KR100543428B1 - 접착제, 접착부재, 접착부재를 구비한 반도체탑재용배선기판 및 이것을 사용한 반도체장치 - Google Patents
접착제, 접착부재, 접착부재를 구비한 반도체탑재용배선기판 및 이것을 사용한 반도체장치 Download PDFInfo
- Publication number
- KR100543428B1 KR100543428B1 KR1020017015235A KR20017015235A KR100543428B1 KR 100543428 B1 KR100543428 B1 KR 100543428B1 KR 1020017015235 A KR1020017015235 A KR 1020017015235A KR 20017015235 A KR20017015235 A KR 20017015235A KR 100543428 B1 KR100543428 B1 KR 100543428B1
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive
- weight
- film
- adhesive member
- wiring board
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/068—Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/26—Porous or cellular plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2477/00—Presence of polyamide
- C09J2477/006—Presence of polyamide in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2481/00—Presence of sulfur containing polymers
- C09J2481/006—Presence of sulfur containing polymers in the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/023—Redistribution layers [RDL] for bonding areas
- H01L2224/0237—Disposition of the redistribution layers
- H01L2224/02377—Fan-in arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05541—Structure
- H01L2224/05548—Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/29386—Base material with a principal constituent of the material being a non metallic, non metalloid inorganic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0104—Zirconium [Zr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01051—Antimony [Sb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15182—Fan-in arrangement of the internal vias
- H01L2924/15183—Fan-in arrangement of the internal vias in a single layer of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Die Bonding (AREA)
Abstract
Description
실시예 1 | 실시예 2 | 실시예 3 | 실시예 4 | 실시예 5 | ||
내열성 | 내리플로우크랙 | O | O | O | O | O |
내온도사이클 | O | O | O | O | O | |
내습성 | O | O | O | O | O | |
발포 | × | O | O | O | O | |
사용가능기간 | O | O | O | O | O | |
실시예 6 | 실시예 7 | 실시예 8 | 실시예 9 | 참고예 1 | ||
내얼성 | 내리플로우크랙 | O | O | O | O | O |
내온도사이 클 | O | O | O | O | O | |
내습성 | O | O | O | O | O | |
발포 | O | O | O | O | O | |
사용가능기간 | O | O | O | O | × |
실시예 10 | 실시예 11 | 참고예 2 | ||
매입성 | 초기 | O | O | O |
1개월 | O | O | O | |
2개월 | O | O | × | |
3개월 | O | O | × | |
4개월 | O | O | × | |
5개월 | × | × | × | |
6개월 | × | × | × | |
사용가능기간 | 4개월 | 4개월 | 1개월 |
Claims (28)
- (1) 에폭시수지 및 그 경화제 100중량부, (2) 글리시딜(메타)아크릴레이트 0.5∼6중량%를 포함하는, Tg(유리전이온도)가 -10℃ 이상이고, 중량평균분자량이 10만 이상인 에폭시기함유 아크릴공중합체 75∼300중량부 및 (3) 애덕트형의 잠재성 경화촉진제 0.1∼20중량부를 함유하는 필름상의 접착제.
- (1) 에폭시수지 및 그 경화제 100중량부, (2) 에폭시수지와 상용성이 있고, 중량평균분자량이 3만 이상인 고분자량 수지 5∼40중량부, (3) 글리시딜(메타)아크릴레이트 0.5∼6중량%를 포함하는, Tg(유리전이온도)가 -10℃ 이상이고, 중량평균분자량이 10만 이상인 에폭시기함유 아크릴공중합체 75∼300중량부 및 (4) 애덕트형의 잠재성 경화촉진제 0.1∼20중량부를 함유하는 필름상의 접착제.
- 제 1항 또는 제 2항에 있어서, 상기 잠재성 경화촉진제가 아민 애덕트인 것을 특징으로 하는 접착제.
- 제 3항에 있어서, 상기 잠재성 경화촉진제가 아민-에폭시 애덕트, 아민-우레이드 애덕트 또는 아민-우레탄 애덕트인 것을 특징으로 하는 접착제.
- 제 4항에 있어서, 상기 잠재성 경화촉진제가 아민-에폭시 애덕트인 것을 특징으로 하는 접착제.
- 제 1항 또는 제 2항에 있어서, 무기필러를 접착제 수지분 100체적부에 대해서 1∼20체적부 포함하는 것을 특징으로 하는 접착제.
