WO2015096254A1 - 石英卡夹装置及其制作方法与带该石英卡夹装置的oled高温炉 - Google Patents

石英卡夹装置及其制作方法与带该石英卡夹装置的oled高温炉 Download PDF

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Publication number
WO2015096254A1
WO2015096254A1 PCT/CN2014/071142 CN2014071142W WO2015096254A1 WO 2015096254 A1 WO2015096254 A1 WO 2015096254A1 CN 2014071142 W CN2014071142 W CN 2014071142W WO 2015096254 A1 WO2015096254 A1 WO 2015096254A1
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Prior art keywords
quartz
bottom plate
base
column
diameter
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PCT/CN2014/071142
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English (en)
French (fr)
Inventor
余威
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深圳市华星光电技术有限公司
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Priority to US14/356,216 priority Critical patent/US9803796B2/en
Publication of WO2015096254A1 publication Critical patent/WO2015096254A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
    • F16M13/00—Other supports for positioning apparatus or articles; Means for steadying hand-held apparatus or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67306—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H05B3/42—Heating elements having the shape of rods or tubes non-flexible
    • H05B3/44—Heating elements having the shape of rods or tubes non-flexible heating conductor arranged within rods or tubes of insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making

Definitions

  • the present invention relates to the field of flat display, and in particular to a quartz clip device and
  • the flat display device has many advantages such as thin body, power saving, no radiation, and has been widely used.
  • the existing flat display devices mainly include a liquid crystal display (LCD) and an organic light emitting display (OLED), and the organic light emitting device has self-luminous, high brightness, wide viewing angle, high contrast, and flexibility. Low-energy and other characteristics have attracted wide attention, and as a new generation of display methods, it has gradually replaced traditional liquid crystal display devices, and is widely used in electronic products such as mobile phone screens, computer monitors, and full-color TVs.
  • the traditional LCD display method is different, no backlight is needed, and a very thin organic material coating and glass substrate are used. When an electric current passes, these organic materials will emit light.
  • OLED devices have very high requirements on packaging. In the OLED packaging process, a good packaging effect on the lifetime of the OLED device Vital role
  • the UV glue commonly used in liquid crystal display devices is not resistant to water and oxygen penetration, so OLED packages generally use glass glue.
  • Glass glue is mainly composed of an organic solvent and glass powder.
  • the glass powder is mixed into a coatable paste with an organic solvent, and is placed on the OLED cover and then placed. There is an OLED device between the glass powder Finally, the glass glue is solidified to complete the encapsulation of the two sheets of glass.
  • the OLED high-temperature furnace used for baking glass glue is usually high in temperature, requires 500 ⁇ 6001, and has a long processing time. Therefore, it is necessary to put a plurality of package substrates into the OLED high-temperature furnace at the same time to save the processing time of each substrate, thus,
  • the method of fabricating a quartz clip device in an OLED high-temperature furnace can be used to meet the demand for simultaneous high-temperature heating of a plurality of substrates.
  • the existing quartz card holder device includes a plurality of quartz card plates 100, a quartz bottom plate 200, and a plurality of quartz columns 400.
  • Quartz card board 100 for placement The plate is used to heat the plurality of substrates at the same time in the high temperature furnace of the OLED.
  • the function of the quartz bottom plate 200 is to assist in fixing the quartz column 400, to prevent the quartz column 400 from being excessively inclined, and to block the heat flow between the process of the upper portion of the quartz substrate 200 and the process of the lower portion thereof, thereby ensuring the temperature between the substrates on the quartz card plate 100. Uniformity.
  • the quartz column 400 is slightly inclined, and the quartz base plate 200 has a partial position of 500. Contact, causing a small crack 600 in the bottom plate of the quartz bottom plate 200, repeatedly heating and cooling in the production process to increase the crack 600, thereby causing the quartz bottom plate 200 to break.
  • the object of the present invention is to provide a quartz clip device, which has a simple structure, and expands the diameter of the circular hole of the quartz bottom plate according to the triangular formula, thereby avoiding cracking of the quartz bottom plate due to contact cracking, avoiding equipment damage and affecting production, and simultaneously making quartz
  • the diameter of the bottom hole of the bottom plate is not too large to avoid temperature unevenness in the upper portion of the quartz bottom plate.
