KR100768539B1 - 반도체 방사 에미터 패키지 - Google Patents
반도체 방사 에미터 패키지 Download PDFInfo
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- KR100768539B1 KR100768539B1 KR1020017011732A KR20017011732A KR100768539B1 KR 100768539 B1 KR100768539 B1 KR 100768539B1 KR 1020017011732 A KR1020017011732 A KR 1020017011732A KR 20017011732 A KR20017011732 A KR 20017011732A KR 100768539 B1 KR100768539 B1 KR 100768539B1
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Abstract
Description
이것은 장치의 복잡성 및 코스트을 증가시키고 또한 본 발명의 다른 기타점에서는 우수한 열적 성능을 약간 손상할 가능성이 있지만, 특정의 실시의 형태에서 바람직한 것이다.
Claims (166)
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- 반도체 발광 에미터 패키지에 있어서,두 개 이상의 전기 도선과;제 1 표면과 이 제 1표면과 대향하는 제 2 표면을 지닌 열추출부재와;상기 열추출부재의 제 1 면에 설치된 하나 이상의 반도체 방사 에미터를 구비하며,상기 두 개 이상의 전기도선이 상기 하나 이상의 반도체 방사 에미터에 전기적으로 접속되어 있으며, 상기 하나 이상의 반도체 방사 에미터는 반도체 방사 에미터 패키지가 백색광을 방사하도록 선택되며;또한, 상기 하나 이상의 반도체 방사 에미터, 상기 하나 이상의 전기도선 및 상기 열추출부재의 일부를 덮도록 형성된 봉입재를 구비하며,상기 봉입재는 상기 열추출부재의 제 2 표면의 일부를 노출시키도록 형성되어 있으며, 이 열추출부재의 노출된 일부는 상기 하나 이상의 반도체 방사 에미터가 설치된 제 1 표면상의 위치에 정반대인 영역을 포함하여, 상기 봉입재의 일부는 상기 하나 이상의 반도체 방사 에미터로부터 방사된 방사의 실질적인 부분에 대해 투명하며;상기 열추출부재는 일차열통로를 하나 이상의 반도체 방사 에미터로부터 장치밖에 제공하며, 상기 전기도선은 이차열통로를 상기 하나 이상의 반도체 방사 에미터로부터 장치밖으로 제공하며, 상기 이차 열 통로는 상기 일차 열통로보다 큰 열저항을 처리를 하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 반도체 방사 에미터 패키지에 있어서,열추출부재와;상기 열추출부재보다 큰 열 저항을 갖는 두 개 이상의 전기도선과;상기 열추출부재의 제 1 표면에 설치된 하나 이상의 반도체 방사 에미터를 구비하며,상기 하나이상의 반도체 방사 에미터가 구동할 때, 반도체 방사 에미터 패키지는 백색광을 방사 하며;또한, 상기 하나 이상의 반도체 방사 에미터를 덮는 봉입재를 구비하며,상기 봉입재가 일부는 상기 하나 이상의 반도체 방사 에미터에 의해 방사된 파장에 대해 투명하며, 상기 봉입재가 상기 열추출부재의 제 1표면의 일부를 덮으면서, 제 1 표면과 반대인 상기 열추출 부재의 제 2 표면의 일부를 노출시키며, 제 2 표면의 노출된 일부는 하나 이상의 반도체 방사 에미터가 설치된 제 1표면의 영역과 정반대인 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 반도체 방사 에미터 패키지에 있어서,열추출부재와;상기 열추출부재보다 열 저항이 큰 두 개 이상의 전기 도선을 구비하며,상기 열추출 부재는 상기 전기도선의 두께보다 큰 반도체 방사 에미터 패키지로부터 방사된 방향에 평행한 방향으로 두께를 갖으며;또한, 상기 열추출부재에 설치된 하나 이상의 반도체 방사 에미터를 구비하며,이 반도체 방사 에미터 패키지는 백색광을 방사 하며;그리고, 하나 이상의 반도체 방사 에미터를 포위하는 봉입재를 구비하며,상기 봉입재의 일부가 상기 하나 이상의 반도체 방사 에미터에 의해 방사된 파장에 투명한 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 반도체 방사 에미터 