- 제 6항에 있어서, 무기필러가 알루미나, 실리카, 수산화알루미늄, 안티몬산화물중의 어느 하나인 것을 특징으로 하는 접착제.
- 제 1항 또는 제 2항에 있어서, 접착제는 DSC를 사용하여 측정한 경우의 전체 경화발열량의 10∼40%의 발열을 종료한 상태인 것을 특징으로 하는 접착제.
- 제 1항 또는 제 2항에 있어서, 잔존용매량이 5중량% 이하인 것을 특징으로 하는 접착제.
- 제 1항 또는 제 2항에 있어서, 동적점탄성 측정장치를 사용하여 측정한 경우의 접착제 경화물의 저장탄성율이, 25℃에서 20∼2000MPa이고, 260℃에서 3∼50MPa인 것을 특징으로 하는 접착제.
- 삭제
- 삭제
- 삭제
- 삭제
- 제 1항 또는 제 2항에 따른 접착제의 층을 캐리어필름상에 형성하여 얻어지는 필름상의 접착부재.
- 제 1항 또는 제 2항에 따른 접착제의 층을 코어재의 양면에 형성하여 얻어지는 접착부재.
- 제 16항에 있어서, 코어재가 내열성 열가소필름인 것을 특징으로 하는 접착부재.
- 제 17항에 있어서, 내열성 열가소필름재료의 연화점이 260℃ 이상인 것을 특징으로 하는 접착부재.
- 제 17항에 있어서, 코어재 또는 내열성 열가소필름이 다공질필름인 것을 특징으로 하는 접착부재.
- 제 17항에 있어서, 내열성 열가소필름이 액정폴리머인 것을 특징으로 하는 접착부재.
- 제 17항에 있어서, 내열성 열가소필름이 폴리아미드이미드, 폴리이미드, 폴리에테르이미드 또는 폴리에테르설폰중 어느 하나인 것을 특징으로 하는 접착부재.
- 제 17항에 있어서, 내열성 열가소필름이 폴리테트라플루오로에틸렌, 에틸렌테트라플루오로에틸렌코폴리머, 테트라플루오로에틸렌-헥사플루오로프로필렌코폴리머, 테트라플루오로에틸렌-퍼플루오로알킬비닐에테르코폴리머중의 어느 하나인 것을 특징으로 하는 접착부재.
- 배선기판의 반도체칩 탑재면에 제 15항에 따른 접착부재를 구비한 반도체탑재용 배선기판.
- 반도체칩과 배선기판을 제 15항에 따른 접착부재를 사용하여 접착시킨 반도체장치.
- 반도체칩의 면적이 배선기판의 면적의 70% 이상인 반도체칩과 배선기판을 제 15항에 따른 접착부재를 사용하여 접착시킨 반도체장치.
- 배선기판의 반도체칩 탑재면에 제 16항에 따른 접착부재를 구비한 반도체탑재용 배선기판.
- 반도체칩과 배선기판을 제 16항에 따른 접착부재를 사용하여 접착시킨 반도체장치.
- 반도체칩의 면적이 배선기판의 면적의 70% 이상인 반도체칩과 배선기판을 제 16항에 따른 접착부재를 사용하여 접착시킨 반도체장치.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-1999-00172815 | 1999-06-18 | ||
JP17281599 | 1999-06-18 | ||
JP33787899 | 1999-11-29 | ||
JPJP-P-1999-00337878 | 1999-11-29 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2004-7008344A Division KR100511759B1 (ko) | 1999-06-18 | 2000-06-15 | 접착제, 접착부재, 접착부재를 구비한 반도체탑재용배선기판 및 이것을 사용한 반도체장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020034084A KR20020034084A (ko) | 2002-05-08 |
KR100543428B1 true KR100543428B1 (ko) | 2006-01-20 |
Family
ID=26495043
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2004-7008344A KR100511759B1 (ko) | 1999-06-18 | 2000-06-15 | 접착제, 접착부재, 접착부재를 구비한 반도체탑재용배선기판 및 이것을 사용한 반도체장치 |
KR1020017015235A KR100543428B1 (ko) | 1999-06-18 | 2000-06-15 | 접착제, 접착부재, 접착부재를 구비한 반도체탑재용배선기판 및 이것을 사용한 반도체장치 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2004-7008344A KR100511759B1 (ko) | 1999-06-18 | 2000-06-15 | 접착제, 접착부재, 접착부재를 구비한 반도체탑재용배선기판 및 이것을 사용한 반도체장치 |
Country Status (7)
Country | Link |
---|---|
US (2) | US6673441B1 (ko) |
EP (2) | EP1586615B1 (ko) |
KR (2) | KR100511759B1 (ko) |
AT (2) | ATE370209T1 (ko) |
DE (2) | DE60036038T2 (ko) |
TW (1) | TWI257415B (ko) |
WO (1) | WO2000078887A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190073129A (ko) * | 2017-12-18 | 2019-06-26 | (주)이녹스첨단소재 | 지문인식센서 칩용 보강필름, 이의 제조방법 및 이를 포함하는 지문인식센서 모듈 |
Families Citing this family (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI299748B (en) * | 2000-02-15 | 2008-08-11 | Hitachi Chemical Co Ltd | Adhesive composition, its manufacturing method, and adhesive film, substrate for carrying a semiconductor device and semiconductor device using such adhesive composition |