  • Another object of the present invention is to provide a method for fabricating a quartz clip device.
  • the method is simple, and the diameter of the circular hole of the quartz bottom plate is enlarged according to a triangular formula, thereby avoiding cracking of the quartz bottom plate due to contact cracking, thereby avoiding equipment damage.
  • the diameter of the circular hole of the quartz bottom plate is not too large to avoid the temperature unevenness in the upper part of the quartz bottom plate.
  • Another object of the present invention is to provide an OLED high-temperature furnace, which has a single structure, and expands the diameter of the circular hole of the quartz base plate according to the triangular formula, thereby avoiding the crack of the quartz bottom plate of the quartz clip device in the OLED high-temperature furnace due to the touch.
  • the rupture, to avoid equipment damage affects the production, at the same time, the diameter of the circular hole of the quartz bottom plate is not too large to avoid the temperature unevenness of the upper part of the quartz bottom plate.
  • the present invention provides a quartz clip device, comprising: a base, a plurality of quartz columns fixedly mounted on the base, a quartz bottom plate located above the base, and a clip above the quartz base plate and clamped on the quartz column. a plurality of quartz card plates; the corresponding quartz column on the quartz bottom plate is provided with a plurality of circular holes, the diameter of the circular holes is larger than the diameter of the quartz column, and the quartz column passes through the circular holes and is disposed below the circular hole The fastening member is further supported to support the quartz base plate on the quartz column.
  • the corresponding quartz column on the base is provided with a plurality of fixing portions, and the quartz column is fixedly mounted on the fixing portion.
  • the quartz bottom plate includes a lower bottom plate and an upper bottom plate, wherein the lower bottom plate is integrally formed with the upper bottom plate, and the circular hole is a through hole penetrating through the upper and lower bottom plates; the lower bottom plate abuts against the fastening member on.
  • the diameter of the circular hole is: D d 2h*arctan( (x ) , where d is the straightness of the quartz column
  • the diameter h is the height of the upper bottom plate Ji of the quartz bottom plate and the height of the base, and ⁇ is the maximum inclination angle of the quartz column after being fixed on the fixed portion.
  • the invention also provides a method for manufacturing a quartz clip device, comprising:
  • Step 1 Provide a base
  • Step 2 providing a plurality of quartz columns, and mounting the plurality of quartz columns on the base;
  • Step 3 providing a quartz bottom plate, and setting a plurality of circular holes on the quartz bottom plate relative to the quartz column, the circular holes The diameter is larger than the diameter of the quartz column;
  • Step 4 mounting a fastening member on a predetermined height of each of the quartz columns from the base, inserting the quartz bottom plate into the quartz column through a circular hole and abutting against the fastening member, and then the quartz a bottom plate supported on the quartz column;
  • Step 5 A plurality of quartz card plates are provided, and the plurality of quartz card plates are respectively clamped on different heights of the quartz column to complete the fabrication of the quartz card holder device.
  • the quartz column is provided with a plurality of fixing portions on the base, and the quartz column is fixedly mounted on the fixing portion;
  • the quartz bottom plate includes a lower bottom plate and an upper bottom plate, and the lower bottom plate and the upper bottom plate are integrally formed,
  • the round hole is a through hole that runs through the upper and lower bottom plates.
  • the maximum tilt angle is:
  • the invention also provides an OLED high-temperature furnace, comprising: a furnace body and a quartz clip device disposed in the furnace body, the quartz clip device comprising a base, a plurality of quartz columns fixedly mounted on the base, and the base.
  • the upper quartz, the plate and the plurality of quartz card plates which are sandwiched on the quartz column by the JL card above the quartz substrate;
  • the quartz column has a plurality of circular holes corresponding to the quartz column, the diameter of the circular hole is larger than the diameter The diameter of the quartz column, the quartz column passes through the circular hole and is provided with a fastening member below the circular hole, thereby supporting the quartz bottom plate on the quartz column.
