CN112164667A - 一种晶圆蚀刻的承载器 - Google Patents
一种晶圆蚀刻的承载器 Download PDFInfo
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Abstract
本发明公开了一种晶圆蚀刻的承载器,其结构包括顶盖、放置承载箱、开闭门、拉块,顶盖焊接于放置承载箱顶部,并且开闭门采用间隙配合安装在放置承载箱内部,通过晶圆外侧的挤压,使得夹片板对顶簧进行挤压,确保晶圆安装进入到外侧限位框内部,通过不同厚度的晶圆对海绵垫进行挤压,同时晶圆的底部通过抵触中轴和抵触板进行承托,提高晶圆中心的承托力,通过两个抵触板和支撑板形成水平三角支撑,提高晶圆底部的承托力,较少晶圆外侧表面的受力,同时晶圆的外侧进入到滑动片内部,与转动轮发生抵触,使得滑动轴能够在挤压滑轨内部进行滑动,确保转动轮贴合着晶圆的外侧进行转动,提高滑动片与晶圆之间的顺滑度,防止晶圆外侧受到磨损。
Description
技术领域
本发明涉及晶圆蚀刻领域,更具体地说,尤其是涉及到一种晶圆蚀刻的承载器。
背景技术
在半导体的制程中,晶圆蚀刻被用来将某种材质从晶圆表面上移除,从而生产出晶圆,晶圆的厚度很薄,需要使用到承载器来对多个晶圆进行集中放置,对晶圆进行保护,防止晶圆发生断裂,但是承载器在对晶圆进行集中收集放置的过程中,由于晶圆的厚度较薄,承载器对晶圆的外侧进行夹紧,而晶圆的中部抵触支撑能力较弱,从而使得晶圆的外侧与承载器装夹处的装夹力度需要增大,在对承载器进行移动的过程中,晶圆外侧容易与承载器装夹处发生挤压摩擦,造成晶圆外侧发生断裂,导致晶圆破损,降低对晶圆进行集中保护的效果。
发明内容
本发明实现技术目的所采用的技术方案是:该一种晶圆蚀刻的承载器,其结构包括顶盖、放置承载箱、开闭门、拉块,所述顶盖焊接于放置承载箱顶部,并且开闭门采用间隙配合安装在放置承载箱内部,所述开闭门前表面焊接有拉块,所述放置承载箱包括外包箱体、回位弹簧、抵触装夹器、转动支撑器,所述外包箱体内部设有回位弹簧,并且开闭门采用间隙配合安装在外包箱体内部,所述回位弹簧与开闭门相固定,所述抵触装夹器外端焊接于外包箱体内侧表面,并且转动支撑器外端焊接于开闭门内侧表面,所述转动支撑器内端与抵触装夹器内端相连接,所述外包箱体呈半环形结构,并且回位弹簧呈弧形结构。
作为本发明的进一步改进,所述抵触装夹器包括抵触中轴、抵触板、限位夹片,所述抵触中轴外表面与抵触板一端相焊接,并且抵触板另一端与限位夹片下端相固定,所述限位夹片外侧表面焊接于外包箱体内侧表面,所述抵触中轴与转动支撑器内端轴连接,所述抵触板和限位夹片均设有两个,并且两个抵触板均与抵触中轴外侧相固定,两个抵触板之间的夹角为60°。
作为本发明的进一步改进,所述限位夹片包括外侧限位框、顶簧、夹片板,所述外侧限位框右侧内部焊接有顶簧,并且顶簧与夹片板外侧表面相焊接,所述夹片板采用间隙配合安装在外侧限位框内部,所述外侧限位框呈弧形结构,并且外侧限位框的中部呈空腔结构。
作为本发明的进一步改进,所述夹片板包括凹槽夹板、海绵垫,所述凹槽夹板右端采用间隙配合安装在外侧限位框内部,并且凹槽夹板内侧设有海绵垫,所述海绵垫呈褶皱型结构,并且设有两个,分别设在凹槽夹板凹槽内部的上下两端。
作为本发明的进一步改进,所述转动支撑器包括连接转板、支撑板、滑动夹板,所述连接转板与抵触中轴轴连接,所述连接转板左端与支撑板右端相焊接,所述支撑板左端焊接有滑动夹板,所述连接转板与抵触中轴位于同一圆心上,所述支撑板与抵触中轴处于同一水平高度。
作为本发明的进一步改进,所述滑动夹板包括滑动片、转动轮、滑动轴、挤压滑轨,所述滑动片右端与支撑板左端相焊接,并且滑动轴采用间隙配合贯穿于转动轮内部,所述转动轮位于滑动片内部左侧,所述滑动轴滑动安装在挤压滑轨内部,所述转动轮、滑动轴和挤压滑轨均设有三个,并且呈弧形均匀分布在滑动片内侧。