JP4780844B2 (ja) * | 2001-03-05 | 2011-09-28 | Okiセミコンダクタ株式会社 | 半導体装置 |
JP2002299378A (ja) * | 2001-03-30 | 2002-10-11 | Lintec Corp | 導電体付接着シート、半導体装置製造方法および半導体装置 |
TWI300073B (en) * | 2001-09-14 | 2008-08-21 | Sumitomo Chemical Co | Resin composition for sealing a photo semiconductor |
JP2003092379A (ja) * | 2001-09-18 | 2003-03-28 | Hitachi Ltd | 半導体装置 |
US6873059B2 (en) | 2001-11-13 | 2005-03-29 | Texas Instruments Incorporated | Semiconductor package with metal foil attachment film |
JP3889700B2 (ja) * | 2002-03-13 | 2007-03-07 | 三井金属鉱業株式会社 | Cofフィルムキャリアテープの製造方法 |
US7173322B2 (en) * | 2002-03-13 | 2007-02-06 | Mitsui Mining & Smelting Co., Ltd. | COF flexible printed wiring board and method of producing the wiring board |
US20050205972A1 (en) * | 2002-03-13 | 2005-09-22 | Mitsui Mining & Smelting Co., Ltd. | COF flexible printed wiring board and semiconductor device |
US7304362B2 (en) * | 2002-05-20 | 2007-12-04 | Stmicroelectronics, Inc. | Molded integrated circuit package with exposed active area |
KR101164671B1 (ko) * | 2002-06-17 | 2012-07-11 | 헨켈 코포레이션 | 층간 절연 물질 및 미리 도포되는 다이 부착 접착제 물질 |
JP2004140313A (ja) * | 2002-08-22 | 2004-05-13 | Jsr Corp | 二層積層膜を用いた電極パッド上へのバンプ形成方法 |
TW582078B (en) * | 2002-11-29 | 2004-04-01 | Chipmos Technologies Bermuda | Packaging process for improving effective die-bonding area |
JP4238124B2 (ja) * | 2003-01-07 | 2009-03-11 | 積水化学工業株式会社 | 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体 |
US20040197571A1 (en) * | 2003-04-03 | 2004-10-07 | Yuji Hiroshige | Thermosetting composition, and sealing article and sealing structure using the same |
EP1630594B1 (en) * | 2003-05-21 | 2009-07-08 | Nippon Kayaku Kabushiki Kaisha | Sealant for liquid crystal and liquid-crystal display cell made with the same |
US7047633B2 (en) * | 2003-05-23 | 2006-05-23 | National Starch And Chemical Investment Holding, Corporation | Method of using pre-applied underfill encapsulant |
TWI318649B (en) * | 2003-06-06 | 2009-12-21 | Hitachi Chemical Co Ltd | Sticking sheep, connecting sheet unified with dicing tape,and fabricating method of semiconductor device |
JP4610168B2 (ja) * | 2003-08-06 | 2011-01-12 | スリーエム イノベイティブ プロパティズ カンパニー | 耐熱マスキングテープ |
JP4397653B2 (ja) * | 2003-08-26 | 2010-01-13 | 日東電工株式会社 | 半導体装置製造用接着シート |
EP1674919A1 (en) * | 2003-10-17 | 2006-06-28 | Nippon Kayaku Kabushiki Kaisha | Sealant for liquid crystal, liquid-crystal display made with the same, and process for produicng the display |
MY138566A (en) * | 2004-03-15 | 2009-06-30 | Hitachi Chemical Co Ltd | Dicing/die bonding sheet |
