TWI740515B - 液晶高分子膜及包含其之積層板 - Google Patents

液晶高分子膜及包含其之積層板 Download PDF

Info

Publication number
TWI740515B
TWI740515B TW109117530A TW109117530A TWI740515B TW I740515 B TWI740515 B TW I740515B TW 109117530 A TW109117530 A TW 109117530A TW 109117530 A TW109117530 A TW 109117530A TW I740515 B TWI740515 B TW I740515B
Authority
TW
Taiwan
Prior art keywords
liquid crystal
crystal polymer
polymer film
metal foil
creation
Prior art date
Application number
TW109117530A
Other languages
English (en)
Chinese (zh)
Other versions
TW202124544A (zh
Inventor
杜安邦
吳佳鴻
陳建鈞
Original Assignee
長春人造樹脂廠股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=76437850&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI740515(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 長春人造樹脂廠股份有限公司 filed Critical 長春人造樹脂廠股份有限公司
Priority to KR1020200128117A priority Critical patent/KR102487885B1/ko
Publication of TW202124544A publication Critical patent/TW202124544A/zh
Application granted granted Critical
Publication of TWI740515B publication Critical patent/TWI740515B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/06—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from hydroxycarboxylic acids
    • C08G63/065—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from hydroxycarboxylic acids the hydroxy and carboxylic ester groups being bound to aromatic rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C41/12—Spreading-out the material on a substrate, e.g. on the surface of a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D7/00—Producing flat articles, e.g. films or sheets
    • B29D7/01—Films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/098—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/06—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from hydroxycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/60—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from the reaction of a mixture of hydroxy carboxylic acids, polycarboxylic acids and polyhydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/78—Preparation processes
    • C08G63/82—Preparation processes characterised by the catalyst used
    • C08G63/83—Alkali metals, alkaline earth metals, beryllium, magnesium, copper, silver, gold, zinc, cadmium, mercury, manganese, or compounds thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38—Polymers
    • C09K19/3804—Polymers with mesogenic groups in the main chain
    • C09K19/3809—Polyesters; Polyester derivatives, e.g. polyamides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0079—Liquid crystals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/55—Liquid crystals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/704—Crystalline
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption
    • B32B2307/7242—Non-permeable
    • B32B2307/7246—Water vapor barrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/728—Hydrophilic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2250/00—Compositions for preparing crystalline polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/04—Polyesters derived from hydroxy carboxylic acids, e.g. lactones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2219/00—Aspects relating to the form of the liquid crystal [LC] material, or by the technical area in which LC material are used
    • C09K2219/03—Aspects relating to the form of the liquid crystal [LC] material, or by the technical area in which LC material are used in the form of films, e.g. films after polymerisation of LC precursor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Polyesters Or Polycarbonates (AREA)
TW109117530A 2019-12-23 2020-05-26 液晶高分子膜及包含其之積層板 TWI740515B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020200128117A KR102487885B1 (ko) 2019-12-23 2020-10-05 액정 폴리머 필름 및 이를 포함하는 라미네이트

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962952553P 2019-12-23 2019-12-23
US62/952,553 2019-12-23

Publications (2)

Publication Number Publication Date
TW202124544A TW202124544A (zh) 2021-07-01
TWI740515B true TWI740515B (zh) 2021-09-21

Family

ID=76437850

Family Applications (4)

Application Number Title Priority Date Filing Date
TW109117530A TWI740515B (zh) 2019-12-23 2020-05-26 液晶高分子膜及包含其之積層板
TW109144673A TWI741912B (zh) 2019-12-23 2020-12-17 積層板、線路板及用於其之液晶高分子膜
TW109144674A TWI730932B (zh) 2019-12-23 2020-12-17 液晶高分子膜及包含其之積層板
TW109144672A TWI735396B (zh) 2019-12-23 2020-12-17 液晶高分子膜及包含其之積層板

Family Applications After (3)

Application Number Title Priority Date Filing Date
TW109144673A TWI741912B (zh) 2019-12-23 2020-12-17 積層板、線路板及用於其之液晶高分子膜
TW109144674A TWI730932B (zh) 2019-12-23 2020-12-17 液晶高分子膜及包含其之積層板
TW109144672A TWI735396B (zh) 2019-12-23 2020-12-17 液晶高分子膜及包含其之積層板

Country Status (5)

