US2930107A
(en)
*
|
1953-07-16 |
1960-03-29 |
Sylvania Electric Prod |
Semiconductor mount and method
|
US3144709A
(en)
*
|
1959-10-13 |
1964-08-18 |
Continental Can Co |
Preparation of sheet stock having longitudinal internal weakening therein
|
US3304594A
(en)
*
|
1963-08-15 |
1967-02-21 |
Motorola Inc |
Method of making integrated circuit by controlled process
|
US3544857A
(en)
*
|
1966-08-16 |
1970-12-01 |
Signetics Corp |
Integrated circuit assembly with lead structure and method
|
US3493671A
(en)
*
|
1968-11-15 |
1970-02-03 |
Norman H Horwitz |
Universal circuit board and method of forming same
|
US3608186A
(en)
*
|
1969-10-30 |
1971-09-28 |
Jearld L Hutson |
Semiconductor device manufacture with junction passivation
|
US3768986A
(en)
*
|
1971-10-08 |
1973-10-30 |
Micro Science Ass |
Laminated lead frame and method of producing same
|
US3978516A
(en)
*
|
1974-01-02 |
1976-08-31 |
Texas Instruments Incorporated |
Lead frame assembly for a packaged semiconductor microcircuit
|
US4044460A
(en)
*
|
1975-10-23 |
1977-08-30 |
Schachter Herbert I |
Method of mounting prefabricated contacts for printed circuit card connectors
|
US4044888A
(en)
*
|
1975-10-23 |
1977-08-30 |
Schachter Herbert I |
Prefabricated contacts for printed circuit card connectors
|
US4094058A
(en)
*
|
1976-07-23 |
1978-06-13 |
Omron Tateisi Electronics Co. |
Method of manufacture of liquid crystal displays
|
DE2730130C2
(de)
*
|
1976-09-14 |
1987-11-12 |
Mitsubishi Denki K.K., Tokyo |
Verfahren zum Herstellen von Halbleiterbauelementen
|
US4216523A
(en)
*
|
1977-12-02 |
1980-08-05 |
Rca Corporation |
Modular printed circuit board
|
US4275494A
(en)
*
|
1978-06-30 |
1981-06-30 |
Hitachi, Ltd. |
Method for manufacturing liquid crystal display elements
|
CH624491A5
(zh)
*
|
1978-11-06 |
1981-07-31 |
Ebauches Electroniques Sa |
|
US4631805A
(en)
*
|
1981-03-23 |
1986-12-30 |
Motorola Inc. |
Semiconductor device including plateless package fabrication method
|
US4366198A
(en)
*
|
1981-03-24 |
1982-12-28 |
Rca Corporation |
Sheet material separation construction
|
JPS57169293A
(en)
*
|
1981-04-13 |
1982-10-18 |
Nippon Electric Co |
Printed circuit board and method of producing same
|
US4426773A
(en)
*
|
1981-05-15 |
1984-01-24 |
General Electric Ceramics, Inc. |
Array of electronic packaging substrates
|
JPS5843429A
(ja)
*
|
1981-09-09 |
1983-03-14 |
Hitachi Ltd |
液晶表示素子の製造方法
|
US4425380A
(en)
*
|
1982-11-19 |
1984-01-10 |
Kollmorgen Technologies Corporation |
Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions
|
JPS59119317A
(ja)
*
|
1982-12-27 |
1984-07-10 |
Seiko Epson Corp |
液晶表示体の製造方法
|
US4756080A
(en)
*
|
1986-01-27 |
1988-07-12 |
American Microsystems, Inc. |
Metal foil semiconductor interconnection method
|
US4830554A
(en)
*
|
1986-06-23 |
1989-05-16 |
Cencorp, Inc. |
Routing apparatus for cutting printed circuit boards
|
JPH0815193B2
(ja)
*
|
1986-08-12 |
1996-02-14 |
新光電気工業株式会社 |
半導体装置及びこれに用いるリードフレーム
|
US4829404A
(en)
*
|
1987-04-27 |
1989-05-09 |
Flexmark, Inc. |