US20060008735A1 (en) * | 2004-07-09 | 2006-01-12 | Jsr Corporation | Radiation sensitive resin composition for forming microlens |
US7161232B1 (en) | 2004-09-14 | 2007-01-09 | National Semiconductor Corporation | Apparatus and method for miniature semiconductor packages |
US7585570B2 (en) * | 2005-04-14 | 2009-09-08 | Sumitomo Chemical Company, Limited | Adhesives and optical laminates including the same |
DE102006007108B4 (de) * | 2006-02-16 | 2020-09-17 | Lohmann Gmbh & Co. Kg | Reaktive Harzmischung und Verfahren zu deren Herstellung |
US20070212551A1 (en) * | 2006-03-10 | 2007-09-13 | Andrew Collins | Adhesive composition |
JP2007294488A (ja) * | 2006-04-20 | 2007-11-08 | Shinko Electric Ind Co Ltd | 半導体装置、電子部品、及び半導体装置の製造方法 |
KR101370245B1 (ko) * | 2006-05-23 | 2014-03-05 | 린텍 가부시키가이샤 | 점접착제 조성물, 점접착 시트 및 반도체장치의 제조방법 |
US7772040B2 (en) * | 2006-09-12 | 2010-08-10 | Nitto Denko Corporation | Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby |
KR20080047990A (ko) | 2006-11-27 | 2008-05-30 | 린텍 가부시키가이샤 | 점접착제 조성물, 점접착 시트 및 반도체 장치의 제조방법 |
WO2008069179A1 (ja) * | 2006-12-04 | 2008-06-12 | Panasonic Corporation | 封止材料及びその封止材料を用いる実装方法 |
TW200837137A (en) * | 2007-01-26 | 2008-09-16 | Hitachi Chemical Co Ltd | Sealing film and semiconductor device using the same |
JP2008247936A (ja) * | 2007-03-29 | 2008-10-16 | Lintec Corp | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
KR100896106B1 (ko) * | 2007-05-31 | 2009-05-07 | 엘에스엠트론 주식회사 | 상분리 패이스트 타입 점착제 및 그를 이용한 반도체 칩패키지 및 패키징 방법 |
TW200907003A (en) * | 2007-07-03 | 2009-02-16 | Hitachi Chemical Co Ltd | Adhesive composition and method of manufacturing thereof, adhesive member using the adhesive composition and method of manufacturing thereof, supporting member for mounting semiconductor and method of manufacturing thereof, and semiconductor apparatus an |
KR101002488B1 (ko) * | 2007-10-24 | 2010-12-17 | 제일모직주식회사 | 공-연속 상 분리 구조를 가지는 반도체 다이 접착제 조성물 및 이로부터 제조된 접착제 필름 |
WO2009060927A1 (ja) * | 2007-11-08 | 2009-05-14 | Hitachi Chemical Company, Ltd. | 半導体用接着シート及びダイシングテープ一体型半導体用接着シート |
KR100922226B1 (ko) * | 2007-12-10 | 2009-10-20 | 주식회사 엘지화학 | 접착 필름, 다이싱 다이본딩 필름 및 반도체 장치 |
JP5499448B2 (ja) * | 2008-07-16 | 2014-05-21 | デクセリアルズ株式会社 | 異方性導電接着剤 |
CA2746455C (en) | 2008-12-15 | 2017-01-03 | 3M Innovative Properties Company | Surfacing film for composites with barrier layer |
JP5558140B2 (ja) | 2009-06-10 | 2014-07-23 | デクセリアルズ株式会社 | 絶縁性樹脂フィルム、並びにこれを用いた接合体及びその製造方法 |
US8592260B2 (en) * | 2009-06-26 | 2013-11-26 | Nitto Denko Corporation | Process for producing a semiconductor device |
JP5728804B2 (ja) * | 2009-10-07 | 2015-06-03 | デクセリアルズ株式会社 | 熱硬化性接着組成物、熱硬化性接着シート、その製造方法及び補強フレキシブルプリント配線板 |
US8957663B2 (en) * | 2009-12-01 | 2015-02-17 | Nipro Corporation | Cellular potential measurement container and production method therefor |