  • the quartz column is provided with a plurality of fixing portions on the base, and the quartz column is fixedly mounted on the fixing portion;
  • the quartz bottom plate includes a lower bottom plate and an upper bottom plate, and the lower bottom plate and the upper bottom plate are integrally formed,
  • the circular hole is a through hole penetrating the upper and lower bottom plates; the lower bottom plate is abutted against the fastening member.
  • the diameter of the circular hole is: D d 2h*arctan( (x ) , where d is the diameter of the quartz column, h is the height of the upper base plate of the quartz bottom plate from the base, and ⁇ is the quartz column fixed on the fixed portion. Maximum tilt angle.
  • the quartz clip device of the present invention, the manufacturing method thereof and the OLED high-temperature furnace with the quartz clip device expand the diameter of the circular hole of the quartz bottom plate according to the triangular formula, and ensure that the quartz column does not overlap with the quartz bottom plate when it is slightly inclined Touch occurs to prevent the quartz base plate from cracking due to touch
  • the grain avoids the cracking of the quartz bottom plate of the quartz clip device in the OLED high-temperature furnace, avoiding equipment damage affecting the production, and at the same time making the diameter of the circular hole of the quartz bottom plate not excessively large and avoiding temperature unevenness in the upper part of the quartz bottom plate.
  • Figure i is a schematic structural view of a conventional quartz card holder device
  • FIG 2 is a cross-sectional i «J FIG quartz base plate
  • Figure 3 is a plan view of the quartz bottom plate of Figure i;
  • FIG. 4 is a schematic structural view of a quartz clip device of the present invention.
  • Figure 5 is a cross-sectional view of a quartz bottom plate in the quartz clip device of the present invention.
  • Figure 6 is a plan view of the upper bottom plate of the quartz bottom plate in the quartz clip device of the present invention.
  • Figure 7 is a schematic view showing the positional relationship between the base, the quartz column and the quartz base plate in the quartz card holder device of the present invention
  • Fig. 8 is a schematic view showing the arrangement of the diameter of the circular hole of the quartz bottom plate in the quartz card holder device of the present invention; Flow chart of the manufacturing method of the clip device;
  • FIG. 10 is a schematic view showing the structure of an OLED high temperature furnace with a quartz clip device according to the present invention. detailed description
  • the present invention provides a quartz clip device, comprising: a base 20, a plurality of quartz columns 30 fixedly mounted on the base 20, a quartz bottom plate 40 above the base 20, and a quartz bottom plate 40. A plurality of layers of quartz cards 50 are clamped onto the quartz column 30.
  • the corresponding quartz column 30 on the base 20 is provided with a plurality of fixing portions 22, and the quartz column 30 is fixedly mounted on the fixing portion 22.
  • the base 20 is made of metal. In this embodiment, the base 20 is made of iron.
  • the fixing portion 22 and the base 20 may be integrally formed, or may be disposed on the base 20 by welding. In the embodiment, the fixing portion 22 and the base 20 are integrally formed.
  • the quartz bottom plate 40 includes a lower bottom plate 44 and an upper bottom plate 46, and the lower bottom plate 44 is integrally formed with the upper bottom plate 46.
  • the corresponding quartz column 30 on the quartz bottom plate 40 is provided with a plurality of circular holes 42 which are through holes penetrating through the upper and lower bottom plates 46, 44, and the lower bottom plate 44 and the upper bottom plate 46 are formed by the through holes.
  • the cylinders are connected to form a quartz base plate 40.
  • the function of the quartz bottom plate 40 is to assist in fixing the quartz column 30, to prevent the quartz column 30 from being excessively inclined, and to block the heat flow between the upper portion of the quartz bottom plate 40 and the lower process thereof, thereby ensuring the pieces on the quartz card plate 50.
  • the diameter of the circular hole 42 is slightly larger than the diameter of the quartz column 30.
  • the quartz column 30 passes through the circular hole 42 and is provided with a fastening member 60 below the circular hole 42.
  • the lower bottom plate 44 abuts against the On the fastening member 60, the quartz base plate 40 is further supported on the stone pod 30.