패키지에 있어서,열추출부재와;상기 열추출부보다 큰 열저항을 갖는 두 개 이상의 전기도선과;상기 열추출부재의 제 1 표면상에 설치된 하나이상의 반도체 방사 에미터를 구비하며,상기 하나이상의 반도체 방사 에미터가 구동할 때, 반도체 방사 에미터 패키지는 백색광을 방사하며;또한, 제 1 경질 성형 화합물과 제 2 경질 성형 화합물을 구비하며,상기 제 1 경질 성형 화합물은 상기 하나 이상의 반도체 방사 에미터에 의해 방사된 방사에 대해 투명하고 상기 하나 이상의 반도체 방사 에미터로부터 방사한 방사의 광 통로 내에 제공되어 있으며;상기 제 2 경질 성형 화합물은 상기 열추출부재의 제 1 표면의 일부를 덮음과 아울러 제 1 표면에 반대인 상기 열추출부재의 제 2 표면의 일부를 노출시키며, 제 2 표면의 노출된 일부는 상기 하나 이상의 반도체 방사 에미터가 설치된 제 1 표면의 영역에 정반대인 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 반도체 방사 에미터 패키지에 있어서,열추출부재와;상기 열추출부재보다 큰 열 저항성을 갖는 두 개 이상의 전기도선을 구비하며, 상기 열추출부재는 방사가 상기 전기 도선의 두께보다 큰 반도체 방사 에미터 패키지로부터 방사된 방향에 평행한 방향으로 두께를 가지며;또한, 상기 열추출부재에 설치된 하나 이상의 반도체 방사 에미터를 구비하고, 상기 하나 이상의 반도체 방사 에미터가 구동할 때, 반도체 방사 에미터 패키지는 백색광을 방사하며;또한, 상기 하나 이상의 반도체 방사 에미터를 덮는 제 1 경질 성형 화합물을 구비하며,상기 제 1 경질 성형 화합물의 일부가 상기 하나 이상의 반도체 방사 에미터에 의해 방사되는 파장에 대해 투명한 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 반도체 방사 에미터 패키지에 있어서,열추출부재와;상기 열추출부재보다 큰 열 저항을 갖는 두 개 이상의 전기 도선과;상기 열추출부재의 제 1 표면에 설치된 하나 이상의 반도체 방사 에미터와;하나 이상의 반도체 방사 에미터, 상기 열 추출 부재의 일부 및 상기 전기 도선의 일부를 포위하는 봉입재를 구비하며,상기 하나 이상의 반도체 방사 에미터와 상기 열추출부재의 가장 근접한 포위되지 않은 표면 사이의 통로에 직교하는 평면에서 측정된 상기 열추출부재의 단면면적은 패키지 동작 동안, 하나 이상의 반도체 방사 에미터와 전기도선의 가장 근접한 포위되지 않은 표면 사이의 열 흐름의 통로에 직교하는 통로에서 측정된 상기 각각의 전기 도선의 단면적 보다 크며, 상기 봉입재는 다수의 측을 형성하며, 상기 열추출부재는 상기 두 개의 측을 통해 밖으로 연장하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 반도체 방사 에미터 패키지에 있어서,열추출부재와;상기 열추출부재보다 큰 열저항을 갖는 두개 이상의 전기도선과;상기 열추출부재의 제 1 표면에 설치된 하나 이상의 반도체 방사에미터를 구비하며,하나 이상의 반도체 에미터가 구동할 때, 반도체 방사 에미터 패키지는 백색광을 방출하며;또한, 상기 하나 이상의 반도체 방사 에미터에 의해 방사된 방사에 대하여 투명한 제 1 경질 성형 화합물을 구비하며, 상기 제 1 경질 성형 화합물은 상기 하나이상의 반도체 방사 에미터로부터 방출된 방사의 광통로 내에 제공되며;또한, 상기 열추출부재의 일부를 덮음과 동시에 상기 열추출부재의 일부를 노출시키게 하는 제 2 경질 성형 화합물을 구비하고,상기 제 2 경질 성형 화합물은 상기 제1 경질 성형 화합물과 다르며, 상기 전기도선을 유지하도록 상기 전기 도선의 부분을 포위하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항, 제 81항, 제 83항, 제 85항 또는 제 86항 중 어느 한 항에 있어서,상기 열추출부재는 방사가 상기 전기 도선의 두께보다 큰 반도체 방사 에미터 패키지로부터 방출되는 방향에 평행한 방향으로 두께를 가지는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 87항에 있어서,열추출부재의 두께는 전기 도선의 두께의 3배인 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 82 