Country Link
US (4) US11608410B2 (enExample)
JP (5) JP7312152B2 (enExample)
KR (3) KR102396122B1 (enExample)
CN (4) CN113099606A (enExample)
TW (4) TWI740515B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI740515B (zh) 2019-12-23 2021-09-21 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板
TWI697549B (zh) 2019-12-23 2020-07-01 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板
KR20220040731A (ko) * 2020-09-24 2022-03-31 삼성전기주식회사 인쇄회로기판
WO2023022081A1 (ja) * 2021-08-17 2023-02-23 住友化学株式会社 液晶ポリエステル粉末及びその製造方法、並びに、液晶ポリエステル組成物、液晶ポリエステルフィルムの製造方法、及び積層体の製造方法
WO2024237225A1 (ja) * 2023-05-16 2024-11-21 株式会社クラレ 熱可塑性液晶ポリマーフィルム、金属張積層板および積層体ならびにこれらの製造方法
CN117887120A (zh) * 2023-12-29 2024-04-16 金发科技股份有限公司 一种液晶聚合物薄膜及其制备方法和应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201939077A (zh) * 2018-03-02 2019-10-01 日商住友化學股份有限公司 偏光板及偏光板的製造方法
TW201941933A (zh) * 2018-03-30 2019-11-01 日商三井金屬鑛業股份有限公司 貼銅層積板

