KR100928840B1 - 기판처리장치 및 반응용기의 착탈 방법 - Google Patents
기판처리장치 및 반응용기의 착탈 방법 Download PDFInfo
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- KR100928840B1 KR100928840B1 KR1020070090375A KR20070090375A KR100928840B1 KR 100928840 B1 KR100928840 B1 KR 100928840B1 KR 1020070090375 A KR1020070090375 A KR 1020070090375A KR 20070090375 A KR20070090375 A KR 20070090375A KR 100928840 B1 KR100928840 B1 KR 100928840B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
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- H—ELECTRICITY
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49799—Providing transitory integral holding or handling portion
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4981—Utilizing transitory attached element or associated separate material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
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Abstract
Description
Claims (17)
- 기판을 처리하는 처리실을 안쪽에 가지는 반응용기와,상기 반응용기의 외주측으로부터 상기 기판을 가열하는 가열 장치와,상기 처리실을 폐색(閉塞)하는 개체(蓋體)와,상기 반응용기의 안쪽벽에 상기 반응용기의 하단보다 윗쪽에 설치되는 지지부와,상기 반응용기를 상기 가열 장치 내로부터 착탈할 때에 상기 개체에 재치되고, 상면이 상기 지지부에 맞닿는 것과 함께 상기 반응용기의 하단과는 비접촉으로 되는 착탈 치구를 포함하는 것을 특징으로 하는 기판처리장치.
- 제 1항에 있어서, 상기 지지부에는, 상기 반응용기를 상기 가열 장치내로부터 착탈하는 경우에 있어서, 상기 착탈 치구에 맞닿을 때, 상기 반응용기의 중량이 가중되는 것을 특징으로 하는 기판처리장치.
- 제 1항에 있어서, 상기 착탈 치구는, 적어도 상기 지지부와 맞닿는 개소의 수직 방향의 두께(T)가, 상기 반응용기의 하단과 상기 지지부의 하단과의 사이의 수직 방향의 길이(L)보다 두껍도록 구성되어 있는 것을 특징으로 하는 기판처리장치.
- 삭제
- 제 1항에 있어서, 상기 반응용기는, 반응관과 상기 반응관의 하단을 보지하며 상기 지지부를 포함하는 보지구로 구성되어 있는 것을 특징으로 하는 기판처리장치.
- 삭제
- 삭제
- 삭제
- 삭제
- 제 1항에 있어서, 상기 처리실의 하부측에 연설하는 예비실과,상기 예비실 일측면에 인접하는 메인트넌스 영역와 연통 가능하게 설치되고,상기 반응용기의 상기 지지부에서 상기 착탈 치구가 상기 반응용기를 지지한 상태에서, 상기 예비실과 상기 메인트넌스 영역와의 사이를 수평 이동 가능하도록 상기 일측면에 개구된 개구부를 포함하는 것을 특징으로 하는 기판처리장치.
- 제 10항에 있어서, 상기 개구부는, 상기 반응용기의 하단과 상기 착탈 치구의 상면이 맞닿아 상기 반응용기가 지지된 상태에서는, 상기 예비실과 상기 메인트넌스 영역과의 사이를 수평 이동할 수 없도록 개구되어 있는 것을 특징으로 하는 기판처리장치.
- 기판을 처리하는 처리실을 안쪽에 가지는 반응용기와,상기 반응용기의 외주측으로부터 상기 기판을 가열하는 가열 장치와,상기 처리실을 폐색 하는 개체와,상기 반응용기의 안쪽벽에 상기 반응용기의 하단보다 윗쪽에 설치되는 지지부와,상기 반응용기를 상기 가열 장치 내에 장착할 때에 상기 개체에 재치되고, 상면이 상기 지지부에 맞닿는 것과 함께 상기 반응용기의 하단과는 비접촉으로 되는 착탈 치구를 포함하는 것을 특징으로 하는 기판처리장치.
- 착탈 치구를 반응용기의 안쪽에 설치된 처리실을 폐색하는 개체에 재치하는 공정과,상기 반응용기의 내벽에 상기 반응용기의 하단보다 윗쪽에 설치되는 지지부와 상기 개체에 재치된 상기 착탈 치구의 상면이 맞닿는 것과 함께 상기 착탈 치구와 상기 반응용기의 하단이 비접촉인 상태에서, 상기 반응용기를 가열 장치 내에 장착하는 공정을 포함하는 것을 특징으로 하는 반응용기의 착탈 방법.
- 삭제
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- 반응용기의 내벽에 상기 반응용기의 하단보다 윗쪽에 설치되는 지지부와 개체에 재치된 착탈 치구의 상면이 맞닿는 것과 함께 상기 착탈 치구와 상기 반응용기의 하단은 비접촉인 상태에서, 상기 반응용기를 가열 장치 내에 장착하는 공정과,상기 착탈 치구를 상기 개체로부터 떼어내는 공정과,상기 장착된 반응용기의 안쪽에 있는 처리실을 상기 개체로 폐색해 상기 반응용기의 외주측으로부터 상기 가열 장치에 의해 기판을 가열해 처리하는 공정을 포함하는 것을 특징으로 하는 반도체 장치의 제조 방법.
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JP2006258660A JP4814038B2 (ja) | 2006-09-25 | 2006-09-25 | 基板処理装置および反応容器の着脱方法 |
JPJP-P-2006-00258660 | 2006-09-25 |
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KR20080027723A KR20080027723A (ko) | 2008-03-28 |
KR100928840B1 true KR100928840B1 (ko) | 2009-11-30 |
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US20080083109A1 (en) | 2008-04-10 |
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