또는 제84항에 있어서,열추출부재의 두께는 전기 도선의 3배인 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항, 제 81항, 제 82항 또는 제 85항 중 어느 한 항에 있어서,상기 봉입재는 제 1 경질 성형 화합물 및 제 2 경질 성형 화합물을 포함하며, 상기 제 1 경질 성형 화합물은 상기 하나 이상의 반도체 방사 에미터에 의해 방사된 방사에 대해 투명하고 상기 하나 이상의 반도체 방사 에미터로부터 방출된 방사의 광통로 내에 제공된 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 90항에 있어서,상기 제 2 경질 성형 화합물은 상기 열 추출 부재의 제 1 표면의 일부를 덮음과 아울러 제 1 표면에 반대인 상기 열추출 부재의 제 2 표면의 일부를 노출되게 하며, 제 2 표면의 노출된 일부는 상기 하나 이상의 반도체 방사 에미터가 설치된 제 1 표면의 영역에 정반대인 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 91항에 있어서,상기 제 2 경질 성형 화합물은 불투명한 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 83항 또는 제 84항에 있어서,상기 열추출 부재의 일부를 덮음과 아울러 상기 열추출부재의 일부를 노출시키는 제 2 경질 성형 화합물을 더 포함하며, 상기 제 2 경질 성형 화합물은 상기 제 1 경질 성형 화합물과 다르며 상기 전기 도선을 유지하도록 상기 전기 도선의 부분을 포위하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 93항에 있어서,상기 제2 경질 성형 화합물은 불투명한 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제86항에 있어서,상기 제 2 경질 성형 화합물은 불투명한 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 84항에 있어서,상기 제 1 경질 성형 화합물은 상기 열추출 부재의 일부와 상기 전기도선의 부분을 덮음과 아울러 상기 열추출부재와 상기 전기도선 모두의 부분을 덮혀지지 않게 하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 96항에 있어서,상기 하나 이상의 반도체 방사 에미터와 상기 열추출부재의 가장 근접한 덮혀 지지 않은 표면 사이의 통로에 직교하는 평면에서 측정된 상기 열추출부재의 단면적은 패키지의 동작 중, 상기 하나 이상의 반도체 방사 에미터와 상기 전기 도선의 가장 가까운 포위되지 않은 표면 사이의 열 흐름의 통로에 대해 직교하는 평면에서 측정된 각각의 상기 전기 도선의 단면적 보다 큰 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 86항에 있어서,상기 열추출부재는 하나 이상의 반도체 방사 에미터가 설치된 제 1 표면을 포함하며, 상기 제 2 경질 성형 화합물은 상기 열추출부재의 제 1 표면의 일부를 덮음과 동시에 제 1 표면에 반대인 상기 열추출부재의 제2표면의 일부를 노출시키며, 제 2 표면의 노출된 일부는 상기 하나 이상의 반도체 방사 에미터가 설치된 제 1 표면의 영역에 정반대인 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항 내지 제 86항 중 어느 한 항에 있어서,열추출부재는 하나 이상의 반도체 방사 에미터를 포함하는 디프레션(depression)을 포함하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 99항에 있어서,상기 디프레션은 광 반사 코팅으로 피복된 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80 내지 86항 중 어느 한 항에 있어서,하나 이상의 열추출부재는 봉입재로 덮여진 열추출부재의 일부 외측의 표면적을 증가하도록 하나 이상의 핀, 슬롯 및 구멍을 포함하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항, 제81항, 제82항 또는 제85항 중 어느 한 항에 있어서,봉입재의 일부는 렌즈로 형성된 