CN113099606A - 液晶高分子膜及包含其的积层板 - Google Patents
液晶高分子膜及包含其的积层板 Download PDFInfo
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- CN113099606A CN113099606A CN202010483150.8A CN202010483150A CN113099606A CN 113099606 A CN113099606 A CN 113099606A CN 202010483150 A CN202010483150 A CN 202010483150A CN 113099606 A CN113099606 A CN 113099606A
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- liquid crystal
- crystal polymer
- polymer film
- metal foil
- present
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- C09K19/00—Liquid crystal materials
- C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
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Abstract
本发明关于一种液晶高分子膜及包含其的积层板。所述液晶高分子膜具有相对的第一表面和第二表面,所述第一表面的峰度(Rku)为3.0至60.0。本发明还提供了一种积层板,所述积层板包含第一金属箔及上述液晶高分子膜,所述第一金属箔设置于所述液晶高分子膜的第一表面上。通过控制液晶高分子膜的Rku,本发明不仅能提升液晶高分子膜与金属箔的剥离强度,还能确保包含其的积层板保有低讯号损失的优点。
Description
技术领域
本发明关于一种应用于积层板的高分子膜,尤指一种液晶高分子膜及包含其的积层板。
背景技术
随着行动通讯技术的快速发展,业界正积极开发第五代行动通讯技术(5thGeneration Mobile Networks,简称5G),以优化4G通讯技术的数据传输速度、响应时间、系统容量等效能。
由于5G通讯技术利用高频波段进行讯号传输,当讯号频率越高时,传递的讯号损失(insertion loss)也越大。因此,现有技术已知可选择低吸湿性、低介电性的液晶高分子膜(liquid crystal polymer film,简称LCP膜)取代易吸湿、高介电性的聚酰亚胺膜(polyimide film,简称PI膜),并将LCP膜与金属箔叠合形成积层板,以实现在高频波段进行讯号传输,同时设法降低在高频传输的讯号损失。
然而,积层板中LCP膜与金属箔之间多半存在附着性不足的问题,致使后续使用上易导致线路脱落而严重劣化积层板的后续加工,且随着高科技产业的进步,积层板的讯号损失亦有待更进一步地调降;因此,目前仍有待同时改善积层板中液晶高分子膜与金属箔之间的剥离强度不足以及讯号损失过高的问题。
发明内容
有鉴于现有技术存在的缺陷,本发明的目的在于提升积层板中液晶高分子膜与金属箔之间的剥离强度,同时确保积层板具有低讯号损失的特性。
为达成上述目的,本发明提供一种液晶高分子膜,其具有相对的第一表面和第二表面,所述第一表面的峰度(Kurtosis,Rku)为3.0至60.0。
通过控制液晶高分子膜的第一表面的Rku,不仅能增加液晶高分子膜叠合在金属箔上的附着性,提升液晶高分子膜与金属箔之间的剥离强度,从而避免积层板于后续加工中发生如线路脱落的问题,还能同时确保包含此种液晶高分子膜的积层板具有低讯号损失的特性。
除了液晶高分子膜的第一表面之外,于本发明的其中一实施态样中,本发明的液晶高分子膜的第二表面的Rku也可为3.0至60.0;据此,本发明的液晶高分子膜不论是通过第一表面、第二表面或其二者分别与至少一金属箔叠合皆能获得良好的附着性,提升液晶高分子膜与至少一金属箔之间的剥离强度,同时确保积层板具有低讯号损失的特性。
也就是说,当将本发明的液晶高分子膜应用于积层板时,此积层板可特别适用于高阶的5G产品中。
较佳的,本发明的液晶高分子膜的第一表面的Rku为3.4至60.0。于其中一实施态样中,本发明的液晶高分子膜的第一表面的Rku为3.4至59.9。于本发明的一实施态样中,本发明的液晶高分子膜的第一表面的Rku及第二表面的Rku皆落在上述范围。视需要地,本发明的液晶高分子膜的第一表面的Rku与第二表面的Rku可为相同或不同。于其中一实施态样中,本发明的液晶高分子膜的第一表面的Rku与第二表面的Rku并不相同。
较佳的,本发明的液晶高分子膜的第一表面的算术平均粗糙度(arithmeticaverage roughness,Ra)可小于或等于0.09μm;据此,所述液晶高分子膜与金属箔之间不仅具有高剥离强度,且所述液晶高分子膜应用于积层板中能进一步降低讯号损失,使其更加适用于高阶的5G产品中。更佳的,本发明的液晶高分子膜的第一表面的Ra可为0.02μm至0.09μm。再更佳的,本发明的液晶高分子膜的第一表面的Ra可大于或等于0.020μm且小于或等于0.088μm。通过降低液晶高分子膜的第一表面的Ra的技术手段,能进一步降低包含液晶高分子膜的积层板的讯号损失,使其更加适用于高阶的5G产品中。于其中一实施态样中,本发明的液晶高分子膜的第一表面的Ra可大于或等于0.04μm且小于或等于0.09μm。于本发明的一实施态样中,本发明的液晶高分子膜的第一表面的Ra及第二表面的Ra皆落在上述范围。视需要地,本发明的液晶高分子膜的第一表面的Ra与第二表面的Ra可为相同或不同。于其中一实施态样中,本发明的液晶高分子膜的第一表面的Ra与第二表面的Ra并不相同。
较佳的,液晶高分子膜的第一表面的十点平均粗糙度(ten point meanroughness,Rz)可小于或等于2.0微米(μm)。更佳的,本发明的液晶高分子膜的第一表面的Rz可小于或等于1.9μm。于其中一实施态样中,本发明的液晶高分子膜的第一表面的Rz可大于或等于0.1μm且小于或等于2.0μm;较佳的,本发明的液晶高分子膜的第一表面的Rz可大于或等于0.2μm且小于或等于2.0μm;更佳的,本发明的液晶高分子膜的第一表面的Rz可大于或等于0.3μm且小于或等于2.0μm;再更佳的,本发明的液晶高分子膜的第一表面的Rz可大于或等于0.3μm且小于或等于1.9μm。于本发明的一实施态样中,本发明的液晶高分子膜的第一表面的Rz及第二表面的Rz皆落在上述范围。视需要地,本发明的液晶高分子膜的第一表面的Rz与第二表面的Rz可为相同或不同。于其中一实施态样中,本发明的液晶高分子膜的第一表面的Rz与第二表面的Rz并不相同。
