JP6719441B2 - 封止フィルムおよびこれを利用した有機電子装置の封止方法 - Google Patents
封止フィルムおよびこれを利用した有機電子装置の封止方法 Download PDFInfo
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- JP6719441B2 JP6719441B2 JP2017234129A JP2017234129A JP6719441B2 JP 6719441 B2 JP6719441 B2 JP 6719441B2 JP 2017234129 A JP2017234129 A JP 2017234129A JP 2017234129 A JP2017234129 A JP 2017234129A JP 6719441 B2 JP6719441 B2 JP 6719441B2
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- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- OBOSXEWFRARQPU-UHFFFAOYSA-N 2-n,2-n-dimethylpyridine-2,5-diamine Chemical compound CN(C)C1=CC=C(N)C=N1 OBOSXEWFRARQPU-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- CXMYWOCYTPKBPP-UHFFFAOYSA-N 3-(3-hydroxypropylamino)propan-1-ol Chemical compound OCCCNCCCO CXMYWOCYTPKBPP-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 description 1
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- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000001552 barium Chemical class 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- OOULUYZFLXDWDQ-UHFFFAOYSA-L barium perchlorate Chemical compound [Ba+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O OOULUYZFLXDWDQ-UHFFFAOYSA-L 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- QDVNNDYBCWZVTI-UHFFFAOYSA-N bis[4-(ethylamino)phenyl]methanone Chemical compound C1=CC(NCC)=CC=C1C(=O)C1=CC=C(NCC)C=C1 QDVNNDYBCWZVTI-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- LYQFWZFBNBDLEO-UHFFFAOYSA-M caesium bromide Chemical compound [Br-].[Cs+] LYQFWZFBNBDLEO-UHFFFAOYSA-M 0.000 description 1
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- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
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- 238000010538 cationic polymerization reaction Methods 0.000 description 1
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- 230000021615 conjugation Effects 0.000 description 1
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- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- XNMQEEKYCVKGBD-UHFFFAOYSA-N dimethylacetylene Natural products CC#CC XNMQEEKYCVKGBD-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002118 epoxides Chemical group 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- SBDRYJMIQMDXRH-UHFFFAOYSA-N gallium;sulfuric acid Chemical compound [Ga].OS(O)(=O)=O SBDRYJMIQMDXRH-UHFFFAOYSA-N 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
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- 239000004700 high-density polyethylene Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
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- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 1
- INHCSSUBVCNVSK-UHFFFAOYSA-L lithium sulfate Inorganic materials [Li+].[Li+].[O-]S([O-])(=O)=O INHCSSUBVCNVSK-UHFFFAOYSA-L 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- OTCKOJUMXQWKQG-UHFFFAOYSA-L magnesium bromide Chemical compound [Mg+2].[Br-].[Br-] OTCKOJUMXQWKQG-UHFFFAOYSA-L 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