Method of producing a flexible circuit and master grid therefor
|
US4796080A
(en)
*
|
1987-07-23 |
1989-01-03 |
Fairchild Camera And Instrument Corporation |
Semiconductor chip package configuration and method for facilitating its testing and mounting on a substrate
|
US4852227A
(en)
*
|
1988-11-25 |
1989-08-01 |
Sprague Electric Company |
Method for making a multilayer ceramic capacitor with buried electrodes and terminations at a castellated edge
|
JPH02197190A
(ja)
*
|
1989-01-26 |
1990-08-03 |
Shin Kobe Electric Mach Co Ltd |
多層印刷配線板
|
US5150237A
(en)
*
|
1989-05-15 |
1992-09-22 |
Ricoh Company, Ltd. |
Liquid crystal display element
|
US5175638A
(en)
*
|
1989-09-12 |
1992-12-29 |
Ricoh Company, Ltd. |
ECB type liquid crystal display device having birefringent layer with equal refractive indexes in the thickness and plane directions
|
US5217916A
(en)
*
|
1989-10-03 |
1993-06-08 |
Trw Inc. |
Method of making an adaptive configurable gate array
|
US5017164A
(en)
*
|
1990-05-16 |
1991-05-21 |
Gibbs Andrew H |
Surface mount I.C. pin array system
|
JP2848682B2
(ja)
*
|
1990-06-01 |
1999-01-20 |
株式会社東芝 |
高速動作用半導体装置及びこの半導体装置に用いるフィルムキャリア
|
JP2609014B2
(ja)
*
|
1990-07-17 |
1997-05-14 |
三菱電機株式会社 |
半導体装置の製造方法及び製造装置
|
JPH0648700B2
(ja)
*
|
1990-12-27 |
1994-06-22 |
インターナショナル・ビジネス・マシーンズ・コーポレイション |
導電性層の剥離防止構造を有するtabテープ
|
JPH05243455A
(ja)
*
|
1992-03-02 |
1993-09-21 |
Fujitsu Ltd |
半導体装置及びその製造方法
|
US5233448A
(en)
*
|
1992-05-04 |
1993-08-03 |
Industrial Technology Research Institute |
Method of manufacturing a liquid crystal display panel including photoconductive electrostatic protection
|
US5592199A
(en)
*
|
1993-01-27 |
1997-01-07 |
Sharp Kabushiki Kaisha |
Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same
|
DE4319944C2
(de)
*
|
1993-06-03 |
1998-07-23 |
Schulz Harder Juergen |
Mehrfach-Substrat sowie Verfahren zu seiner Herstellung
|
US5376759A
(en)
*
|
1993-06-24 |
1994-12-27 |
Northern Telecom Limited |
Multiple layer printed circuit board
|
US5536906A
(en)
*
|
1993-07-23 |
1996-07-16 |
Texas Instruments Incorporated |
Package for integrated circuits
|
US5444293A
(en)
*
|
1993-09-22 |
1995-08-22 |
Opl Limited |
Structure and method for providing a lead frame with enhanced solder wetting leads
|
US5319523A
(en)
*
|
1993-10-20 |
1994-06-07 |
Compaq Computer Corporation |
Card edge interconnect apparatus for printed circuit boards
|
US5770290A
(en)
*
|
1993-12-01 |
1998-06-23 |
Mchenry; Robert J. |
Easy open end of a metal-plastic construction
|
JP2524477B2
(ja)
*
|
1993-12-20 |
1996-08-14 |
インターナショナル・ビジネス・マシーンズ・コーポレイション |
液晶パネル形成用基板及びその製造方法
|
JPH07175076A
(ja)
*
|
1993-12-20 |
1995-07-14 |
Hitachi Ltd |
液晶表示素子
|
US5659477A
(en)
*
|
1994-12-28 |
1997-08-19 |
Collins; Charles Michael |
Self reproducing fundamental fabricating machines (F-Units)
|
US5621193A
(en)
*
|
1995-05-23 |
1997-04-15 |
Northrop Grumman Corporation |
Ceramic edge connect process
|
US5995178A
(en)
*
|
1995-10-16 |
1999-11-30 |
Sharp Kabushiki Kaisha |
Active matrix liquid crystal panel and method for repairing defect therein