依据本发明,所述液晶高分子膜可使用市售的液晶高分子树脂所制得,也可使用现有的原料进行制备,在本发明中并没有特别限制。举例言之,可使用芳香族或脂肪族羟基化合物(例如,对苯二酚(hydroquinone)、间苯二酚(resorcin)、2,6-萘二酚(2,6-naphthalenediol)、乙二醇(ethanediol)、1,4-丁二醇(1,4-butanediol)、1,6-己二醇(1,6-hexanediol))、芳香族或脂肪族二羧酸(例如,对苯二甲酸(terephthalic acid)、间苯二甲酸(isophthalic acid)、2,6-萘二甲酸(2,6-naphthalenedicarboxylic acid)、2-氯对苯二甲酸(2-chloroterephthalic acid)、己二酸(adipic acid))、芳香族羟基羧酸(例如,3-羟基苯甲酸(3-hydroxybenzoic acid)、4-羟基苯甲酸(4-hydroxybenzoic acid)、6-羟基-2-萘甲酸(6-hydroxy-2-naphthalene carboxylic acid)、4'-羟基联苯-4-羧酸(4'-hydroxy-4-biphenylcarboxylic acid))、芳香族胺类化合物(例如,对苯二胺(pphenylenediamine)、4,4ˊ-二胺基联苯(4,4ˊ-diaminobiphenyl)、2,6-萘二胺(naphthalene-2,6-diamine)、4-胺基苯酚(4-aminophenol)、4-胺基-3-甲基苯酚(4-amino-3-methyl phenol)、4-胺基苯甲酸(4-aminobenzoic acid))为原料制备液晶高分子树脂,再利用此液晶高分子树脂制得本发明的液晶高分子膜。在本发明其中一实施态样中,可选用6-羟基-2-萘甲酸、4-羟基苯甲酸以及乙酸酐(acetyl anhydride)得到用于制备本发明的液晶高分子膜的液晶高分子树脂。于其中一实施态样中,液晶高分子树脂的熔点约为250℃至360℃。
于其中一实施态样中,所属技术领域的技术人员可视不同需求于制备本发明的液晶高分子膜时加入添加剂,例如润滑剂、抗氧化剂、电绝缘剂或填充剂,但并非仅限于此。举例言之,可选用的添加剂为聚碳酸酯、聚酰胺、聚苯硫醚或聚醚醚酮等,但并非仅限于此。
依据本发明,所述液晶高分子膜的厚度并没有特别限制,举例言之,所述液晶高分子膜的厚度可为10μm至500μm;较佳的,本发明的液晶高分子膜的厚度可为10μm至300μm;更佳的,本发明的液晶高分子膜的厚度可为15μm至250μm;再更佳的,本发明的液晶高分子膜的厚度可为20μm至200μm。
为达成上述目的,本发明还提供一种积层板,其包含第一金属箔及上述液晶高分子膜,所述第一金属箔设置于所述液晶高分子膜的第一表面上,即,于本发明的积层板中,所述第一金属箔叠合在所述液晶高分子膜的第一表面上。
于其中一实施态样中,本发明的积层板可进一步包含第二金属箔,所述第二金属箔设置于所述液晶高分子膜的第二表面上,即,于本发明的积层板中,所述第一金属箔叠合在所述液晶高分子膜的第一表面上,且所述第二金属箔叠合在所述液晶高分子膜的第二表面上。于此实施态样中,当同时控制液晶高分子膜的第一表面和第二表面的Rku特性,不仅能同时提升液晶高分子膜叠合在第一、第二金属箔上的附着性,即,同时提升液晶高分子膜与第一、第二金属箔之间的剥离强度,更能确保积层板具有低讯号损失的特性。
依据本发明,“叠合”并不限于直接接触,还包含间接接触。举例言之,于本发明其中一实施态样中,所述积层板中第一金属箔与所述液晶高分子膜的第一表面直接接触。于本发明另一实施态样中,所述积层板中第一金属箔与所述液晶高分子膜的第一表面间接接触,具体言之,可视不同需求于第一金属箔与液晶高分子膜的第一表面间设置一连结层,使第一金属箔与液晶高分子膜的第一表面通过所述连结层接触,其中所述连结层的材料可根据不同需求而调整;举例言之,所述连结层的材料可包含镍、钴、铬或其合金,以提供例如耐热性、耐化性、或电阻性的作用。同样地,所述积层板中第二金属箔与液晶高分子膜亦可选择以直接接触或者间接接触的方式叠合。于其中一实施态样中,液晶高分子膜与第一金属箔的叠合方式以及液晶高分子膜与第二金属箔的叠合方式相同。于其中一实施态样中,液晶高分子膜与第一金属箔的叠合方式不同于液晶高分子膜与第二金属箔的叠合方式。
依据本发明,所述第一金属箔及/或第二金属箔可为铜箔、金箔、银箔、镍箔、铝箔或不锈钢箔等,但并非仅限于此。于其中一实施态样中,所述第一金属箔及第二金属箔选用不同材质。较佳的,第一金属箔及/或第二金属箔可为铜箔,使铜箔与液晶高分子膜叠合形成铜箔积层板(copper clad laminate,简称CCL)。此外,所述第一金属箔及/或第二金属箔的制备方法并无特别限制,只要不违反本发明的发明目的即可,举例言之,可选用辊轧法或电解法进行制备,但并非仅限于此。
依据本发明,所述第一金属箔及/或第二金属箔的厚度并没有特别限制,所属技术领域的技术人员可视不同需求进行相应的调整。举例言之,于其中一实施态样中,第一金属箔及/或第二金属箔的厚度可各自独立为1μm至200μm;较佳的,所述第一金属箔及/或第二金属箔的厚度可各自独立为1μm至40μm;更佳的,所述第一金属箔及/或第二金属箔的厚度可各自独立为1μm至20μm;再更佳的,所述第一金属箔及/或第二金属箔的厚度可各自独立为3μm至20μm。
依据本发明,所属技术领域的技术人员可视不同需求,对本发明的第一金属箔及/或第二金属箔进行表面处理。举例言之,可选用粗糙化处理、酸碱处理、加热处理、脱脂处理、紫外线照射处理、电晕放电处理、电浆处理、涂布底漆处理等,但并非仅限于此。
依据本发明,所述第一金属箔及/或第二金属箔的粗糙度并无特别的限制,所属技术领域的技术人员可根据不同的需求进行相应的调整。于其中一实施态样中,所述第一金属箔及/或第二金属箔的Rz可各自独立为大于或等于0.1μm且小于或等于2.0μm。较佳的,所述第一金属箔及/或第二金属箔的Rz可各自独立为大于或等于0.1μm且小于或等于1.5μm。于其中一实施态样中,第一金属箔的Rz及第二金属箔的Rz皆可落在上述范围。视需要地,第一金属箔及第二金属箔的Rz可为相同或不同。于其中一实施态样中,第一金属箔的Rz与第二金属箔的Rz并不相同。
于其中一实施态样中,所属技术领域的技术人员可视不同需求额外设置第三金属箔,视需要地,所述第三金属箔可与第一金属箔及/或第二金属箔相同或不同。于其中一实施态样中,所述第三金属箔的Rz可落在上述第一金属箔及/或第二金属箔的Rz的范围。于其中一实施态样中,第一金属箔的Rz、第二金属箔的Rz和第三金属箔的Rz并不相同。