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 83항, 제 84항 또는 제 86항 중 어느 한 항에 있어서,제 1 경질 성형 화합물의 일부는 렌즈로 형성된 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항, 제 81항, 제 82항 또는 제 85항 중 어느 한 항에 있어서,봉입재는 필러 성분과 벌크 성분을 포함하고, 필러 성분은 벌크 성분의 열팽창계수를 낮추고, 필러 성분은 벌크 성분의 굴절률에 정합하는 굴절률을 갖는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항, 제 81항, 제82항 또는 제 85항 중 어느 한 항에 있어서,봉입재는 반도체 방사 에미터 출력 방사를 확산하도록 작동하는 필러 성분을 포함하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 83항, 제 84항 또는 제 86항 중 어느 한 항에 있어서,제 1 경질 성형 화합물은 반도체 방사 에미터 출력 방사를 확산하도록 동작하는 필러 성분을 포함하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항 내지 제 86항 중 어느 한 항에 있어서,반도체 방사 에미터는 열추출부재와 전기 접촉하는 전도 베이스를 포함하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항 내지 제 86항 중 어느 한 항에 있어서,하나 이상의 반도체 방사 에미터는 발광 다이오드를 포함하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항 내지 제 86항 중 어느 한 항에 있어서,하나 이상의 반도체 방사 에미터는 광 방사 폴리머를 포함하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항 내지 86항 중 어느 한 항에 있어서,형광 재료를 더 포함하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 110항에 있어서,상기 형광 재료는 상기 봉입재 내에 확산 되는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 111항에 있어서,상기 형광 물질은 하나 이상의 형광 염료, 안료 및 형광체인 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항 내지 제 86항 중 어느 한 항에 있어서,열 추출 부재와 열접촉하는 히트싱크를 더 포함하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항, 제 81 항 또는 제 82항 중 어느 한 항에 있어서,상기 봉입재는 다수의 측을 형성하고;각각의 전기 도선은 제 1 세트의 봉입 재 측 중 하나를 통해 연장하며,상기 열추출부재는 하나이상의 제 2세트의 봉입재 측을 통해 연장하며, 제 2 세트의 봉입재 측은 제 1 세트의 봉입재 측과 다른 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 114항에 있어서,제 1 세트의 봉입재 측은 제1측을 포함하고 제 2 세트의 봉입재 측은 제 1 측과 대향하는 제 2측을 포함하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 114항에 있어서,제 1 세트의 봉입재측은 대향측을 포함하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제114항에 있어서,제 1세트의 봉입재 측은 대향측을 포함하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제86항에 있어서,상기 제 2 경질 성형 복합물은 다수의 측을 포함하고,각각의 상기 전기 도선은 제 1 세트의 측들 중 하나를 통해 연장하고;상기 열 추출 부재는 하나 이상의 제 2세트의 측을 통해 연장하고, 제 2 세트의 측은 제 1세트의 측과 다른 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항, 제 81항, 제 82항 또는 제 85항 중 어느 한 항에 있어서,두 개 이상의 상기 전도 도선은 상기 봉입재에 의해 유지되는 것을 특징으로 반도체 방사 에미터 패키지.