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- 239000002245 particle Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006124 polyolefin elastomer Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920005673 polypropylene based resin Polymers 0.000 description 1
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- 229920002223 polystyrene Polymers 0.000 description 1
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- 238000005546 reactive sputtering Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001631 strontium chloride Inorganic materials 0.000 description 1
- AHBGXTDRMVNFER-UHFFFAOYSA-L strontium dichloride Chemical compound [Cl-].[Cl-].[Sr+2] AHBGXTDRMVNFER-UHFFFAOYSA-L 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- YRGLXIVYESZPLQ-UHFFFAOYSA-I tantalum pentafluoride Chemical compound F[Ta](F)(F)(F)F YRGLXIVYESZPLQ-UHFFFAOYSA-I 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- 229920002397 thermoplastic olefin Polymers 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- HDUMBHAAKGUHAR-UHFFFAOYSA-J titanium(4+);disulfate Chemical compound [Ti+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O HDUMBHAAKGUHAR-UHFFFAOYSA-J 0.000 description 1
- 125000005106 triarylsilyl group Chemical group 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- ZOYIPGHJSALYPY-UHFFFAOYSA-K vanadium(iii) bromide Chemical compound [V+3].[Br-].[Br-].[Br-] ZOYIPGHJSALYPY-UHFFFAOYSA-K 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/002—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising natural stone or artificial stone
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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Description
(1)封止層(第1層)の製造
常温で反応器にシラン変成エポキシ樹脂(KSR−177、グッド化学)100gおよびブタジエンラバー変成エポキシ樹脂(KR−450、グッド化学)100g、フェノキシ樹脂(YP−50、ドンド化成)150gを投入して、メチルエチルケトンで希釈した。前記均質化された溶液に硬化剤であるイミダゾール(四国化成)4gを投入した後、1時間の間高速撹拌して第1層溶液を製造した。
水分吸着剤として焼成ドロマイト(calcined dolomite)100gおよび溶剤としてMEKを固形分50重量%の濃度で投入して水分吸着剤溶液を製造した。常温で反応器にシラン変成エポキシ樹脂(KSR−177、グッド化学)200gおよびフェノキシ樹脂(YP−50、ドンド化成)150gを投入して、メチルエチルケトンで希釈した。前記均質化された溶液に硬化剤であるイミダゾール(四国化成)4gを投入した後、1時間の間高速撹拌して水分防止層溶液を製造した。前記溶液にあらかじめ用意した水分吸着剤溶液を焼成ドロマイトの含量が第2層の封止樹脂100重量部対比50重量部となるように投入して、混合して第2層溶液を製造した。
前記において、用意しておいた水分防止層の溶液を離型PETの離型面に塗布し、110℃で10分間乾燥して、厚さが40μmである第2層を形成した。前記において、用意しておいた第1層および第2層を合板して多層フィルムを製造し、これをさらに20μm銅フィルムと合板して封止フィルムを製造した。
常温で反応器にシラン変成エポキシ樹脂(KSR−177、グッド化学)100gおよびアクリルラバー変成エポキシ樹脂(KR−692、グッド化学)100g、フェノキシ樹脂(YP−50、ドンド化成)150gを投入して、メチルエチルケトンで希釈した。前記均質化された溶液に硬化剤であるイミダゾール(四国化成)4gを投入した後、1時間の間高速撹拌して第1層溶液を製造したことを除いては、実施例1と同じ方法で封止フィルムを製造した。
常温で反応器に第1層の封止樹脂としてポリイソブテン樹脂(重量平均分子量45万)50g、および粘着付与剤として水素化されたジシクロペンタジエン系樹脂(軟化点125℃)50gを投入した後、DCPD系エポキシ樹脂10g、イミダゾール(四国化成)1gをトルエンで固形分が30重量%程度となるように希釈したことを除いては、実施例1と同じ方法で封止フィルムを製造した。