本发明的有益效果在于:
1.通过晶圆外侧的挤压,使得夹片板对顶簧进行挤压,确保晶圆安装进入到外侧限位框内部,通过不同厚度的晶圆对海绵垫进行挤压,同时晶圆的底部通过抵触中轴和抵触板进行承托,提高晶圆中心的承托力,避免晶圆外侧受到的装夹力度过大,避免晶圆发生断裂。
2.通过两个抵触板和支撑板形成水平三角支撑,提高晶圆底部的承托力,较少晶圆外侧表面的受力,同时晶圆的外侧进入到滑动片内部,与转动轮发生抵触,使得滑动轴能够在挤压滑轨内部进行滑动,确保转动轮贴合着晶圆的外侧进行转动,提高滑动片与晶圆之间的顺滑度,防止晶圆外侧受到磨损。
附图说明
图1为本发明一种晶圆蚀刻的承载器的结构示意图。
图2为本发明一种放置承载箱的俯视内部结构示意图。
图3为本发明一种抵触装夹器的立体结构示意图。
图4为本发明一种限位夹片的俯视内部结构示意图。
图5为本发明一种夹片板的剖视结构示意图。
图6为本发明一种转动支撑器的俯视结构示意图。
图7为本发明一种滑动夹板的俯视内部结构示意图。
图中:顶盖-1、放置承载箱-2、开闭门-3、拉块-4、外包箱体-21、回位弹簧-22、抵触装夹器-23、转动支撑器-24、抵触中轴-231、抵触板-232、限位夹片-233、外侧限位框-33a、顶簧-33b、夹片板-33c、凹槽夹板-c1、海绵垫-c2、连接转板-241、支撑板-242、滑动夹板-243、滑动片-43a、转动轮-43b、滑动轴-43c、挤压滑轨-43d。
具体实施方式
以下结合附图对本发明做进一步描述:
实施例1:
如附图1至附图5所示:
本发明一种晶圆蚀刻的承载器,其结构包括顶盖1、放置承载箱2、开闭门3、拉块4,所述顶盖1焊接于放置承载箱2顶部,并且开闭门3采用间隙配合安装在放置承载箱2内部,所述开闭门3前表面焊接有拉块4,所述放置承载箱2包括外包箱体21、回位弹簧22、抵触装夹器23、转动支撑器24,所述外包箱体21内部设有回位弹簧22,并且开闭门3采用间隙配合安装在外包箱体21内部,所述回位弹簧22与开闭门3相固定,所述抵触装夹器23外端焊接于外包箱体21内侧表面,并且转动支撑器24外端焊接于开闭门3内侧表面,所述转动支撑器24内端与抵触装夹器23内端相连接,所述外包箱体21呈半环形结构,并且回位弹簧22呈弧形结构,确保回位弹簧22带动开闭门3在外包箱体21内部进行自动弧形转动,将晶圆进行外侧进行包裹,提高对晶圆外侧全方位的保护。
其中,所述抵触装夹器23包括抵触中轴231、抵触板232、限位夹片233,所述抵触中轴231外表面与抵触板232一端相焊接,并且抵触板232另一端与限位夹片233下端相固定,所述限位夹片233外侧表面焊接于外包箱体21内侧表面,所述抵触中轴231与转动支撑器24内端轴连接,所述抵触板232和限位夹片233均设有两个,并且两个抵触板232均与抵触中轴231外侧相固定,两个抵触板232之间的夹角为60°,提高对晶圆的中心和底部的承托力,避免晶圆外侧受到的装夹力度过大。
其中,所述限位夹片233包括外侧限位框33a、顶簧33b、夹片板33c,所述外侧限位框33a右侧内部焊接有顶簧33b,并且顶簧33b与夹片板33c外侧表面相焊接,所述夹片板33c采用间隙配合安装在外侧限位框33a内部,所述外侧限位框33a呈弧形结构,并且外侧限位框33a的中部呈空腔结构,利于对晶圆外侧的上下两侧表面进行装夹,提高对晶圆的装夹稳定性。
其中,所述夹片板33c包括凹槽夹板c1、海绵垫c2,所述凹槽夹板c1右端采用间隙配合安装在外侧限位框33a内部,并且凹槽夹板c1内侧设有海绵垫c2,所述海绵垫c2呈褶皱型结构,并且设有两个,分别设在凹槽夹板c1凹槽内部的上下两端,能够对不同厚度的晶圆进行紧密的抵触,并且海绵垫c2较为柔软,避免对晶圆表面造成刮伤。
