TW504043U - Apparatus for holding wafers - Google Patents

Apparatus for holding wafers

Info

Publication number
TW504043U
TW504043U TW90216606U TW90216606U TW504043U TW 504043 U TW504043 U TW 504043U TW 90216606 U TW90216606 U TW 90216606U TW 90216606 U TW90216606 U TW 90216606U TW 504043 U TW504043 U TW 504043U
Authority
TW
Taiwan
Prior art keywords
holding wafers
wafers
holding
Prior art date
Application number
TW90216606U
Other languages
Chinese (zh)
Inventor
Shian-Ping Fan
Original Assignee
Ge Lin Wei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ge Lin Wei Co Ltd filed Critical Ge Lin Wei Co Ltd
Priority to TW90216606U priority Critical patent/TW504043U/en
Publication of TW504043U publication Critical patent/TW504043U/en

Links

TW90216606U 2001-09-27 2001-09-27 Apparatus for holding wafers TW504043U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90216606U TW504043U (en) 2001-09-27 2001-09-27 Apparatus for holding wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90216606U TW504043U (en) 2001-09-27 2001-09-27 Apparatus for holding wafers

Publications (1)

Publication Number Publication Date
TW504043U true TW504043U (en) 2002-09-21

Family

ID=27608420

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90216606U TW504043U (en) 2001-09-27 2001-09-27 Apparatus for holding wafers

Country Status (1)

Country Link
TW (1) TW504043U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113964071A (en) * 2021-11-25 2022-01-21 滁州钰顺企业管理咨询合伙企业(有限合伙) Method for reducing wafer package damage

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113964071A (en) * 2021-11-25 2022-01-21 滁州钰顺企业管理咨询合伙企业(有限合伙) Method for reducing wafer package damage

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees