JP6321172B2 - 熱エネルギー伝達低減のための基板キャリア - Google Patents
熱エネルギー伝達低減のための基板キャリア Download PDFInfo
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- JP6321172B2 JP6321172B2 JP2016533589A JP2016533589A JP6321172B2 JP 6321172 B2 JP6321172 B2 JP 6321172B2 JP 2016533589 A JP2016533589 A JP 2016533589A JP 2016533589 A JP2016533589 A JP 2016533589A JP 6321172 B2 JP6321172 B2 JP 6321172B2
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- 239000000758 substrate Substances 0.000 title claims description 363
- 230000009467 reduction Effects 0.000 title description 8
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000001771 vacuum deposition Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 description 24
- 239000000463 material Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 239000000969 carrier Substances 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 238000005137 deposition process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
- H01L21/67316—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3321—CVD [Chemical Vapor Deposition]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3322—Problems associated with coating
- H01J2237/3323—Problems associated with coating uniformity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1892—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates
- H01L31/1896—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates for thin-film semiconductors
Description
中間部分120は、一又は複数の熱エネルギー分離切り欠き、及びオプションにより、一又は複数の応力低減切り欠きを含む。
Claims (15)
- 処理される基板を保持し、移送装置によって基板を処理領域内で又は処理領域を通って移送するための基板キャリアであって、
基板を保持するための主要部分と、
移送装置によって支持される第1末端部分と
前記主要部分を前記第1末端部分に接続する第1中間部分とを備え、
前記第1中間部分には、前記主要部分と前記第1末端部分との間の熱エネルギー伝達を低減するための一又は複数の切り欠きが設けられ、前記主要部分と前記第1末端部分との間の熱伝導経路の最短長が、前記主要部分と前記第1末端部分との間の最短距離よりも大きく、
さらに、
移送装置により支持される第2末端部分と
前記主要部分と前記第2末端部分との間にある第2中間部分であって前記主要部分と前記第2末端部分との間の熱エネルギー伝達を低減するための一又は複数の切り欠きが設けられた第2中間部分とを備える、基板キャリア。 - 前記第1中間部分及び/又は前記第二中間部分に設けられた一又は複数の切り欠きは、開放切り欠きと閉鎖切り欠きを含み、前記開放切り欠き及び前記閉鎖切り欠きは、前記第1末端部、前記第1中間部分、前記主要部分、前記第2中間部分、前記第2末端部分を通る長手方向に延在する中央平面に対して対称に設けられている、請求項1に記載の基板キャリア。
- 前記主要部分と前記第2末端部分との間の熱伝導経路の最短長が、前記主要部分と前記第2末端部分との間の最短距離よりも大きい、請求項1または2に記載の基板キャリア。
- 前記主要部分から前記第1末端部分までの、及び/又は前記主要部分から前記第2末端部分までのすべての直線経路は、前記一又は複数の切り欠きのうちの少なくとも1つと交差する、請求項1から3のいずれか一項に記載の基板キャリア。
- 前記一又は複数の切り欠きのうちの少なくとも1つは、前記基板キャリアによって完全に囲まれている、請求項1から4のいずれか一項に記載の基板キャリア。
- 前記一又は複数の切り欠きのうちの少なくとも1つは、前記第1中間部分の、及び/又は前記第2中間部分の外側端面の全長が、それぞれの前記中間部分の前記外側端面に沿った、前記基板キャリアの外側端面に平行な直線の長さよりも大きくなるように配置される、請求項1から5のいずれか一項に記載の基板キャリア。
- 前記第1中間部分、及び/又は前記第2中間部分は、2つ以上の切り欠きを備える、請求項1から6のいずれか一項に記載の基板キャリア。
- 前記第1中間部分、及び/又は前記第2中間部分は、一又は複数の応力低減切り欠きを備える、請求項1から7のいずれか一項に記載の基板キャリア。
- 前記一又は複数の応力低減切り欠きは、前記主要部分と前記第1末端部分との間の、及び/又は前記主要部分と前記第2末端部分との間の熱エネルギー伝達を低減するための前記一又は複数の切り欠きの一部である、請求項8に記載の基板キャリア。
- 前記一又は複数の応力低減切り欠きは、2mmを超える曲率半径を有する、請求項8又は9に記載の基板キャリア。
- 前記一又は複数の切り欠き、及び/又は一又は複数の応力低減切り欠きは、前記基板キャリアを完全に通って延在する、請求項1から10のいずれか一項に記載の基板キャリア。
- 前記第1末端部分及び前記第2末端部分は前記基板キャリアの対向する末端にある、請求項2に記載の基板キャリア。
- 前記基板キャリアによって保持された前記基板が熱処理を受けている間に、前記基板と前記移送装置との間の前記熱エネルギー伝達を低減するための、請求項1から12のいずれか一項に記載の前記基板キャリアの使用。
- 請求項1から10のいずれか一項に記載の前記基板キャリアと、
基板を処理するための少なくとも1つの処理チャンバと、
前記基板キャリアを支持するための移送装置と
を備える、基板を処理するためのシステム。 - 前記システムは真空堆積システムである、請求項14に記載のシステム。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2013/074604 WO2015074725A1 (en) | 2013-11-25 | 2013-11-25 | Substrate carrier for a reduced transmission of thermal energy |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016541117A JP2016541117A (ja) | 2016-12-28 |