本实施例的具体使用方式与作用:
本发明中,拉动拉块4将开闭门3进行转动,接着将放置承载箱2进行打开,接着将晶圆放入外包箱体21内部,通过晶圆的外侧与限位夹片233内部进行抵触,通过晶圆外侧的挤压,使得夹片板33c对顶簧33b进行挤压,确保晶圆安装进入到外侧限位框33a内部,提高对晶圆的装夹稳定性,通过不同厚度的晶圆对海绵垫c2进行挤压,确保凹槽夹板c1能够对不同厚度的晶圆进行紧密抵触,同时避免对晶圆表面造成刮伤,通过两个限位夹片233提高对晶圆外侧的装夹能力,同时晶圆的底部通过抵触中轴231和抵触板232进行承托,提高晶圆中心的承托力,避免晶圆外侧受到的装夹力度过大,避免晶圆外侧受到磨损,将多个晶圆分别安装进入相对应的限位夹片233内部后,防止晶圆与晶圆之间发生挤压,避免晶圆发生断裂。
实施例2:
如附图6至附图7所示:
其中,所述转动支撑器24包括连接转板241、支撑板242、滑动夹板243,所述连接转板241与抵触中轴231轴连接,所述连接转板241左端与支撑板242右端相焊接,所述支撑板242左端焊接有滑动夹板243,所述连接转板241与抵触中轴231位于同一圆心上,确保连接转板241绕着抵触中轴231的中心进行平稳的转动,所述支撑板242与抵触中轴231处于同一水平高度,确保晶圆的中心点与外侧底面处于同一高度承托,提高晶圆承载的平稳度。
其中,所述滑动夹板243包括滑动片43a、转动轮43b、滑动轴43c、挤压滑轨43d,所述滑动片43a右端与支撑板242左端相焊接,并且滑动轴43c采用间隙配合贯穿于转动轮43b内部,所述转动轮43b位于滑动片43a内部左侧,所述滑动轴43c滑动安装在挤压滑轨43d内部,所述转动轮43b、滑动轴43c和挤压滑轨43d均设有三个,并且呈弧形均匀分布在滑动片43a内侧,利于与晶圆外侧表面进行抵触,通过转动轮43b辅助滑动,确保开闭门3在进行关闭的过程中,滑动片43a不会与晶圆外侧发生卡位,提高顺滑度,防止晶圆外侧受到磨损。
本实施例的具体使用方式与作用:
本发明中,晶圆承载完成后,通过回位弹簧22的弹性回位,推动了开闭门3进行关闭,开闭门3在进行关闭的过程中连接转板241绕着抵触中轴231进行转动,这时支撑板242增加对晶圆底部的承托力,通过两个抵触板232和支撑板242形成水平三角支撑,提高晶圆底部的承托力,较少晶圆外侧表面的受力,同时晶圆的外侧进入到滑动片43a内部,与转动轮43b发生抵触,通过晶圆的挤压,使得滑动轴43c能够在挤压滑轨43d内部进行滑动,确保转动轮43b贴合着晶圆的外侧进行转动,提高滑动片43a与晶圆之间的顺滑度,防止晶圆外侧受到磨损。
利用本发明所述技术方案,或本领域的技术人员在本发明技术方案的启发下,设计出类似的技术方案,而达到上述技术效果的,均是落入本发明的保护范围。
Claims (6)
1.一种晶圆蚀刻的承载器,其结构包括顶盖(1)、放置承载箱(2)、开闭门(3)、拉块(4),所述顶盖(1)焊接于放置承载箱(2)顶部,并且开闭门(3)采用间隙配合安装在放置承载箱(2)内部,所述开闭门(3)前表面焊接有拉块(4),其特征在于:
所述放置承载箱(2)包括外包箱体(21)、回位弹簧(22)、抵触装夹器(23)、转动支撑器(24),所述外包箱体(21)内部设有回位弹簧(22),并且开闭门(3)采用间隙配合安装在外包箱体(21)内部,所述回位弹簧(22)与开闭门(3)相固定,所述抵触装夹器(23)外端焊接于外包箱体(21)内侧表面,并且转动支撑器(24)外端焊接于开闭门(3)内侧表面,所述转动支撑器(24)内端与抵触装夹器(23)内端相连接。