较佳的,第一金属箔、第二金属箔及/或第三金属箔可为低粗糙度的金属箔,例如低粗糙度的铜箔。
于其中一实施态样中,所述积层板可包含多个液晶高分子膜。在不违反本发明的精神的前提下,所属技术领域的技术人员可视不同需求将多个本发明的液晶高分子膜与多个金属箔(例如,上述第一金属箔、第二金属箔及/或第三金属箔)叠合,制得具有多个液晶高分子膜及多个金属箔的积层板。
于本说明书中,“峰度”根据JIS B 0601:2001规定的标准方法定义,“算术平均粗糙度”及“十点平均粗糙度”则根据JIS B 0601:1994规定的标准方法定义。
具体实施方式
为了对本发明的技术特征、目的和有益效果有更加清楚的理解,现对本发明的技术方案进行以下详细说明,但不能理解为对本发明的可实施范围的限定。
以下,列举数种制备例说明用于制作本发明的液晶高分子膜的原料,另列举数种实施例说明本发明的液晶高分子膜和积层板的实施方式,同时提供数种比较例作为对照,所属技术领域的技术人员可通过下方实施例和比较例的内容轻易理解本发明能达到的优点及效果。应当理解的是,本说明书所列举的实施例仅仅用于示范性说明本发明的实施方式,并非用于局限本发明的范围,本领域技术人员可以根据其通常知识在不悖离本发明的精神下进行各种修饰、变更,以实施或应用本发明的内容。
液晶高分子树脂
制备例1:液晶高分子树脂
在3公升的高压釜中,将540克的6-羟基-2-萘甲酸、1071克的4-羟基苯甲酸、1086克的乙酸酐、1.3克的亚磷酸钠(sodium phosphite)及0.3克的1-甲基咪唑(1-methylimidazole)混合,使其于氮气气氛、160℃、常压的环境下进行约2小时的乙酰化反应;接着,以每小时30℃的升温速率升温至320℃,再于此温度条件下将压力由760托(torr)缓慢下降至3torr以下、温度由320℃升温至340℃;之后,提高搅拌功率、升压、泄料、拉条、切粒,得到熔点约278℃、黏度(@300℃)约45Pa·s的液晶高分子树脂。
制备例2:液晶高分子树脂
在3公升的高压釜中,将440克的6-羟基-2-萘甲酸、1145克的4-羟基苯甲酸、1085克的乙酸酐及1.3克的亚磷酸钠混合,使其于氮气气氛、160℃、常压的环境下进行约2小时的乙酰化反应;接着,以每小时30℃的升温速率升温至320℃,再于此温度条件下将压力由760torr缓慢下降至3torr以下、温度由320℃升温至340℃;之后,提高搅拌功率、升压、泄料、拉条、切粒,得到熔点约305℃、黏度(@300℃)约40Pa·s的液晶高分子树脂。
液晶高分子膜
实施例1至12、比较例1至6:液晶高分子膜
选用如上述制备例1及2得到的液晶高分子树脂作为原料,并大致上经由如下所述的方法分别制备得到实施例1至12及比较例1至6的液晶高分子膜。
首先,将液晶高分子树脂投入螺杆直径27毫米的挤出机(仪器型号:ZSE27,购自Leistritz)中加热至300℃至320℃,再以每小时5.5公斤(kg/hr)至8.5kg/hr的喂料速度将液晶高分子树脂自宽度500毫米的T模头挤出,接着,通入距离T模头约5至20毫米、温度约290℃至330℃且直径约35公分至45公分的二铸膜轮间,以约20千牛顿(kN)至60kN的力道压出;随后送至冷却轮进行常温冷却后,获得厚度约50微米(μm)的液晶高分子膜。
制备实施例1至12及比较例1至6的液晶高分子膜的工艺差异主要在于:液晶高分子树脂的种类、T模头至铸模轮轮面的距离、喂料速度及挤出机温度,各实施例及比较例所设定的工艺参数分别列于下表1中。
表1:制备实施例1至12及比较例1至6的液晶高分子膜的工艺参数
上述制备液晶高分子膜的方法仅用于列举说明本发明的实施方式,所属技术领域的技术人员亦可选用积层体延伸法、吹胀法等现有方法制备液晶高分子膜。
于其中一实施态样中,当液晶高分子树脂从T模头挤出后,所属技术领域的技术人员可视需要将液晶高分子树脂与二耐高温膜一起通入二铸模轮间,进一步形成三层的叠层结构,于室温下再将耐高温膜与液晶高分子树脂剥离,得到本发明的液晶高分子膜。所述耐高温膜可选用例如聚四氟乙烯膜(poly(tetrafluoroethene)film,PTFE film)、聚酰亚胺膜(polyimide film,PI film)、聚醚砜膜(poly(ether sulfone)film,PES film),但并非仅限于此。
此外,所属技术领域的技术人员可视不同需求对所制得的液晶高分子膜进行如抛光、紫外线照射、电浆等后处理,但并非仅限于此。举例而言,针对电浆后处理,亦可视不同需求于氮气、氧气或空气气氛、于减压或常压环境中施以1千瓦的电浆后处理,但并非仅限于此。
试验例1:液晶高分子膜的Rku、Ra及Rz表面分析
本试验例是将上述实施例1至12和比较例1至6所制得的液晶高分子膜作为待测样品,根据JIS B 0601:2001规定的标准方法分析各待测样品的表面的Rku,另根据JIS B0601:1994规定的标准方法分析各待测样品的表面的Ra及Rz。
为获得各待测样品的其中一表面的Rku、Ra及Rz,先利用激光扫描共轭焦显微镜(型号:LEXT OLS5000-SAF,购自Olympus株式会社,物镜为MPLAPON-50xLEXT),于24±3℃的温度、63±3%的相对湿度的环境下,以波长为405纳米的光源、50倍的物镜倍率、1.0倍的光学变焦的条件观察各待测样品的表面型貌,并撷取其影像。之后,设定评估长度(evaluation length)为4毫米、高通滤波器截止值(High-pass filter of cutoff value,λc)为0.8mm、低通滤波器截止值(Low-pass filter of cutoff value,λs)为2.5μm、模式为消除自动倾斜(auto tilt removal)、分辨率为1024画数(pixels)×1024pixels分析上述影像,得到各待测样品的Rku;另外,设定评估长度为4毫米、截止值为0.8mm分析上述影像,得到各待测样品的Ra及Rz。
根据上述分析方法,实施例1至12及比较例1至6的液晶高分子膜的其中一表面的Rku、Ra及Rz测试结果统一于下表2中。
实施例1A至12A:积层板
选用上述实施例1至12及比较例1至6的液晶高分子膜与市售铜箔叠合,分别制得如实施例1A至12A及比较例1A至6A的积层板。所述市售铜箔的商品型号及相关说明如下:
铜箔1:CF-T49A-HD2,购自福田金属箔粉工业株式会社,其Rz约1.2μm;及
铜箔2:CF-H9A-HD2,购自福田金属箔粉工业株式会社,其Rz约1.0μm。