|
KR100237679B1
(ko)
|
1995-12-30 |
2000-01-15 |
윤종용 |
저항 차를 줄이는 팬 아웃부를 가지는 액정 표시 패널
|
US5831218A
(en)
*
|
1996-06-28 |
1998-11-03 |
Motorola, Inc. |
Method and circuit board panel for circuit board manufacturing that prevents assembly-line delamination and sagging
|
US5773764A
(en)
*
|
1996-08-28 |
1998-06-30 |
Motorola, Inc. |
Printed circuit board panel
|
US6525718B1
(en)
*
|
1997-02-05 |
2003-02-25 |
Sharp Kabushiki Kaisha |
Flexible circuit board and liquid crystal display device incorporating the same
|
US5789302A
(en)
*
|
1997-03-24 |
1998-08-04 |
Siemens Aktiengesellschaft |
Crack stops
|
JPH1117290A
(ja)
*
|
1997-06-27 |
1999-01-22 |
Fuji Photo Film Co Ltd |
多層基板及びその製造方法
|
JP3463539B2
(ja)
*
|
1997-10-22 |
2003-11-05 |
ソニーケミカル株式会社 |
異方導電性接着剤付き可撓性回路基板および製造方法
|
JP3969808B2
(ja)
*
|
1997-10-29 |
2007-09-05 |
富士機械製造株式会社 |
電気部品供給方法および装置ならびに電気部品装着装置
|
US5869353A
(en)
*
|
1997-11-17 |
1999-02-09 |
Dense-Pac Microsystems, Inc. |
Modular panel stacking process
|
KR100252051B1
(ko)
*
|
1997-12-03 |
2000-04-15 |
윤종용 |
휨 방지막을 구비하는 탭 테이프
|
EP0924547A1
(fr)
*
|
1997-12-22 |
1999-06-23 |
Asulab S.A. |
Procédé de fabrication de cellules électro-optiques, notamment à cristaux liquides
|
KR100247463B1
(ko)
*
|
1998-01-08 |
2000-03-15 |
윤종용 |
탄성중합체를 포함하는 반도체 집적회로 소자의 제조 방법
|
JP3783404B2
(ja)
*
|
1998-04-24 |
2006-06-07 |
ミツミ電機株式会社 |
プリント基板の製造方法
|
US6335548B1
(en)
*
|
1999-03-15 |
2002-01-01 |
Gentex Corporation |
Semiconductor radiation emitter package
|
US6413839B1
(en)
*
|
1998-10-23 |
2002-07-02 |
Emcore Corporation |
Semiconductor device separation using a patterned laser projection
|
JP2000173551A
(ja)
*
|
1998-12-07 |
2000-06-23 |
Harison Electric Co Ltd |
蛍光ランプ
|
US6204906B1
(en)
*
|
1999-03-22 |
2001-03-20 |
Lawrence E. Tannas, Jr. |
Methods of customizing the physical size and shape of commercial off-the-shelf (COTS) electronic displays
|
DE19927046B4
(de)
*
|
1999-06-14 |
2007-01-25 |
Electrovac Ag |
Keramik-Metall-Substrat als Mehrfachsubstrat
|
TW550428B
(en)
*
|
1999-07-12 |
2003-09-01 |
Nec Lcd Technologies Ltd |
Flat panel display device and manufacturing method thereof
|
EP1087261A1
(en)
*
|
1999-09-24 |
2001-03-28 |
Sumitomo Bakelite Company Limited |
Photosensitive resin composition, multilayer printed wiring board and process for production thereof
|
JP2001199082A
(ja)
*
|
1999-10-08 |
2001-07-24 |
Seiko Epson Corp |
インクカートリッジ、インクジェット記録装置、及びインクカートリッジの装着方法
|
JP3715487B2
(ja)
*
|
1999-11-22 |
2005-11-09 |
日本電波工業株式会社 |
回路基板及びこれを用いた水晶発振器
|
US6509949B1
(en)
*
|
1999-12-20 |
2003-01-21 |
Honeywell International Inc. |
Method of resizing a liquid crystal display
|
US6376904B1
(en)
*
|
1999-12-23 |
2002-04-23 |
Rambus Inc. |
Redistributed bond pads in stacked integrated circuit die package
|
JP2001185651A
(ja)
*
|
1999-12-27 |
2001-07-06 |
Matsushita Electronics Industry Corp |
半導体装置およびその製造方法
|
KR100671211B1
(ko)
*
|
2000-01-12 |
2007-01-18 |
엘지.필립스 엘시디 주식회사 |
액정표시장치용 어레이기판 제조방법
|
US7091606B2
(en)
*
|
2000-01-31 |
2006-08-15 |
Sanyo Electric Co., Ltd. |