- 제 80항, 제 81항, 제 82항 또는 제 85항 중 어느 한 항에 있어서,상기 봉입재는 상기 열추출부재의 전체 표면적의 65%와 같거나 미만인 상기 열추출 부재의 일부를 덮는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항 내지 제 86항 중 어느 한 항에 있어서,상기 전기 도선과 상기 열추출 부재의 벌크는 동일한 재료로 이루어진 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항 내지 제 86항 중 어느 한 항에 있어서,상기 하나이상의 반도체 방사 에미터는 백색광을 형성하도록 혼합되는 2원 상보적 색상을 갖는 조명을 방출하는 두 개의 반도체 방사 에미터를 포함하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항 내지 제 86항 중 어느 한 항에 있어서,상기 하나 이상의 반도체 방사 에미터는 백색광을 형성하도록 혼합될 수 있는 3원 상보적 색상을 갖는 조명을 방출하는 3개의 반도체 방사 에미터를 포함하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 123항에 있어서,상기 3개의 반도체 방사 에미터 중 제 1 반도체 방사 에미터는 적색상을 갖는 광선을 방사하고, 상기 3개의 반도체 방사 에미터 중 제 2의 반도체 방사 에미터는 녹색상을 가지는 광선을 방사하고, 상기 3개의 반도체 방사 에미터 중 제 3의 반도체 방사 에미터는 청색상을 갖는 광선을 방사하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항 내지 제 86항 중 어느 한 항에 있어서,반도체 방사 에미터 패키지의 전력 용량은 150mW인 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항 내지 제 86항 중 어느 한 항에 있어서,열추출 부재에 형성된 하나 이상의 리세스 된 광 반사 컵을 더 포함하며, 상기 하나이상의 반도체 방사 에미터는 상기 하나 이상의 리세스된 광 반사 컵내에 설치되어 있으며, 상기 하나 이상의 리세스된 광 반사컵의 깊이는 상기 하나이상의 반도체 방사 에미터의 높이와 같거나 크며, 각각은 상기 하나 이상의 반도체 방사 에미터가 설치된 반사컵의 광축에 평행한 크기로 측정되는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항, 제 81항 또는 제 82항 중 어느 한 항에 있어서,하나이상의 반도체 방사 에미터와 상기 열추출부재의 가장 근접한 포위되지 않은 표면 사이의 통로에 직교하는 평면에서 측정된 상기 열추출부재의 단면적은 패키지 동작 동안, 상기 하나 이상의 반도체 방사 에미터와 상기 전기도선의 가장 근접한 포위되지 않은 표면 사이의 열 흐름의 통로에 직교하는 평면에서 측정된 각각의 전기 도선의 단면적 보다 큰 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항에 있어서,상기 봉입재는 상기 하나 이상의 반도체 방사 에미터로부터의 방사가 방출되는 상면을 포함하고, 상기 상면에 대향하는 저면을 더 포함하며, 상기 봉입재는 상기 열추출부재의 저면의 노출된 일부가 봉입재의 저면을 통해 노출되게 하도록 형성된 것을 특징으로 반도체 방사 에미터 패키지.
- 제 80 내지 제 86항 중 어느 한 항에 있어서,상기 열 추출 부재는 열 전도도가 높은 재료로 된 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 129항에 있어서,상기 재료는 세라믹 재료, 동, 동합금, 알류미늄, 연강(soft steel) 또는 기타 금속으로 이루어진 군으로부터 선택된 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항에 있어서,상기 반도체 방사 에미터로부터 상기 열추출부재의 저면의 노출된 일부까지의 열 통로는 상기 반도체 방사 에미터로부터 상기 전기도선이 상기 봉입재로부터 나온 위치까지의 열통로보다 짧은 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항에 있어서,상기 열추출부재의 노출된 일부는 열방사성이 강화된 코팅 재료로 코팅된 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 132항에 있어서,상기 코팅 재료는 니크롬, 흑산화물(black oxide)로 구성된 그룹으로부터 선택되는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항에 있어서,상기 열추출부재의 노출된 일부는 텍스쳐(texture)된 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 134항에 있어서,상기 열추출부재의 노출된 일부는 메트 최종물(matte finish)을 갖는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항에 있어서,열추출부재의 노출된 일부는 상기 하나 이상의 반도체 방사 에미터로부터의 광 방사 방출의 일차 방향과 대향 하는 영역을 포함하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항, 제 81 항, 제 82항 또는 제 85항 중 어느 한 항에 있어서,상기 봉입재는 두 개의 상이한 재료를 포함하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 137항에 있어서,상기 두 개의 상이한 재료 중 하나는 투명한 에폭시인 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 