  • the quartz card plate 50 is provided with an engaging portion with respect to the quartz column 30, and the quartz card plate 50 is clamped to the quartz column 30 through the engaging portion.
  • the quartz card board 50 is used for placing a substrate coated with glass glue to be baked, and different quartz card plates 50 are respectively clamped on different heights of the quartz column 30, thereby realizing simultaneous heating of multiple pieces in the OLED high-temperature furnace. .Substraterov
  • D-d+2x-d+2h*arctan( ⁇ ) is set, D is the diameter of the circular hole 42, and d is the diameter of the quartz column 30, therefore, the difference between the diameter of the circular hole 42 and the diameter of the quartz column 30 is according to the formula Ad -2x-2h*arctan( ⁇ ) is set, where h is the height of the upper bottom plate 46 of the quartz bottom plate 40 from the base 20, and ⁇ is the maximum inclination angle of the quartz column 30 after being fixed on the fixed portion 22, thereby being able to be based on a triangular formula Calculate the maximum possible offset distance ⁇ of the quartz column 30 when moving, and then increase the diameter D of the circular hole 42 by 2x on the basis of the diameter d of the quartz column 30, so as to ensure that the quartz column 30 does not tilt with the quartz base plate 40 when it is slightly inclined.
  • the touch is generated to avoid cracking due to the touch, and at the same time, the diameter of the circular hole 42 of the quartz base plate 40 is not excessively large, resulting
  • the present invention provides a method for fabricating a quartz clip device, including:
  • Step 1 Provide a base 20.
  • the base 20 is provided with a plurality of fixing portions 22.
  • the base 20 is made of metal.
  • the base 20 is made of iron.
  • the fixing portion 22 and the base 20 may be integrally formed, or may be disposed on the base 20 by welding.
  • the fixing portion 22 is integrally formed with the base 20.
  • Step 2 A plurality of quartz columns 30 are provided, and the plurality of quartz columns 30 are mounted on the base 20.
  • the plurality of fixing portions 22 are disposed corresponding to the quartz column 30, and the quartz column 30 is fixedly mounted on The fixing portion 22 is on the same.
  • Step 3 A quartz substrate 40 is provided, and a plurality of circular holes 42 are formed on the quartz substrate 40 with respect to the quartz column 30, and the diameter of the circular holes 42 is slightly larger than the diameter of the quartz column 30.
  • the quartz substrate 40 includes a lower substrate 44 and an upper substrate 46, and the lower substrate 44 is formed integrally with the upper substrate 46.
  • the circular hole 42 is a through hole penetrating through the upper and lower bottom plates 46, 44, and the lower bottom plate 44 and the upper bottom plate 46 are connected by a cylinder forming the through hole, thereby forming a quartz bottom plate 40.
  • the function of the quartz bottom plate 40 is to assist in fixing the quartz column 30 to prevent the quartz column 30 from being excessively inclined, and to block the flow of heat between the upper portion of the quartz substrate 40 and the lower portion thereof.
  • Step 4 mounting a fastening member 60 at a predetermined height from the base 20 of each of the stone pods 30, inserting the quartz bottom plate 40 into the quartz column 30 through the circular hole 42 and leaning against the quartz column 30
  • the solid member 60 further supports the quartz substrate 40 on the quartz column 30.
  • the fastening member 60 is disposed below the circular hole 42
  • Step 5 A plurality of quartz card plates 50 are provided, and the plurality of quartz card plates 50 are respectively clamped on different heights of the quartz column 30 to complete the fabrication of the quartz card holder device.
  • the quartz card plate 50 is provided with an engaging portion with respect to the quartz column 30, and the quartz card plate 50 is clamped to the quartz column 30 through the engaging portion.
  • the quartz card plate 50 is used for placing a substrate coated with a glass paste to be baked, thereby further heating a plurality of substrates at a high temperature in an OLED high temperature furnace.
  • the inclination angle thereby calculating the maximum possible offset distance X of the quartz column 30 when moving, according to the triangular formula, and increasing the diameter D of the circular hole 42 by 2x on the basis of the diameter d of the quartz column 30, thus ensuring the quartz column 30 When it is slightly inclined, it does not touch the quartz bottom plate 40, and cracks are prevented from being touched. At the same time, the diameter of the circular hole 42 of the quartz bottom plate 40 is not excessively large, and the temperature of the upper portion of the quartz bottom plate 40 is uneven.