Circuit device and manufacturing method of circuit device and semiconductor module
|
JP2001236890A
(ja)
*
|
2000-02-25 |
2001-08-31 |
Mitsubishi Electric Corp |
ガス放電表示パネル及びその製造方法
|
JP4722318B2
(ja)
*
|
2000-06-05 |
2011-07-13 |
ローム株式会社 |
チップ抵抗器
|
JP2001305570A
(ja)
*
|
2000-04-24 |
2001-10-31 |
Nec Corp |
表示パネルモジュール及びその製造方法
|
US20030192585A1
(en)
*
|
2002-01-25 |
2003-10-16 |
Konarka Technologies, Inc. |
Photovoltaic cells incorporating rigid substrates
|
US6949400B2
(en)
*
|
2002-01-25 |
2005-09-27 |
Konarka Technologies, Inc. |
Ultrasonic slitting of photovoltaic cells and modules
|
US7186911B2
(en)
*
|
2002-01-25 |
2007-03-06 |
Konarka Technologies, Inc. |
Methods of scoring for fabricating interconnected photovoltaic cells
|
JP2002050754A
(ja)
*
|
2000-05-08 |
2002-02-15 |
Canon Inc |
半導体装置とその製造方法、放射線検出装置とそれを用いた放射線検出システム
|
ATE275504T1
(de)
*
|
2000-06-15 |
2004-09-15 |
Crown Packaging Technology Inc |
Dose mit giesstülle
|
JP2002040462A
(ja)
*
|
2000-07-26 |
2002-02-06 |
Kyocera Corp |
液晶表示装置
|
JP3596807B2
(ja)
*
|
2000-08-09 |
2004-12-02 |
インターナショナル・ビジネス・マシーンズ・コーポレーション |
プリント配線板及びその製造方法
|
JP2002062821A
(ja)
*
|
2000-08-17 |
2002-02-28 |
Enplas Corp |
表示パネル検査装置
|
JP2002134860A
(ja)
*
|
2000-10-23 |
2002-05-10 |
Matsushita Electric Ind Co Ltd |
フレキシブルプリント配線板
|
US6760227B2
(en)
*
|
2000-11-02 |
2004-07-06 |
Murata Manufacturing Co., Ltd. |
Multilayer ceramic electronic component and manufacturing method thereof
|
US6951707B2
(en)
*
|
2001-03-08 |
2005-10-04 |
Ppg Industries Ohio, Inc. |
Process for creating vias for circuit assemblies
|
JP4485708B2
(ja)
*
|
2001-05-21 |
2010-06-23 |
シャープ株式会社 |
液晶表示装置用周辺回路基板及びそれを備えた液晶表示装置
|
JP4098556B2
(ja)
*
|
2001-07-31 |
2008-06-11 |
ローム株式会社 |
端子板、この端子板を備えた回路基板、およびこの端子板の接続方法
|
US20030143899A1
(en)
*
|
2002-01-31 |
2003-07-31 |
Fulk Mikel R. |
High density wire bondable connector assembly
|
JP2003243564A
(ja)
*
|
2002-02-08 |
2003-08-29 |
Samsung Electro Mech Co Ltd |
プリント回路基板ストリップのメッキのための設計方法及びこれを用いた半導体チップパッケージの製造方法
|
US6995032B2
(en)
*
|
2002-07-19 |
2006-02-07 |
Cree, Inc. |
Trench cut light emitting diodes and methods of fabricating same
|
JP3690378B2
(ja)
*
|
2002-07-26 |
2005-08-31 |
株式会社 日立ディスプレイズ |
表示装置
|
JP2004063803A
(ja)
*
|
2002-07-29 |
2004-02-26 |
Ngk Spark Plug Co Ltd |
プリント配線基板の製造方法、プリント配線基板製造用金属板、連結プリント配線基板
|
KR100900537B1
(ko)
*
|
2002-08-23 |
2009-06-02 |
삼성전자주식회사 |
액정 표시 장치, 그 검사 방법 및 제조 방법
|
US7008854B2
(en)
*
|
2003-05-21 |
2006-03-07 |
Micron Technology, Inc. |
Silicon oxycarbide substrates for bonded silicon on insulator
|
JP4411898B2
(ja)
|
2003-07-31 |
2010-02-10 |
セイコーエプソン株式会社 |
液晶表示パネル
|
JP4394432B2
(ja)
*
|
2003-12-15 |
2010-01-06 |
日東電工株式会社 |
配線回路基板保持シートの製造方法
|
JP4013914B2
(ja)
*
|
2004-04-12 |
2007-11-28 |
住友電装株式会社 |
基板用コネクタ
|
US7161651B2
(en)
*
|
2004-11-20 |
2007-01-09 |
Luxell Technologies Inc. |
Method of resizing a liquid crystal display
|
JP4725207B2
(ja)
*
|
2005-06-20 |
2011-07-13 |
船井電機株式会社 |
液晶表示装置
|
JP5022576B2
(ja)
*
|
2005-07-08 |
2012-09-12 |
株式会社ジャパンディスプレイイースト |
表示パネルおよび表示装置
|