Family Cites Families (119)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4429105A (en) 1983-02-22 1984-01-31 Celanese Corporation Process for preparing a polyester of hydroxy naphthoic acid and hydroxy benzoic acid
US4975312A (en) 1988-06-20 1990-12-04 Foster-Miller, Inc. Multiaxially oriented thermotropic polymer substrate for printed wire board
CA2015324C (en) 1989-04-27 1998-09-15 Gary T. Brooks Crystalline polyphthalamide composition having improved heat resistance properties
JP2587500B2 (ja) 1989-09-22 1997-03-05 日本電気株式会社 レーザマーキング工法及びその素材
CA2060494A1 (en) 1991-02-13 1992-08-14 Elena S. Percec Polymer composites of thermoplastic and liquid crystal polymers and a process for their preparation
JPH06240019A (ja) 1993-02-16 1994-08-30 Toray Ind Inc ポリアルキレンテレフタレートフィルム及び積層ポリアルキレンテレフタレートフィルム
JP2962459B2 (ja) 1993-02-25 1999-10-12 ジャパンゴアテックス株式会社 液晶ポリマーフィルム及びその製造方法
JPH07251438A (ja) 1994-03-15 1995-10-03 Japan Gore Tex Inc 液晶ポリマーフィルム及びその製造方法
US5529740A (en) 1994-09-16 1996-06-25 Jester; Randy D. Process for treating liquid crystal polymer film
JPH08281817A (ja) 1995-04-11 1996-10-29 Sumitomo Chem Co Ltd 全芳香族液晶ポリエステルフィルムおよびその製造方法
US5746949A (en) 1995-11-21 1998-05-05 Hoechst Celanese Corp. Polarizer films comprising aromatic liquid crystalline polymers comprising dichroic dyes in their main chains
US5998804A (en) 1997-07-03 1999-12-07 Hna Holdings, Inc. Transistors incorporating substrates comprising liquid crystal polymers
US6268026B1 (en) 1997-10-20 2001-07-31 Hoechst Celanese Corporation Multilayer laminate formed from a substantially stretched non-molten wholly aromatic liquid crystalline polymer and non-liquid crystalline polyester and method for forming same
JP2000044797A (ja) 1998-04-06 2000-02-15 Kuraray Co Ltd 液晶ポリマ―フィルムと積層体及びそれらの製造方法並びに多層実装回路基板
JP2000006351A (ja) 1998-06-24 2000-01-11 Sumitomo Chem Co Ltd 積層フィルム、並びに、磁気記録媒体およびその製造方法
JP2000063551A (ja) 1998-08-26 2000-02-29 Ube Ind Ltd 多孔質フイルム及び電池用セパレータ
JP4091209B2 (ja) 1999-04-07 2008-05-28 株式会社クラレ ポリマーアロイおよびそのフィルム
WO2002020698A1 (en) 2000-09-01 2002-03-14 Ticona Llc Blends of stretchable liquid crystal polymers with thermoplastics
US6859241B2 (en) * 2001-10-16 2005-02-22 Nitto Denko Corporation Method of producing polarizing plate, and liquid crystal display comprising the polarizing plate
JP3958629B2 (ja) 2002-05-30 2007-08-15 ジャパンゴアテックス株式会社 液晶ポリマーフィルム及びその製造方法
JP3896324B2 (ja) 2002-11-28 2007-03-22 ジャパンゴアテックス株式会社 液晶ポリマーブレンドフィルム
KR20050085331A (ko) 2002-12-05 2005-08-29 가부시키가이샤 가네카 적층체, 인쇄 배선판 및 이들의 제조 방법
JP4245969B2 (ja) 2003-04-24 2009-04-02 ポリプラスチックス株式会社 非晶質全芳香族ポリエステルアミド及びその組成物
TWI359159B (en) 2003-11-05 2012-03-01 Sumitomo Chemical Co Aromatic liquid-crystalline polyester
JP4341023B2 (ja) 2004-04-13 2009-10-07 住友金属鉱山株式会社 金属被覆液晶ポリマーフィルムの製造方法
JP2006001185A (ja) 2004-06-18 2006-01-05 Dowa Mining Co Ltd プラスチックフィルム、金属被覆基板、及び、それらの製造方法
JP4731955B2 (ja) 2005-03-09 2011-07-27 ポリプラスチックス株式会社 表面加工用液晶性ポリエステル樹脂組成物
JP4851264B2 (ja) 2005-08-30 2012-01-11 古河電気工業株式会社 高分子フィルム、その製造方法、および配線基板用積層体
US8956738B2 (en) 2005-10-26 2015-02-17 Global Oled Technology Llc Organic element for low voltage electroluminescent devices
JP2007126578A (ja) 2005-11-04 2007-05-24 Fujifilm Corp 液晶ポリマー組成物、液晶ポリマーフィルム及びそれを用いた積層体
JP2007203702A (ja) 2006-02-06 2007-08-16 Polyplastics Co 多層射出延伸ブロー成形品及びその製造法
JP4804165B2 (ja) 2006-02-17 2011-11-02 旭化成ケミカルズ株式会社 樹脂製シートの製造方法
WO2008044398A1 (en) 2006-10-06 2008-04-17 Toray Industries, Inc. Hard-coating film, process for producing the same, and antireflection film