  • the present invention provides an OLED high temperature furnace, comprising: a furnace body 10 and a quartz chuck device 12 disposed in the furnace body 10, the quartz chuck device 12 including A base 20, a plurality of quartz columns 30 fixedly mounted on the base 20, a quartz bottom plate 40 above the base 20, and a plurality of quartz card plates 50 positioned above the quartz base plate 40 and clamped on the quartz column 30.
  • a plurality of fixing portions 22 are disposed on the corresponding quartz column 30 of the base 20, and the quartz column 30 is fixedly mounted on the fixing portion 22.
  • the base 20 is made of metal.
  • the base 20 is made of iron.
  • the fixing portion 22 and the base 20 may be integrally formed, or may be disposed on the base 20 by welding. In the embodiment, the fixing portion 22 and the base 20 are integrally formed.
  • the quartz substrate 40 includes a lower substrate 44 and an upper substrate 46, and the lower substrate 44 is formed integrally with the upper substrate 46.
  • the corresponding quartz column 30 on the quartz bottom plate 40 is provided with a plurality of circular holes 42 which are through holes penetrating through the upper and lower bottom plates 46, 44, and the lower bottom plate 44 and the upper bottom plate 46 are formed by the through holes.
  • the cylinders are connected to form a quartz base plate 40.
  • the function of the quartz bottom plate 40 is to assist in fixing the quartz column 30, to prevent the quartz column 30 from being excessively inclined, and to block the heat flow between the upper portion of the quartz bottom plate 40 and the lower process thereof, thereby ensuring that each of the quartz card plates 50 is The uniformity of temperature between the substrates.
  • the diameter of the circular hole 42 is slightly larger than the diameter of the quartz column 30.
  • the stone pod 30 passes through the circular hole 42 and is provided with a fastening member 60 below the circular hole 42.
  • the lower bottom plate 44 abuts against The fastening member 60 further supports the quartz substrate 40 on the quartz column 30.
  • the quartz card plate 50 is provided with an engaging portion with respect to the quartz column 30, and the quartz card plate 50 is clamped to the quartz column 30 through the engaging portion.
  • the quartz card board 50 is used for placing a substrate coated with a glass glue to be baked, and different quartz card plates 50 are respectively clamped on different heights of the quartz column 30, thereby realizing simultaneous heating of a plurality of substrates in the OLED high-temperature furnace at a high temperature. .
  • the tilt angle thereby calculating the maximum possible offset distance X of the quartz column 30 when moving according to the trigonometric formula, and further increasing the diameter D of the circular hole by 2x based on the diameter d of the quartz column 30, thus ensuring that the quartz column 30 is slightly When it is tilted, it does not touch the quartz bottom plate 40, and cracks are prevented from being touched.
  • the diameter of the circular hole 42 of the quartz bottom plate 40 is not excessively large, and the temperature of the upper portion of the quartz bottom plate 40 is uneven.
  • the quartz clip device of the present invention and the manufacturing method thereof and the OLED high-temperature furnace with the quartz clip device expand the diameter of the circular hole of the quartz bottom plate according to the triangular formula, and ensure that the quartz column does not occur with the quartz bottom plate when it is slightly tilted. Touch, avoid cracks in the quartz base plate due to touch, and avoid cracking of the quartz bottom plate of the quartz clip device in the OLED high temperature furnace, avoiding equipment damage affecting production, and making the diameter of the circular hole of the quartz bottom plate not too large and avoiding the upper part of the quartz bottom plate The temperature in the process section is not uniform.

