CN113964071A - 一种降低晶圆包装破损的方法 - Google Patents

一种降低晶圆包装破损的方法 Download PDF

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CN113964071A
CN113964071A CN202111413085.2A CN202111413085A CN113964071A CN 113964071 A CN113964071 A CN 113964071A CN 202111413085 A CN202111413085 A CN 202111413085A CN 113964071 A CN113964071 A CN 113964071A
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叶顺闵
林伯璋
蔡孟霖
蘇政宏
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Chuzhou Yushun Enterprise Management Consulting Partnership LP
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Abstract

本发明属于半导体制作技术领域，具体涉及一种降低晶圆包装破损的方法；本发明以对应的层叠包装方式，有序的层别出各自晶圆放置位置，不仅可有效达到减震的效果，亦可有效降低破片异常。

Description

一种降低晶圆包装破损的方法
技术领域
本发明属于半导体制作技术领域，具体的讲涉及一种降低晶圆包装破损的方法。
背景技术
科技与时俱进,半导体发展神速,各种软硬件的运用更是火热,为了将更多不同功能的晶片堆叠放置于芯片中,晶圆薄化的制程更是重中之重,故晶圆薄化的需求更是个家厂商极近所能研发与改善,晶圆薄化可使芯片在晶圆内的延展性及提升高功率芯片在运行中加速散热效果,如何让晶圆薄化至极致且完整包装出货至客户端,对于各家厂商是一大考验。
现行包装方式多使用特制晶舟盒或是客户端提供之装置盒,一般的晶舟盒对于减薄mil数高的晶圆承载并无问题,但是要满足减薄效果薄至3mil或是更薄之产品,晶圆的包装放置方式与内容物的置放就是一大考验与挑战,本发明能有效降低晶圆于包装中破片之几率,且能大幅提升晶舟盒内部承载片数,不仅能多片承载更能完善保护精密的晶圆。
发明内容
为解决现有技术存在的问题，本发明提供一种降低晶圆包装破损的方法，可以有效避免晶圆放置过程中造成晶圆刮伤与碎裂，更能稳固的将多片晶圆放置于晶舟盒内大幅降低薄晶圆的包装成本，可有效降低晶圆运送过程的破片率。
本发明的技术方案是这样实现的：
一种降低晶圆包装破损的方法，包括如下步骤：
提供晶圆，该晶圆具有集成电路的正面与背面，接着将该晶圆放入一个晶舟装置内，并依据置入的不同厚薄规格置放包装。
进一步地，晶圆包装方式可适用于2mil及以上的晶圆产品。
进一步地，晶圆包装尺寸为4in、5in、6in、8in与12in中的任意一种。
进一步地，晶舟装置设有一个承载部，所述承载部外延延伸有承载保护件，还设有一个和承载部对应的上盖部，所述上盖部外延延伸有上盖保护件，承载部与上盖部接合，两个保护件相互镶合以保护晶圆。
进一步地，晶舟装置内部设有若干隔层件用以将晶圆间隔置放减少晶圆摩擦。
进一步地，晶舟装置内部设有若干软隔层用以将晶圆间隔置放以有效减缓晶舟装置因放置晶圆的震动。
进一步地，晶舟装置内部可拆卸连接有边条软件，用于接合时稳固承载部与上盖部。
进一步地，隔层件为TYVEK材料制作。
进一步地，软隔层为PE或PU中的任意一种。
进一步地，边条软件为PE或PU材料中任意一种。
进一步地，隔层件使用前需烘烤60℃±2，且烘烤时间为240分钟以上，并需摊开摆放每摊纸高度≤4cm。
进一步地，软隔层于使用前需放置氮气柜内24HR。
进一步地，边条软件使用前需烘烤50℃±2，且烘烤时间为30分钟以上，并需摊开摆放每摊≤20cm，并于烘烤后存放于氮气柜内。
进一步地，隔层件于晶舟装置内可拆卸连接，且该材质抗静电。
进一步地，软隔层材质为PU材质，于晶舟装置内可拆卸连接，且该材质抗静电。
进一步地，边条软件材质为PE材质，于晶舟装置内可拆卸连接，且该材质抗静电。
本方案的有益效果如下：
本发明提供一种降低晶圆包装破损的方法，本发明与现有技术相比优点在于，现有技术中使用晶舟盒放置晶圆，而包装方式与包装内容物并无特殊设计与摆放，容易导致晶圆因放置导致刮伤或破片异常，而本发明则以对应的层叠包装方式，有序的层别出各自晶圆放置位置，不仅可有效达到减震的效果，亦可有效降低破片异常。
附图说明
图1为本发明一种降低晶圆包装破损的方法实施例1的晶舟装置的结构示意图。
附图标记：晶圆1、晶舟装置2、隔层件3、软隔层4、边条软件5、承载部21、上盖部22、承载保护件211、上盖保护件221
具体实施方式
下面将结合本发明实施例中的附图对本发明实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明，本发明实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，在本发明中涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本发明要求的保护范围内。
实施例1
如图1所示，一种降低晶圆包装破损的方法，拿取一片依照客户要求厚度规格的晶圆1，将晶圆1放入晶舟装置2中，该晶舟装置2可依据不同客户需求变换放置顺序与位置，晶舟装置2的包装作业适用于晶圆1尺寸4in、5in、6in、8in与12in，并且最终晶圆1成品可放置薄度至少2mil以上的晶圆1。
具体包装方法是，在晶舟装置2的承载部21置入若干个边条软件5，并藉由承载保护件211可将边条软件5环绕包复，本技术中，承载保护件211或者上盖保护件211，均是沿对应的承载部21或者上盖部22边缘向轴向延伸的环套；接着放入若干个软隔层4及隔层件3，再置入晶圆1,晶圆1和软隔层4间隔设置；每置入两片晶圆1之间至少需要置入一个软隔层4，依序放入所需片数，直至放满整个晶舟装置2，由下向上堆叠放置，最后再次放入隔层件3，接着将上盖部22套于承载部21，并利用承载部21的承载保护件211与上盖部22的上盖保护件221相互紧密镶合以形成封闭密封起到保护作用；
若遇有晶舟装置2因放置片数不足而有残留空间，可于晶舟装置2内部的上层或下层填充放置软隔层4，直至内部晶圆1不受因片数不足导致摇摆产生异常。
放置于晶舟装置2内的隔层件3为TYVEK且为抗静电材质，且于使用前需烘烤60℃±2，且烘烤时间为240分钟以上,并需摊开摆放每摊纸高度且不得超过4cm，而软隔层4可为PU或PE材质,并于使用前需放置于氮气柜内24小时,而边条软件5可为PU或PE材质,使用前需烘烤50℃±2，且烘烤时间为30分钟以上,并需摊开摆放每摊且不得超过20cm，并于烘烤后存放于氮气柜内,所有置入晶舟装置2内的非晶圆1物件,都需依循先进先出的原则,避免物件变质影响包覆与隔离效果。
考察到晶舟装置2的放置顺序与物件使用会依据客户需求变更,本实施例乃列举的正常包装流程,其包装物件使用数量,晶圆1装置片数可依照客户需求，进行变化各种包装形式。
最后说明的是，以上实施例仅用以说明本发明的技术方案而非限制，尽管参照较佳实施例对本发明进行了详细说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或者等同替换，而不脱离本发明技术方案的宗旨和范围，其均应涵盖在本发明的权利要求范围当中。

