TW200715012A - Display panel and display device - Google Patents

Display panel and display device

Info

Publication number
TW200715012A
TW200715012A TW095124889A TW95124889A TW200715012A TW 200715012 A TW200715012 A TW 200715012A TW 095124889 A TW095124889 A TW 095124889A TW 95124889 A TW95124889 A TW 95124889A TW 200715012 A TW200715012 A TW 200715012A
Authority
TW
Taiwan
Prior art keywords
conductive layer
display
display panel
extending
terminals
Prior art date
Application number
TW095124889A
Other languages
English (en)
Other versions
TWI354171B (zh
Inventor
Saori Sugiyama
Yasuko Gotoh
Original Assignee
Hitachi Displays Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Displays Ltd filed Critical Hitachi Displays Ltd
Publication of TW200715012A publication Critical patent/TW200715012A/zh
Application granted granted Critical
Publication of TWI354171B publication Critical patent/TWI354171B/zh

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1345Conductors connecting electrodes to cell terminals
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/032Materials
    • H05K2201/0326Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969Apertured conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/244Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49121Beam lead frame or beam lead device

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Multi-Conductor Connections (AREA)
TW095124889A 2005-07-08 2006-07-07 Display panel and display device TW200715012A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005200314A JP5022576B2 (ja) 2005-07-08 2005-07-08 表示パネルおよび表示装置

Publications (2)

Publication Number Publication Date
TW200715012A true TW200715012A (en) 2007-04-16
TWI354171B TWI354171B (zh) 2011-12-11

Family

ID=37597384

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095124889A TW200715012A (en) 2005-07-08 2006-07-07 Display panel and display device

Country Status (5)

Country Link
US (1) US7719650B2 (zh)
JP (1) JP5022576B2 (zh)
KR (1) KR100821433B1 (zh)
CN (1) CN1892372B (zh)
TW (1) TW200715012A (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5022576B2 (ja) * 2005-07-08 2012-09-12 株式会社ジャパンディスプレイイースト 表示パネルおよび表示装置
JP5072518B2 (ja) * 2007-09-28 2012-11-14 三菱電機株式会社 マトリクスアレイ基板及び表示装置
KR101427584B1 (ko) * 2008-01-22 2014-08-08 삼성디스플레이 주식회사 표시 장치
KR100897157B1 (ko) 2008-02-28 2009-05-14 삼성모바일디스플레이주식회사 유기전계발광 표시장치
JP5467449B2 (ja) * 2008-09-17 2014-04-09 Nltテクノロジー株式会社 引出線配線装置、画像表示装置及び引出線配線装置の製造方法
JP2012195509A (ja) * 2011-03-17 2012-10-11 Canon Inc 半導体装置及びその製造方法
JP6257428B2 (ja) * 2014-04-15 2018-01-10 株式会社ジャパンディスプレイ 電極基板、表示装置、入力装置および電極基板の製造方法
CN104644409A (zh) * 2015-03-10 2015-05-27 吕莉 一种神经内科用按摩装置
CN109156080B (zh) * 2016-05-16 2021-10-08 株式会社村田制作所 陶瓷电子部件