JP2008221488A (ja) 2007-03-08 2008-09-25 Kanto Gakuin Univ Surface Engineering Research Institute 液晶ポリマーフィルム金属張積層板
JP2008291168A (ja) 2007-05-28 2008-12-04 Sumitomo Chemical Co Ltd 液晶ポリマーフィルムの製造方法、及びプリント配線板用基板
TW200912484A (en) * 2007-07-30 2009-03-16 Fujifilm Corp Retardation film, polarizing plate, and liquid-crystal display device comprising it
JP5225653B2 (ja) 2007-10-30 2013-07-03 上野製薬株式会社 液晶ポリエステルブレンド
JP5228869B2 (ja) 2007-12-12 2013-07-03 日立化成株式会社 回路接続用接着フィルム、及び回路部材の位置識別用のマークを認識する方法
JP5177749B2 (ja) 2008-09-26 2013-04-10 富士フイルム株式会社 熱可塑性樹脂フィルムの製造方法
JP2010147442A (ja) 2008-12-22 2010-07-01 Panasonic Electric Works Co Ltd フレキシブルプリント配線板、フレキシブルプリント配線板の製造方法、及びフレキシブルプリント回路板
WO2010093009A1 (ja) 2009-02-13 2010-08-19 古河電気工業株式会社 金属箔およびその製造方法，絶縁基板，配線基板
US8906515B2 (en) 2009-06-02 2014-12-09 Integran Technologies, Inc. Metal-clad polymer article
JP5369054B2 (ja) 2009-06-15 2013-12-18 上野製薬株式会社 液晶ポリエステルブレンド組成物
JP5237892B2 (ja) 2009-06-29 2013-07-17 住友化学株式会社 積層体の製造方法、積層体およびｓｕｓ基板
JP2011054945A (ja) 2009-08-03 2011-03-17 Japan Gore Tex Inc 有機電解液系蓄電デバイス
JP5308295B2 (ja) 2009-09-28 2013-10-09 株式会社クラレ 伝送線路用熱可塑性液晶ポリマーフィルムおよび伝送線路
JP2011104789A (ja) 2009-11-12 2011-06-02 Polyplastics Co 金属複合積層部品の製造方法
CN102791480B (zh) 2010-03-12 2015-06-17 积水化学工业株式会社 脱模膜和脱模膜的制造方法
KR101094633B1 (ko) * 2010-03-12 2011-12-20 (주)디오 단일층 반사방지（ａｒ）필름용 유무기 하이브리드 코팅 조성물 및 그의 제조 방법
JPWO2011118449A1 (ja) 2010-03-26 2013-07-04 株式会社クラレ 光反射性フィルム、光反射性積層体、及び光反射性回路基板
JP2011216598A (ja) 2010-03-31 2011-10-27 Kuraray Co Ltd 高周波回路基板
CN103069933B (zh) * 2010-08-12 2014-06-04 新日铁住金化学株式会社 覆金属层叠板
JP5679167B2 (ja) 2010-10-18 2015-03-04 信越ポリマー株式会社 フィルムキャパシタ用フィルム
TWI535767B (zh) 2010-12-27 2016-06-01 住友化學股份有限公司 製造液晶聚酯膜之方法
KR20140009323A (ko) 2011-01-26 2014-01-22 스미토모 베이클리트 컴퍼니 리미티드 프린트 배선판 및 프린트 배선판의 제조 방법
JP2012186453A (ja) 2011-02-16 2012-09-27 Sumitomo Chemical Co Ltd 太陽電池用基板及び太陽電池素子
JP2012167224A (ja) 2011-02-16 2012-09-06 Sumitomo Chemical Co Ltd 中空樹脂筐体用樹脂組成物および中空樹脂筐体
KR20130126997A (ko) * 2011-03-01 2013-11-21 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 액정 폴리머 필름 베이스 구리 피복 적층판 및 그 제조 방법
CN103747959B (zh) 2011-08-09 2016-02-17 宇部爱科喜模株式会社 层叠体制造装置及层叠体的制造方法
CN104040383B (zh) 2012-01-17 2016-08-24 三菱树脂株式会社 反射材料
JP5871426B2 (ja) 2012-01-31 2016-03-01 古河電気工業株式会社 高周波伝送用表面処理銅箔、高周波伝送用積層板及び高周波伝送用プリント配線板
JP5916404B2 (ja) 2012-02-01 2016-05-11 古河電気工業株式会社 金属張積層体、回路基板およびその製造方法
EP2867022B1 (en) 2012-05-30 2018-12-12 Exatec, LLC. Plastic assembly, methods of making and using the same, and articles comprising the same
JP6277576B2 (ja) 2012-08-03 2018-02-14 大日本印刷株式会社 光学フィルム用基材、光学フィルム、偏光板、液晶パネルおよび画像表示装置
JP5481577B1 (ja) 2012-09-11 2014-04-23 Ｊｘ日鉱日石金属株式会社 キャリア付き銅箔
CN104663007B (zh) 2012-09-20 2017-10-24 株式会社可乐丽 电路基板及其制造方法
WO2014074227A1 (en) 2012-11-09 2014-05-15 Ticona Llc Liquid crystalline polymer composition for films
JP6206165B2 (ja) 2013-03-29 2017-10-04 東レ株式会社 転写箔用フィルム
JP2015077783A (ja) 2013-09-10 2015-04-23 東レ株式会社 離型用二軸配向ポリエステルフィルム
DE102013015237A1 (de) 2013-09-13 2015-03-19 Blum-Novotest Gmbh Rauheits-Messinstrument zum Einsatz in einer Werkzeugmaschine und Verfahren zur Rauheitsmessung in einer Werkzeugmaschine
JP2015066910A (ja) 2013-09-30 2015-04-13 信越ポリマー株式会社 フィルムキャパシタ用フィルム及びその製造方法
WO2015050080A1 (ja) 2013-10-03 2015-04-09 株式会社クラレ 熱可塑性液晶ポリマーフィルム、回路基板、およびそれらの製造方法
KR101449342B1 (ko) 2013-11-08 2014-10-13 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지
JP6019012B2 (ja) 2013-12-17 2016-11-02 株式会社クラレ 高周波回路基板
JP2016053751A (ja) 2014-09-02 2016-04-14 キヤノン株式会社 情報処理装置、情報処理方法及びプログラム
