JP5436552B2 - 低熱容量半導体ウェハサポート - Google Patents

低熱容量半導体ウェハサポート Download PDF

Info

Publication number
JP5436552B2
JP5436552B2 JP2011516492A JP2011516492A JP5436552B2 JP 5436552 B2 JP5436552 B2 JP 5436552B2 JP 2011516492 A JP2011516492 A JP 2011516492A JP 2011516492 A JP2011516492 A JP 2011516492A JP 5436552 B2 JP5436552 B2 JP 5436552B2
Authority
JP
Japan
Prior art keywords
wafer
support
holes
wafer boat
boat including
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011516492A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011527109A (ja
JP2011527109A5 (enExample
Inventor
ブライアン・エル・ギルモア
ランス・ジー・ヘルウィグ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SunEdison Inc
Original Assignee
MEMC Electronic Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MEMC Electronic Materials Inc filed Critical MEMC Electronic Materials Inc
Publication of JP2011527109A publication Critical patent/JP2011527109A/ja
Publication of JP2011527109A5 publication Critical patent/JP2011527109A5/ja
Application granted granted Critical
Publication of JP5436552B2 publication Critical patent/JP5436552B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2011516492A 2008-06-30 2009-06-22 低熱容量半導体ウェハサポート Active JP5436552B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/165,048 2008-06-30
US12/165,048 US8042697B2 (en) 2008-06-30 2008-06-30 Low thermal mass semiconductor wafer support
PCT/US2009/048126 WO2010002617A1 (en) 2008-06-30 2009-06-22 Low thermal mass semiconductor wafer support

Publications (3)

Publication Number Publication Date
JP2011527109A JP2011527109A (ja) 2011-10-20
JP2011527109A5 JP2011527109A5 (enExample) 2012-08-09
JP5436552B2 true JP5436552B2 (ja) 2014-03-05

Family

ID=40912053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011516492A Active JP5436552B2 (ja) 2008-06-30 2009-06-22 低熱容量半導体ウェハサポート

Country Status (7)

Country Link
US (3) US8042697B2 (enExample)
EP (3) EP2311080B1 (enExample)
JP (1) JP5436552B2 (enExample)
KR (1) KR20110025781A (enExample)
CN (1) CN102077336A (enExample)
TW (1) TWI430391B (enExample)
WO (1) WO2010002617A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090162183A1 (en) * 2007-12-19 2009-06-25 Peter Davison Full-contact ring for a large wafer
US8042697B2 (en) * 2008-06-30 2011-10-25 Memc Electronic Materials, Inc. Low thermal mass semiconductor wafer support
JP5565242B2 (ja) * 2010-09-29 2014-08-06 東京エレクトロン株式会社 縦型熱処理装置
JP5881956B2 (ja) * 2011-02-28 2016-03-09 株式会社日立国際電気 基板処理装置、半導体装置の製造方法およびウェーハホルダ
USD763807S1 (en) * 2014-05-22 2016-08-16 Hzo, Inc. Boat for a deposition apparatus
US9099514B2 (en) * 2012-03-21 2015-08-04 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer holder with tapered region
US10190235B2 (en) * 2013-05-24 2019-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer supporting structure and method for forming the same
JP6321172B2 (ja) * 2013-11-25 2018-05-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 熱エネルギー伝達低減のための基板キャリア
KR20150110207A (ko) * 2014-03-24 2015-10-02 주식회사 테라세미콘 보트
US10072892B2 (en) * 2015-10-26 2018-09-11 Globalwafers Co., Ltd. Semiconductor wafer support ring for heat treatment
DE102015014903A1 (de) * 2015-11-18 2017-05-18 Centrotherm Photovoltaics Ag Waferboot und Plasma-Behandlungsvorrichtung für Wafer
JP6770461B2 (ja) * 2017-02-21 2020-10-14 クアーズテック株式会社 縦型ウエハボート
WO2020001730A1 (en) * 2018-06-25 2020-01-02 Applied Materials, Inc. Carrier for a substrate and method for carrying a substrate
TWI735115B (zh) * 2019-12-24 2021-08-01 力成科技股份有限公司 晶圓儲存裝置及晶圓承載盤
US12046495B2 (en) 2020-06-26 2024-07-23 Globalwafers Co., Ltd. Wafer boats for supporting semiconductor wafers in a furnace
JP7734211B2 (ja) * 2021-05-12 2025-09-04 アプライド マテリアルズ インコーポレイテッド 低質量基板支持体
CN113964071A (zh) * 2021-11-25 2022-01-21 滁州钰顺企业管理咨询合伙企业(有限合伙) 一种降低晶圆包装破损的方法
US12261068B2 (en) * 2022-10-27 2025-03-25 Intel Corporation Wafer support member and method of manufacturing a wafer support member
EP4498411A3 (en) * 2023-06-28 2025-03-26 ASM IP Holding B.V. Wafer boat system, holder ring and use thereof
TW202537026A (zh) * 2024-03-13 2025-09-16 力晶積成電子製造股份有限公司 晶圓承載裝置

