JP2016518699A5 - - Google Patents

Download PDF

Info

Publication number
JP2016518699A5
JP2016518699A5 JP2016500800A JP2016500800A JP2016518699A5 JP 2016518699 A5 JP2016518699 A5 JP 2016518699A5 JP 2016500800 A JP2016500800 A JP 2016500800A JP 2016500800 A JP2016500800 A JP 2016500800A JP 2016518699 A5 JP2016518699 A5 JP 2016518699A5
Authority
JP
Japan
Prior art keywords
substrate support
substrate
recess
lift pin
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016500800A
Other languages
English (en)
Japanese (ja)
Other versions
JP6873696B2 (ja
JP2016518699A (ja
Filing date
Publication date
Priority claimed from US14/197,699 external-priority patent/US9799548B2/en
Application filed filed Critical
Publication of JP2016518699A publication Critical patent/JP2016518699A/ja
Publication of JP2016518699A5 publication Critical patent/JP2016518699A5/ja
Application granted granted Critical
Publication of JP6873696B2 publication Critical patent/JP6873696B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016500800A 2013-03-15 2014-03-07 強化されたプロセスの均一性および低減された基板の滑りのためのサセプタ Active JP6873696B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361788920P 2013-03-15 2013-03-15
US61/788,920 2013-03-15
US14/197,699 US9799548B2 (en) 2013-03-15 2014-03-05 Susceptors for enhanced process uniformity and reduced substrate slippage
US14/197,699 2014-03-05
PCT/US2014/021639 WO2014149957A1 (en) 2013-03-15 2014-03-07 Susceptors for enhanced process uniformity and reduced substrate slippage

Publications (3)

Publication Number Publication Date
JP2016518699A JP2016518699A (ja) 2016-06-23
JP2016518699A5 true JP2016518699A5 (enExample) 2017-04-13
JP6873696B2 JP6873696B2 (ja) 2021-05-19

Family

ID=51524050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016500800A Active JP6873696B2 (ja) 2013-03-15 2014-03-07 強化されたプロセスの均一性および低減された基板の滑りのためのサセプタ

Country Status (6)

Country Link
US (1) US9799548B2 (enExample)
JP (1) JP6873696B2 (enExample)
KR (1) KR102335921B1 (enExample)
CN (2) CN105009272A (enExample)
TW (1) TWI631660B (enExample)
WO (1) WO2014149957A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102361710B1 (ko) 2014-05-21 2022-02-10 어플라이드 머티어리얼스, 인코포레이티드 열 처리 서셉터
GB2534146B (en) * 2015-01-14 2017-06-28 Sky Tech Inc Wafer carrier tray
JP2018026503A (ja) * 2016-08-12 2018-02-15 株式会社Sumco サセプタ、エピタキシャル成長装置、及びエピタキシャルウェーハの製造方法
CN109661715B (zh) * 2016-09-05 2023-07-28 信越半导体株式会社 气相生长装置及外延晶片的制造方法
KR102540125B1 (ko) 2017-08-30 2023-06-05 주성엔지니어링(주) 기판안치수단 및 기판처리장치
US10755955B2 (en) * 2018-02-12 2020-08-25 Applied Materials, Inc. Substrate transfer mechanism to reduce back-side substrate contact
KR102640172B1 (ko) 2019-07-03 2024-02-23 삼성전자주식회사 기판 처리 장치 및 이의 구동 방법
CN115704108A (zh) * 2021-08-09 2023-02-17 广州集成电路技术研究院有限公司 预热环和基板处理装置
JP7774416B2 (ja) * 2021-10-20 2025-11-21 東京エレクトロン株式会社 基板載置方法および基板載置機構