137항에 있어서,상기 두개의 상이한 재료 중 하나의 재료는 응력 완화 겔인 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 139항에 있어서,응력 완화 겔은 실리콘인 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 139항에 있어서,응력 완화 겔은 하나 이상의 반도체 방사 에미터에 걸쳐 접착되는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 141항에 있어서,상기 두 개의 상이한 재료 중 하나의 재료는 응력 완화 겔에 걸쳐 형성된 경질 성형 화합물인 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 142항에 있어서,상기 경질 성형 화합물은 에폭시인 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 137항에 있어서,상기 두개의 상이한 재료는 제 1 경질 성형 화합물과 제 2 경질 성형 화합물을 포함하는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 144항에 있어서,상기 제 1 경질 성형 화합물은 상기 하나 이상의 반도체 방사 에미터에 의해 방사된 방사에 대하여 투명한 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 145항에 있어서,상기 제 1 경질 성형 화합물은 상기 하나 이상의 반도체 방사 에미터의 광 통로내에 제공되어 있고 렌즈를 형성하도록 형상을 한 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 146항에 있어서,상기 제 2 경질 성형 화합물은 상기 하나 이상의 반도체 방사 에미터의 광통로내에 있지 않은 영역에 제공되는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 147항에 있어서,상기 제 2 경질 성형 소자는 불투명한 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 144항에 있어서,상기 제 2 경질 성형 화합물은 상기 봉입재가 상기 전기 도선에 유지되는 곳에 제공되는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항, 제81항, 제82항 또는 제 85항 중 어느 한 항에 있어서,상기 봉입재는 상기 열 추출 부재의 일부로 직접 성형 되는 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 86항에 있어서,상기 제 2 경질 성형 화합물은 상기 열추출부재의 일부로 직접 성형된 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항, 제 81 항, 제 82항 또는 제 86항 중 어느 한 항에 있어서,상기 봉입재는 다수의 측을 형성하며, 상기 열추출부재는 두 개의 측을 통해 밖으로 연장한 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항, 제 81항, 제82항 또는 제86항 중 어느 한 항에 있어서,상기 제 2 경질 성형 화합물은 다수의 측을 형성하고 상기 열추출 부재는 두개의 상기 측을 통해 밖으로 연장한 것을 특징으로 하는 반도체 방사 에미터 패키지.
- 제 80항, 제 81항, 제 82항 또는 제 86항 중 어느 한 항에 있어서,상기 봉입재는 단일의 투명한 재료로 된 것을 특징으로 하는 반도체 방사 반도체 패키지.
- 제 1 표면과 이 제 1 표면에 대향 하는 제 2 표면을 가지는 열추출 부재와;상기 열추출부재의 제 1 표면에 설치되어 광 통로를 따라 광을 방사 하는 LED칩과,이 LED칩은 상기 제 1 및 제 2 전기도선을 경유하여 구동하며, 상기 LED칩이 구동할 때, LED패키지는 백색광을 방사 할 수 있으며;또한, 상기 제 1 및 제 2 전기 도선의 일부, 상기 LED칩 및 상기 열 추출 부재의 일부를 덮는 봉입재를 구비하며,상기 봉입재는 상기 열추출부재의 제 2 표면의 일부로 노출되게 형성되어 있으며,상기 열 추출 부재의 노출된 일부는 상기 LED칩이 설치된 제 1 표면상의 위치에 정반대인 영역을 포함하며;상기 봉입재는 제 1 경질 성형 화합물과 제 2 경질 성형 화합물을 포함하는 두개의 다른 재료를 포함하고, 상기 제 1 경질 성형 화합물은 상기 LED칩에 의해 방사된 광에 대하여 투명하며, 상기 LED칩으로부터 방출된 광의 광 통로 내에 제공되어 렌즈를 형성되도록 형상을 하고 있으며, 상기 제 2 경질 성형 화합물은 상기 봉입재가 상기 전기 도선을 덮는 곳과 상기 LED칩으로부터 방사된 광의 광통로내에 있지 않은 영역에 제공되어 있으며, 상기 제 2 경질 성형 화합물은 투명하며,상기 LED칩과 상기 열추출부재의 가장 근접한 노출된 표면 사이의 통로에 직교하는 평면에서 측정된 상기 열추출 부재의 단면적은 패키지의 동작 중에 상기 LED칩과 상기 전기도선의 가장 근접한 노출된 표면의 통로에 직교하는 평면에서 측정된 각각의 전기도선의 단면적보다 크며,상기 봉입재는 다수의 측을 포함하며, 상기 제 1 및 제 2 전기 도선은 제 1 세트의 봉입재 측들 중 한 개를 통해 연장하고 있으며, 상기 열추출 부재는 두개이상의 측을 포함하는 하나이상의 제 2 세트의 봉입재 측을 통해 연장하고 있으며, 제 2 세트의 봉입재 측은 제 2 세트의 봉입재 측과 다르며,상기 열추출 부재는 광이 상기 전기도선의 두께보다 큰 LED패키지로부터 방사 되는 방향에 평행한 방향으로 두께를 갖는 것을 특징으로 하는 LED 패키지.