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1587693A (en) * 1924-07-26 1926-06-08 Edith M Beland Attachment for sinks
US5199582A (en) * 1990-05-14 1993-04-06 Halstrick Robert T Storage rack shelving with improved fire protection
JP3125199B2 (ja) * 1993-03-18 2001-01-15 東京エレクトロン株式会社 縦型熱処理装置
JPH07254591A (ja) * 1994-03-16 1995-10-03 Toshiba Corp 熱処理装置
KR0135049B1 (ko) * 1994-05-31 1998-04-20 양승택 반도체 제조장비의 웨이퍼 장착 카세트
JP3692697B2 (ja) 1997-03-25 2005-09-07 三菱住友シリコン株式会社 ウェハ支持体及び縦型ボート
JPH11260746A (ja) 1998-03-13 1999-09-24 Sumitomo Metal Ind Ltd ウェーハ支持板
KR20000002833A (ko) 1998-06-23 2000-01-15 윤종용 반도체 웨이퍼 보트
KR100427916B1 (ko) * 1999-09-03 2004-04-28 미쯔이 죠센 가부시키가이샤 웨이퍼 보유 지지구
JP4592849B2 (ja) 1999-10-29 2010-12-08 アプライド マテリアルズ インコーポレイテッド 半導体製造装置
US7204887B2 (en) 2000-10-16 2007-04-17 Nippon Steel Corporation Wafer holding, wafer support member, wafer boat and heat treatment furnace
JP2002134484A (ja) 2000-10-19 2002-05-10 Asm Japan Kk 半導体基板保持装置
US6497403B2 (en) 2000-12-28 2002-12-24 Memc Electronic Materials, Inc. Semiconductor wafer holder
US6488497B1 (en) * 2001-07-12 2002-12-03 Saint-Gobain Ceramics & Plastics, Inc. Wafer boat with arcuate wafer support arms
JP4633977B2 (ja) 2001-08-30 2011-02-16 信越半導体株式会社 アニールウエーハの製造方法及びアニールウエーハ
JP3541838B2 (ja) 2002-03-28 2004-07-14 信越半導体株式会社 サセプタ、エピタキシャルウェーハの製造装置および製造方法
JP2003197722A (ja) * 2001-12-26 2003-07-11 Toshiba Ceramics Co Ltd 半導体ウェーハ熱処理用治具及びこれを用いた熱処理用装置並びに半導体ウェーハ熱処理用治具の製造方法
JP3377996B1 (ja) * 2001-12-27 2003-02-17 東京エレクトロン株式会社 熱処理用ボート及び縦型熱処理装置
US7077913B2 (en) 2002-01-17 2006-07-18 Hitachi Kokusai Electric, Inc. Apparatus for fabricating a semiconductor device
US7256375B2 (en) 2002-08-30 2007-08-14 Asm International N.V. Susceptor plate for high temperature heat treatment
KR100492977B1 (ko) * 2002-12-12 2005-06-07 삼성전자주식회사 다공성 실리카 박막의 소결을 위한 웨이퍼 보트
CN100352032C (zh) 2003-03-26 2007-11-28 信越半导体株式会社 热处理用晶片支持器具及热处理装置
JPWO2004090967A1 (ja) 2003-04-02 2006-07-06 株式会社Sumco 半導体ウェーハ用熱処理治具
US7033126B2 (en) 2003-04-02 2006-04-25 Asm International N.V. Method and apparatus for loading a batch of wafers into a wafer boat
JP4506125B2 (ja) * 2003-07-16 2010-07-21 信越半導体株式会社 熱処理用縦型ボート及びその製造方法
WO2005044694A1 (ja) * 2003-11-06 2005-05-19 Sharp Kabushiki Kaisha 基板搬送用トレイ
US20050145584A1 (en) * 2004-01-06 2005-07-07 Buckley Richard F. Wafer boat with interference fit wafer supports
JP4826070B2 (ja) 2004-06-21 2011-11-30 信越半導体株式会社 半導体ウエーハの熱処理方法
JP4534619B2 (ja) 2004-06-21 2010-09-01 株式会社Sumco 半導体シリコン基板用熱処理治具
KR100875464B1 (ko) * 2004-09-30 2008-12-22 가부시키가이샤 히다치 고쿠사이 덴키 열처리 장치 및 기판의 제조방법
US7033168B1 (en) 2005-01-24 2006-04-25 Memc Electronic Materials, Inc. Semiconductor wafer boat for a vertical furnace
DE102005013831B4 (de) 2005-03-24 2008-10-16 Siltronic Ag Siliciumscheibe und Verfahren zur thermischen Behandlung einer Siliciumscheibe
US7713355B2 (en) 2005-05-03 2010-05-11 Integrated Materials, Incorporated Silicon shelf towers
JP2007201417A (ja) 2005-12-28 2007-08-09 Tokyo Electron Ltd 熱処理用ボート及び縦型熱処理装置
US20080041798A1 (en) * 2006-06-30 2008-02-21 Memc Electronic Materials, Inc. Wafer Platform
JP2008108926A (ja) 2006-10-26 2008-05-08 Bridgestone Corp ウェハ熱処理用治具
JP2008130695A (ja) 2006-11-17 2008-06-05 Bridgestone Corp 熱処理用ホルダー
JP4954693B2 (ja) * 2006-12-21 2012-06-20 東京エレクトロン株式会社 基板の処理方法、基板の処理システム及びプログラムを記録したコンピュータ読み取り可能な記録媒体
JP4313401B2 (ja) 2007-04-24 2009-08-12 東京エレクトロン株式会社 縦型熱処理装置及び被処理基板移載方法
JP5208547B2 (ja) * 2008-03-19 2013-06-12 東京エレクトロン株式会社 電力合成器およびマイクロ波導入機構
US8042697B2 (en) * 2008-06-30 2011-10-25 Memc Electronic Materials, Inc. Low thermal mass semiconductor wafer support
US20100098519A1 (en) 2008-10-17 2010-04-22 Memc Electronic Materials, Inc. Support for a semiconductor wafer in a high temperature environment
USD616391S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Pedestal of heat insulating cylinder for manufacturing semiconductor wafers
USD616396S1 (en) * 2009-03-12 2010-05-25 Tokyo Electron Limited Pedestal of heat insulating cylinder for manufacturing semiconductor wafers

