JP5883646B2 - 発光装置の製造方法 - Google Patents
発光装置の製造方法 Download PDFInfo
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- JP5883646B2 JP5883646B2 JP2011531596A JP2011531596A JP5883646B2 JP 5883646 B2 JP5883646 B2 JP 5883646B2 JP 2011531596 A JP2011531596 A JP 2011531596A JP 2011531596 A JP2011531596 A JP 2011531596A JP 5883646 B2 JP5883646 B2 JP 5883646B2
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- light
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- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000000034 method Methods 0.000 title claims description 9
- 239000000463 material Substances 0.000 claims description 63
- 239000000725 suspension Substances 0.000 claims description 59
- 239000000758 substrate Substances 0.000 claims description 56
- 230000003287 optical effect Effects 0.000 claims description 40
- 239000002245 particle Substances 0.000 claims description 9
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 description 6
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000002310 reflectometry Methods 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
Claims (7)
- 発光装置の製造方法であり、
この上に少なくとも1つの発光体が配される基板を設けるステップと、
前記基板上に、前記少なくとも1つの発光体を少なくとも部分的に横に囲んでいる反射性光学ハウジングを配するステップと、
前記反射性光学ハウジングと前記少なくとも1つ発光体との間の空間に反射性材料の懸濁液を少なくとも部分的に充填するステップと、
を有する方法であって、前記充填するステップが、前記反射性光学ハウジング内、前記基板内、又は前記基板と前記反射性光学ハウジングとの間に形成されている少なくとも1つのチャネルを通して前記反射性材料の懸濁液を注入するステップによって実施され、前記反射性材料は、毛管力によって前記反射性光学ハウジングと前記少なくとも1つの発光体との間の空間内に分散される製造方法。 - 前記反射性材料を硬化するステップを更に有する、請求項1に記載の製造方法。
- 前記反射性光学ハウジングは、白色反射性、鏡面的反射性、又はこれらの組み合わせである、請求項1又は2に記載の製造方法。
- 前記反射性光学ハウジングは、コリメータ、集光器、色若しくは光混合器、又はこれらの組み合わせを構成している、請求項1又は2に記載の製造方法。
- 前記反射性材料は、TiO 2 、他の反射性粒子、又は異なる反射性粒子の組み合わせを有する、請求項1又は2に記載の製造方法。
- 前記充填するステップは、前記反射性材料を前記基板から前記発光体の高さの少なくとも50%まで延在させることを含む、請求項1又は2に記載の製造方法。
- 前記発光装置は、少なくとも1つの薄膜フリップチップ(TFFC)ダイを有する、請求項1又は2に記載の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08166857 | 2008-10-17 | ||
EP08166857.6 | 2008-10-17 | ||
PCT/IB2009/054410 WO2010044023A1 (en) | 2008-10-17 | 2009-10-08 | Light emitting device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015212852A Division JP6023303B2 (ja) | 2008-10-17 | 2015-10-29 | 発光装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012506140A JP2012506140A (ja) | 2012-03-08 |
JP2012506140A5 JP2012506140A5 (ja) | 2015-12-17 |
JP5883646B2 true JP5883646B2 (ja) | 2016-03-15 |
Family
ID=41571374
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011531596A Active JP5883646B2 (ja) | 2008-10-17 | 2009-10-08 | 発光装置の製造方法 |
JP2015212852A Active JP6023303B2 (ja) | 2008-10-17 | 2015-10-29 | 発光装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015212852A Active JP6023303B2 (ja) | 2008-10-17 | 2015-10-29 | 発光装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US8513691B2 (ja) |
EP (1) | EP2340569B1 (ja) |
JP (2) | JP5883646B2 (ja) |
KR (1) | KR20110079900A (ja) |
CN (1) | CN102187486B (ja) |
RU (1) | RU2509393C2 (ja) |
TW (1) | TW201027002A (ja) |
WO (1) | WO2010044023A1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8803201B2 (en) * | 2011-01-31 | 2014-08-12 | Cree, Inc. | Solid state lighting component package with reflective layer |
DE102010029368A1 (de) * | 2010-05-27 | 2011-12-01 | Osram Opto Semiconductors Gmbh | Elektronische Anordnung und Verfahren zum Herstellen einer elektronischen Anordnung |
JP2012054383A (ja) * | 2010-09-01 | 2012-03-15 | Citizen Holdings Co Ltd | 半導体発光装置及びその製造方法 |