选用上述厚度约50μm的液晶高分子膜及厚度约12μm的二片市售铜箔,将上述液晶高分子膜和二片市售铜箔各自裁切为20cm×20cm的尺寸大小后,将液晶高分子膜叠置于二片市售铜箔之间;先以180℃的温度、5kg/cm2的压力持续压合60秒,再以300℃的温度、20kg/cm2的压力持续压合25分钟,再降至常温后得到一积层板。各积层板中液晶高分子膜和二片市售铜箔的样品编号如下表2所示。
于此,积层板的压合方式并无特别的限制,所属技术领域的技术人员可选用例如线压合或面压合等现有技术完成压合步骤;本发明可适用的压合机台例如间歇式热压机、卷对卷型辊压机、双带压机等,但并非仅限于此。根据不同需求,所属技术领域的技术人员也可直接将液晶高分子膜和铜箔对齐后进行加温、加压步骤,完成面压合的步骤。
于其他实施态样中,所属技术领域的技术人员亦可视不同需求选用例如溅射、电镀、化学镀、或蒸镀等方式在液晶高分子膜上形成一金属箔(例如:铜箔)或液晶高分子膜与金属箔之间的一连结层(例如:胶、镍层、钴层、铬层、或其合金层)。
试验例2:积层板的剥离强度分析
本试验例根据如IPC-TM-650No.:2.4.9的测试方法,将上述实施例1A至12A和比较例1A至6A的积层板制成长度约228.6毫米、宽度约3.2毫米的蚀刻试片(etched specimen),再将各蚀刻试片置于23±2℃的温度、50±5%的相对湿度下放置24小时使其趋于稳定;接着,将各蚀刻试片用双面胶黏贴至测试机台(仪器型号:HT-9102,购自弘达仪器股份有限公司(Hung Ta Instrument Co.,Ltd.))的夹具上,再以50.8毫米/分钟(mm/min)的剥离速度剥离夹具上的蚀刻试片,并且持续记录剥离过程中的剥离拉力。于此,剥离拉力应控制在测试机台可承受的15%至85%的范围,剥离的长度至少应超过57.2毫米,并且忽略不计最初剥离6.4毫米的剥离拉力,其结果如下表2所示。
试验例3:积层板的讯号损失分析
本试验例是将上述实施例1A至12A和比较例1A至6A的积层板制成长度约100毫米、宽度约140毫米、阻抗约50欧姆(Ω)的带状线试片(strip line specimen),再使用微波网络分析仪(仪器型号:8722ES,购自安捷伦科技(Agilent Technology)公司)、探针(型号:ACP40-250,购自Cascade Microtech公司)测定各试片在10GHz下的讯号损失。各积层板的测试结果列于下表2中。
表2:实施例1至12及比较例1至6的液晶高分子膜的表面分析结果以及实施例1A至12A及比较例1A至6A的积层板所用的铜箔编号及剥离强度与讯号损失测试结果
实验结果讨论
应当理解的是,为了确定本发明的液晶高分子膜能优化积层板的特性,也为了确定体现在积层板上的有益效果归因于液晶高分子膜,所属技术领域的技术人员分析上述结果时,会选择含有同款铜箔的多个积层板的测试结果进行比较,由此确定液晶高分子膜对于积层板的特性的影响。
如上表2所示,实施例1至12的液晶高分子膜其中一表面的Rku皆控制在3.0至60.0,故此种液晶高分子膜与各种市售铜箔压合所形成的积层板(实施例1A至12A)皆能兼具高剥离强度与低讯号损失的特性。反之,比较例1至6的液晶高分子膜其中一表面的Rku超出上述范围,故比较例1A至6A的积层板并未能同时获得高剥离强度与低讯号损失二者特性。
具体来说,比较含有铜箔1的多个积层板的测试结果可知:当液晶高分子膜的Rku超过60.0(如比较例1),所得积层板的讯号损失将过高(如比较例1A),然而,若液晶高分子膜的Rku低于3.0(如比较例2),则所得积层板的剥离强度明显不足(如比较例2A);相反地,若控制液晶高分子膜的Rku在3.0至60.0时(如实施例1至6),液晶高分子膜与金属箔之间不仅能获得较佳的剥离强度,且积层板也同时具备低讯号损失的特性(如实施例1A至6A)。
事实上,就算使用不同铜箔制备积层板,本发明的液晶高分子膜也可提供具较佳剥离强度与低讯号损失的积层板。具体来说,比较含有铜箔2的多个积层板的测试结果可知:如比较例3A至6A所显示,相较于使用Rku不在本发明所请范围的液晶高分子膜(如比较例3至6),使用Rku在3.0至60.0的液晶高分子膜(如实施例7至12)可提供具有较佳剥离强度及低讯号损失的积层板(如实施例7A至12A)。
综上所述,本发明通过控制液晶高分子膜的第一表面的Rku为3.0至60.0,不仅能提升液晶高分子膜与金属箔间的剥离强度,还能同时确保积层板具有低讯号损失的特性,从而令包含此种液晶高分子膜的积层板能适用于高阶的5G产品中。
Claims (11)
1.一种液晶高分子膜,其具有相对的第一表面和第二表面,其特征在于,所述第一表面的峰度为3.0至60.0。
2.如权利要求1所述的液晶高分子膜,其特征在于,所述第一表面的峰度为3.4至60.0。
3.如权利要求1所述的液晶高分子膜,其特征在于,所述第一表面的算术平均粗糙度为小于或等于0.09微米。
4.如权利要求3所述的液晶高分子膜,其特征在于,所述第一表面的算术平均粗糙度为0.02微米至0.09微米。
5.如权利要求1所述的液晶高分子膜,其特征在于,所述第一表面的十点平均粗糙度为小于或等于2.0微米。
6.如权利要求5所述的液晶高分子膜,其特征在于,所述第一表面的十点平均粗糙度为0.1微米至2.0微米。
7.如权利要求1至6中任一项所述的液晶高分子膜,其特征在于,所述第二表面的峰度为3.0至60.0。
8.如权利要求7所述的液晶高分子膜,其特征在于,所述第二表面的算术平均粗糙度为小于或等于0.09微米。
9.如权利要求7所述的液晶高分子膜,其特征在于,所述第二表面的十点平均粗糙度为小于或等于2.0微米。
10.一种积层板,其特征在于,所述积层板包含第一金属箔及如权利要求1至9中任一项所述的液晶高分子膜,所述第一金属箔设置于所述液晶高分子膜的第一表面上。
11.如权利要求10所述的积层板,其特征在于,所述积层板具有第二金属箔,所述第二金属箔设置于所述液晶高分子膜的第二表面上。
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Family Cites Families (120)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4429105A (en) | 1983-02-22 | 1984-01-31 | Celanese Corporation | Process for preparing a polyester of hydroxy naphthoic acid and hydroxy benzoic acid |
US4975312A (en) | 1988-06-20 | 1990-12-04 | Foster-Miller, Inc. | Multiaxially oriented thermotropic polymer substrate for printed wire board |
