JP5498156B2 - 放射線−または熱−硬化性バリヤシーラント - Google Patents
放射線−または熱−硬化性バリヤシーラント Download PDFInfo
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- JP5498156B2 JP5498156B2 JP2009502735A JP2009502735A JP5498156B2 JP 5498156 B2 JP5498156 B2 JP 5498156B2 JP 2009502735 A JP2009502735 A JP 2009502735A JP 2009502735 A JP2009502735 A JP 2009502735A JP 5498156 B2 JP5498156 B2 JP 5498156B2
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- sealant
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- curing
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- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- WYXIGTJNYDDFFH-UHFFFAOYSA-Q triazanium;borate Chemical compound [NH4+].[NH4+].[NH4+].[O-]B([O-])[O-] WYXIGTJNYDDFFH-UHFFFAOYSA-Q 0.000 description 1
- IVIIAEVMQHEPAY-UHFFFAOYSA-N tridodecyl phosphite Chemical compound CCCCCCCCCCCCOP(OCCCCCCCCCCCC)OCCCCCCCCCCCC IVIIAEVMQHEPAY-UHFFFAOYSA-N 0.000 description 1
- XOTMHFNWERTCLG-UHFFFAOYSA-N tris(4-ethenoxybutyl) benzene-1,2,4-tricarboxylate Chemical compound C=COCCCCOC(=O)C1=CC=C(C(=O)OCCCCOC=C)C(C(=O)OCCCCOC=C)=C1 XOTMHFNWERTCLG-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sealing Material Composition (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
- Paints Or Removers (AREA)
Description
関連出願
発明の分野
背景
図面の簡単な説明
発明の概要
発明の詳細な説明
実施例
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2006/011441 WO2007111606A1 (en) | 2006-03-29 | 2006-03-29 | Radiation-or thermally-curable barrier sealants |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013207508A Division JP5785236B2 (ja) | 2013-10-02 | 2013-10-02 | 放射線−または熱−硬化性バリヤシーラント |
Publications (2)
Publication Number | Publication Date |
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JP2009531515A JP2009531515A (ja) | 2009-09-03 |
JP5498156B2 true JP5498156B2 (ja) | 2014-05-21 |
Family
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Family Applications (1)
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JP2009502735A Expired - Fee Related JP5498156B2 (ja) | 2006-03-29 | 2006-03-29 | 放射線−または熱−硬化性バリヤシーラント |
Country Status (7)
Country | Link |
---|---|
US (1) | US8278401B2 (ja) |
EP (1) | EP1999177B1 (ja) |
JP (1) | JP5498156B2 (ja) |
KR (1) | KR101252701B1 (ja) |
CN (1) | CN101410433A (ja) |
TW (1) | TWI408152B (ja) |
WO (1) | WO2007111606A1 (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
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TW201002126A (en) * | 2007-12-21 | 2010-01-01 | Du Pont | Encapsulation assembly for electronic devices |
DE102009013710A1 (de) | 2009-03-20 | 2010-09-23 | Merck Patent Gmbh | Polymere aus Mischungen mit Vinylether-Monomeren |
US9136195B2 (en) | 2009-07-17 | 2015-09-15 | Tyco Electronics Corporation | Oxygen barrier compositions and related methods |
US8525635B2 (en) | 2009-07-17 | 2013-09-03 | Tyco Electronics Corporation | Oxygen-barrier packaged surface mount device |
US20130228276A1 (en) * | 2010-11-10 | 2013-09-05 | Kuo-Kuang Chang | Method for manufacturing cover plate and method for manufacturing encapsulated light-emitting diode using the cover plate |
CN102531459B (zh) * | 2012-01-13 | 2013-04-10 | 刘小南 | 防火密封胶泥及其制备方法 |
JP2014056123A (ja) * | 2012-09-12 | 2014-03-27 | Sanyo Chem Ind Ltd | 感光性組成物 |
WO2014092019A1 (ja) * | 2012-12-12 | 2014-06-19 | 株式会社ニコン | 組成物、積層体、積層体の製造方法、トランジスタおよびトランジスタの製造方法 |
WO2014126626A1 (en) * | 2013-02-15 | 2014-08-21 | Empire Technology Development Llc | Phenolic epoxy compounds |
JP6200203B2 (ja) * | 2013-05-16 | 2017-09-20 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス表示素子用封止剤及び有機エレクトロルミネッセンス表示素子の製造方法 |
KR101806862B1 (ko) | 2013-06-13 | 2017-12-08 | 엠파이어 테크놀로지 디벨롭먼트 엘엘씨 | 다작용 페놀 수지 |
JP6227505B2 (ja) * | 2013-11-12 | 2017-11-08 | Jfeケミカル株式会社 | エポキシ樹脂組成物およびエポキシ樹脂硬化物 |
CN105814014B (zh) | 2013-12-02 | 2018-06-12 | 英派尔科技开发有限公司 | 新型双子表面活性剂和它们的用途 |
KR20150097359A (ko) * | 2014-02-18 | 2015-08-26 | 주식회사 엘지화학 | 봉지 필름 및 이를 포함하는 유기전자장치 |
WO2015133840A2 (ko) * | 2014-03-05 | 2015-09-11 | 한국생산기술연구원 | 알콕시실릴기를 갖는 에폭시 화합물, 이의 제조 방법, 이를 포함하는 조성물, 경화물 및 이의 용도 |
KR102334395B1 (ko) * | 2014-12-05 | 2021-12-01 | 삼성전자주식회사 | 배리어 코팅 조성물, 그로부터 제조되는 복합체, 및 이를 포함하는 양자점-폴리머 복합체 물품 |
ES2941899T3 (es) | 2016-11-23 | 2023-05-26 | Essilor Int | Composición con funcionalidad epoxi que protege tintes de la fotodegradación y recubrimientos curados preparados a partir de la misma |
CN108546536A (zh) * | 2018-05-17 | 2018-09-18 | 深圳飞世尔新材料股份有限公司 | 一种oled边框封装用环氧胶粘合剂及其制备方法 |
US11155728B2 (en) | 2018-12-06 | 2021-10-26 | Kateeva, Inc. | Quantum dot material and method of curing |
KR102232340B1 (ko) | 2019-11-15 | 2021-03-26 | 한국생산기술연구원 | 알콕시실릴기를 갖는 에폭시 수지의 조성물 및 이의 복합체 |
CN111410455A (zh) * | 2020-04-03 | 2020-07-14 | 杨云 | 一种蛭石高温密封胶及其制备方法和制备装置 |
CN113831872A (zh) * | 2020-06-23 | 2021-12-24 | 3M创新有限公司 | 环氧胶粘剂组合物、环氧胶粘剂、和制备环氧胶粘剂的方法 |
KR20230095934A (ko) * | 2021-03-31 | 2023-06-29 | 덴카 주식회사 | 조성물, 경화체 및 유기 el 표시장치 |
CN113324031B (zh) * | 2021-05-28 | 2022-06-28 | 中国科学院上海光学精密机械研究所 | 放大器隔板玻璃耐强激光辐射密封安装方法 |
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NL282251A (ja) * | 1961-08-18 | |||
US3925315A (en) * | 1974-09-20 | 1975-12-09 | Us Army | Diglycidyl ether of 4-methylol resorcinol |
JPS62127315A (ja) * | 1985-11-28 | 1987-06-09 | Dainippon Ink & Chem Inc | 内部可塑化されたエポキシ樹脂の製造法 |