EP2513204A1 (en) * | 2009-12-15 | 2012-10-24 | 3M Innovative Properties Company | Fluoropolymer film with epoxy adhesive |
CN102695768B (zh) * | 2010-01-15 | 2015-04-29 | 迪睿合电子材料有限公司 | 各向异性导电粘结剂 |
JP5586313B2 (ja) * | 2010-04-23 | 2014-09-10 | 京セラケミカル株式会社 | 接着剤層の形成方法、及び接着剤組成物 |
JP5820108B2 (ja) * | 2010-11-29 | 2015-11-24 | デクセリアルズ株式会社 | 熱硬化性接着シート及び熱硬化性接着シートの製造方法 |
JP5770995B2 (ja) | 2010-12-01 | 2015-08-26 | デクセリアルズ株式会社 | 熱硬化性樹脂組成物、熱硬化性接着シート及び熱硬化性接着シートの製造方法 |
KR101191075B1 (ko) * | 2011-06-15 | 2012-10-16 | (주)에프씨아이 | 에스아이피 구현을 위한 패키지 및 그 제조방법 |
US20130026660A1 (en) * | 2011-07-29 | 2013-01-31 | Namics Corporation | Liquid epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same |
US20130042976A1 (en) * | 2011-08-19 | 2013-02-21 | Harris Corporation | Film adhesives and processes for bonding components using same |
JP5901923B2 (ja) * | 2011-09-30 | 2016-04-13 | 太陽インキ製造株式会社 | 熱硬化性樹脂充填材及びプリント配線板 |
JP5894035B2 (ja) * | 2012-08-15 | 2016-03-23 | 日立化成株式会社 | 半導体装置の製造方法 |
KR20140123779A (ko) * | 2013-04-15 | 2014-10-23 | 동우 화인켐 주식회사 | 광경화 코팅 조성물, 이를 이용한 코팅 필름 및 편광판 |
CN104570498B (zh) * | 2014-11-24 | 2017-10-13 | 深圳市华星光电技术有限公司 | 可挠曲液晶面板及其制作方法 |
KR101843900B1 (ko) * | 2015-04-29 | 2018-03-30 | 주식회사 엘지화학 | 반도체 접착용 수지 조성물 및 반도체용 접착 필름 및 다이싱 다이본딩 필름 |
JP6265954B2 (ja) * | 2015-09-16 | 2018-01-24 | 古河電気工業株式会社 | 半導体裏面用フィルム |
EP3336120A1 (de) * | 2016-12-14 | 2018-06-20 | Sika Technology AG | Epoxidharz-klebstoff mit hoher druckfestigkeit |
MY193912A (en) * | 2017-05-10 | 2022-11-01 | Hitachi Chemical Co Ltd | Temporary protective film for semiconductor sealing molding |
WO2020150222A1 (en) * | 2019-01-16 | 2020-07-23 | Henkel IP & Holding GmbH | Curable compositions for production of reaction induced phase separated compositions with improved properties |
DE102019004057B4 (de) * | 2019-06-11 | 2022-02-03 | Lohmann Gmbh & Co. Kg | Komprimierbarer, haftklebriger, struktureller Klebefilm auf Basis einer latent reaktiven Zusammensetzung |
JP6691998B1 (ja) * | 2019-12-24 | 2020-05-13 | 株式会社鈴木 | 半導体装置の製造方法及び半導体装置の製造装置 |
DE102020206619A1 (de) | 2020-05-27 | 2021-12-02 | Tesa Se | Vorvernetzte epoxid-haftklebmassen und klebebänder, welche diese enthalten |
DE102020213368A1 (de) | 2020-10-22 | 2022-04-28 | Tesa Se | Protonenschwämme als Katalysator in Klebstoffen und Klebstoffe die diese enthalten |
KR102485700B1 (ko) * | 2020-12-23 | 2023-01-06 | 주식회사 두산 | 반도체 패키지용 언더필 필름 및 이를 이용하는 반도체 패키지의 제조방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05156229A (ja) * | 1991-08-31 | 1993-06-22 | Nippon Carbide Ind Co Inc | 耐熱性樹脂ライニング用接着剤組成物 |
JPH1117346A (ja) * | 1997-06-20 | 1999-01-22 | Hitachi Chem Co Ltd | 多層配線板 |
Family Cites Families (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62297377A (ja) * | 1986-06-18 | 1987-12-24 | Nissan Motor Co Ltd | エポキシ樹脂系接着性組成物 |