JP6144241B2 (ja) * 2014-09-22 2017-06-07 本田技研工業株式会社 燃料電池用樹脂枠付き電解質膜・電極構造体
JP6867102B2 (ja) 2014-10-22 2021-04-28 Ｊｘ金属株式会社 銅放熱材、キャリア付銅箔、コネクタ、端子、積層体、シールド材、プリント配線板、金属加工部材、電子機器、及び、プリント配線板の製造方法
JP6316178B2 (ja) 2014-12-05 2018-04-25 株式会社クラレ 片面金属張積層板およびその製造方法
CN107113982B (zh) * 2014-12-25 2020-04-10 住友电气工业株式会社 印刷配线板用基板、制作印刷配线板用基板的方法、印刷配线板、制作印刷配线板的方法以及树脂基材
KR102469672B1 (ko) 2015-01-13 2022-11-23 우베 에쿠시모 가부시키가이샤 플렉서블 라미네이트 시트 및 이의 제조 방법
JP6475020B2 (ja) 2015-01-13 2019-02-27 宇部エクシモ株式会社 積層板の製造方法
JP6518445B2 (ja) 2015-01-13 2019-05-22 宇部エクシモ株式会社 フレキシブル積層板、及びフレキシブル積層板の製造方法
JPWO2016136537A1 (ja) 2015-02-26 2017-09-28 アルプス電気株式会社 部材、当該部材の製造方法および当該部材を備える電子部品
JP6907435B2 (ja) * 2015-03-20 2021-07-21 大日本印刷株式会社 反射防止フィルム、該反射防止フィルムを用いた表示装置、及び反射防止フィルムの選択方法
TWI682019B (zh) * 2015-03-31 2020-01-11 日商鐘化股份有限公司 多層接著膜及撓性貼金屬箔積層板
TWI686291B (zh) 2015-04-20 2020-03-01 日商可樂麗股份有限公司 覆金屬之積層板的製造方法及使用其之覆金屬之積層板
WO2016174868A1 (ja) 2015-04-27 2016-11-03 株式会社クラレ 熱可塑性液晶ポリマーフィルム及び回路基板
WO2016194964A1 (ja) 2015-06-04 2016-12-08 住友電気工業株式会社 プリント配線板用原板及びプリント配線板
JP6083619B2 (ja) 2015-07-29 2017-02-22 福田金属箔粉工業株式会社 低誘電性樹脂基材用処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板
JP6710053B2 (ja) 2016-01-26 2020-06-17 日本メクトロン株式会社 フレキシブルプリント基板およびフレキシブルプリント基板の製造方法
KR102304510B1 (ko) 2016-03-03 2021-09-23 주식회사 쿠라레 금속 클래드 적층판 및 그 제조방법
KR101948821B1 (ko) * 2016-03-14 2019-02-15 주식회사 엘지화학 반사 방지 필름 및 디스플레이 장치
JP2017189894A (ja) 2016-04-12 2017-10-19 宇部エクシモ株式会社 金属積層体及び金属成形体
CN109312198B (zh) 2016-05-24 2024-05-28 富士胶片株式会社 层叠体以及使用该层叠体的图像显示装置的前面板、图像显示装置、带图像显示功能的反射镜、电阻膜式触摸面板及静电电容式触摸面板
CN109196716B (zh) 2016-05-27 2021-01-01 夏普株式会社 扫描天线及扫描天线的制造方法
JP6567771B2 (ja) 2016-06-01 2019-08-28 オリンパス株式会社 マニピュレータシステム
MY189231A (en) 2016-06-24 2022-01-31 Toray Industries Biaxially oriented thermoplastic resin film
US9673646B1 (en) 2016-08-19 2017-06-06 Chang Chun Petrochemical Co., Ltd. Surface-treated electrolytic copper foil and method for wireless charging of flexible printed circuit board
JP6721876B2 (ja) 2016-12-15 2020-07-15 Dic株式会社 液晶表示素子
CN110475655B (zh) * 2017-03-28 2022-08-16 电化株式会社 层叠体的制造方法以及层叠体的制造装置
JP6872947B2 (ja) 2017-03-29 2021-05-19 Ｊｘ金属株式会社 キャリア付銅箔、積層体、キャリア付銅箔の製造方法、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
KR102612138B1 (ko) 2017-03-31 2023-12-08 주식회사 쿠라레 열가소성 액정 폴리머 및 그 필름
JP7055049B2 (ja) 2017-03-31 2022-04-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP7356209B2 (ja) 2017-03-31 2023-10-04 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN110461593B (zh) 2017-04-07 2021-11-02 株式会社可乐丽 覆金属层叠板及其制造方法
JP7000076B2 (ja) 2017-08-29 2022-01-19 上野製薬株式会社 フィルム
KR101999455B1 (ko) 2017-12-26 2019-10-01 한승훈 3d 프린팅 업체 매칭서비스 시스템
WO2019130839A1 (ja) 2017-12-27 2019-07-04 Jsr株式会社 アレイアンテナ及びその製造方法、並びにアレイアンテナ用液晶配向剤
JP2018121085A (ja) 2018-05-09 2018-08-02 Ｊｘ金属株式会社 プリント配線板の製造方法
CN110498913B (zh) 2018-05-16 2022-06-03 臻鼎科技股份有限公司 改性的液晶高分子聚合物、高分子膜及相应的制备方法
JP6722370B2 (ja) 2018-07-06 2020-07-15 タツタ電線株式会社 プリント配線基板用貼付フィルム
EP3860958A4 (en) 2018-10-04 2022-08-10 Central Glass Company, Limited ANTI-GLARE SWITCHABLE GLASS CONSTRUCTION
CN109180979B (zh) 2018-10-31 2020-11-24 西安科技大学 一种高导热侧链型液晶高分子膜材料的制备方法
CN113286906B (zh) 2019-01-16 2023-12-08 日本制铁株式会社 方向性电磁钢板及成为方向性电磁钢板原板的钢板
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
TWI687465B (zh) 2019-06-28 2020-03-11 南亞塑膠工業股份有限公司 液晶聚合物薄膜及液晶聚合物與聚醯亞胺的複合膜及其製法
TWI740515B (zh) 2019-12-23 2021-09-21 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板
TWI697549B (zh) 2019-12-23 2020-07-01 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板
JPWO2021256491A1 (enExample) * 2020-06-19 2021-12-23

