JP5775002B2 - 発光装置の製造方法 - Google Patents
発光装置の製造方法 Download PDFInfo
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- JP5775002B2 JP5775002B2 JP2011551934A JP2011551934A JP5775002B2 JP 5775002 B2 JP5775002 B2 JP 5775002B2 JP 2011551934 A JP2011551934 A JP 2011551934A JP 2011551934 A JP2011551934 A JP 2011551934A JP 5775002 B2 JP5775002 B2 JP 5775002B2
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- light emitting
- electrode
- sealing member
- electrodes
- emitting element
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Description
(第1実施形態)
図1乃至図3には本発明の第1実施形態に係る製造方法によって製造された発光装置が示され、図4乃至図25には第1実施形態に係る製造方法の工程が示されている。
図26には本発明の第2実施形態に係る製造方法によって製造された発光装置が示され、図27乃至図32には第2実施形態に係る製造方法の工程が示されている。
図33には本発明の第3実施形態に係る製造方法によって得られた発光装置が示され、図34には第3実施形態に係る製造方法の特徴的な工程が示されている。なお、第1実施形態における部材と同等の部材には同一の符号を付すことで、詳細な説明を省略する。
図35は本発明の第4実施形態における発光装置40の断面図を示したものである。この発光装置40は、前記第3実施形態における発光装置30の第2封止部材32が発光素子3の上面及び周側面を被覆する蛍光剤含有樹脂体42aと、その外側を封止する透明樹脂体42bとで構成されている点が第3実施形態の発光装置30と異なる以外は同一の構成からなる。したがって、第3実施形態における発光装置30の部材と同等の部材には同一の符合を付して詳細な説明は省略する。なお、蛍光剤含有樹脂体42aは、約100μm程度の均一な厚みで発光素子3の下面を除く全体を被覆している。
図36には本発明の第5実施形態に係る製造方法によって製造された発光装置が示され、図37及び図38には第5実施形態に係る製造方法の工程が示されている。
図39には本発明の第6実施形態に係る発光装置60が示されている。この発光装置60は、上面と、下面と、上面と下面の間の周側面を有し、下面に一対の素子電極を有する発光素子3と、発光素子3の上面に設けられた蛍光剤含有樹脂体である蛍光体層52と、発光体層52の上面に設けられたガラス基材などの透明基材53と、発光素子3の一対の素子電極3a,3bを露出させるように配置され、発光素子3の周側面を封止する封止部材と、発光素子3の一対の素子電極3a,3bと電気的に接続され、封止部材上に設けられた一対の外部接続電極13n,13pを有している。この発光装置60が、先の第5実施形態に係る発光装置50と異なるのは、発光素子3を封止している封止部材が2層構造からなる透明樹脂体61と白色反射体62とで構成されている点である。透明樹脂体61は発光素子3の外周側面を覆うように設けられ、白色反射体62は発光素子3の下面に形成されている一対の素子電極3a,3bの周囲に設けられて素子電極を封止している。この白色反射体62は、第3実施形態における発光装置30と同様、発光素子3の素子電極3a,3bを白色セラミックインクによって封止するものであるが、白色セラミックインクのような無機材料に限られず、酸化チタン等の反射性微粉末を含むシリコーン樹脂やエポキシ樹脂を用いても良い。なお、その他の構成は第5実施形態における発光装置50と同一なので、同一の符合を付すことで詳細な説明を省略する。
3a N電極(素子電極)
3b P電極(素子電極)
3L 複数の発光素子を集合的に樹脂封止する封止部材
5 封止部材
5a 下面
6、26 下地電極膜
6a,26a N電極下地膜
6b,26b P電極下地膜
6c,6d,26c,26d 露出部分の下地電極膜
8 切断部
10,20,30,40,50,60 発光装置
11a,11b,21a,21b ニッケル層
12a,12b,22a,22b 金層
13n,23n N外部接続電極
13P,23p P外部接続電極
15 反射枠
25 保護膜
27a,27b 段差部
31 第1封止部材
32 第2封止部材
51 封止部材
52 蛍光体層
53 透明基材