- 제 155항에 있어서,상기 제 1 및 제 2 경질 성형 화합물은 투명한 에폭시인 것을 특징으로 하는 LED 패키지.
- 제 155항에 있어서,상기 봉입재는 응력 완화 겔을 더 함유하는 것을 특징으로 하는 LED 패키지.
- 제157항에 있어서,응력 완화 겔은 실리콘인 것을 특징으로 하는 LED패키지.
- 제 157항에 있어서,응력 완화 겔은 상기 LED칩에 걸쳐 부착된 것을 특징으로 하는 LED 패키지.
- 제 155항에 있어서,상기 열 추출 부재의 상기 제 1 표면은 상기 전기 도선의 저면 전체 표면 아래의 평면에 위치한 저면이며, 상기 제 2 경질 성형 화합물은 상기 열추출 부재의 저면의 평면 아래로 연장하지 않은 것을 특징으로 하는 LED 패키지.
- 제 155항에 있어서,상기 봉입재의 상기 제 2 세트의 측은 인접 측을 포함하고, 상기 봉입재의 제 2 세트의 측은 상기 봉입재의 단일측을 포함하는 것을 특징으로 하는 LED 패키지.
- 제156항에 있어서,추가적인 LED칩을 더 포함하며, 상기 LED칩과 상기 추가적인 LED 칩은 백색광을 형성하도록 혼합될 수 있는 2원 상보적 색상을 광을 방사 하는 것을 특징으로 하는 LED패키지.
- 제 156항에 있어서,형광 재료를 더 포함하는 것을 특징으로 하는 LED패키지.
- 제 163항에 있어서,상기 형광 물질은 하나 이상의 형광염료, 안료 및 형광체인 것을 특징으로 하는 LED패키지.
- 제 156항에 있어서,LED패키지의 전력 용량은 150mV인 것을 특징으로 하는 LED패키지.
- 제 156항에 있어서,상기 제 2 경질 성형 화합물은 상기 열추출부재의 일부에 직접적으로 성형 된 것을 특징으로 하는 LED패키지.
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JP2002539623A (ja) | 2002-11-19 |
US7253448B2 (en) | 2007-08-07 |
JP2005005740A (ja) | 2005-01-06 |
US6335548B1 (en) | 2002-01-01 |
EP1169735A1 (en) | 2002-01-09 |
US6828170B2 (en) | 2004-12-07 |
CA2373368C (en) | 2008-02-05 |
US20050077623A1 (en) | 2005-04-14 |
CA2373368A1 (en) | 2000-09-21 |
US20020004251A1 (en) | 2002-01-10 |
EP1169735A4 (en) | 2003-08-06 |
EP1169735B1 (en) | 2009-02-04 |
ATE422269T1 (de) | 2009-02-15 |
JP3850665B2 (ja) | 2006-11-29 |
DE60041513D1 (de) | 2009-03-19 |
KR20010114224A (ko) | 2001-12-31 |
WO2000055914A1 (en) | 2000-09-21 |
AU3899500A (en) | 2000-10-04 |
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J301 | Trial decision |
Free format text: TRIAL NUMBER: 2019130000010; TRIAL DECISION FOR INVALIDATION REQUESTED 20190111 Effective date: 20190122 |