JP6139578B2 - 装置および方法 - Google Patents

装置および方法 Download PDF

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Publication number
JP6139578B2
JP6139578B2 JP2015020306A JP2015020306A JP6139578B2 JP 6139578 B2 JP6139578 B2 JP 6139578B2 JP 2015020306 A JP2015020306 A JP 2015020306A JP 2015020306 A JP2015020306 A JP 2015020306A JP 6139578 B2 JP6139578 B2 JP 6139578B2
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Japan
Prior art keywords
solder ball
solder balls
solder
substrate
die
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JP2015020306A
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English (en)
Japanese (ja)
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JP2015170854A (ja
Inventor
ボニス、トーマス ジェイ． デ
ボニス、トーマス ジェイ． デ
メイ、リリア
エス． シズ、ラジェン
エス． シズ、ラジェン
ピー． レナヴィカー、ムクル
ピー． レナヴィカー、ムクル
エー． ダニ、アシャイ
エー． ダニ、アシャイ
アール． プラック、エドワード
アール． プラック、エドワード
エル． デッピシュ、カール
エル． デッピシュ、カール
エム． プラカシュ、アンナ
エム． プラカシュ、アンナ
（ジュニア）、ジェームス シー． マタヤバス
（ジュニア）、ジェームス シー． マタヤバス
ジエピン ザン、ジェイソン
ジエピン ザン、ジェイソン
アール． アラヴァムダン、スリニヴァサ
アール． アラヴァムダン、スリニヴァサ
リン、チャン
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Intel Corp
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Intel Corp
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Publication of JP2015170854A publication Critical patent/JP2015170854A/ja
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Publication of JP6139578B2 publication Critical patent/JP6139578B2/ja
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