Family Cites Families (106)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2930107A (en) * 1953-07-16 1960-03-29 Sylvania Electric Prod Semiconductor mount and method
US3144709A (en) * 1959-10-13 1964-08-18 Continental Can Co Preparation of sheet stock having longitudinal internal weakening therein
US3304594A (en) * 1963-08-15 1967-02-21 Motorola Inc Method of making integrated circuit by controlled process
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
US3493671A (en) * 1968-11-15 1970-02-03 Norman H Horwitz Universal circuit board and method of forming same
US3608186A (en) * 1969-10-30 1971-09-28 Jearld L Hutson Semiconductor device manufacture with junction passivation
US3768986A (en) * 1971-10-08 1973-10-30 Micro Science Ass Laminated lead frame and method of producing same
US3978516A (en) * 1974-01-02 1976-08-31 Texas Instruments Incorporated Lead frame assembly for a packaged semiconductor microcircuit
US4044460A (en) * 1975-10-23 1977-08-30 Schachter Herbert I Method of mounting prefabricated contacts for printed circuit card connectors
US4044888A (en) * 1975-10-23 1977-08-30 Schachter Herbert I Prefabricated contacts for printed circuit card connectors
US4094058A (en) * 1976-07-23 1978-06-13 Omron Tateisi Electronics Co. Method of manufacture of liquid crystal displays
DE2730130C2 (de) * 1976-09-14 1987-11-12 Mitsubishi Denki K.K., Tokyo Verfahren zum Herstellen von Halbleiterbauelementen
US4216523A (en) * 1977-12-02 1980-08-05 Rca Corporation Modular printed circuit board
US4275494A (en) * 1978-06-30 1981-06-30 Hitachi, Ltd. Method for manufacturing liquid crystal display elements
CH624491A5 (zh) * 1978-11-06 1981-07-31 Ebauches Electroniques Sa
US4631805A (en) * 1981-03-23 1986-12-30 Motorola Inc. Semiconductor device including plateless package fabrication method
US4366198A (en) * 1981-03-24 1982-12-28 Rca Corporation Sheet material separation construction
JPS57169293A (en) * 1981-04-13 1982-10-18 Nippon Electric Co Printed circuit board and method of producing same
US4426773A (en) * 1981-05-15 1984-01-24 General Electric Ceramics, Inc. Array of electronic packaging substrates
JPS5843429A (ja) * 1981-09-09 1983-03-14 Hitachi Ltd 液晶表示素子の製造方法
US4425380A (en) * 1982-11-19 1984-01-10 Kollmorgen Technologies Corporation Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions
JPS59119317A (ja) * 1982-12-27 1984-07-10 Seiko Epson Corp 液晶表示体の製造方法
US4756080A (en) * 1986-01-27 1988-07-12 American Microsystems, Inc. Metal foil semiconductor interconnection method
US4830554A (en) * 1986-06-23 1989-05-16 Cencorp, Inc. Routing apparatus for cutting printed circuit boards
JPH0815193B2 (ja) * 1986-08-12 1996-02-14 新光電気工業株式会社 半導体装置及びこれに用いるリードフレーム
US4829404A (en) * 1987-04-27 1989-05-09 Flexmark, Inc. Method of producing a flexible circuit and master grid therefor
US4796080A (en) * 1987-07-23 1989-01-03 Fairchild Camera And Instrument Corporation Semiconductor chip package configuration and method for facilitating its testing and mounting on a substrate
US4852227A (en) * 1988-11-25 1989-08-01 Sprague Electric Company Method for making a multilayer ceramic capacitor with buried electrodes and terminations at a castellated edge
JPH02197190A (ja) * 1989-01-26 1990-08-03 Shin Kobe Electric Mach Co Ltd 多層印刷配線板
US5150237A (en) * 1989-05-15 1992-09-22 Ricoh Company, Ltd. Liquid crystal display element
US5175638A (en) * 1989-09-12 1992-12-29 Ricoh Company, Ltd. ECB type liquid crystal display device having birefringent layer with equal refractive indexes in the thickness and plane directions
US5217916A (en) * 1989-10-03 1993-06-08 Trw Inc. Method of making an adaptive configurable gate array