JPS6372722A (ja) * | 1986-09-12 | 1988-04-02 | Matsushita Electric Ind Co Ltd | 一液性熱硬化型エポキシ樹脂組成物 |
JPS6381187A (ja) * | 1986-09-25 | 1988-04-12 | Ibiden Co Ltd | 熱硬化性接着シ−ト |
EP0289939A1 (de) | 1987-05-08 | 1988-11-09 | ASTA Pharma AG | Neue 4-Benzyl-1-(2H)-phthalazinon-Derivate mit einem Aminosäurerest |
JPH0747725B2 (ja) * | 1987-10-26 | 1995-05-24 | サンスター技研株式会社 | フレキシブルプリント基板用接着剤 |
US5021519A (en) * | 1988-03-24 | 1991-06-04 | Aluminum Company Of America | Epoxy-polyimide blend for low temperature cure, high-performance resin system and composites |
JPH0715087B2 (ja) * | 1988-07-21 | 1995-02-22 | リンテック株式会社 | 粘接着テープおよびその使用方法 |
JPH03255185A (ja) * | 1990-03-05 | 1991-11-14 | Hitachi Chem Co Ltd | アディティブ法プリント配線板用の接着剤 |
JPH07119273B2 (ja) * | 1990-05-30 | 1995-12-20 | ソマール株式会社 | エポキシ樹脂組成物の製造方法 |
JPH04314391A (ja) * | 1991-04-12 | 1992-11-05 | Hitachi Chem Co Ltd | アディティブ法プリント配線板用接着剤 |
JPH05156226A (ja) * | 1991-12-03 | 1993-06-22 | Ube Ind Ltd | 構造用接着剤組成物 |
JP3513835B2 (ja) * | 1993-03-09 | 2004-03-31 | 日立化成工業株式会社 | 接着フィルム |
JP3321261B2 (ja) * | 1993-09-08 | 2002-09-03 | 日立化成工業株式会社 | 抵抗回路付シートヒーター用接着剤組成物 |
JPH07173449A (ja) * | 1993-12-17 | 1995-07-11 | Hitachi Chem Co Ltd | アクリル系接着剤組成物及びこれを用いた接着フィルム |
JPH07292339A (ja) * | 1994-04-21 | 1995-11-07 | Nippon Carbide Ind Co Inc | 金属箔張積層板用接着剤組成物及び金属箔張積層板用接着シート |
US5965269A (en) * | 1995-04-04 | 1999-10-12 | Hitachi Chemical Company, Ltd. | Adhesive, adhesive film and adhesive-backed metal foil |
US5708056A (en) | 1995-12-04 | 1998-01-13 | Delco Electronics Corporation | Hot melt epoxy encapsulation material |
JP3787889B2 (ja) | 1996-05-09 | 2006-06-21 | 日立化成工業株式会社 | 多層配線板及びその製造方法 |
AU3460997A (en) * | 1996-07-15 | 1998-02-09 | Hitachi Chemical Company, Ltd. | Film-like adhesive for connecting circuit and circuit board |
TW383435B (en) * | 1996-11-01 | 2000-03-01 | Hitachi Chemical Co Ltd | Electronic device |
JP3675072B2 (ja) * | 1996-11-28 | 2005-07-27 | 日立化成工業株式会社 | 半導体装置 |
JP3792327B2 (ja) | 1996-12-24 | 2006-07-05 | 日立化成工業株式会社 | 熱伝導性接着剤組成物及び該組成物を用いた熱伝導性接着フィルム |
JPH10226769A (ja) * | 1997-02-17 | 1998-08-25 | Hitachi Chem Co Ltd | フィルム状接着剤及び接続方法 |
JP4514840B2 (ja) * | 1997-02-14 | 2010-07-28 | 日立化成工業株式会社 | 回路部材接続用接着剤 |
JP4440352B2 (ja) * | 1997-02-17 | 2010-03-24 | 日立化成工業株式会社 | 回路部材接続用接着剤 |
JP3559137B2 (ja) | 1997-02-27 | 2004-08-25 | 日立化成工業株式会社 | 熱伝導性接着剤組成物及び該組成物を用いた熱伝導性接着フィルム |
JPH10245533A (ja) * | 1997-03-06 | 1998-09-14 | Sekisui Chem Co Ltd | 硬化型粘接着シート |
JP4151081B2 (ja) | 1997-03-07 | 2008-09-17 | 日立化成工業株式会社 | 回路部材接続用接着剤 |
JP3877089B2 (ja) * | 1997-03-31 | 2007-02-07 | 日立化成工業株式会社 | 回路接続用接着剤及び回路板の製造法 |
JP3915940B2 (ja) * | 1997-06-10 | 2007-05-16 | 日立化成工業株式会社 | 絶縁層用接着フィルム |