Claims (7)

1.一种降低晶圆包装破损的方法，其特征在于，包含如下步骤：
提供晶圆，该晶圆具有集成电路的正面与背面，接着将该晶圆放入一个晶舟装置内，并依据置入的不同厚薄规格置放包装。
2.根据权利要求1所述的一种降低晶圆包装破损的方法，其特征在于，晶圆包装方式可适用于2mil及以上的晶圆产品。
3.根据权利要求1所述的一种降低晶圆包装破损的方法，其特征在于，晶圆包装尺寸为4in、5in、6in、8in与12in中的任意一种。
4.根据权利要求1所述的一种降低晶圆包装破损的方法，其特征在于，所述晶舟装置设有一个承载部，所述承载部外延延伸有承载保护件，还设有一个和承载部对应的上盖部，所述上盖部外延延伸有上盖保护件，承载部与上盖部接合，两个保护件相互镶合以保护晶圆；晶舟装置内部设有若干隔层件用以将晶圆间隔置放减少晶圆摩擦；所述晶舟装置内部设有若干软隔层用以将晶圆间隔置放以有效减缓晶舟装置因放置晶圆的震动；所述晶舟装置内部可拆卸连接有边条软件，用于接合时稳固承载部与上盖部。
5.根据权利要求4所述的一种降低晶圆包装破损的方法，其特征在于，所述隔层件为TYVEK材料制作；所述软隔层为PE或PU中的任意一种；所述边条软件为PE或PU中任意一种材料。
6.根据权利要求5所述的一种降低晶圆包装破损的方法，其特征在于，所述隔层件使用前需烘烤60℃±2，且烘烤时间为240分钟以上，并需摊开摆放每摊纸高度≤4cm；所述软隔层于使用前需放置氮气柜内24HR；所述边条软件使用前需烘烤50℃±2，且烘烤时间为30分钟以上，并需摊开摆放每摊≤20cm，并于烘烤后存放于氮气柜内。
7.根据权利要求5所述的一种降低晶圆包装破损的方法，其特征在于，所述隔层件于晶舟装置内可拆卸连接，且该材质抗静电；所述软隔层材质为PU材质，于晶舟装置内可拆卸连接，且该材质抗静电；所述边条软件材质为PE材质，于晶舟装置内可拆卸连接，且该材质抗静电。
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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