TWI430391B - 低熱質量半導體晶圓支撐 - Google Patents

低熱質量半導體晶圓支撐 Download PDF

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Publication number
TWI430391B
TWI430391B TW098121898A TW98121898A TWI430391B TW I430391 B TWI430391 B TW I430391B TW 098121898 A TW098121898 A TW 098121898A TW 98121898 A TW98121898 A TW 98121898A TW I430391 B TWI430391 B TW I430391B
Authority
TW
Taiwan
Prior art keywords
wafer
support
holes
boat
wafer boat
Prior art date
Application number
TW098121898A
Other languages
English (en)
Chinese (zh)
Other versions
TW201009998A (en
Inventor
Brian L Gilmore
Lance G Hellwig
Original Assignee
Memc Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials filed Critical Memc Electronic Materials
Publication of TW201009998A publication Critical patent/TW201009998A/zh
Application granted granted Critical
Publication of TWI430391B publication Critical patent/TWI430391B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW098121898A 2008-06-30 2009-06-29 低熱質量半導體晶圓支撐 TWI430391B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/165,048 US8042697B2 (en) 2008-06-30 2008-06-30 Low thermal mass semiconductor wafer support

Publications (2)

Publication Number Publication Date
TW201009998A TW201009998A (en) 2010-03-01
TWI430391B true TWI430391B (zh) 2014-03-11

Family

ID=40912053

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098121898A TWI430391B (zh) 2008-06-30 2009-06-29 低熱質量半導體晶圓支撐

Country Status (7)

Country Link
US (3) US8042697B2 (enExample)
EP (3) EP2311080B1 (enExample)
JP (1) JP5436552B2 (enExample)
KR (1) KR20110025781A (enExample)
CN (1) CN102077336A (enExample)
TW (1) TWI430391B (enExample)
WO (1) WO2010002617A1 (enExample)

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USD763807S1 (en) * 2014-05-22 2016-08-16 Hzo, Inc. Boat for a deposition apparatus
US9099514B2 (en) * 2012-03-21 2015-08-04 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer holder with tapered region
US10190235B2 (en) * 2013-05-24 2019-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer supporting structure and method for forming the same
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KR20150110207A (ko) * 2014-03-24 2015-10-02 주식회사 테라세미콘 보트
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JP7734211B2 (ja) * 2021-05-12 2025-09-04 アプライド マテリアルズ インコーポレイテッド 低質量基板支持体
CN113964071A (zh) * 2021-11-25 2022-01-21 滁州钰顺企业管理咨询合伙企业(有限合伙) 一种降低晶圆包装破损的方法
US12261068B2 (en) * 2022-10-27 2025-03-25 Intel Corporation Wafer support member and method of manufacturing a wafer support member
EP4498411A3 (en) * 2023-06-28 2025-03-26 ASM IP Holding B.V. Wafer boat system, holder ring and use thereof
TW202537026A (zh) * 2024-03-13 2025-09-16 力晶積成電子製造股份有限公司 晶圓承載裝置

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Also Published As

Publication number Publication date
JP5436552B2 (ja) 2014-03-05
KR20110025781A (ko) 2011-03-11
JP2011527109A (ja) 2011-10-20
US8220647B2 (en) 2012-07-17
EP2311080B1 (en) 2013-02-27
US20090321372A1 (en) 2009-12-31
US20120077138A1 (en) 2012-03-29
US20120074081A1 (en) 2012-03-29
WO2010002617A1 (en) 2010-01-07
US8042697B2 (en) 2011-10-25
CN102077336A (zh) 2011-05-25
EP2597673A2 (en) 2013-05-29
EP2597672A2 (en) 2013-05-29
EP2311080A1 (en) 2011-04-20
US8220646B2 (en) 2012-07-17
TW201009998A (en) 2010-03-01

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