US5017164A (en) * 1990-05-16 1991-05-21 Gibbs Andrew H Surface mount I.C. pin array system
JP2848682B2 (ja) * 1990-06-01 1999-01-20 株式会社東芝 高速動作用半導体装置及びこの半導体装置に用いるフィルムキャリア
JP2609014B2 (ja) * 1990-07-17 1997-05-14 三菱電機株式会社 半導体装置の製造方法及び製造装置
JPH0648700B2 (ja) * 1990-12-27 1994-06-22 インターナショナル・ビジネス・マシーンズ・コーポレイション 導電性層の剥離防止構造を有するtabテープ
JPH05243455A (ja) * 1992-03-02 1993-09-21 Fujitsu Ltd 半導体装置及びその製造方法
US5233448A (en) * 1992-05-04 1993-08-03 Industrial Technology Research Institute Method of manufacturing a liquid crystal display panel including photoconductive electrostatic protection
US5592199A (en) * 1993-01-27 1997-01-07 Sharp Kabushiki Kaisha Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same
DE4319944C2 (de) * 1993-06-03 1998-07-23 Schulz Harder Juergen Mehrfach-Substrat sowie Verfahren zu seiner Herstellung
US5376759A (en) * 1993-06-24 1994-12-27 Northern Telecom Limited Multiple layer printed circuit board
US5536906A (en) * 1993-07-23 1996-07-16 Texas Instruments Incorporated Package for integrated circuits
US5444293A (en) * 1993-09-22 1995-08-22 Opl Limited Structure and method for providing a lead frame with enhanced solder wetting leads
US5319523A (en) * 1993-10-20 1994-06-07 Compaq Computer Corporation Card edge interconnect apparatus for printed circuit boards
US5770290A (en) * 1993-12-01 1998-06-23 Mchenry; Robert J. Easy open end of a metal-plastic construction
JP2524477B2 (ja) * 1993-12-20 1996-08-14 インターナショナル・ビジネス・マシーンズ・コーポレイション 液晶パネル形成用基板及びその製造方法
JPH07175076A (ja) * 1993-12-20 1995-07-14 Hitachi Ltd 液晶表示素子
US5659477A (en) * 1994-12-28 1997-08-19 Collins; Charles Michael Self reproducing fundamental fabricating machines (F-Units)
US5621193A (en) * 1995-05-23 1997-04-15 Northrop Grumman Corporation Ceramic edge connect process
US5995178A (en) * 1995-10-16 1999-11-30 Sharp Kabushiki Kaisha Active matrix liquid crystal panel and method for repairing defect therein
KR100237679B1 (ko) 1995-12-30 2000-01-15 윤종용 저항 차를 줄이는 팬 아웃부를 가지는 액정 표시 패널
US5831218A (en) * 1996-06-28 1998-11-03 Motorola, Inc. Method and circuit board panel for circuit board manufacturing that prevents assembly-line delamination and sagging
US5773764A (en) * 1996-08-28 1998-06-30 Motorola, Inc. Printed circuit board panel
US6525718B1 (en) * 1997-02-05 2003-02-25 Sharp Kabushiki Kaisha Flexible circuit board and liquid crystal display device incorporating the same
US5789302A (en) * 1997-03-24 1998-08-04 Siemens Aktiengesellschaft Crack stops
JPH1117290A (ja) * 1997-06-27 1999-01-22 Fuji Photo Film Co Ltd 多層基板及びその製造方法
JP3463539B2 (ja) * 1997-10-22 2003-11-05 ソニーケミカル株式会社 異方導電性接着剤付き可撓性回路基板および製造方法
JP3969808B2 (ja) * 1997-10-29 2007-09-05 富士機械製造株式会社 電気部品供給方法および装置ならびに電気部品装着装置
US5869353A (en) * 1997-11-17 1999-02-09 Dense-Pac Microsystems, Inc. Modular panel stacking process
KR100252051B1 (ko) * 1997-12-03 2000-04-15 윤종용 휨 방지막을 구비하는 탭 테이프
EP0924547A1 (fr) * 1997-12-22 1999-06-23 Asulab S.A. Procédé de fabrication de cellules électro-optiques, notamment à cristaux liquides
KR100247463B1 (ko) * 1998-01-08 2000-03-15 윤종용 탄성중합체를 포함하는 반도체 집적회로 소자의 제조 방법
JP3783404B2 (ja) * 1998-04-24 2006-06-07 ミツミ電機株式会社 プリント基板の製造方法
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
US6413839B1 (en) * 1998-10-23 2002-07-02 Emcore Corporation Semiconductor device separation using a patterned laser projection
JP2000173551A (ja) * 1998-12-07 2000-06-23 Harison Electric Co Ltd 蛍光ランプ
US6204906B1 (en) * 1999-03-22 2001-03-20 Lawrence E. Tannas, Jr. Methods of customizing the physical size and shape of commercial off-the-shelf (COTS) electronic displays
DE19927046B4 (de) * 1999-06-14 2007-01-25 Electrovac Ag Keramik-Metall-Substrat als Mehrfachsubstrat