Also Published As

Publication number Publication date
KR20110025781A (ko) 2011-03-11
TWI430391B (zh) 2014-03-11
JP2011527109A (ja) 2011-10-20
US8220647B2 (en) 2012-07-17
EP2311080B1 (en) 2013-02-27
US20090321372A1 (en) 2009-12-31
US20120077138A1 (en) 2012-03-29
US20120074081A1 (en) 2012-03-29
WO2010002617A1 (en) 2010-01-07
US8042697B2 (en) 2011-10-25
CN102077336A (zh) 2011-05-25
EP2597673A2 (en) 2013-05-29
EP2597672A2 (en) 2013-05-29
EP2311080A1 (en) 2011-04-20
US8220646B2 (en) 2012-07-17
TW201009998A (en) 2010-03-01

Similar Documents

Publication Publication Date Title
JP5436552B2 (ja) 低熱容量半導体ウェハサポート
US7033168B1 (en) Semiconductor wafer boat for a vertical furnace
KR100530407B1 (ko) 반도체 제조 장치
CN100386847C (zh) 晶片保持架
US20080041798A1 (en) Wafer Platform
JPWO2001018856A1 (ja) ウェーハ保持具
TW201529444A (zh) 晶圓裝載皿及用於處理半導體晶圓之設備
KR20100105892A (ko) 세라믹 패들
JPH10284429A (ja) ウェーハ支持装置
JP2007529909A (ja) 半導体ウェーハキャリヤ用改良型レール
KR102709165B1 (ko) 웨이퍼 보트
JP5218039B2 (ja) 気相成長装置
US8420554B2 (en) Wafer support ring
JPH0950967A (ja) 被処理体の支持ボート
JP4029611B2 (ja) ウェーハ支持具
JP4590162B2 (ja) 基板ホルダ、積層ボート、半導体製造装置および半導体装置の製造方
JP2001313266A (ja) 熱処理用ボート
JP2008021824A (ja) ボートトレイ及びウェーハ用熱処理炉
JP3034901B2 (ja) ウエハボート
JP2004327776A (ja) 縦型熱処理炉用ウェーハボート
JP2009111271A (ja) 熱処理用ボート、ウェーハ熱処理方法
JP2004221220A (ja) ウェーハ支持具

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120619

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120619

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130610

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130618

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20130917

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20130925

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131017

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20131119

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131210

R150 Certificate of patent or registration of utility model

Ref document number: 5436552

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250