CA2015324C (en) | 1989-04-27 | 1998-09-15 | Gary T. Brooks | Crystalline polyphthalamide composition having improved heat resistance properties |
JP2587500B2 (ja) | 1989-09-22 | 1997-03-05 | 日本電気株式会社 | レーザマーキング工法及びその素材 |
CA2060494A1 (en) | 1991-02-13 | 1992-08-14 | Elena S. Percec | Polymer composites of thermoplastic and liquid crystal polymers and a process for their preparation |
JPH06240019A (ja) | 1993-02-16 | 1994-08-30 | Toray Ind Inc | ポリアルキレンテレフタレートフィルム及び積層ポリアルキレンテレフタレートフィルム |
JP2962459B2 (ja) | 1993-02-25 | 1999-10-12 | ジャパンゴアテックス株式会社 | 液晶ポリマーフィルム及びその製造方法 |
JPH07251438A (ja) | 1994-03-15 | 1995-10-03 | Japan Gore Tex Inc | 液晶ポリマーフィルム及びその製造方法 |
US5529740A (en) | 1994-09-16 | 1996-06-25 | Jester; Randy D. | Process for treating liquid crystal polymer film |
JPH08281817A (ja) | 1995-04-11 | 1996-10-29 | Sumitomo Chem Co Ltd | 全芳香族液晶ポリエステルフィルムおよびその製造方法 |
US5746949A (en) | 1995-11-21 | 1998-05-05 | Hoechst Celanese Corp. | Polarizer films comprising aromatic liquid crystalline polymers comprising dichroic dyes in their main chains |
US5998804A (en) | 1997-07-03 | 1999-12-07 | Hna Holdings, Inc. | Transistors incorporating substrates comprising liquid crystal polymers |
US6268026B1 (en) | 1997-10-20 | 2001-07-31 | Hoechst Celanese Corporation | Multilayer laminate formed from a substantially stretched non-molten wholly aromatic liquid crystalline polymer and non-liquid crystalline polyester and method for forming same |
JP2000044797A (ja) | 1998-04-06 | 2000-02-15 | Kuraray Co Ltd | 液晶ポリマ―フィルムと積層体及びそれらの製造方法並びに多層実装回路基板 |
JP2000006351A (ja) | 1998-06-24 | 2000-01-11 | Sumitomo Chem Co Ltd | 積層フィルム、並びに、磁気記録媒体およびその製造方法 |
JP2000063551A (ja) | 1998-08-26 | 2000-02-29 | Ube Ind Ltd | 多孔質フイルム及び電池用セパレータ |
JP4091209B2 (ja) | 1999-04-07 | 2008-05-28 | 株式会社クラレ | ポリマーアロイおよびそのフィルム |
WO2002020698A1 (en) | 2000-09-01 | 2002-03-14 | Ticona Llc | Blends of stretchable liquid crystal polymers with thermoplastics |
US6859241B2 (en) * | 2001-10-16 | 2005-02-22 | Nitto Denko Corporation | Method of producing polarizing plate, and liquid crystal display comprising the polarizing plate |
JP3958629B2 (ja) | 2002-05-30 | 2007-08-15 | ジャパンゴアテックス株式会社 | 液晶ポリマーフィルム及びその製造方法 |
JP3896324B2 (ja) | 2002-11-28 | 2007-03-22 | ジャパンゴアテックス株式会社 | 液晶ポリマーブレンドフィルム |
US20060048963A1 (en) | 2002-12-05 | 2006-03-09 | Masaru Nishinaka | Laminate, printed circuit board, and preparing method thereof |
JP4245969B2 (ja) | 2003-04-24 | 2009-04-02 | ポリプラスチックス株式会社 | 非晶質全芳香族ポリエステルアミド及びその組成物 |
TWI359159B (en) | 2003-11-05 | 2012-03-01 | Sumitomo Chemical Co | Aromatic liquid-crystalline polyester |
JP4341023B2 (ja) | 2004-04-13 | 2009-10-07 | 住友金属鉱山株式会社 | 金属被覆液晶ポリマーフィルムの製造方法 |
JP2006001185A (ja) | 2004-06-18 | 2006-01-05 | Dowa Mining Co Ltd | プラスチックフィルム、金属被覆基板、及び、それらの製造方法 |
JP4731955B2 (ja) | 2005-03-09 | 2011-07-27 | ポリプラスチックス株式会社 | 表面加工用液晶性ポリエステル樹脂組成物 |
