JP2011527109A5 - - Google Patents

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Publication number
JP2011527109A5
JP2011527109A5 JP2011516492A JP2011516492A JP2011527109A5 JP 2011527109 A5 JP2011527109 A5 JP 2011527109A5 JP 2011516492 A JP2011516492 A JP 2011516492A JP 2011516492 A JP2011516492 A JP 2011516492A JP 2011527109 A5 JP2011527109 A5 JP 2011527109A5
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JP
Japan
Prior art keywords
support
wafer
wafer boat
holes
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2011516492A
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English (en)
Japanese (ja)
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JP2011527109A (ja
JP5436552B2 (ja
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Priority claimed from US12/165,048 external-priority patent/US8042697B2/en
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Publication of JP2011527109A publication Critical patent/JP2011527109A/ja
Publication of JP2011527109A5 publication Critical patent/JP2011527109A5/ja
Application granted granted Critical
Publication of JP5436552B2 publication Critical patent/JP5436552B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011516492A 2008-06-30 2009-06-22 低熱容量半導体ウェハサポート Active JP5436552B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/165,048 2008-06-30
US12/165,048 US8042697B2 (en) 2008-06-30 2008-06-30 Low thermal mass semiconductor wafer support
PCT/US2009/048126 WO2010002617A1 (en) 2008-06-30 2009-06-22 Low thermal mass semiconductor wafer support

Publications (3)

Publication Number Publication Date
JP2011527109A JP2011527109A (ja) 2011-10-20
JP2011527109A5 true JP2011527109A5 (enExample) 2012-08-09
JP5436552B2 JP5436552B2 (ja) 2014-03-05

Family

ID=40912053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011516492A Active JP5436552B2 (ja) 2008-06-30 2009-06-22 低熱容量半導体ウェハサポート

Country Status (7)

Country Link
US (3) US8042697B2 (enExample)
EP (3) EP2597672A2 (enExample)
JP (1) JP5436552B2 (enExample)
KR (1) KR20110025781A (enExample)
CN (1) CN102077336A (enExample)
TW (1) TWI430391B (enExample)
WO (1) WO2010002617A1 (enExample)

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US9099514B2 (en) 2012-03-21 2015-08-04 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer holder with tapered region
US10190235B2 (en) * 2013-05-24 2019-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer supporting structure and method for forming the same
CN105745744B (zh) * 2013-11-25 2018-10-26 应用材料公司 用于减少的热能传输的基板载体
KR20150110207A (ko) * 2014-03-24 2015-10-02 주식회사 테라세미콘 보트
US10072892B2 (en) * 2015-10-26 2018-09-11 Globalwafers Co., Ltd. Semiconductor wafer support ring for heat treatment
DE102015014903A1 (de) * 2015-11-18 2017-05-18 Centrotherm Photovoltaics Ag Waferboot und Plasma-Behandlungsvorrichtung für Wafer
JP6770461B2 (ja) * 2017-02-21 2020-10-14 クアーズテック株式会社 縦型ウエハボート
KR102607248B1 (ko) * 2018-06-25 2023-11-30 어플라이드 머티어리얼스, 인코포레이티드 기판을 위한 캐리어 및 기판을 운반하기 위한 방법
TWI735115B (zh) * 2019-12-24 2021-08-01 力成科技股份有限公司 晶圓儲存裝置及晶圓承載盤
US12046495B2 (en) * 2020-06-26 2024-07-23 Globalwafers Co., Ltd. Wafer boats for supporting semiconductor wafers in a furnace
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CN113964071A (zh) * 2021-11-25 2022-01-21 滁州钰顺企业管理咨询合伙企业(有限合伙) 一种降低晶圆包装破损的方法
US12261068B2 (en) * 2022-10-27 2025-03-25 Intel Corporation Wafer support member and method of manufacturing a wafer support member
EP4498411A3 (en) * 2023-06-28 2025-03-26 ASM IP Holding B.V. Wafer boat system, holder ring and use thereof
TW202537026A (zh) * 2024-03-13 2025-09-16 力晶積成電子製造股份有限公司 晶圓承載裝置

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