JP6584419B2 - 封止フィルム及びこれを含む有機電子装置 - Google Patents
封止フィルム及びこれを含む有機電子装置 Download PDFInfo
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- JP6584419B2 JP6584419B2 JP2016551239A JP2016551239A JP6584419B2 JP 6584419 B2 JP6584419 B2 JP 6584419B2 JP 2016551239 A JP2016551239 A JP 2016551239A JP 2016551239 A JP2016551239 A JP 2016551239A JP 6584419 B2 JP6584419 B2 JP 6584419B2
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Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
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Description
吸光物質として一次粒子の大きさが約20nm以下のカーボンブラック(#2600三菱カーボンブラック)を溶剤として、MEKを固形分10重量%の濃度で投入して、カーボンブラック分散液を製造した。一方、水分吸着剤として焼成ドロマイト(calcined dolomite)100g及び溶剤としてMEKを固形分50重量%の濃度で投入して、水分着剤溶液を製造した。
吸光物質として一次粒子の大きさが約20nm以下のカーボンブラック(#2600三菱カーボンブラック)を溶剤として、MEKを固形分10重量%の濃度で投入して、カーボンブラック分散液を製造した。
実施例2で製造した水分防止層の溶液を離型PETの離型面に塗布し、130℃で3分間乾燥し、厚さが20μmである水分防止層を形成した。同6一な方法で、実施例2の吸光層の溶液を離型PETの離型面に塗布し、130℃で3分間乾燥し、厚さが5μmである吸光層を形成した。
カーボンブラック分散液をカーボンブラックの含量が吸光層の封止樹脂100重量部に対して1重量部になるように投入したこと以外は、実施例1と同一な方法で封止フィルムを製造した。
水分吸着剤の含量が封止樹脂100重量部に対して10重量部になるように投入したこと以外は、実施例2と同一な方法で封止フィルムを製造した。
カーボンブラック分散液をカーボンブラックの含量が吸光層の封止樹脂100重量部に対して0.5重量部になるように投入したこと以外は、実施例1と同一な方法で封止フィルムを製造した。
前記製造したフィルムの吸光領域に対して、UV−Vis Spectrometerを利用して550nmでの光透過度を測定した。前記光透過度は、単一層の場合、吸光層の吸光領域に対して厚さ方向に測定し、多層構造の場合、複数の層が積層された状態で吸光領域に対して厚さ方向に測定した。
実施例及び比較例によって製造した封止フィルムを、ガラス上に形成された有機電子素子の全面に適用して有機電子装置を製造し、金属配線を連結する。具体的には、ガラス上に真空蒸着方法で透明電極を形成し、前記透明電極上に有機材料層を形成する。前記有機材料層は、正孔注入層、正孔輸送層、発光層、電子注入層及び電子輸送層を含む。その後、前記有機材料層上に反射電極をさらに形成する。その後、前記ガラス上の有機電子素子の上部に前記有機電子素子(透明電極、反射電極及び有機材料層)を全てカバーするように、実施例及び比較例の封止フィルムを適用する(離型PET除去)。一方、前記封止フィルムは、20μm厚さの銅フィルム(正反射光を含む測定(Specular Component Included、SCI)で、銅フィルムの一面(光沢面)が58.32%であり、他の一面(粗表面)が20.7%である。また、正反射光を除く測定(Specular Component Excluded、SCE)で、銅フィルムの一面(光沢面)が、45.59%であり、他の一面(粗表面)が、20.02%である)が、吸光層及び/または水分防止層の一面に合板された封止フィルムである。
2:吸光層
3:吸光物質
4、6:水分防止層
5:水分吸着剤
10:第1領域(吸光領域)
11:第2領域(非吸光領域)
21:基板
22:カバー基板
23:有機電子素子
Claims (22)
- 吸光領域を含む吸光層;及び
水分防止層を含む、
有機電子素子の全面を封止するための封止フィルムであって、