JP2012098627A (ja) * | 2010-11-04 | 2012-05-24 | Dainippon Printing Co Ltd | カラーフィルタの製造方法 |
US8652860B2 (en) | 2011-01-09 | 2014-02-18 | Bridgelux, Inc. | Packaging photon building blocks having only top side connections in a molded interconnect structure |
US9461023B2 (en) | 2011-10-28 | 2016-10-04 | Bridgelux, Inc. | Jetting a highly reflective layer onto an LED assembly |
US9281301B2 (en) * | 2011-05-19 | 2016-03-08 | Osram Opto Semiconductors Gmbh | Optoelectronic device and method for producing optoelectronic devices |
CN103563078B (zh) * | 2011-06-08 | 2017-08-25 | 皇家飞利浦有限公司 | 二极管照明装置 |
CN102856468B (zh) * | 2011-06-30 | 2015-02-04 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
WO2016150807A1 (en) * | 2015-03-26 | 2016-09-29 | Koninklijke Philips N.V. | Light source |
EP3144887A1 (en) * | 2015-09-17 | 2017-03-22 | Thomson Licensing | A method and an apparatus for generating data representative of a pixel beam |
JP7266961B2 (ja) | 2015-12-31 | 2023-05-01 | 晶元光電股▲ふん▼有限公司 | 発光装置 |
DE102017104871A1 (de) * | 2017-03-08 | 2018-09-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil |
RU2693632C1 (ru) * | 2019-01-18 | 2019-07-03 | Общество с ограниченной ответственностью «Научно-технический центр «Биолюмен» (ООО «НТЦ «Биолюмен») | Светодиодный источник белого света с биологически адекватным спектром излучения |
CN108878626B (zh) * | 2018-06-29 | 2020-02-18 | 京东方科技集团股份有限公司 | 一种显示面板及制作方法、显示装置 |
JP2021034642A (ja) * | 2019-08-28 | 2021-03-01 | 浜松ホトニクス株式会社 | 光半導体装置及び光半導体装置の製造方法 |
CN117497667B (zh) * | 2023-12-29 | 2024-03-19 | 江西省兆驰光电有限公司 | 一种发光led封装方法及发光led封装结构 |
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JPH09116187A (ja) * | 1995-10-16 | 1997-05-02 | Stanley Electric Co Ltd | 完全同軸複合光素子 |
US6274890B1 (en) * | 1997-01-15 | 2001-08-14 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and its manufacturing method |
RU2133068C1 (ru) * | 1997-07-30 | 1999-07-10 | Абрамов Владимир Семенович | Светодиодное устройство |
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JP2001168400A (ja) * | 1999-12-09 | 2001-06-22 | Rohm Co Ltd | ケース付チップ型発光装置およびその製造方法 |
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-
2009
- 2009-10-08 US US13/124,401 patent/US8513691B2/en not_active Expired - Fee Related
- 2009-10-08 CN CN200980141134.2A patent/CN102187486B/zh active Active
- 2009-10-08 JP JP2011531596A patent/JP5883646B2/ja active Active
- 2009-10-08 RU RU2011119632/28A patent/RU2509393C2/ru active
- 2009-10-08 EP EP09737152.0A patent/EP2340569B1/en active Active
- 2009-10-08 KR KR1020117011197A patent/KR20110079900A/ko not_active Application Discontinuation
- 2009-10-08 WO PCT/IB2009/054410 patent/WO2010044023A1/en active Application Filing
- 2009-10-14 TW TW098134821A patent/TW201027002A/zh unknown
-
2015
- 2015-10-29 JP JP2015212852A patent/JP6023303B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
RU2011119632A (ru) | 2012-11-27 |
WO2010044023A1 (en) | 2010-04-22 |
US8513691B2 (en) | 2013-08-20 |
RU2509393C2 (ru) | 2014-03-10 |
EP2340569B1 (en) | 2018-03-14 |
TW201027002A (en) | 2010-07-16 |
KR20110079900A (ko) | 2011-07-11 |
CN102187486A (zh) | 2011-09-14 |
CN102187486B (zh) | 2014-01-15 |
JP2016015527A (ja) | 2016-01-28 |
JP2012506140A (ja) | 2012-03-08 |
US20110198655A1 (en) | 2011-08-18 |
EP2340569A1 (en) | 2011-07-06 |
JP6023303B2 (ja) | 2016-11-09 |
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