JP2016541117A5 JP2016541117A5 (ja) | 2017-02-09 |
JP6321172B2 true JP6321172B2 (ja) | 2018-05-09 |
Family
ID=49681012
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016533589A Expired - Fee Related JP6321172B2 (ja) | 2013-11-25 | 2013-11-25 | 熱エネルギー伝達低減のための基板キャリア |
Country Status (7)
Country | Link |
---|---|
US (1) | US20160276142A1 (ja) |
EP (1) | EP3075004A1 (ja) |
JP (1) | JP6321172B2 (ja) |
KR (1) | KR20160089507A (ja) |
CN (1) | CN105745744B (ja) |
TW (1) | TWI653697B (ja) |
WO (1) | WO2015074725A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7476117B2 (ja) * | 2018-06-25 | 2024-04-30 | アプライド マテリアルズ インコーポレイテッド | 基板用キャリア及び基板を搬送するための方法 |
US20210370528A1 (en) * | 2020-05-29 | 2021-12-02 | Persimmon Technologies Corporation | Robot for High-Temperature Applications |
DE102021003330B3 (de) * | 2021-06-28 | 2022-09-01 | Singulus Technologies Aktiengesellschaft | Substratträger |
DE102021003326B3 (de) * | 2021-06-28 | 2022-09-08 | Singulus Technologies Aktiengesellschaft | Substratträger |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03106357U (ja) * | 1990-02-19 | 1991-11-01 | ||
US6183026B1 (en) * | 1999-04-07 | 2001-02-06 | Gasonics International Corporation | End effector |
JP2004235439A (ja) * | 2003-01-30 | 2004-08-19 | Shin Etsu Handotai Co Ltd | サセプタ及び気相成長装置 |
JP2007150336A (ja) * | 2007-01-09 | 2007-06-14 | Nsk Ltd | 基板搬送装置 |
US8042697B2 (en) * | 2008-06-30 | 2011-10-25 | Memc Electronic Materials, Inc. | Low thermal mass semiconductor wafer support |
FR2935769B1 (fr) * | 2008-09-10 | 2016-08-12 | Renault Sas | Articulation elastique de suspension de vehicule automobile et structure de vehicule automobile comportant une telle articulation |
JP4895061B2 (ja) * | 2010-04-26 | 2012-03-14 | アキム株式会社 | 部品搬送キャリア |
EP2423350B1 (en) | 2010-08-27 | 2013-07-31 | Applied Materials, Inc. | Carrier for a substrate and a method for assembling the same |
JP5881956B2 (ja) * | 2011-02-28 | 2016-03-09 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法およびウェーハホルダ |
JP5667012B2 (ja) * | 2011-08-26 | 2015-02-12 | 東京エレクトロン株式会社 | リング状シールド部材、その構成部品及びリング状シールド部材を備えた基板載置台 |
JP5522181B2 (ja) * | 2012-01-26 | 2014-06-18 | 株式会社安川電機 | 搬送ロボット |
-
2013
- 2013-11-25 US US15/031,138 patent/US20160276142A1/en not_active Abandoned
- 2013-11-25 CN CN201380081075.0A patent/CN105745744B/zh active Active
- 2013-11-25 JP JP2016533589A patent/JP6321172B2/ja not_active Expired - Fee Related
- 2013-11-25 KR KR1020167017053A patent/KR20160089507A/ko not_active Application Discontinuation
- 2013-11-25 WO PCT/EP2013/074604 patent/WO2015074725A1/en active Application Filing
- 2013-11-25 EP EP13798627.9A patent/EP3075004A1/en not_active Withdrawn
-
2014
- 2014-11-20 TW TW103140182A patent/TWI653697B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201533828A (zh) | 2015-09-01 |
KR20160089507A (ko) | 2016-07-27 |
CN105745744B (zh) | 2018-10-26 |
CN105745744A (zh) | 2016-07-06 |
TWI653697B (zh) | 2019-03-11 |
US20160276142A1 (en) | 2016-09-22 |
WO2015074725A1 (en) | 2015-05-28 |
EP3075004A1 (en) | 2016-10-05 |
JP2016541117A (ja) | 2016-12-28 |
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