KR20020034084A - 접착제, 접착부재, 접착부재를 구비한 반도체탑재용배선기판 및 이것을 사용한 반도체장치 - Google Patents
접착제, 접착부재, 접착부재를 구비한 반도체탑재용배선기판 및 이것을 사용한 반도체장치 Download PDFInfo
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- KR20020034084A KR20020034084A KR1020017015235A KR20017015235A KR20020034084A KR 20020034084 A KR20020034084 A KR 20020034084A KR 1020017015235 A KR1020017015235 A KR 1020017015235A KR 20017015235 A KR20017015235 A KR 20017015235A KR 20020034084 A KR20020034084 A KR 20020034084A
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
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- C09J133/04—Homopolymers or copolymers of esters
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Abstract
Description
실시예 1 | 실시예 2 | 실시예 3 | 실시예 4 | 실시예 5 | ||
내열성 | 내리플로우크랙 | O | O | O | O | O |
내온도사이클 | O | O | O | O | O | |
내습성 | O | O | O | O | O | |
발포 | × | O | O | O | O | |
사용가능기간 | O | O | O | O | O | |
실시예 6 | 실시예 7 | 실시예 8 | 실시예 9 | 참고예 1 | ||
내얼성 | 내리플로우크랙 | O | O | O | O | O |
내온도사이클 | O | O | O | O | O | |
내습성 | O | O | O | O | O | |
발포 | O | O | O | O | O | |
사용가능기간 | O | O | O | O | × |
실시예 10 | 실시예 11 | 참고예 2 | ||
매입성 | 초기 | O | O | O |
1개월 | O | O | O | |
2개월 | O | O | × | |
3개월 | O | O | × | |
4개월 | O | O | × | |
5개월 | × | × | × | |
6개월 | × | × | × | |
사용가능기간 | 4개월 | 4개월 | 1개월 |
Claims (25)
- (1) 에폭시수지 및 그 경화제 100중량부, (2) 글리시딜(메타)아크릴레이트 0.5∼6중량%를 포함하는, Tg(유리전이온도)가 -10℃ 이상이고, 중량평균분자량이 10만 이상인 에폭시기함유 아크릴공중합체 75∼300중량부 및 (3) 잠재성 경화촉진제 0.1∼20중량부를 함유하는 접착제.
- (1) 에폭시수지 및 그 경화제 100중량부, (2) 에폭시수지와 상용성이 있고, 중량평균분자량이 3만 이상인 고분자량 수지 5∼40중량부, (3) 글리시딜(메타)아크릴레이트 0.5∼6중량%를 포함하는, Tg(유리전이온도)가 -10℃ 이상이고, 중량평균분자량이 10만 이상인 에폭시기함유 아크릴공중합체 75∼300중량부 및 (4) 잠재성 경화촉진제 0.1∼20중량부를 함유하는 접착제.
- 제 1항 내지 제 2항중 어느 한 항에 있어서, 잠재성 경화촉진제가 애덕트형인 것을 특징으로 하는 접착제.
- 제 3항에 있어서, 잠재성 경화촉진제가 아민 애덕트인 것을 특징으로 하는 접착제.
- 제 4항에 있어서, 잠재성 경화촉진제가 아민-에폭시 애덕트인 것을 특징으로하는 접착제.
- 제 1항 내지 제 5항중 어느 한 항에 있어서, 무기필러를 접착제 수지분 100체적부에 대해서 1∼20체적부 포함하는 것을 특징으로 하는 접착제.
- 제 6항에 있어서, 무기필러가 알루미나, 실리카, 수산화알루미늄, 안티몬산화물중의 어느 하나인 것을 특징으로 하는 접착제.
- 제 1항 내지 제 7항중 어느 한 항에 있어서, 접착제는 DSC를 사용하여 측정한 경우의 전체 경화발열량의 10∼40%의 발열을 종료한 상태인 것을 특징으로 하는 접착제.
- 제 1항 내지 제 8항중 어느 한 항에 있어서, 잔존용매량이 5중량% 이하인 것을 특징으로 하는 접착제.
- 제 1항 내지 제 9항중 어느 한 항에 있어서, 동적점탄성 측정장치를 사용하여 측정한 경우의 접착제 경화물의 저장탄성율이, 25℃에서 20∼2000MPa이고, 260℃에서 3∼50MPa인 것을 특징으로 하는 접착제.
- B스테이지 상태에서 상분리하는 2종류의 수지, 경화제 및 경화촉진제를 필수성분으로 하는 접착제 조성물로서, B스테이지 상태에서 경화촉진제가 분산상에 상용성을 갖고, 연속상과는 상분리하는 것을 특징으로 하는 접착제.
- 제 11항에 있어서, B스테이지 상태에서 분상상이 에폭시수지 및 경화제를 주성분으로 하는 상으로 되고, 연속상이 중량평균분자량 10만 이상의 고분자량 성분을 주성분으로 하는 상으로 되는 것을 특징으로 하는 접착제.