TW550428B (en) * 1999-07-12 2003-09-01 Nec Lcd Technologies Ltd Flat panel display device and manufacturing method thereof
EP1087261A1 (en) * 1999-09-24 2001-03-28 Sumitomo Bakelite Company Limited Photosensitive resin composition, multilayer printed wiring board and process for production thereof
JP2001199082A (ja) * 1999-10-08 2001-07-24 Seiko Epson Corp インクカートリッジ、インクジェット記録装置、及びインクカートリッジの装着方法
JP3715487B2 (ja) * 1999-11-22 2005-11-09 日本電波工業株式会社 回路基板及びこれを用いた水晶発振器
US6509949B1 (en) * 1999-12-20 2003-01-21 Honeywell International Inc. Method of resizing a liquid crystal display
US6376904B1 (en) * 1999-12-23 2002-04-23 Rambus Inc. Redistributed bond pads in stacked integrated circuit die package
JP2001185651A (ja) * 1999-12-27 2001-07-06 Matsushita Electronics Industry Corp 半導体装置およびその製造方法
KR100671211B1 (ko) * 2000-01-12 2007-01-18 엘지.필립스 엘시디 주식회사 액정표시장치용 어레이기판 제조방법
US7091606B2 (en) * 2000-01-31 2006-08-15 Sanyo Electric Co., Ltd. Circuit device and manufacturing method of circuit device and semiconductor module
JP2001236890A (ja) * 2000-02-25 2001-08-31 Mitsubishi Electric Corp ガス放電表示パネル及びその製造方法
JP4722318B2 (ja) * 2000-06-05 2011-07-13 ローム株式会社 チップ抵抗器
JP2001305570A (ja) * 2000-04-24 2001-10-31 Nec Corp 表示パネルモジュール及びその製造方法
US20030192585A1 (en) * 2002-01-25 2003-10-16 Konarka Technologies, Inc. Photovoltaic cells incorporating rigid substrates
US6949400B2 (en) * 2002-01-25 2005-09-27 Konarka Technologies, Inc. Ultrasonic slitting of photovoltaic cells and modules
US7186911B2 (en) * 2002-01-25 2007-03-06 Konarka Technologies, Inc. Methods of scoring for fabricating interconnected photovoltaic cells
JP2002050754A (ja) * 2000-05-08 2002-02-15 Canon Inc 半導体装置とその製造方法、放射線検出装置とそれを用いた放射線検出システム
ATE275504T1 (de) * 2000-06-15 2004-09-15 Crown Packaging Technology Inc Dose mit giesstülle
JP2002040462A (ja) * 2000-07-26 2002-02-06 Kyocera Corp 液晶表示装置
JP3596807B2 (ja) * 2000-08-09 2004-12-02 インターナショナル・ビジネス・マシーンズ・コーポレーション プリント配線板及びその製造方法
JP2002062821A (ja) * 2000-08-17 2002-02-28 Enplas Corp 表示パネル検査装置
JP2002134860A (ja) * 2000-10-23 2002-05-10 Matsushita Electric Ind Co Ltd フレキシブルプリント配線板
US6760227B2 (en) * 2000-11-02 2004-07-06 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component and manufacturing method thereof
US6951707B2 (en) * 2001-03-08 2005-10-04 Ppg Industries Ohio, Inc. Process for creating vias for circuit assemblies
JP4485708B2 (ja) * 2001-05-21 2010-06-23 シャープ株式会社 液晶表示装置用周辺回路基板及びそれを備えた液晶表示装置
JP4098556B2 (ja) * 2001-07-31 2008-06-11 ローム株式会社 端子板、この端子板を備えた回路基板、およびこの端子板の接続方法
US20030143899A1 (en) * 2002-01-31 2003-07-31 Fulk Mikel R. High density wire bondable connector assembly
JP2003243564A (ja) * 2002-02-08 2003-08-29 Samsung Electro Mech Co Ltd プリント回路基板ストリップのメッキのための設計方法及びこれを用いた半導体チップパッケージの製造方法
US6995032B2 (en) * 2002-07-19 2006-02-07 Cree, Inc. Trench cut light emitting diodes and methods of fabricating same
JP3690378B2 (ja) * 2002-07-26 2005-08-31 株式会社 日立ディスプレイズ 表示装置
JP2004063803A (ja) * 2002-07-29 2004-02-26 Ngk Spark Plug Co Ltd プリント配線基板の製造方法、プリント配線基板製造用金属板、連結プリント配線基板
KR100900537B1 (ko) * 2002-08-23 2009-06-02 삼성전자주식회사 액정 표시 장치, 그 검사 방법 및 제조 방법
US7008854B2 (en) * 2003-05-21 2006-03-07 Micron Technology, Inc. Silicon oxycarbide substrates for bonded silicon on insulator
JP4411898B2 (ja) 2003-07-31 2010-02-10 セイコーエプソン株式会社 液晶表示パネル
JP4394432B2 (ja) * 2003-12-15 2010-01-06 日東電工株式会社 配線回路基板保持シートの製造方法
JP4013914B2 (ja) * 2004-04-12 2007-11-28 住友電装株式会社 基板用コネクタ
US7161651B2 (en) * 2004-11-20 2007-01-09 Luxell Technologies Inc. Method of resizing a liquid crystal display
JP4725207B2 (ja) * 2005-06-20 2011-07-13 船井電機株式会社 液晶表示装置
JP5022576B2 (ja) * 2005-07-08 2012-09-12 株式会社ジャパンディスプレイイースト 表示パネルおよび表示装置