JPH07179511A (ja) * | 1993-12-22 | 1995-07-18 | Japan Carlit Co Ltd:The | 光重合性樹脂組成物 |
JPH0952942A (ja) * | 1995-06-05 | 1997-02-25 | Daicel Chem Ind Ltd | エポキシ樹脂硬化方法およびその硬化物 |
JP2000344872A (ja) * | 1999-03-31 | 2000-12-12 | Dainippon Ink & Chem Inc | カチオン型紫外線硬化性組成物、それを用いた貼り合わせ方法、光ディスク、及び光ディスクの製造方法 |
JP2001002760A (ja) * | 1999-04-23 | 2001-01-09 | Mitsubishi Heavy Ind Ltd | エネルギー線遮蔽物含有樹脂のエネルギー線照射による樹脂硬化組成物、及び硬化方法 |
KR20010080093A (ko) | 1999-08-12 | 2001-08-22 | 사토 아키오 | 실링제용광경화형수지조성물 및 실링방법. |
JP2001100224A (ja) | 1999-09-28 | 2001-04-13 | Mitsui Chemicals Inc | 液晶表示セル用シール材組成物 |
JP2002069269A (ja) * | 2000-08-29 | 2002-03-08 | Dainippon Ink & Chem Inc | 紫外線硬化型組成物及び光ディスク |
KR100502993B1 (ko) * | 2002-03-08 | 2005-07-25 | 주식회사 루밴틱스 | 광통신부품용 광학접착제 |
KR100799146B1 (ko) * | 2003-08-21 | 2008-01-29 | 아사히 가세이 케미칼즈 가부시키가이샤 | 감광성 조성물 및 그 경화물 |
JP4290519B2 (ja) * | 2003-10-14 | 2009-07-08 | 太陽インキ製造株式会社 | インクジェット用カチオン硬化性組成物とその硬化物、及びそれを用いたプリント配線板 |
KR101103936B1 (ko) | 2003-10-17 | 2012-01-12 | 샤프 가부시키가이샤 | 액정 시일제, 그것을 사용한 액정 표시 장치 및 이 장치의제조 방법 |
JP4403829B2 (ja) * | 2004-02-27 | 2010-01-27 | 株式会社日立製作所 | 回転電機,電気絶縁線輪及びそれに用いるエポキシ樹脂組成物 |
JP2006070164A (ja) * | 2004-09-02 | 2006-03-16 | Toray Ind Inc | 可視光硬化性樹脂組成物 |
US7687119B2 (en) | 2005-04-04 | 2010-03-30 | Henkel Ag & Co. Kgaa | Radiation-curable desiccant-filled adhesive/sealant |
US20060223978A1 (en) * | 2005-04-04 | 2006-10-05 | Shengqian Kong | Radiation- or thermally-curable oxetane barrier sealants |
US20060223937A1 (en) * | 2005-04-04 | 2006-10-05 | Herr Donald E | Radiation curable cycloaliphatic barrier sealants |
-
2006
- 2006-03-29 JP JP2009502735A patent/JP5498156B2/ja not_active Expired - Fee Related
- 2006-03-29 WO PCT/US2006/011441 patent/WO2007111606A1/en active Application Filing
- 2006-03-29 KR KR1020087023578A patent/KR101252701B1/ko active IP Right Grant
- 2006-03-29 US US12/280,119 patent/US8278401B2/en not_active Expired - Fee Related
- 2006-03-29 CN CNA2006800540450A patent/CN101410433A/zh active Pending
- 2006-03-29 EP EP06748872.6A patent/EP1999177B1/en not_active Not-in-force
- 2006-06-30 TW TW095123695A patent/TWI408152B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN101410433A (zh) | 2009-04-15 |
EP1999177A1 (en) | 2008-12-10 |
KR101252701B1 (ko) | 2013-04-09 |
EP1999177B1 (en) | 2016-05-11 |
TWI408152B (zh) | 2013-09-11 |
US8278401B2 (en) | 2012-10-02 |
KR20080105118A (ko) | 2008-12-03 |
WO2007111606A1 (en) | 2007-10-04 |
JP2009531515A (ja) | 2009-09-03 |
TW200736331A (en) | 2007-10-01 |
US20100164368A1 (en) | 2010-07-01 |
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