JP7476117B2 - 基板用キャリア及び基板を搬送するための方法 - Google Patents
基板用キャリア及び基板を搬送するための方法 Download PDFInfo
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Description
Claims (14)
- 真空処理システム内で基板(110)を保持し且つ輸送方向(x1)に輸送するように構成されたキャリア(100)であって、
互いの反対側の2つの側方エッジ(200)と、
側方エッジ(200)の間に配置された接合構造(300)であって、基板(110)を露出させる複数の開孔を含む平坦な構造を有する接合構造(300)と、
接合構造(300)に隣接して且つ接合構造(300)から離間させて基板(110)を保持するように構成された保持アセンブリ(400)と
を備え、
前記複数の開孔が50個よりも多い開孔を含み、
前記接合構造が0.8を超える開孔比を有し、
キャリア(100)であって、
前記保持アセンブリは、
前記2つの側方エッジのそれぞれのエッジ接触面を提供する上側保持バーと下側保持バーとを備えており、前記接合構造が前記基板から離間され、前記接合構造は前記基板から少なくとも10mmかつ60mm未満の距離に配置される、キャリア(100)。 - 輸送方向(x1)に、基板(110)と同じ範囲に又は基板(110)より小さい範囲に延びる、請求項1に記載のキャリア(100)。
- 開孔が、連続的に周方向に縁取られる若しくは境界を有するか、又は
各開孔が、湾曲した若しくは曲線的な境界又は多角形の境界を有するか、又は
開孔が連続的に周方向に縁取られる若しくは境界を有し且つ各開孔が湾曲した若しくは曲線的な境界又は多角形の境界を有する、
請求項1または2に記載のキャリア(100)。 - 開孔の境界が、少なくとも3つの角を有する多角形として形成されているか、又は
開孔の境界が、3つから6つの角を有する多角形として形成されている、
請求項1から3のいずれか一項に記載のキャリア(100)。 - 接合構造(300)が、格子構造を有するか、又はメッシュ状に形成されている、請求項1から4のいずれか一項に記載のキャリア(100)。
- 接合構造(300)が、少なくともいくつかの領域内において、均一な開孔のシーケンスによって形成されているか、又は
接合構造(300)が、少なくともいくつかの領域内において、周期的な開孔のシーケンスによって形成されているか、又は
接合構造(300)が、少なくともいくつかの領域内において、均一且つ周期的な開孔のシーケンスによって形成されている、
請求項1から5のいずれか一項に記載のキャリア(100)。 - 少なくとも2つの接合構造(300)を備える、請求項1から6のいずれか一項に記載のキャリア(100)。
- 少なくとも2つの接合構造(300)が、少なくとも2つの層(303、304)を含む層状構造に配置されているか、又は
少なくとも2つの接合構造(300)が、少なくとも2つの層(303、304)を含む層状構造に配置されており且つ層(303、304)が上下に配置されているか、又は
少なくとも2つの接合構造(300)が、少なくとも2つの層(303、304)を含む層状構造に配置されており且つ少なくとも2つの接合構造(300)が、非0°、45°、少なくとも30°、及び60°未満からなる群のうちの少なくとも1つである角度だけ回転又は反転された状態で互いに対して配置されているか、又は
少なくとも2つの接合構造(300)が、少なくとも2つの層(303、304)を含む層状構造に配置されており、層(303、304)は上下に配置されており、且つ少なくとも2つの接合構造(300)が、非0°、45°、少なくとも30°、及び60°未満からなる群のうちの少なくとも1つである角度だけ回転又は反転された状態で互いに対して配置されている、
請求項7に記載のキャリア。 - 接合構造(300)又は各接合構造(300)が、i)フライス加工された構造又はii)屈曲させたワイヤ構造として形成されているか、又は
上下に配置された接合構造(300)が、接続アセンブリ(305)によって相互接続されているか、又は
上下に配置された接合構造(300)が、接続アセンブリ(305)によって相互接続されており、接続アセンブリはジグザグ形状又は曲線的形状を備えている、
請求項1から8のいずれか一項に記載のキャリア(100)。 - 保持アセンブリ(400)が、静電チャックアセンブリ、ヤモリチャックアセンブリ、磁気チャックアセンブリ、及び基板(110)を支持するための支持面からなる群より選択される少なくとも1つを含む、請求項1から9のいずれか一項に記載のキャリア(100)。
- 真空処理システム内で基板(110)を保持し且つ輸送方向(x1)に輸送するように構成されたキャリア(100)であって、
互いの反対側の2つの側方エッジ(200)と、
側方エッジ(200)の間に配置された接合構造(300)であって、基板(110)を露出させる50個よりも多い開孔を含み且つ少なくとも0.8の開孔比を有する平坦な構造を有する接合構造(300)と、
接合構造(300)に隣接して基板(110)を保持するように構成された保持アセンブリ(400)と
を備え、
前記保持アセンブリは、
前記2つの側方エッジのそれぞれのエッジ接触面を提供する上側保持バーと下側保持バーとを備えており、前記接合構造が前記基板から離間され、前記接合構造は前記基板から少なくとも10mmかつ60mm未満の距離に配置される、キャリア(100)。 - 真空処理システム内で基板(110)を保持し且つ輸送方向(x1)に輸送するように構成されたキャリア(100)であって、
互いの反対側の2つの側方エッジ(200)であって、垂直に配向された基板については上側のエッジと下側のエッジである2つの側方エッジ(200)と、
前記基板(110)を前記キャリア(100)に固定するための少なくとも1つの保持バー(401)であって、前記側方エッジ(200)の少なくとも一方に配置されることで、前記接合構造が前記基板から離間される、保持バー(401)と、
側方エッジ(200)の間に配置された接合構造(300)であって、基板(110)の裏面で基板(110)を露出させる複数の開孔を含む平坦な構造を有する接合構造(300)と
を備え、
前記複数の開孔が50個よりも多い開孔を含み、
前記接合構造が0.8を超える開孔比を有するキャリア(100)。 - キャリア(100)を用いて、堆積チャンバ内で堆積プロセス中に基板(110)を輸送方向(x1)に搬送するための方法(500)であって、前記キャリア(100)が、互いの反対側の2つの側方エッジ(200)であって、上側保持バーと下側保持バーとによってエッジ接触面を提供する、2つの側方エッジ(200)と、前記側方エッジ(200)の間に配置された接合構造(300)であって、複数の開孔を含む平坦な構造を有する接合構造(300)と、前記接合構造(300)に隣接して基板(110)を保持するように構成された保持アセンブリ(400)とを有し、前記接合構造が、前記基板から少なくとも10mmかつ60mm未満の距離に配置され、前記方法が、
側方エッジ(200)の少なくとも一方で、接合構造(300)から離間させて、保持アセンブリ(400)の支持面において基板(110)を支持すること(520)を含み、
前記キャリアは、前記輸送方向(x1)にて前記基板を越えないか、または前記基板を越えて延びることがなく、
前記複数の開孔が50個よりも多い開孔を含み、
前記接合構造が0.8を超える開孔比を有する、方法。 - 材料が堆積される基板表面とは反対側の基板表面を加熱すること
をさらに含む、請求項13に記載の方法(500)。
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DE102005045717B3 (de) * | 2005-09-24 | 2007-05-03 | Applied Materials Gmbh & Co. Kg | Träger für ein Substrat |
KR20080002372A (ko) * | 2006-06-30 | 2008-01-04 | 엘지.필립스 엘시디 주식회사 | 서셉터 및 이를 구비한 기판이송장치 |
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