Also Published As

Publication number Publication date
JP5022576B2 (ja) 2012-09-12
CN1892372B (zh) 2011-03-30
KR20070006604A (ko) 2007-01-11
JP2007017767A (ja) 2007-01-25
TWI354171B (zh) 2011-12-11
CN1892372A (zh) 2007-01-10
US7719650B2 (en) 2010-05-18
KR100821433B1 (ko) 2008-04-10
US20070007526A1 (en) 2007-01-11

Similar Documents

Publication Publication Date Title
TW200715012A (en) Display panel and display device
TW200636638A (en) Double-sided display device
TW200743881A (en) Pixel structure and liquid crystal display panel
WO2008081303A3 (en) Transparent layer application
TW200629673A (en) Flexible flat cable assembly and electronic device utilizing the same
HK1119807A1 (en) Small computing device with improved device interface
TW200604638A (en) Display device
TW200733026A (en) Circuit structure of a display
TW200739153A (en) Embedded waveguide printed circuit board structure
TW200619282A (en) Coatable conductive polyethylenedioxythiophene with carbon nanotubes
TW200702840A (en) Optical film having a surface with rounded pyramidal structures
TW200734735A (en) Liquid crystal apparatus and electronic device
DE602005025476D1 (de) Elektrolumineszenzanzeigen
TW200641765A (en) Plasma display panel which is driven single-sidedly
TW200742486A (en) Electroluminescent device and electroluminescent device unit
TW200620333A (en) Electromagnetic wave suppressing material, electromagnetic wave suppressing device and electronic equipment
TW200720805A (en) Electrode structure of electrochromic device
TW200743194A (en) Package structure
TW200628895A (en) Display device
TW200944073A (en) Flexible display apparatus
TW200638577A (en) Battery-engaging module of portable electronic device
TW200739862A (en) Module
TW200644414A (en) Piezoelectric device and electronic apparatus
EP2728977A3 (en) Display device
TW200639548A (en) A liquid crystal display device