- 제 12항에 있어서, 중량평균분자량 10만 이상의 고분자량 성분이 글리시딜메타크릴레이트 또는 글리시딜아크릴레이트 2∼6중량%를 포함하는 에폭시기함유 아크릴공중합체인 것을 특징으로 하는 접착제.
- 제 11항 내지 제 13항중 어느 한 항에 있어서, 경화촉진제가 아민-에폭시 애덕트화합물인 것을 특징으로 하는 접착제.
- 제 1항 내지 제 14항중 어느 한 항에 따른 접착제의 층을 캐리어필름상에 형성하여 얻어지는 필름상의 접착부재.
- 제 1항 내지 제 14항중 어느 한 항에 따른 접착제의 층을 코어재의 양면에 형성하여 얻어지는 접착부재.
- 제 16항에 있어서, 코어재가 내열성 열가소필름인 것을 특징으로 하는 접착부재.
- 제 17항에 있어서, 내열성 열가소필름재료의 연화점이 260℃ 이상인 것을 특징으로 하는 접착부재.
- 제 17항 또는 제 18항에 있어서, 코어재 또는 내열성 열가소필름이 다공질필름인 것을 특징으로 하는 접착부재.
- 제 17항 내지 제 19항중 어느 한 항에 있어서, 내열성 열가소필름이 액정폴리머인 것을 특징으로 하는 접착부재.
- 제 17항 내지 제 20항중 어느 한 항에 있어서, 내열성 열가소필름이 폴리아미드이미드, 폴리이미드, 폴리에테르이미드 또는 폴리에테르설폰중 어느 하나인 것을 특징으로 하는 접착부재.
- 제 17항 내지 제 20항중 어느 한 항에 있어서, 내열성 열가소필름이 폴리테트라플루오로에틸렌, 에틸렌테트라플루오로에틸렌코폴리머, 테트라플루오로에틸렌-헥사플루오로프로필렌코폴리머, 테트라플루오로에틸렌-퍼플루오로알킬비닐에테르코폴리머중의 어느 하나인 것을 특징으로 하는 접착부재.
- 배선기판의 반도체칩 탑재면에 제 15항 내지 제 22항중 어느 한 항에 따른 접착부재를 구비한 반도체탑재용 배선기판.
- 반도체칩과 배선기판을 제 15항 내지 제 22항중 어느 한 항에 따른 접착부재를 사용하여 접착시킨 반도체장치.
- 반도체칩의 면적이 배선기판의 면적의 70% 이상인 반도체칩과 배선기판을 제 15항 내지 제 22항중 어느 한 항에 따른 접착부재를 사용하여 접착시킨 반도체장치.
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KR1020017015235A KR100543428B1 (ko) | 1999-06-18 | 2000-06-15 | 접착제, 접착부재, 접착부재를 구비한 반도체탑재용배선기판 및 이것을 사용한 반도체장치 |
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EP (2) | EP1586615B1 (ko) |
KR (2) | KR100511759B1 (ko) |
AT (2) | ATE316560T1 (ko) |
DE (2) | DE60025720T2 (ko) |
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2000
- 2000-06-15 WO PCT/JP2000/003908 patent/WO2000078887A1/ja active IP Right Grant
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- 2000-06-15 AT AT00937250T patent/ATE316560T1/de not_active IP Right Cessation
- 2000-06-15 DE DE2000636038 patent/DE60036038T2/de not_active Expired - Lifetime
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- 2000-06-15 KR KR1020017015235A patent/KR100543428B1/ko active IP Right Grant
- 2000-06-15 EP EP00937250A patent/EP1209211B1/en not_active Expired - Lifetime
- 2000-06-15 AT AT05012968T patent/ATE370209T1/de not_active IP Right Cessation
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101136719B1 (ko) * | 2002-06-17 | 2012-04-20 | 헨켈 코포레이션 | 층간 절연 물질 및 미리 도포되는 다이 부착 접착제 물질 |
US9426896B2 (en) | 2009-06-10 | 2016-08-23 | Dexerials Corporation | Insulating resin film, bonded structure using insulating resin film, and production method of bonded structure |
Also Published As
Publication number | Publication date |
---|---|
EP1586615A1 (en) | 2005-10-19 |
DE60025720D1 (de) | 2006-04-13 |
EP1586615B1 (en) | 2007-08-15 |
DE60036038D1 (de) | 2007-09-27 |
EP1209211A4 (en) | 2002-09-25 |
ATE316560T1 (de) | 2006-02-15 |
KR20040064722A (ko) | 2004-07-19 |
TWI257415B (en) | 2006-07-01 |
DE60025720T2 (de) | 2006-11-09 |
KR100511759B1 (ko) | 2005-08-31 |
US6838170B2 (en) | 2005-01-04 |
EP1209211A1 (en) | 2002-05-29 |
US20030145949A1 (en) | 2003-08-07 |
EP1209211B1 (en) | 2006-01-25 |
DE60036038T2 (de) | 2008-04-30 |
US6673441B1 (en) | 2004-01-06 |
ATE370209T1 (de) | 2007-09-15 |
WO2000078887A1 (fr) | 2000-12-28 |
KR100543428B1 (ko) | 2006-01-20 |
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