前記吸光領域が、硬化性樹脂又は架橋性樹脂である封止樹脂及び吸光物質を含有し、可視光線領域に対して15%以下の光透過度を有し、
前記水分防止層は、硬化性樹脂又は架橋性樹脂であり且つ前記吸光層の封止樹脂とは同一又は異なる、封止樹脂を含み、
前記水分防止層は、その上に保護層が形成される前記有機電子素子と接触することになることを特徴とする封止フィルム。 - 吸光領域は、封止フィルムの少なくとも一つ以上の周縁部に形成されることを特徴とする請求項1に記載の封止フィルム。
- 吸光領域は、封止フィルムの全体面積に形成されることを特徴とする請求項1に記載の封止フィルム。
- 封止樹脂は、アクリル樹脂、エポキシ樹脂、シリコン樹脂、フッ素樹脂、スチレン樹脂、ポリオレフィン樹脂、ポリオキシアルキレン樹脂、ポリエステル樹脂、ポリ塩化ビニル樹脂、ポリカーボネート樹脂、ポリフェニレンスルフィド樹脂、ポリアミド樹脂またはこれらの混合物であることを特徴とする請求項1に記載の封止フィルム。
- 硬化性樹脂は、熱硬化性樹脂または光硬化性樹脂であることを特徴とする請求項1に記載の封止フィルム。
- 硬化性樹脂は、グリシジル基、イソシアネート基、ヒドロキシ基、カルボキシル基またはアミド基、エポキシド基、環状エーテル基、スルフィド基、アセタール基またはラクトン基から選択される一つ以上の硬化性官能基を含むことを特徴とする請求項1に記載の封止フィルム。
- 硬化性樹脂は、分子構造内に環状構造を含むエポキシ樹脂であることを特徴とする請求項1に記載の封止フィルム。
- 硬化性樹脂は、シラン変性エポキシ樹脂であることを特徴とする請求項1に記載の封止フィルム。
- 吸光物質は、非伝導性物質であることを特徴とする請求項1に記載の封止フィルム。
- 吸光物質は、カーボンブラック、カーボンナノチューブ、フラーレン、フタロシアニン誘導体、ポルフィリン誘導体、トリフェニルアミン誘導体からなる群より選択された1以上であることを特徴とする請求項1に記載の封止フィルム。
- 吸光物質は、前記吸光層の封止樹脂100重量部に対して0.6重量部以上含まれることを特徴とする請求項1に記載の封止フィルム。
- 水分吸着剤をさらに含むことを特徴とする請求項1に記載の封止フィルム。
- 水分吸着剤は、P2O5、Li2O、Na2O、BaO、CaO、MgO、Li2SO4、Na2SO4、CaSO4、MgSO4、CoSO4、Ga2(SO4)3、Ti(SO4)2、NiSO4、CaCl2、MgCl2、SrCl2、YCl2、CuCl2、CsF、TaF5、NbF5、LiBr、CaBr2、CeBr3、SeBr4、VBr3、MgBr2、BaI2、MgI2、Ba(ClO4)2、Mg(ClO4)2からなる群より選択された一つ以上であることを特徴とする請求項12に記載の封止フィルム。
- 水分防止層は、透湿度が50g/m2day以下であることを特徴とする請求項1に記載の封止フィルム。
- メタル層をさらに含むことを特徴とする請求項1に記載の封止フィルム。
- メタル層は、50W/mK以上の熱伝導度を有することを特徴とする請求項15に記載の封止フィルム。
- メタル層の反射率は、正反射光を含む測定(Specular Component Included、SCI)で、15%〜90%であるか、正反射光を除く測定(Specular Component Excluded、SCE)で、15%〜80%であることを特徴とする請求項15に記載の封止フィルム。
- 基板;
前記基板上に存在する透明電極層、前記透明電極層上に存在して少なくとも発光層を含む有機層及び前記有機層上に存在する反射電極層を含む有機電子素子;及び
前記有機電子素子の全面を封止する請求項1に記載の封止フィルムを含むことを特徴とする有機電子装置。 - 吸光領域は、封止フィルムの少なくとも一つ以上の周縁部に形成されることを特徴とする請求項18に記載の有機電子装置。
- 吸光領域は、封止フィルムの全体面積に形成されることを特徴とする請求項18に記載の有機電子装置。
- 封止フィルムは、メタル層をさらに含むことを特徴とする請求項18に記載の有機電子装置。
- 基板上に、透明電極層、前記透明電極層上に存在し、少なくとも発光層を含む有機層及び前記有機層上に存在する反射電極層を含む有機電子素子を形成する段階;及び
有機電子素子が形成された基板に、請求項1に記載の封止フィルムが前記有機電子素子の全面を封止するように適用する段階を含むことを特徴とする有機電子装置の製造方法。
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