常温で反応器に亀裂防止層の封止樹脂としてポリイソブテン樹脂(重量平均分子量45万)50g、および粘着付与剤として水素化されたジシクロペンタジエン系樹脂(軟化点125℃)50gを投入した後、多官能性アクリルモノマー(TMPTA)20g、光開始剤1gをトルエンで固形分が25重量%程度となるように希釈したことを除いては、実施例1と同じ方法で封止フィルムを製造した。
水分吸着剤として焼成ドロマイト100gおよび溶剤としてトルエンを固形分50重量%の濃度で投入して水分吸着剤溶液を製造した。常温で反応器に第1層の封止樹脂としてポリイソブテン樹脂(重量平均分子量45万)50g、および粘着付与剤として水素化されたジシクロペンタジエン系樹脂(軟化点125℃)50gを投入した後、多官能性アクリルモノマー(TMPTA)10g、光開始剤1gをトルエンで固形分が25重量%程度となるように希釈したものを用い、第2層を除外したことを除いては、実施例1と同じ方法で封止フィルムを製造した。
前記実施例5の1層でのみ構成された封止層がアルミニウムフィルムに合板された封止フィルムを構成した。
常温で反応器にシラン変成エポキシ樹脂(KSR−177、グッド化学)200gおよびフェノキシ樹脂(YP−50、ドンド化成)150gを投入して、メチルエチルケトンで希釈した。前記均質化された溶液に硬化剤であるイミダゾール(四国化成)4gを投入した後、1時間の間高速撹拌して第1層溶液を製造したことを除いては、実施例1と同じ方法で封止フィルムを製造した。
実施例1の第2層でのみ構成された封止層を用いたことを除いては、実施例1と同様に封止フィルムを製造した。
実施例または比較例で製造した亀裂防止層または水分防止層をラミネーションして厚さが40μmであるコーティング膜を製造した。製造されたコーティング膜を製造時のコーティング方向を長さ方向にして、50mm×10mm(長さ×幅)の大きさで裁断して試片を製造した後、前記試片を長さ方向に25mmだけ残るように両端をテーピングした。引き続き、テーピング部分を掴み25℃で18mm/minの速度で引張しながら、引張弾性率を測定した。
実施例および比較例で製造したフィルムをカバー基板にラミネーションした後、グラス基板の間にラミネートし、70℃条件で加圧加熱圧着して、試片を製造した。その後、試片を85℃および85%相対湿度の恒温恒湿チャンバーで約300時間維持しながら、撓みが発生する場合はX、発生しなかった場合はOで表示した。
12:封止層
12a:第1層
12b:第2層
13:メタル層
21:基板
22:有機電子装置
Claims (17)
- 有機電子装置を封止する封止フィルムであって、
メタル層;および
封止樹脂及び水分吸着剤を含む封止層を含み、
前記封止樹脂が、ポリオレフィン系樹脂又はエラストマーを含み、
前記ポリオレフィン系樹脂が、イソブチレン単量体の単独重合体;イソブチレン単量体と重合可能な単量体を共重合した共重合体;またはこれらの混合物を含む、封止フィルム。 - メタル層は50W/mK以上の熱伝導度を有する、請求項1に記載の封止フィルム。
- メタル層は酸化金属、窒化金属、炭化金属、オキシ窒化金属、オキシホウ化金属、およびその配合物中のいずれか一つを含む、請求項1に記載の封止フィルム。
- メタル層は酸化シリコン、酸化アルミニウム、酸化チタン、酸化インジウム、酸化錫、酸化錫インジウム、酸化タンタリウム、酸化ジルコニウム、酸化ニオビウム、およびそれらの配合物中のいずれか一つを含む、請求項3に記載の封止フィルム。
- メタル層は基材をさらに含む、請求項1に記載の封止フィルム。
- 基材はポリエチレンテレフタレート、ポリテトラフルオロエチレン、ポリエチレン、ポリプロピレン、ポリブテン、ポリブタジエン、塩化ビニル共重合体、ポリウレタン、エチレン−ビニルアセテート、エチレン−プロピレン共重合体、エチレン−アクリル酸エチル共重合体、エチレン−アクリル酸メチル共重合体、ポリイミド、ナイロンおよびこれらの組合せのうちいずれか一つである、請求項5に記載の封止フィルム。
- 封止層は単一層あるいは2以上の層で形成されている、請求項1に記載の封止フィルム。
- 封止層が2以上の層で形成される場合、少なくとも一つ以上の層が常温で0.001MPa〜500MPaの引張弾性率を有する、請求項7に記載の封止フィルム。
- 封止樹脂はスチレン系樹脂、熱可塑性エラストマー、ポリオキシアルキレン系樹脂、ポリエステル系樹脂、ポリ塩化ビニル系樹脂、ポリカーボネート系樹脂、ポリフェニレンサルファイド系樹脂、炭化水素の混合物、ポリアミド系樹脂、アクリレート系樹脂、エポキシ系樹脂、シリコン系樹脂、フッ素系樹脂またはこれらの混合物をさらに含む、請求項1に記載の封止フィルム。
- 封止樹脂は硬化性樹脂をさらに含む、請求項1に記載の封止フィルム。
- 硬化性樹脂はグリシジル基、イソシアネート基、ヒドロキシ基、カルボキシル基、アミド基、エポキシド基、環状エーテル基、サルファイド基、アセタール基およびラクトン基から選択される一つ以上の硬化性官能基を含む、請求項10に記載の封止フィルム。
- 硬化性樹脂が分子構造内に環状構造を含むエポキシ樹脂である、請求項10に記載の封止フィルム。
- 硬化性樹脂がシラン変成エポキシ樹脂である、請求項10に記載の封止フィルム。
- 前記封止層が、常温で0.001MPa〜500MPaの引張弾性率を有する、請求項1に記載の封止フィルム。
- 基板;前記基板上に形成された有機電子装置;および前記有機電子装置を封止する請求項1乃至請求項14のうちいずれか一項に記載された封止フィルムを含み、前記封止フィルムの封止層が前記有機電子装置の前面を付着している、有機電子装置封止製品。
- 有機電子装置が有機発光ダイオードである、請求項15に記載の有機電子装置封止製品。
- 上部に有機電子装置が形成された基板に請求項1乃至請求項14のうちいずれか一項に記載された封止フィルムの封止層が前記有機電子装置の前面を付着するように適用する段階;および前記封止層を硬化する段階を含む、有機電子装置の封止方法。
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US10336919B2 (en) * | 2015-03-24 | 2019-07-02 | Lg Chem, Ltd. | Adhesive composition |
TWI654268B (zh) | 2015-03-24 | 2019-03-21 | 南韓商Lg化學股份有限公司 | 黏合組成物 |
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