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3911518B2 (ja) * 1995-03-31 2007-05-09 株式会社Ｓｕｍｃｏ 気相成長装置用サセプターと気相成長方法
JPH08335583A (ja) * 1995-06-08 1996-12-17 Murata Mfg Co Ltd ウエハ加熱装置
JPH0952792A (ja) 1995-08-11 1997-02-25 Hitachi Cable Ltd 半導体成長装置における基板ホルダ
US6395363B1 (en) * 1996-11-05 2002-05-28 Applied Materials, Inc. Sloped substrate support
US6026589A (en) * 1998-02-02 2000-02-22 Silicon Valley Group, Thermal Systems Llc Wafer carrier and semiconductor apparatus for processing a semiconductor substrate
JP3076791B2 (ja) 1998-10-19 2000-08-14 アプライド マテリアルズ インコーポレイテッド 半導体製造装置
EP1006562A3 (en) * 1998-12-01 2005-01-19 Greene, Tweed Of Delaware, Inc. Two-piece clamp ring for holding semiconductor wafer or other workpiece
JP2002134484A (ja) * 2000-10-19 2002-05-10 Asm Japan Kk 半導体基板保持装置
JP2002231713A (ja) * 2001-01-30 2002-08-16 Ibiden Co Ltd 半導体製造装置用治具
JP2002313874A (ja) * 2001-04-17 2002-10-25 Dainippon Screen Mfg Co Ltd 基板支持部材、ならびにそれを用いた基板保持機構、基板搬送装置、基板搬送方法、基板処理装置および基板処理方法
JP2002057210A (ja) * 2001-06-08 2002-02-22 Applied Materials Inc ウェハ支持装置及び半導体製造装置
US20030178145A1 (en) * 2002-03-25 2003-09-25 Applied Materials, Inc. Closed hole edge lift pin and susceptor for wafer process chambers
JP3972710B2 (ja) 2002-03-28 2007-09-05 信越半導体株式会社 サセプタ、エピタキシャルウェーハの製造装置および製造方法
US6800833B2 (en) * 2002-03-29 2004-10-05 Mariusch Gregor Electromagnetically levitated substrate support
US6695921B2 (en) 2002-06-13 2004-02-24 Taiwan Semiconductor Manufacturing Co., Ltd. Hoop support for semiconductor wafer
US7531039B2 (en) * 2002-09-25 2009-05-12 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and substrate processing system
JP2004119859A (ja) * 2002-09-27 2004-04-15 Shin Etsu Handotai Co Ltd サセプタ、半導体ウェーハの製造装置及び製造方法
JP4019998B2 (ja) * 2003-04-14 2007-12-12 信越半導体株式会社 サセプタ及び気相成長装置
JP4599816B2 (ja) * 2003-08-01 2010-12-15 信越半導体株式会社 シリコンエピタキシャルウェーハの製造方法
US20050217585A1 (en) * 2004-04-01 2005-10-06 Blomiley Eric R Substrate susceptor for receiving a substrate to be deposited upon
JP2006005095A (ja) * 2004-06-16 2006-01-05 Ngk Insulators Ltd 基板加熱装置とその製造方法
TWI327339B (en) * 2005-07-29 2010-07-11 Nuflare Technology Inc Vapor phase growing apparatus and vapor phase growing method
US20070089836A1 (en) * 2005-10-24 2007-04-26 Applied Materials, Inc. Semiconductor process chamber
AU2007307935A1 (en) * 2006-10-05 2008-04-17 Michael Bucci System and method for supporting an object during application of surface coating
JP5032828B2 (ja) * 2006-11-09 2012-09-26 株式会社ニューフレアテクノロジー 気相成長装置
US20080314319A1 (en) * 2007-06-19 2008-12-25 Memc Electronic Materials, Inc. Susceptor for improving throughput and reducing wafer damage
JP5537766B2 (ja) * 2007-07-04 2014-07-02 株式会社ニューフレアテクノロジー 気相成長装置及び気相成長方法
JP5444607B2 (ja) * 2007-10-31 2014-03-19 株式会社Ｓｕｍｃｏ エピタキシャル膜形成装置用のサセプタ、エピタキシャル膜形成装置、エピタキシャルウェーハの製造方法
US20090165721A1 (en) * 2007-12-27 2009-07-02 Memc Electronic Materials, Inc. Susceptor with Support Bosses
DE112008003535T5 (de) * 2007-12-28 2010-12-09 Shin-Etsu Handotai Co., Ltd. Suszeptor für das epitaxiale Wachstum
JP5156446B2 (ja) * 2008-03-21 2013-03-06 株式会社Ｓｕｍｃｏ 気相成長装置用サセプタ
US8409355B2 (en) * 2008-04-24 2013-04-02 Applied Materials, Inc. Low profile process kit
JP5359698B2 (ja) * 2009-08-31 2013-12-04 豊田合成株式会社 化合物半導体の製造装置、化合物半導体の製造方法及び化合物半導体
JP2011146506A (ja) * 2010-01-14 2011-07-28 Sumco Corp 気相成長装置用サセプタ及び気相成長装置
JP2011146504A (ja) * 2010-01-14 2011-07-28 Sumco Corp 気相成長装置用サセプタ及び気相成長装置
US9650726B2 (en) * 2010-02-26 2017-05-16 Applied Materials, Inc. Methods and apparatus for deposition processes
US9517539B2 (en) * 2014-08-28 2016-12-13 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer susceptor with improved thermal characteristics
US10269614B2 (en) * 2014-11-12 2019-04-23 Applied Materials, Inc. Susceptor design to reduce edge thermal peak
US10184193B2 (en) * 2015-05-18 2019-01-22 Globalwafers Co., Ltd. Epitaxy reactor and susceptor system for improved epitaxial wafer flatness

Similar Documents

Publication Publication Date Title
JP2016518699A5 (enExample)
JP2017516668A5 (enExample)
JP2013534725A5 (enExample)
JP2007250967A5 (enExample)
JP2016530705A5 (enExample)
WO2018112159A3 (en) Rotatable electrostatic chuck having backside gas supply
CN104061370A (zh) 可调节电缆支架
SG10201808377WA (en) Wafer Support System, Wafer Support Device, System Comprising A Wafer And A Wafer Support Device As Well As Mask Aligner
JP2016518699A (ja) 強化されたプロセスの均一性および低減された基板の滑りのためのサセプタ
USD785578S1 (en) Substrate supporting arm for semiconductor manufacturing apparatus
CN103591555B (zh) 扩散板支撑架、直下式背光模组和显示装置
TWI650829B (zh) 晶圓承載盤及其支撐結構
JP6201400B2 (ja) 半導体ウエハプロセス用吸着プレート
SG10201707557QA (en) Electrostatic chuck including clamp electrode assembly forming portion of faraday cage for rf delivery and associated methods
JP2018530451A5 (enExample)
JP2015220392A5 (enExample)
TW200739793A (en) Vertical boat and vertical heat processing apparatus for semiconductor process
JP2014011953A5 (enExample)
WO2016100829A3 (en) Apparatuses and methods for controlling equivalent series resistance of a capacitor
JP2016161749A5 (enExample)
TWI575650B (zh) 基板支持裝置
JP2016078220A5 (enExample)
JP2014188668A5 (ja) 基板の製造方法及びキャリア
JP2017522726A5 (enExample)
CN203863300U (zh) 背光模组对合平台