JP4851264B2 (ja) | 2005-08-30 | 2012-01-11 | 古河電気工業株式会社 | 高分子フィルム、その製造方法、および配線基板用積層体 |
US8956738B2 (en) | 2005-10-26 | 2015-02-17 | Global Oled Technology Llc | Organic element for low voltage electroluminescent devices |
JP2007126578A (ja) | 2005-11-04 | 2007-05-24 | Fujifilm Corp | 液晶ポリマー組成物、液晶ポリマーフィルム及びそれを用いた積層体 |
JP2007203702A (ja) | 2006-02-06 | 2007-08-16 | Polyplastics Co | 多層射出延伸ブロー成形品及びその製造法 |
JP4804165B2 (ja) | 2006-02-17 | 2011-11-02 | 旭化成ケミカルズ株式会社 | 樹脂製シートの製造方法 |
JP5211696B2 (ja) | 2006-10-06 | 2013-06-12 | 東レ株式会社 | ハードコートフィルム、その製造方法及び反射防止フィルム |
JP2008221488A (ja) | 2007-03-08 | 2008-09-25 | Kanto Gakuin Univ Surface Engineering Research Institute | 液晶ポリマーフィルム金属張積層板 |
JP2008291168A (ja) | 2007-05-28 | 2008-12-04 | Sumitomo Chemical Co Ltd | 液晶ポリマーフィルムの製造方法、及びプリント配線板用基板 |
TW200912484A (en) * | 2007-07-30 | 2009-03-16 | Fujifilm Corp | Retardation film, polarizing plate, and liquid-crystal display device comprising it |
JP5225653B2 (ja) | 2007-10-30 | 2013-07-03 | 上野製薬株式会社 | 液晶ポリエステルブレンド |
JP5228869B2 (ja) | 2007-12-12 | 2013-07-03 | 日立化成株式会社 | 回路接続用接着フィルム、及び回路部材の位置識別用のマークを認識する方法 |
JP5177749B2 (ja) | 2008-09-26 | 2013-04-10 | 富士フイルム株式会社 | 熱可塑性樹脂フィルムの製造方法 |
JP2010147442A (ja) | 2008-12-22 | 2010-07-01 | Panasonic Electric Works Co Ltd | フレキシブルプリント配線板、フレキシブルプリント配線板の製造方法、及びフレキシブルプリント回路板 |
TWI432615B (zh) | 2009-02-13 | 2014-04-01 | Furukawa Electric Co Ltd | A metal foil, a method for manufacturing the same, an insulating substrate, and a wiring substrate |
US8906515B2 (en) | 2009-06-02 | 2014-12-09 | Integran Technologies, Inc. | Metal-clad polymer article |
JP5369054B2 (ja) | 2009-06-15 | 2013-12-18 | 上野製薬株式会社 | 液晶ポリエステルブレンド組成物 |
JP5237892B2 (ja) | 2009-06-29 | 2013-07-17 | 住友化学株式会社 | 積層体の製造方法、積層体およびsus基板 |
JP2011054945A (ja) | 2009-08-03 | 2011-03-17 | Japan Gore Tex Inc | 有機電解液系蓄電デバイス |
JP5308295B2 (ja) | 2009-09-28 | 2013-10-09 | 株式会社クラレ | 伝送線路用熱可塑性液晶ポリマーフィルムおよび伝送線路 |
JP2011104789A (ja) | 2009-11-12 | 2011-06-02 | Polyplastics Co | 金属複合積層部品の製造方法 |
JP5719290B2 (ja) | 2010-03-12 | 2015-05-13 | 積水化学工業株式会社 | 離型フィルム及び離型フィルムの製造方法 |
KR101094633B1 (ko) * | 2010-03-12 | 2011-12-20 | (주)디오 | 단일층 반사방지(ar)필름용 유무기 하이브리드 코팅 조성물 및 그의 제조 방법 |
JPWO2011118449A1 (ja) | 2010-03-26 | 2013-07-04 | 株式会社クラレ | 光反射性フィルム、光反射性積層体、及び光反射性回路基板 |
JP2011216598A (ja) | 2010-03-31 | 2011-10-27 | Kuraray Co Ltd | 高周波回路基板 |
JP5611355B2 (ja) * | 2010-08-12 | 2014-10-22 | 新日鉄住金化学株式会社 | 金属張積層板 |
JP5679167B2 (ja) | 2010-10-18 | 2015-03-04 | 信越ポリマー株式会社 | フィルムキャパシタ用フィルム |
TWI535767B (zh) | 2010-12-27 | 2016-06-01 | 住友化學股份有限公司 | 製造液晶聚酯膜之方法 |
WO2012101985A1 (ja) | 2011-01-26 | 2012-08-02 | 住友ベークライト株式会社 | プリント配線板およびプリント配線板の製造方法 |
JP2012186453A (ja) | 2011-02-16 | 2012-09-27 | Sumitomo Chemical Co Ltd | 太陽電池用基板及び太陽電池素子 |
JP2012167224A (ja) | 2011-02-16 | 2012-09-06 | Sumitomo Chemical Co Ltd | 中空樹脂筐体用樹脂組成物および中空樹脂筐体 |
CN103402757B (zh) | 2011-03-01 | 2016-02-10 | 吉坤日矿日石金属株式会社 | 基于液晶聚合物薄膜的覆铜箔层压板及其制造方法 |