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201939077A (zh) * 2018-03-02 2019-10-01 日商住友化學股份有限公司 偏光板及偏光板的製造方法
TW201941933A (zh) * 2018-03-30 2019-11-01 日商三井金屬鑛業股份有限公司 貼銅層積板

Also Published As

Publication number Publication date
US20210187884A1 (en) 2021-06-24
CN113088053A (zh) 2021-07-09
US11926698B2 (en) 2024-03-12
KR20210082093A (ko) 2021-07-02
TW202124669A (zh) 2021-07-01
JP7372901B2 (ja) 2023-11-01
TW202124544A (zh) 2021-07-01
JP2021098837A (ja) 2021-07-01
JP2021098852A (ja) 2021-07-01
CN113099606A (zh) 2021-07-09
JP7312152B2 (ja) 2023-07-20
TWI735396B (zh) 2021-08-01
US20210189118A1 (en) 2021-06-24
CN113099607A (zh) 2021-07-09
JP2021098366A (ja) 2021-07-01
CN113088053B (zh) 2023-09-26
TWI741912B (zh) 2021-10-01
TW202124515A (zh) 2021-07-01
US11840602B2 (en) 2023-12-12
JP7125468B2 (ja) 2022-08-24
US20210189242A1 (en) 2021-06-24
JP2021098851A (ja) 2021-07-01
KR102396122B1 (ko) 2022-05-09
US11608410B2 (en) 2023-03-21
US20210189059A1 (en) 2021-06-24
CN113099607B (zh) 2024-06-18
JP2023099000A (ja) 2023-07-11
CN113087938B (zh) 2024-10-29
TWI730932B (zh) 2021-06-11
US11945907B2 (en) 2024-04-02
KR102578626B1 (ko) 2023-09-13
TW202124514A (zh) 2021-07-01
CN113087938A (zh) 2021-07-09
KR20210082094A (ko) 2021-07-02
KR20210082095A (ko) 2021-07-02
JP7012812B2 (ja) 2022-01-28

Similar Documents

Publication Publication Date Title
TWI740515B (zh) 液晶高分子膜及包含其之積層板
JPWO2017154811A1 (ja) 金属張積層板の製造方法および金属張積層板
TWI697549B (zh) 液晶高分子膜及包含其之積層板
KR102487885B1 (ko) 액정 폴리머 필름 및 이를 포함하는 라미네이트