2.根据权利要求1所述的一种晶圆蚀刻的承载器,其特征在于:所述抵触装夹器(23)包括抵触中轴(231)、抵触板(232)、限位夹片(233),所述抵触中轴(231)外表面与抵触板(232)一端相焊接,并且抵触板(232)另一端与限位夹片(233)下端相固定,所述限位夹片(233)外侧表面焊接于外包箱体(21)内侧表面,所述抵触中轴(231)与转动支撑器(24)内端轴连接。
3.根据权利要求2所述的一种晶圆蚀刻的承载器,其特征在于:所述限位夹片(233)包括外侧限位框(33a)、顶簧(33b)、夹片板(33c),所述外侧限位框(33a)右侧内部焊接有顶簧(33b),并且顶簧(33b)与夹片板(33c)外侧表面相焊接,所述夹片板(33c)采用间隙配合安装在外侧限位框(33a)内部。
4.根据权利要求3所述的一种晶圆蚀刻的承载器,其特征在于:所述夹片板(33c)包括凹槽夹板(c1)、海绵垫(c2),所述凹槽夹板(c1)右端采用间隙配合安装在外侧限位框(33a)内部,并且凹槽夹板(c1)内侧设有海绵垫(c2)。
5.根据权利要求2所述的一种晶圆蚀刻的承载器,其特征在于:所述转动支撑器(24)包括连接转板(241)、支撑板(242)、滑动夹板(243),所述连接转板(241)与抵触中轴(231)轴连接,所述连接转板(241)左端与支撑板(242)右端相焊接,所述支撑板(242)左端焊接有滑动夹板(243)。
6.根据权利要求5所述的一种晶圆蚀刻的承载器,其特征在于:所述滑动夹板(243)包括滑动片(43a)、转动轮(43b)、滑动轴(43c)、挤压滑轨(43d),所述滑动片(43a)右端与支撑板(242)左端相焊接,并且滑动轴(43c)采用间隙配合贯穿于转动轮(43b)内部,所述转动轮(43b)位于滑动片(43a)内部左侧,所述滑动轴(43c)滑动安装在挤压滑轨(43d)内部。
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Cited By (4)
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CN113003185A (zh) * | 2021-02-23 | 2021-06-22 | 胡慧红 | 一种晶圆光刻显影用的平贴设备 |
CN113725128A (zh) * | 2021-11-01 | 2021-11-30 | 天霖(张家港)电子科技有限公司 | 一种半导体浸泡装置 |
CN113964071A (zh) * | 2021-11-25 | 2022-01-21 | 滁州钰顺企业管理咨询合伙企业(有限合伙) | 一种降低晶圆包装破损的方法 |
WO2023221286A1 (zh) * | 2022-05-17 | 2023-11-23 | 上海果纳半导体技术有限公司 | 晶圆盒 |
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Cited By (5)
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CN113003185A (zh) * | 2021-02-23 | 2021-06-22 | 胡慧红 | 一种晶圆光刻显影用的平贴设备 |
CN113725128A (zh) * | 2021-11-01 | 2021-11-30 | 天霖(张家港)电子科技有限公司 | 一种半导体浸泡装置 |
CN113725128B (zh) * | 2021-11-01 | 2022-03-04 | 天霖(张家港)电子科技有限公司 | 一种半导体浸泡装置 |
CN113964071A (zh) * | 2021-11-25 | 2022-01-21 | 滁州钰顺企业管理咨询合伙企业(有限合伙) | 一种降低晶圆包装破损的方法 |
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