JP5921549B2 (ja) | 2011-08-09 | 2016-05-24 | 宇部エクシモ株式会社 | 積層体製造装置及び積層体の製造方法 |
CN104635282B (zh) | 2012-01-17 | 2017-08-11 | 三菱化学株式会社 | 反射材料、液晶显示器、照明器具及照明看板 |
JP5871426B2 (ja) | 2012-01-31 | 2016-03-01 | 古河電気工業株式会社 | 高周波伝送用表面処理銅箔、高周波伝送用積層板及び高周波伝送用プリント配線板 |
JP5916404B2 (ja) | 2012-02-01 | 2016-05-11 | 古河電気工業株式会社 | 金属張積層体、回路基板およびその製造方法 |
EP2867022B1 (en) | 2012-05-30 | 2018-12-12 | Exatec, LLC. | Plastic assembly, methods of making and using the same, and articles comprising the same |
JP6277576B2 (ja) | 2012-08-03 | 2018-02-14 | 大日本印刷株式会社 | 光学フィルム用基材、光学フィルム、偏光板、液晶パネルおよび画像表示装置 |
JP5481577B1 (ja) | 2012-09-11 | 2014-04-23 | Jx日鉱日石金属株式会社 | キャリア付き銅箔 |
WO2014046014A1 (ja) | 2012-09-20 | 2014-03-27 | 株式会社クラレ | 回路基板およびその製造方法 |
US8853344B2 (en) | 2012-11-09 | 2014-10-07 | Ticona Llc | Liquid crystalline polymer composition for films |
JP6206165B2 (ja) | 2013-03-29 | 2017-10-04 | 東レ株式会社 | 転写箔用フィルム |
JP2015077783A (ja) | 2013-09-10 | 2015-04-23 | 東レ株式会社 | 離型用二軸配向ポリエステルフィルム |
DE102013015237A1 (de) | 2013-09-13 | 2015-03-19 | Blum-Novotest Gmbh | Rauheits-Messinstrument zum Einsatz in einer Werkzeugmaschine und Verfahren zur Rauheitsmessung in einer Werkzeugmaschine |
JP2015066910A (ja) | 2013-09-30 | 2015-04-13 | 信越ポリマー株式会社 | フィルムキャパシタ用フィルム及びその製造方法 |
CN105637019B (zh) | 2013-10-03 | 2019-09-10 | 株式会社可乐丽 | 热塑性液晶聚合物膜、电路基板、及它们的制造方法 |
KR101449342B1 (ko) | 2013-11-08 | 2014-10-13 | 일진머티리얼즈 주식회사 | 전해동박, 이를 포함하는 전기부품 및 전지 |
JP6019012B2 (ja) | 2013-12-17 | 2016-11-02 | 株式会社クラレ | 高周波回路基板 |
JP2016053751A (ja) | 2014-09-02 | 2016-04-14 | キヤノン株式会社 | 情報処理装置、情報処理方法及びプログラム |
JP6867102B2 (ja) | 2014-10-22 | 2021-04-28 | Jx金属株式会社 | 銅放熱材、キャリア付銅箔、コネクタ、端子、積層体、シールド材、プリント配線板、金属加工部材、電子機器、及び、プリント配線板の製造方法 |
JP6316178B2 (ja) | 2014-12-05 | 2018-04-25 | 株式会社クラレ | 片面金属張積層板およびその製造方法 |
WO2016104420A1 (ja) | 2014-12-25 | 2016-06-30 | 住友電気工業株式会社 | プリント配線板用基板及びその製造方法、プリント配線板及びその製造方法、並びに、樹脂基材 |
JP6475020B2 (ja) | 2015-01-13 | 2019-02-27 | 宇部エクシモ株式会社 | 積層板の製造方法 |
JP6518445B2 (ja) | 2015-01-13 | 2019-05-22 | 宇部エクシモ株式会社 | フレキシブル積層板、及びフレキシブル積層板の製造方法 |
KR102469672B1 (ko) | 2015-01-13 | 2022-11-23 | 우베 에쿠시모 가부시키가이샤 | 플렉서블 라미네이트 시트 및 이의 제조 방법 |
WO2016136537A1 (ja) | 2015-02-26 | 2016-09-01 | アルプス電気株式会社 | 部材、当該部材の製造方法および当該部材を備える電子部品 |
JP6907435B2 (ja) * | 2015-03-20 | 2021-07-21 | 大日本印刷株式会社 | 反射防止フィルム、該反射防止フィルムを用いた表示装置、及び反射防止フィルムの選択方法 |
JP6515180B2 (ja) * | 2015-03-31 | 2019-05-15 | 株式会社カネカ | 多層接着フィルム及びフレキシブル金属張積層板 |
CN107530979B (zh) | 2015-04-20 | 2020-03-06 | 株式会社可乐丽 | 覆金属层压板的制造方法及用该制造方法制造的覆金属层压板 |
JPWO2016174868A1 (ja) | 2015-04-27 | 2018-02-15 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルム及び回路基板 |
CN107637184B (zh) | 2015-06-04 | 2020-07-17 | 住友电气工业株式会社 | 印刷线路板用基板和印刷线路板 |
JP6083619B2 (ja) | 2015-07-29 | 2017-02-22 | 福田金属箔粉工業株式会社 | 低誘電性樹脂基材用処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板 |
JP6710053B2 (ja) | 2016-01-26 | 2020-06-17 | 日本メクトロン株式会社 | フレキシブルプリント基板およびフレキシブルプリント基板の製造方法 |