JP3978623B2 (ja) * | 1997-06-10 | 2007-09-19 | 日立化成工業株式会社 | 多層配線板 |
JP3498537B2 (ja) * | 1997-06-25 | 2004-02-16 | 日立化成工業株式会社 | 絶縁層用接着フィルム |
JP4045620B2 (ja) * | 1997-10-08 | 2008-02-13 | 日立化成工業株式会社 | 回路接続用フィルム状接着剤 |
JPH11166019A (ja) * | 1997-12-03 | 1999-06-22 | Hitachi Chem Co Ltd | アクリル樹脂とこれを用いた接着剤及び接着フィルム並びにアクリル樹脂の製造法 |
JPH11209724A (ja) * | 1998-01-30 | 1999-08-03 | Hitachi Chem Co Ltd | 難燃化接着剤、難燃化接着部材、難燃化接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 |
JPH11209723A (ja) * | 1998-01-30 | 1999-08-03 | Hitachi Chem Co Ltd | 難燃化接着剤、難燃化接着部材、難燃化接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 |
JPH11246829A (ja) * | 1998-02-27 | 1999-09-14 | Hitachi Chem Co Ltd | 両面接着フィルム及び半導体装置 |
JPH11256013A (ja) * | 1998-03-12 | 1999-09-21 | Ajinomoto Co Inc | エポキシ樹脂組成物 |
JPH11265960A (ja) * | 1998-03-18 | 1999-09-28 | Hitachi Chem Co Ltd | 金属製補強材付き半導体装置 |
JPH11284114A (ja) * | 1998-03-27 | 1999-10-15 | Hitachi Chem Co Ltd | 半導体装置 |
JP2000144077A (ja) * | 1998-11-17 | 2000-05-26 | Hitachi Chem Co Ltd | 両面接着フィルム及びこれを用いた半導体装置 |
JP2000159860A (ja) * | 1998-11-27 | 2000-06-13 | Hitachi Chem Co Ltd | 耐熱性樹脂組成物 |
-
2000
- 2000-06-15 EP EP20050012968 patent/EP1586615B1/en not_active Expired - Lifetime
- 2000-06-15 AT AT05012968T patent/ATE370209T1/de not_active IP Right Cessation
- 2000-06-15 DE DE2000636038 patent/DE60036038T2/de not_active Expired - Lifetime
- 2000-06-15 AT AT00937250T patent/ATE316560T1/de not_active IP Right Cessation
- 2000-06-15 WO PCT/JP2000/003908 patent/WO2000078887A1/ja active IP Right Grant
- 2000-06-15 DE DE60025720T patent/DE60025720T2/de not_active Expired - Lifetime
- 2000-06-15 US US09/979,979 patent/US6673441B1/en not_active Expired - Lifetime
- 2000-06-15 EP EP00937250A patent/EP1209211B1/en not_active Expired - Lifetime
- 2000-06-15 KR KR10-2004-7008344A patent/KR100511759B1/ko active IP Right Review Request
- 2000-06-15 KR KR1020017015235A patent/KR100543428B1/ko active IP Right Grant
- 2000-06-17 TW TW89111960A patent/TWI257415B/zh not_active IP Right Cessation
-
2003
- 2003-01-27 US US10/351,430 patent/US6838170B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05156229A (ja) * | 1991-08-31 | 1993-06-22 | Nippon Carbide Ind Co Inc | 耐熱性樹脂ライニング用接着剤組成物 |
JPH1117346A (ja) * | 1997-06-20 | 1999-01-22 | Hitachi Chem Co Ltd | 多層配線板 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190073129A (ko) * | 2017-12-18 | 2019-06-26 | (주)이녹스첨단소재 | 지문인식센서 칩용 보강필름, 이의 제조방법 및 이를 포함하는 지문인식센서 모듈 |
CN110027283A (zh) * | 2017-12-18 | 2019-07-19 | 利诺士尖端材料有限公司 | 用于指纹识别传感器芯片的增强膜、及包括其的指纹识别传感器模块 |
KR102057204B1 (ko) * | 2017-12-18 | 2020-01-22 | (주)이녹스첨단소재 | 지문인식센서 칩용 보강필름, 이의 제조방법 및 이를 포함하는 지문인식센서 모듈 |
CN110027283B (zh) * | 2017-12-18 | 2022-12-02 | 利诺士尖端材料有限公司 | 用于指纹识别传感器芯片的增强膜、及包括其的指纹识别传感器模块 |
Also Published As
