WO2014189293A1 - 유기전자장치 - Google Patents
유기전자장치 Download PDFInfo
- Publication number
- WO2014189293A1 WO2014189293A1 PCT/KR2014/004551 KR2014004551W WO2014189293A1 WO 2014189293 A1 WO2014189293 A1 WO 2014189293A1 KR 2014004551 W KR2014004551 W KR 2014004551W WO 2014189293 A1 WO2014189293 A1 WO 2014189293A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin
- electronic device
- organic electronic
- encapsulation
- layer
- Prior art date
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Images
Classifications
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- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
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- B32B9/002—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising natural stone or artificial stone
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- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/151—Copolymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- aromatic group-containing epoxy resin examples include biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene modified phenol type epoxy resin, cresol type epoxy resin, Bisphenol-based epoxy resins, xylox-based epoxy resins, polyfunctional epoxy resins, phenol novolac epoxy resins, triphenol methane-type epoxy resins and alkyl-modified triphenol methane epoxy resins, such as one or a mixture of two or more, but is not limited thereto. no.
- the organic electronic device may be an organic light emitting diode.
- Another embodiment of the present application to the substrate on which the organic electronic device is formed applying an encapsulation film including an encapsulation resin and a metal layer formed on the encapsulation layer to attach the entire surface of the organic electronic device on the substrate step; And it provides a method for manufacturing an organic electronic device comprising the step of curing the encapsulation layer of the encapsulation film.
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Laminated Bodies (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Photovoltaic Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
실시예 1 | 실시예 2 | 비교예 1 | 비교예 2 | 비교예 3 | |
공차│d│ | (+)50㎛ | (-)50㎛ | (+)700㎛ | (+)1mm | (-)500㎛ |
공정불량 | 없음 | 없음 | 없음 | 없음 | 불량 |
신뢰성 | O | O | X | X | X |
Claims (19)
- 기판;상기 기판 상에 형성된 유기전자소자; 및상기 유기전자소자의 전면을 봉지하고 봉지 수지를 포함하는 봉지층, 및 상기 봉지층 상에 형성된 메탈층을 포함하는 봉지 필름을 포함하고,상기 봉지 필름의 메탈층과 봉지층의 치수 공차(d)는 하기 일반식 1을 만족하는 유기전자장치:[일반식 1]│d│ ≤ 200 ㎛상기 일반식 1에서, d는 상기 메탈층의 임의의 최외각 측면과 상기 측면과 대응되는 상기 봉지층의 최외각 측면의 거리 차이를 나타낸다.
- 제 1 항에 있어서, 메탈층은 50W/mK 이상의 열전도도를 갖는 유기전자장치.
- 제 1 항에 있어서, 메탈층은 산화금속, 질화금속, 탄화금속, 옥시질화금속, 옥시붕화금속, 및 그의 배합물 중 어느 하나를 포함하는 유기전자장치.
- 제 3 항에 있어서, 메탈층은 산화실리콘, 산화알루미늄, 산화티타늄, 산화인듐, 산화 주석, 산화주석인듐, 산화탄탈룸, 산화지르코늄, 산화니오븀, 및 그들의 배합물 중 어느 하나를 포함하는 유기전자장치.
- 제 1 항에 있어서, 메탈층은 기재를 추가로 포함하는 유기전자장치.
- 제 5 항에 있어서, 기재는 폴리에틸렌테레프탈레이트, 폴리테트라플루오르에틸렌, 폴리에틸렌, 폴리프로필렌, 폴리부텐, 폴리부타디엔, 염화비닐 공중합체, 폴리우레탄, 에틸렌-비닐 아세테이트, 에틸렌-프로필렌 공중합체, 에틸렌-아크릴산 에틸 공중합체, 에틸렌-아크릴산 메틸 공중합체, 폴리이미드, 나일론 및 이들의 조합 중 어느 하나인 유기전자장치.
- 제 1 항에 있어서, 봉지층은 단일층 혹은 2 이상의 층으로 형성되어 있는 유기전자장치.
- 제 1 항에 있어서, 봉지층은 상온에서 0.001MPa 내지 500MPa의 인장 탄성률을 가지는 유기전자장치.
- 제 7 항에 있어서, 봉지층이 2 이상의 층으로 형성될 경우, 적어도 하나 이상의 층이 상온에서 0.001MPa 내지 500MPa의 인장 탄성률을 갖는 봉지 필름.
- 제 9 항에 있어서, 봉지층은 상온에서 0.001MPa 내지 500MPa의 인장 탄성률을 가지는 제1층 및 상온에서 200MPa 내지 1000MPa의 인장 탄성률을 가지는 제2층을 포함하는 유기전자장치.