61 透明樹脂体
62 白色反射体
63,83 第1レジストマスク
64,84 第2レジストマスク
70 外部基板
71,72 配線電極
80 治具板
81 粘着シート
81a 粘着糊層
81b 基材層
Claims (9)
- 剥離性の粘着シートを準備すること、
それぞれの発光素子の下面にP電極及びN電極からなる一対の素子電極を有する、複数の発光素子を準備すること、
基材層とその上面に積層される粘着糊層とで構成された前記粘着シート上に、各発光素子の下面を押し付けて、各発光素子のP電極及びN電極が前記基材層に当接するまで粘着シートの粘着糊層の中に沈み込ませて複数の発光素子を配列すること、
前記粘着シート上に封止部材を設けて、前記粘着シートの粘着糊層から突出した前記複数の発光素子を封止すること、
前記粘着シートを前記封止部材の下面と前記複数の発光素子の下面とから剥離して、粘着シートの粘着糊層の中に沈み込ませていた各発光素子のP電極及びN電極を露出させること、を含む発光装置の製造方法。 - 前記封止部材上で、前記複数の発光素子の下面側に反射材を設けること、を含む請求項1に記載の発光装置の製造方法。
- 前記反射材を研磨することによって複数の発光素子のそれぞれの下面が有する一対のP電極及びN電極の少なくとも一面を反射材から露出させること、を含む請求項2に記載の発光装置の製造方法。
- 前記反射材から露出されている前記複数の発光素子のそれぞれの下面が有するP電極及びN電極の少なくとも一部と接して、電気的に接続される一対の外部接続電極を形成すること、を含む請求項3に記載の発光装置の製造方法。
- 前記複数の発光素子のそれぞれの下面が有する前記P電極及びN電極の少なくとも一部と接して、電気的に接続される一対の外部接続電極を形成すること、を含む請求項1に記載の発光装置の製造方法。
- 前記封止部材を設けて前記複数の発光素子を封止部材によって封止する際に、複数の四角格子を有する反射枠を、各四角格子が各発光素子の周りを囲むように配置し、各発光素子を複数の四角格子を有する反射枠の各四角格子内で封止すること、
前記反射枠上を切断することで前記封止部材を分割すること、を含む請求項1に記載の発光装置の製造方法。 - 前記封止部材を設けて前記複数の発光素子を封止部材によって封止する際に、各発光素子の周りに四角格子形状を有する溝を形成するために、封止部材を縦横にハーフダイシングし、この溝に反射枠を形成すること、
前記反射枠上を切断することで前記封止部材を分割すること、を含む請求項1に記載の発光装置の製造方法。 - 剥離性の粘着シートを準備すること、
それぞれの発光素子の下面にP電極及びN電極からなる一対の素子電極を有する、複数の発光素子を準備すること、
基材層とその上面に積層される粘着糊層とで構成された前記粘着シート上に、各発光素子の下面を押し付けて、各発光素子のP電極及びN電極が前記基材層に当接するまで粘着シートの粘着糊層の中に沈み込ませて複数の発光素子を配列すること、
前記粘着シート上に封止部材を設けて、前記粘着シートの粘着糊層から突出した前記複数の発光素子を封止部材によって封止すること、
前記粘着シートを前記封止部材の下面と前記複数の発光素子の下面とから剥離して、粘着シートの粘着糊層の中に沈み込ませていた各発光素子のP電極及びN電極を露出させること、
複数の発光素子のそれぞれの下面が有するP電極及びN電極に対応する部分を除いて、前記封止部材の下面に保護膜を形成すること、
複数の発光素子のそれぞれの下面が有するP電極及びN電極に下地電極膜を形成すること、
下地電極膜上に前記一対の素子電極のP電極とN電極とに対応して分離する位置に、レジストマスクを形成すること、
下地電極膜上で、レジストマスクが形成されていない位置に外部接続電極用金属をメッキ形成すること、
前記レジストマスクを除去すること、
前記レジストマスクを除去した位置において、前記外部接続電極用金属をマスクとして下地電極膜をエッチングしてP電極とN電極に電気的に分離された一対の外部接続電極を、複数の発光素子のそれぞれの下面が有する一対のP電極及びN電極と電気的に接続される位置に複数形成すること、を含む発光装置の製造方法。 - 前記封止部材が蛍光剤含有樹脂からなる請求項1,2,6,7,8のいずれか一つに記載の発光装置の製造方法。
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CN102884645A (zh) | 2013-01-16 |
US20120302124A1 (en) | 2012-11-29 |
US8556672B2 (en) | 2013-10-15 |
CN102884645B (zh) | 2015-05-27 |
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