication Date
KR20100038155A KR20100038155A (ko) 2010-04-13
KR101533222B1 true KR101533222B1 (ko) 2015-07-02

Family

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Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020090093761A Expired - Fee Related KR101533222B1 (ko) 2008-10-03 2009-10-01 표시 장치
KR1020140045199A Ceased KR20140062007A (ko) 2008-10-03 2014-04-16 표시 장치
KR1020160143180A Active KR101794754B1 (ko) 2008-10-03 2016-10-31 표시 장치
KR1020170144564A Ceased KR20170125307A (ko) 2008-10-03 2017-11-01 표시 장치

Family Applications After (3)

Application Number Title Priority Date Filing Date
KR1020140045199A Ceased KR20140062007A (ko) 2008-10-03 2014-04-16 표시 장치
KR1020160143180A Active KR101794754B1 (ko) 2008-10-03 2016-10-31 표시 장치
KR1020170144564A Ceased KR20170125307A (ko) 2008-10-03 2017-11-01 표시 장치

Country Status (6)

Country Link
US (4) US8368066B2 (enExample)
EP (1) EP2172804B1 (enExample)
JP (8) JP5534769B2 (enExample)
KR (4) KR101533222B1 (enExample)
CN (2) CN101713897B (enExample)
TW (5) TWI655781B (enExample)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
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KR101722409B1 (ko) * 2008-09-19 2017-04-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101507324B1 (ko) * 2008-09-19 2015-03-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
EP2172804B1 (en) * 2008-10-03 2016-05-11 Semiconductor Energy Laboratory Co, Ltd. Display device
KR101273972B1 (ko) 2008-10-03 2013-06-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치
CN101719493B (zh) 2008-10-08 2014-05-14 株式会社半导体能源研究所 显示装置
JP2010153802A (ja) * 2008-11-20 2010-07-08 Semiconductor Energy Lab Co Ltd 半導体装置及び半導体装置の作製方法
WO2011004755A1 (en) 2009-07-10 2011-01-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR101759504B1 (ko) 2009-10-09 2017-07-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 표시 장치 및 이를 포함한 전자 기기
KR101847656B1 (ko) * 2009-10-21 2018-05-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제조 방법
IN2012DN04871A (enExample) 2009-12-11 2015-09-25 Semiconductor Energy Laoboratory Co Ltd
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US8653514B2 (en) * 2010-04-09 2014-02-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
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US8558960B2 (en) * 2010-09-13 2013-10-15 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and method for manufacturing the same
US8835917B2 (en) * 2010-09-13 2014-09-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, power diode, and rectifier
WO2012043971A2 (ko) * 2010-09-29 2012-04-05 포항공과대학교 산학협력단 롤 형상의 모기판을 이용한 플렉서블 전자소자의 제조방법, 플렉서블 전자소자 및 플렉서블 기판
KR101318601B1 (ko) 2010-12-01 2013-10-15 샤프 가부시키가이샤 Tft 기판 및 tft 기판의 제조 방법
US9443984B2 (en) 2010-12-28 2016-09-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
TWI621121B (zh) 2011-01-05 2018-04-11 Semiconductor Energy Laboratory Co., Ltd. 儲存元件、儲存裝置、及信號處理電路
TWI535032B (zh) * 2011-01-12 2016-05-21 半導體能源研究所股份有限公司 半導體裝置的製造方法
JP5859839B2 (ja) 2011-01-14 2016-02-16 株式会社半導体エネルギー研究所 記憶素子の駆動方法、及び、記憶素子
TWI567735B (zh) 2011-03-31 2017-01-21 半導體能源研究所股份有限公司 記憶體電路，記憶體單元，及訊號處理電路
KR20190039345A (ko) * 2011-06-17 2019-04-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그의 제조 방법
TWI457885B (zh) * 2012-04-02 2014-10-21 Au Optronics Corp 顯示裝置
US9153699B2 (en) * 2012-06-15 2015-10-06 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor with multiple oxide semiconductor layers
CN108054175A (zh) 2012-08-03 2018-05-18 株式会社半导体能源研究所 半导体装置
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TWI611511B (zh) 2012-08-31 2018-01-11 半導體能源研究所股份有限公司 半導體裝置
KR102400509B1 (ko) 2012-09-13 2022-05-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
KR101942489B1 (ko) * 2012-10-17 2019-01-28 삼성디스플레이 주식회사 박막 트랜지스터 기판 및 이를 포함하는 유기 발광 표시 장치
TWI618075B (zh) 2012-11-06 2018-03-11 半導體能源研究所股份有限公司 半導體裝置及其驅動方法
TWI882464B (zh) 2012-11-28 2025-05-01 日商半導體能源研究所股份有限公司 顯示裝置
TWI627483B (zh) 2012-11-28 2018-06-21 半導體能源研究所股份有限公司 顯示裝置及電視接收機
KR102798241B1 (ko) 2012-12-25 2025-04-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR102241249B1 (ko) 2012-12-25 2021-04-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 저항 소자, 표시 장치, 및 전자기기
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KR102112367B1 (ko) 2013-02-12 2020-05-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
TWI611566B (zh) 2013-02-25 2018-01-11 半導體能源研究所股份有限公司 顯示裝置和電子裝置
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JP6151070B2 (ja) * 2013-04-11 2017-06-21 株式会社ジャパンディスプレイ 薄膜トランジスタ及びそれを用いた表示装置
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KR102294507B1 (ko) * 2013-09-06 2021-08-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP6442321B2 (ja) 2014-03-07 2018-12-19 株式会社半導体エネルギー研究所 半導体装置及びその駆動方法、並びに電子機器
TWI538177B (zh) * 2014-04-15 2016-06-11 友達光電股份有限公司 光感應裝置及其製作方法
CN103969874B (zh) * 2014-04-28 2017-02-15 京东方科技集团股份有限公司 液晶面板及制作方法、半透半反显示装置及显示控制方法
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CN104716145B (zh) * 2015-03-27 2018-03-20 京东方科技集团股份有限公司 一种显示基板及其制造方法、显示装置
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TWI745515B (zh) * 2017-12-22 2021-11-11 啟耀光電股份有限公司 電子裝置與其製造方法
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