- 제 1 항에 있어서, 봉지 수지는 스티렌계 수지, 폴리올레핀계 수지, 열가소성 엘라스토머, 폴리옥시알킬렌계 수지, 폴리에스테르계 수지, 폴리염화비닐계 수지, 폴리카보네이트계 수지, 폴리페닐렌설파이드계 수지, 탄화수소의 혼합물, 폴리아미드계 수지, 아크릴레이트계 수지, 에폭시계 수지, 실리콘계 수지, 불소계 수지 또는 이들의 혼합물인 유기전자장치.
- 제 1 항에 있어서, 봉지 수지는 경화성 수지를 포함하는 유기전자장치.
- 제 12 항에 있어서, 경화성 수지는 글리시딜기, 이소시아네이트기, 히드록시기, 카르복실기, 아미드기, 에폭사이드기, 고리형 에테르기, 설파이드기, 아세탈기 및 락톤기로부터 선택되는 하나 이상의 경화성 관능기를 포함하는 유기전자장치.
- 제 12 항에 있어서, 경화성 수지가 분자 구조 내에 환형구조를 포함하는 에폭시 수지인 유기전자장치.
- 제 12 항에 있어서, 경화성 수지가 실란 변성 에폭시 수지인 유기전자장치.
- 제 1 항에 있어서, 봉지층은 수분 흡착제를 추가로 포함하는 유기전자장치.
- 제 1 항에 있어서, 유기전자소자가 유기발광다이오드인 유기전자장치.
- 상부에 유기전자소자가 형성된 기판에, 봉지 수지를 포함하는 봉지층 및 상기 봉지층 상에 형성된 메탈층을 포함하는 봉지 필름을 상기 유기전자소자 전면을 부착하도록 적용하는 단계; 및상기 봉지 필름의 봉지층을 경화하는 단계를 포함하고,상기 봉지 필름의 메탈층과 봉지층의 치수 공차(d)는 하기 일반식 1을 만족하는 유기전자장치 제조방법:[일반식 1]│d│ ≤ 200 ㎛상기 일반식 1에서, d는 상기 메탈층의 임의의 최외각 측면과 상기 측면과 대응되는 상기 봉지층의 최외각 측면의 거리 차이를 나타낸다.
- 제 18 항에 있어서, 봉지 필름의 봉지층이 상기 유기전자소자의 전면에 부착되도록 커버하는 유기전자장치 제조방법.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/892,929 US10103352B2 (en) | 2013-05-21 | 2014-05-21 | Organic electronic device having dimension tolerance between encapsulating layer and metal-containing layer less than or equal to 200 microns |
EP14800973.1A EP3001477B1 (en) | 2013-05-21 | 2014-05-21 | Organic electronic device |
JP2016515269A JP6346664B2 (ja) | 2013-05-21 | 2014-05-21 | 有機電子装置 |
CN201480029811.2A CN105340102B (zh) | 2013-05-21 | 2014-05-21 | 有机电子器件 |
US16/125,244 US10522786B2 (en) | 2013-05-21 | 2018-09-07 | Organic electronic device having dimension tolerance between encapsulating layer and metal layer less than or equal to 200 microns |
Applications Claiming Priority (2)
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---|---|---|---|
KR20130057309 | 2013-05-21 | ||
KR10-2013-0057309 | 2013-05-21 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/892,929 A-371-Of-International US10103352B2 (en) | 2013-05-21 | 2014-05-21 | Organic electronic device having dimension tolerance between encapsulating layer and metal-containing layer less than or equal to 200 microns |
US16/125,244 Continuation US10522786B2 (en) | 2013-05-21 | 2018-09-07 | Organic electronic device having dimension tolerance between encapsulating layer and metal layer less than or equal to 200 microns |
Publications (1)
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WO2014189293A1 true WO2014189293A1 (ko) | 2014-11-27 |
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PCT/KR2014/004551 WO2014189293A1 (ko) | 2013-05-21 | 2014-05-21 | 유기전자장치 |
PCT/KR2014/004550 WO2014189292A1 (ko) | 2013-05-21 | 2014-05-21 | 봉지 필름 및 이를 이용한 유기전자장치의 봉지 방법 |
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PCT/KR2014/004550 WO2014189292A1 (ko) | 2013-05-21 | 2014-05-21 | 봉지 필름 및 이를 이용한 유기전자장치의 봉지 방법 |
Country Status (7)
Country | Link |
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US (4) | US10403850B2 (ko) |
EP (2) | EP3001477B1 (ko) |
JP (3) | JP6258471B2 (ko) |
KR (2) | KR101589373B1 (ko) |
CN (3) | CN105247699B (ko) |
TW (2) | TWI590948B (ko) |
WO (2) | WO2014189293A1 (ko) |
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JP2019194348A (ja) * | 2015-02-04 | 2019-11-07 | エルジー・ケム・リミテッド | 粘着剤組成物 |
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