Publication number | Publication date |
---|---|
TWI257415B (en) | 2006-07-01 |
ATE370209T1 (de) | 2007-09-15 |
US20030145949A1 (en) | 2003-08-07 |
ATE316560T1 (de) | 2006-02-15 |
US6838170B2 (en) | 2005-01-04 |
EP1586615A1 (en) | 2005-10-19 |
WO2000078887A1 (fr) | 2000-12-28 |
EP1209211B1 (en) | 2006-01-25 |
US6673441B1 (en) | 2004-01-06 |
KR20040064722A (ko) | 2004-07-19 |
KR20020034084A (ko) | 2002-05-08 |
KR100511759B1 (ko) | 2005-08-31 |
EP1209211A4 (en) | 2002-09-25 |
DE60036038T2 (de) | 2008-04-30 |
DE60025720T2 (de) | 2006-11-09 |
DE60025720D1 (de) | 2006-04-13 |
EP1209211A1 (en) | 2002-05-29 |
DE60036038D1 (de) | 2007-09-27 |
EP1586615B1 (en) | 2007-08-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100543428B1 (ko) | 접착제, 접착부재, 접착부재를 구비한 반도체탑재용배선기판 및 이것을 사용한 반도체장치 | |
JP4165072B2 (ja) | 接着剤組成物、接着フィルム、半導体搭載用配線基板及び半導体装置とその製造方法 | |
KR100603484B1 (ko) | 접착제 및 양면 접착 필름 | |
KR100932045B1 (ko) | 경화성 수지 조성물, 접착성 에폭시 수지 페이스트, 접착성에폭시 수지 시트, 도전 접속 페이스트, 도전 접속 시트및 전자 부품 접합체 | |
JP3617417B2 (ja) | 接着剤、接着部材、接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 | |
KR20060043767A (ko) | 반도체용 점접착(粘接着) 시트 및 반도체 장치의 제조 방법 | |
JP4994743B2 (ja) | フィルム状接着剤及びそれを使用する半導体パッケージの製造方法 | |
JP3528639B2 (ja) | 接着剤、接着部材、接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 | |
JP3539242B2 (ja) | 接着部材、接着部材を設けた半導体搭載用配線基板及びこれを用いた半導体装置 | |
JP2002060716A (ja) | 低弾性接着剤、低弾性接着部材、低弾性接着部材を備えた半導体搭載用基板及びこれを用いた半導体装置 | |
JP4505769B2 (ja) | 接着フィルム、接着フィルムを備えた半導体搭載用配線基板、半導体装置及びその製造方法 | |
JP4161544B2 (ja) | 半導体素子搭載用接着フィルム | |
JPH11209724A (ja) | 難燃化接着剤、難燃化接着部材、難燃化接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 | |
JP3617504B2 (ja) | 半導体素子搭載用接着フィルム | |
JP4556472B2 (ja) | 接着剤、接着部材、接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 | |
JP2003073641A (ja) | 難燃性接着フィルム、半導体搭載用配線基板、半導体装置及び半導体装置の製造方法 | |
JP4719992B2 (ja) | 接着剤組成物およびその用途 | |
KR100483102B1 (ko) | 접착제 및 양면 접착 필름 | |
JP4699620B2 (ja) | 感光性接着フィルムおよびその用途ならびに半導体装置の製造方法 | |
JP4934895B2 (ja) | 接着剤組成物、接着フィルム、半導体搭載用配線基板及び半導体装置 | |
JP2000154360A (ja) | 接着剤、接着部材、接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 | |
JPH11209723A (ja) | 難燃化接着剤、難燃化接着部材、難燃化接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 | |
JP2001279217A (ja) | 接着剤組成物、難燃性接着剤組成物、接着フィルム、半導体搭載用配線基板及び半導体装置とその製造方法 | |
JP2000164607A (ja) | 電子部品用接着部材、電子部品用接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
A107 | Divisional application of patent | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20121231 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20131230 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20150105 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20160104 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20161230 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20190102 Year of fee payment: 14 |