JP7312152B2 - 液晶ポリマーフィルム及び該液晶ポリマーフィルムを含む積層体 - Google Patents

液晶ポリマーフィルム及び該液晶ポリマーフィルムを含む積層体 Download PDF

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Publication number
JP7312152B2
JP7312152B2 JP2020166621A JP2020166621A JP7312152B2 JP 7312152 B2 JP7312152 B2 JP 7312152B2 JP 2020166621 A JP2020166621 A JP 2020166621A JP 2020166621 A JP2020166621 A JP 2020166621A JP 7312152 B2 JP7312152 B2 JP 7312152B2
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metal foil
lcp
liquid crystal
polymer film
crystal polymer
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Japanese (ja)
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JP2021098837A (ja
JP2021098837A5 (enExample
Inventor
杜安邦
呉佳鴻
陳建鈞
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Chang Chun Plastics Co Ltd
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Chang Chun Plastics Co Ltd
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0141Liquid crystal polymer [LCP]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

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