JP5022576B2 - 表示パネルおよび表示装置 - Google Patents
表示パネルおよび表示装置 Download PDFInfo
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- JP5022576B2 JP5022576B2 JP2005200314A JP2005200314A JP5022576B2 JP 5022576 B2 JP5022576 B2 JP 5022576B2 JP 2005200314 A JP2005200314 A JP 2005200314A JP 2005200314 A JP2005200314 A JP 2005200314A JP 5022576 B2 JP5022576 B2 JP 5022576B2
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- Prior art keywords
- wiring
- display panel
- substrate
- conductive layer
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims description 81
- 239000004020 conductor Substances 0.000 claims description 31
- 238000010030 laminating Methods 0.000 claims description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 19
- 238000005260 corrosion Methods 0.000 description 14
- 230000007797 corrosion Effects 0.000 description 14
- 230000004048 modification Effects 0.000 description 13
- 238000012986 modification Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 12
- 230000015556 catabolic process Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000002161 passivation Methods 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Multi-Conductor Connections (AREA)
Description
なお、実施例を説明するための全図において、同一機能を有するものは、同一符号を付け、その繰り返しの説明は省略する。
図1乃至図4は、本発明による一実施例の表示パネルの概略構成を示す模式図であり、図1は表示パネルの全体的な構成を示す平面図、図2は図1の領域Lの拡大平面図、図3は図2のA−A’線断面図、図4は配線の構成例を説明する図である。
図1において、1は第1の基板(TFT基板)、2は第2の基板(対向基板)、3はシール材、4は液晶材料である。また、図2乃至図4において、1Aは基板端面、101は配線、101aは配線の接続端子部、101bは配線の端部、101cはスリットを設けた部分、101dは配線の第1端面、101eは配線の第2端面、102は透明基板、103はITO膜、104はSiN膜、105はパッシベーション膜、SL1は第1スリット、SL2は第2スリットである。
1A…基板端面
101…配線
101a…配線の接続端子部
101b…配線の端部
101c…スリットを設けた部分
101d…配線の第1端面
101e…配線の第2端面
102…透明基板
103…ITO膜
104…SiN膜
105…パッシベーション膜
106…第1導体
107…第2導体
2…第2の基板
3…シール材
4…液晶材料
5…TCP
501…絶縁基板
502…TCPの配線
502a…TCPのアウターリード
503…半導体チップ
504…金バンプ
6…ACF
SL1…第1スリット
SL2…第2スリット
Claims (7)
- 基板と、前記基板に形成され外部機器と電気的に接続される複数の接続端子部と、前記接続端子部より前記基板の端面側に延在し且つ前記基板の端面に到達している複数の導電層を有し、
該各導電層は、前記端子部と前記基板端面との間で、前記導電層の延在方向に沿った2つの端面に、一方の端面から他方の端面の方向に延びるスリットが交互に設けられていることを特徴とする表示パネル。 - 前記導電層の第1端面から第2端面の方向に延びるスリットと、前記導電層の第2端面から第1端面の方向に延びるスリットは、前記導電層の延在方向でずれ、かつ幅方向で重なっていることを特徴とする請求項1に記載の表示パネル。
- 前記スリットは、前記導電層の延在方向に対して斜め方向に延びていることを特徴とする請求項2に記載の表示パネル。
- 前記導電層の延在方向と前記スリットが延びている方向とのなす角は、30度から150度であることを特徴とする請求項2または請求項3に記載の表示パネル。
- 前記導電層は2種類の導体が積層されてなり、前記スリットは、前記2種類の導体に設けられていることを特徴とする請求項2乃至請求項4のいずれか1項に記載の表示パネル。
- 前記導電層は、2種類の導体が積層されてなり、前記スリットは、前記2種類の導体のうちのいずれか一方に設けられていることを特徴とする請求項2乃至請求項4のいずれか1項に記載の表示パネル。
- 請求項1乃至請求項6のいずれか1項に記載の表示パネルを備えることを特徴とする表示装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005200314A JP5022576B2 (ja) | 2005-07-08 | 2005-07-08 | 表示パネルおよび表示装置 |
CN2006100959998A CN1892372B (zh) | 2005-07-08 | 2006-06-30 | 显示板和显示装置 |
US11/481,974 US7719650B2 (en) | 2005-07-08 | 2006-07-07 | Display panel and display device |
KR1020060063815A KR100821433B1 (ko) | 2005-07-08 | 2006-07-07 | 표시 패널 및 표시 장치 |
TW095124889A TW200715012A (en) | 2005-07-08 | 2006-07-07 | Display panel and display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005200314A JP5022576B2 (ja) | 2005-07-08 | 2005-07-08 | 表示パネルおよび表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007017767A JP2007017767A (ja) | 2007-01-25 |
JP5022576B2 true JP5022576B2 (ja) | 2012-09-12 |
Family
ID=37597384
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005200314A Active JP5022576B2 (ja) | 2005-07-08 | 2005-07-08 | 表示パネルおよび表示装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7719650B2 (ja) |
JP (1) | JP5022576B2 (ja) |
KR (1) | KR100821433B1 (ja) |
CN (1) | CN1892372B (ja) |
TW (1) | TW200715012A (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5022576B2 (ja) * | 2005-07-08 | 2012-09-12 | 株式会社ジャパンディスプレイイースト | 表示パネルおよび表示装置 |
JP5072518B2 (ja) * | 2007-09-28 | 2012-11-14 | 三菱電機株式会社 | マトリクスアレイ基板及び表示装置 |
KR101427584B1 (ko) * | 2008-01-22 | 2014-08-08 | 삼성디스플레이 주식회사 | 표시 장치 |
KR100897157B1 (ko) | 2008-02-28 | 2009-05-14 | 삼성모바일디스플레이주식회사 | 유기전계발광 표시장치 |
JP5467449B2 (ja) * | 2008-09-17 | 2014-04-09 | Nltテクノロジー株式会社 | 引出線配線装置、画像表示装置及び引出線配線装置の製造方法 |
JP2012195509A (ja) * | 2011-03-17 | 2012-10-11 | Canon Inc | 半導体装置及びその製造方法 |
JP6257428B2 (ja) * | 2014-04-15 | 2018-01-10 | 株式会社ジャパンディスプレイ | 電極基板、表示装置、入力装置および電極基板の製造方法 |
CN104644409A (zh) * | 2015-03-10 | 2015-05-27 | 吕莉 | 一种神经内科用按摩装置 |
CN109156080B (zh) * | 2016-05-16 | 2021-10-08 | 株式会社村田制作所 | 陶瓷电子部件 |
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-
2005
- 2005-07-08 JP JP2005200314A patent/JP5022576B2/ja active Active
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2006
- 2006-06-30 CN CN2006100959998A patent/CN1892372B/zh active Active
- 2006-07-07 TW TW095124889A patent/TW200715012A/zh unknown
- 2006-07-07 US US11/481,974 patent/US7719650B2/en active Active
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KR100821433B1 (ko) | 2008-04-10 |
US20070007526A1 (en) | 2007-01-11 |
KR20070006604A (ko) | 2007-01-11 |
JP2007017767A (ja) | 2007-01-25 |
CN1892372B (zh) | 2011-03-30 |
CN1892372A (zh) | 2007-01-10 |
US7719650B2 (en) | 2010-05-18 |
TW200715012A (en) | 2007-04-16 |
TWI354171B (ja) | 2011-12-11 |
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