CN108778713B (zh) | 2016-03-03 | 2021-05-07 | 株式会社可乐丽 | 覆金属层压板及其制造方法 |
KR101948821B1 (ko) * | 2016-03-14 | 2019-02-15 | 주식회사 엘지화학 | 반사 방지 필름 및 디스플레이 장치 |
JP2017189894A (ja) | 2016-04-12 | 2017-10-19 | 宇部エクシモ株式会社 | 金属積層体及び金属成形体 |
JP6751438B2 (ja) | 2016-05-24 | 2020-09-02 | 富士フイルム株式会社 | 積層体ならびにこれを有する画像表示装置の前面板、画像表示装置、画像表示機能付きミラ−、抵抗膜式タッチパネルおよび静電容量式タッチパネル |
CN109196716B (zh) | 2016-05-27 | 2021-01-01 | 夏普株式会社 | 扫描天线及扫描天线的制造方法 |
WO2017208395A1 (ja) | 2016-06-01 | 2017-12-07 | オリンパス株式会社 | マニピュレータシステム |
WO2017221701A1 (ja) | 2016-06-24 | 2017-12-28 | 東レ株式会社 | 二軸配向熱可塑性樹脂フィルム |
US9673646B1 (en) | 2016-08-19 | 2017-06-06 | Chang Chun Petrochemical Co., Ltd. | Surface-treated electrolytic copper foil and method for wireless charging of flexible printed circuit board |
CN110073282B (zh) | 2016-12-15 | 2022-02-25 | Dic株式会社 | 液晶显示元件 |
CN110475655B (zh) | 2017-03-28 | 2022-08-16 | 电化株式会社 | 层叠体的制造方法以及层叠体的制造装置 |
JP6872947B2 (ja) | 2017-03-29 | 2021-05-19 | Jx金属株式会社 | キャリア付銅箔、積層体、キャリア付銅箔の製造方法、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法 |
JP7055049B2 (ja) | 2017-03-31 | 2022-04-15 | Jx金属株式会社 | 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法 |
JP7069124B2 (ja) | 2017-03-31 | 2022-05-17 | 株式会社クラレ | 熱可塑性液晶ポリマーおよびそのフィルム |
JP7356209B2 (ja) | 2017-03-31 | 2023-10-04 | Jx金属株式会社 | 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP7138623B2 (ja) * | 2017-04-07 | 2022-09-16 | 株式会社クラレ | 金属張積層板およびその製造方法 |
JP7000076B2 (ja) | 2017-08-29 | 2022-01-19 | 上野製薬株式会社 | フィルム |
KR101999455B1 (ko) | 2017-12-26 | 2019-10-01 | 한승훈 | 3d 프린팅 업체 매칭서비스 시스템 |
WO2019130839A1 (ja) | 2017-12-27 | 2019-07-04 | Jsr株式会社 | アレイアンテナ及びその製造方法、並びにアレイアンテナ用液晶配向剤 |
JP7358739B2 (ja) * | 2018-03-02 | 2023-10-11 | 住友化学株式会社 | 偏光板および偏光板の製造方法 |
WO2019188087A1 (ja) * | 2018-03-30 | 2019-10-03 | 三井金属鉱業株式会社 | 銅張積層板 |
JP2018121085A (ja) | 2018-05-09 | 2018-08-02 | Jx金属株式会社 | プリント配線板の製造方法 |
CN110498913B (zh) | 2018-05-16 | 2022-06-03 | 臻鼎科技股份有限公司 | 改性的液晶高分子聚合物、高分子膜及相应的制备方法 |
WO2020009230A1 (ja) | 2018-07-06 | 2020-01-09 | タツタ電線株式会社 | プリント配線基板用貼付フィルム |
CN112789249A (zh) | 2018-10-04 | 2021-05-11 | 中央硝子株式会社 | 抗反射调光玻璃构造体 |
CN109180979B (zh) | 2018-10-31 | 2020-11-24 | 西安科技大学 | 一种高导热侧链型液晶高分子膜材料的制备方法 |
EP3913074A4 (en) | 2019-01-16 | 2022-10-26 | Nippon Steel Corporation | CORNORIENTED ELECTROMAGNETIC STEEL SHEET AND STEEL SHEET USABLE AS RAW MATERIAL SHEET FOR CORNORIENTED ELECTROMAGNETIC STEEL SHEET |
US10581081B1 (en) | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
TWI687465B (zh) | 2019-06-28 | 2020-03-11 | 南亞塑膠工業股份有限公司 | 液晶聚合物薄膜及液晶聚合物與聚醯亞胺的複合膜及其製法 |
TWI697549B (zh) | 2019-12-23 | 2020-07-01 | 長春人造樹脂廠股份有限公司 | 液晶高分子膜及包含其之積層板 |
TWI740515B (zh) | 2019-12-23 | 2021-09-21 | 長春人造樹脂廠股份有限公司 | 液晶高分子膜及包含其之積層板 |
WO2021256491A1 (ja) | 2020-06-19 | 2021-12-23 | 株式会社クラレ | 熱可塑性液晶ポリマー成形体、金属張積層体および回路基板 |
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