WO2009060927A1 - 半導体用接着シート及びダイシングテープ一体型半導体用接着シート - Google Patents
半導体用接着シート及びダイシングテープ一体型半導体用接着シート Download PDFInfo
- Publication number
- WO2009060927A1 WO2009060927A1 PCT/JP2008/070268 JP2008070268W WO2009060927A1 WO 2009060927 A1 WO2009060927 A1 WO 2009060927A1 JP 2008070268 W JP2008070268 W JP 2008070268W WO 2009060927 A1 WO2009060927 A1 WO 2009060927A1
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- WIPO (PCT)
- Prior art keywords
- adhesive sheet
- semiconductor
- dicing tape
- tape integrated
- curing
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Adhesive Tapes (AREA)
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Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08847953A EP2219212A4 (en) | 2007-11-08 | 2008-11-07 | ADHESIVE FILM FOR A SEMICONDUCTOR AND SAW FILM STRIP WITH THE SHEET FOR A SEMICONDUCTOR |
US12/741,117 US9969909B2 (en) | 2007-11-08 | 2008-11-07 | Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor |
CN2008801114549A CN101821841B (zh) | 2007-11-08 | 2008-11-07 | 半导体用粘接片及切割带一体型半导体用粘接片 |
JP2009540093A JP5287725B2 (ja) | 2007-11-08 | 2008-11-07 | 半導体用接着シート及びダイシングテープ一体型半導体用接着シート |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007290680 | 2007-11-08 | ||
JP2007-290680 | 2007-11-08 |
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US (1) | US9969909B2 (ja) |
EP (1) | EP2219212A4 (ja) |
JP (1) | JP5287725B2 (ja) |
KR (1) | KR101557171B1 (ja) |
CN (2) | CN102543809B (ja) |
MY (1) | MY151971A (ja) |
SG (1) | SG185968A1 (ja) |
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Cited By (6)
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JP2010100840A (ja) * | 2008-09-24 | 2010-05-06 | Hitachi Chem Co Ltd | 接着剤フィルム及び回路接続材料 |
CN102382585A (zh) * | 2010-07-28 | 2012-03-21 | 日东电工株式会社 | 倒装芯片型半导体背面用膜、半导体背面用条状膜的生产方法和倒装芯片型半导体器件 |
CN102382586A (zh) * | 2010-07-28 | 2012-03-21 | 日东电工株式会社 | 倒装芯片型半导体背面用膜 |
JP2013006899A (ja) * | 2011-06-22 | 2013-01-10 | Hitachi Chemical Co Ltd | 接着フィルム及びこれを用いた半導体装置 |
WO2013005470A1 (ja) * | 2011-07-01 | 2013-01-10 | 古河電気工業株式会社 | 接着フィルム、並びにダイシングダイボンディングフィルム及びそれを用いた半導体加工方法 |
JP2015021062A (ja) * | 2013-07-19 | 2015-02-02 | 住友ベークライト株式会社 | 樹脂組成物、接着フィルム、接着シート、ダイシングテープ一体型接着シートおよび電子部品 |
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WO2012026431A1 (ja) * | 2010-08-23 | 2012-03-01 | 積水化学工業株式会社 | 接着シート及び半導体チップの実装方法 |
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JP6876540B2 (ja) * | 2017-06-27 | 2021-05-26 | 日東電工株式会社 | ダイシングテープ一体型接着性シート |
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- 2008-11-07 KR KR1020107008099A patent/KR101557171B1/ko active IP Right Grant
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- 2008-11-07 JP JP2009540093A patent/JP5287725B2/ja active Active
- 2008-11-07 WO PCT/JP2008/070268 patent/WO2009060927A1/ja active Application Filing
- 2008-11-07 EP EP08847953A patent/EP2219212A4/en not_active Withdrawn
- 2008-11-07 TW TW097143118A patent/TWI390621B/zh active
- 2008-11-07 CN CN201210003464.9A patent/CN102543809B/zh active Active
- 2008-11-07 SG SG2012082244A patent/SG185968A1/en unknown
- 2008-11-07 CN CN2008801114549A patent/CN101821841B/zh active Active
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010100840A (ja) * | 2008-09-24 | 2010-05-06 | Hitachi Chem Co Ltd | 接着剤フィルム及び回路接続材料 |
CN102382585A (zh) * | 2010-07-28 | 2012-03-21 | 日东电工株式会社 | 倒装芯片型半导体背面用膜、半导体背面用条状膜的生产方法和倒装芯片型半导体器件 |
CN102382586A (zh) * | 2010-07-28 | 2012-03-21 | 日东电工株式会社 | 倒装芯片型半导体背面用膜 |
JP2013006899A (ja) * | 2011-06-22 | 2013-01-10 | Hitachi Chemical Co Ltd | 接着フィルム及びこれを用いた半導体装置 |
WO2013005470A1 (ja) * | 2011-07-01 | 2013-01-10 | 古河電気工業株式会社 | 接着フィルム、並びにダイシングダイボンディングフィルム及びそれを用いた半導体加工方法 |
JP2015021062A (ja) * | 2013-07-19 | 2015-02-02 | 住友ベークライト株式会社 | 樹脂組成物、接着フィルム、接着シート、ダイシングテープ一体型接着シートおよび電子部品 |
Also Published As
Publication number | Publication date |
---|---|
MY151971A (en) | 2014-07-31 |
CN102543809B (zh) | 2015-11-04 |
JPWO2009060927A1 (ja) | 2011-03-24 |
KR20100085035A (ko) | 2010-07-28 |
KR101557171B1 (ko) | 2015-10-02 |
CN101821841A (zh) | 2010-09-01 |
SG185968A1 (en) | 2012-12-28 |
CN101821841B (zh) | 2013-05-08 |
TW200933722A (en) | 2009-08-01 |
TWI390621B (zh) | 2013-03-21 |
EP2219212A4 (en) | 2012-07-11 |
US9969909B2 (en) | 2018-05-15 |
EP2219212A1 (en) | 2010-08-18 |
US20100266842A1 (en) | 2010-10-21 |
CN102543809A (zh) | 2012-07-04 |
JP5287725B2 (ja) | 2013-09-11 |
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