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Abstract

一种石英卡夹装置及其制作方法与带该石英卡夹装置的OLED高温炉。该石英卡夹装置包括：一底座（20）、固定安装于底座（20）上的数根石英柱（30）、位于底座（20）上方的石英底板（40）及位于石英底板（40）上方且卡夹于石英柱（30）上的数层石英卡板（50）；所述石英底板（40）上对应石英柱（30）设有数个圆孔（42），该圆孔（42）的直径大于石英柱（30）的直径，所述石英柱（30）穿过圆孔（42）并在圆孔（42）下方设有紧固部件（60），进而使石英底板（40）支撑于所述石英柱（30）上，通过扩大石英底板圆孔的直径，保证石英柱轻微倾斜时不会与石英底板发生触碰，避免石英底板因触碰产生裂纹，影响生产。

Description

本发明涉及平面显示领域， 尤其涉及一种石英卡夹装置及其
该石英卡夹装置的 OLED高温炉。 背景
平面显示装置具有机身薄、 省电、 无辐射等众多优点， 得到了广泛的 应用。 现有的平面显示装置主要包括液晶显示装置 （LCD, Liquid Crystal Display ) 及有机发光显示装置 ( OLED， Organic Light Emitting 有机发光显示装置具备自发光、 高亮度、 宽视角、 高对比度、 可挠 曲、 低能耗等特性， 因此受到广泛的关注， 并作为新一代的显示方式， 已 开始逐渐取代传统液晶显示装置， 被广泛应用于手机屏幕、 电脑显示器、 全彩电视等电子产品上。 OLED 显示技术与传统的 LCD 显示方式不同， 无需背光灯， 采用非常薄的有机材料涂层和玻璃基板， 当有电流通过时， 这些有机材料就会发光。 但是由于有机材料对大气中的水汽和氧气很敏 感， 容易因水氧发生老化变性， 亮度和寿命会出现明显衰减， 因此作为基 于有机材料的显示设备， OLED器件对封装的要求非常高， 在 OLED封装 制程中， 好的封装效果对 OLED器件的寿命起着至关重要的作用。
在液晶显示装置中常用的 UV胶抗水氧穿透能力不够， 所以 OLED封 装一般选择使用玻璃胶。 玻璃胶主要由有机溶剂和玻璃粉组成。 在 OLED 封装时， 用有机溶剂把玻璃粉混成可涂布的膏状， ^布在 OLED封 盖板上， 再放入
Figure imgf000003_0001
玻璃粉之间发生 作有 OLED器
Figure imgf000003_0002
最后使玻璃胶 凝固即完成两片玻璃的封装。
用于玻璃胶烘烤的 OLED高温炉通常温度很高， 需 500~6001， 制程 时间长， 所以需将多片封装基板同时放入 OLED高温炉烘烤以节省每片基 板的制程时间， 因而， 可釆用在 OLED高温炉中制作石英卡夹装置的方式 来满足多片基板同时高温加热的需求。
请参阅图 , 为现有的石英卡夹装置， 该石英卡夹装置包括数层石英 卡板 100、 石英底板 200以及数根石英柱 400。 石英卡板 100用于放置基 板， 以实现在 OLED高温炉内同时高温加热多片基板。 石英底板 200的作 用是辅助固定石英柱 400， 避免石英柱 400倾斜过大， 同时阻隔石英底板 200上部的制程与其下部的制程之间的热量流动， 保证石英卡板 100上各 片基板间温度的均一性。
但将整体组装完成的石英卡夹装置推入 OLED高温炉中时， 易发生轻 微晃动， 如图 2及图 3所示， 石英柱 400出现轻微倾斜， 与石英底板 200 发生部分点位 500的强力接触， 使石英底板 200底板产生小的裂紋 600， 在生产过程中重复升温降温使裂紋 600 增大， 进而导致石英底板 200 破
发明内容
本发明的目的在于提供一种石英卡夹装置， 其结构简单， 根据三角公 式将石英底板圓孔的直径扩大， 避免了石英底板因触碰产生裂纹而破裂， 避免设备损坏影响生产， 同时使石英底板圓孔的直径不至于过大进而避免 石英底板上部制程部的温度不均。
本发明的另一目的在于提供一种石英卡夹装置的制作方法， 该方法简 单， 根据三角公式将石英底板圓孔的直径扩大， 避免了石英底板因触碰产 生裂纹而破裂， 避免设备损坏影响生产， 同时使石英底板圆孔的直径不至 于过大进而避免石英底板上部制程部的温度不均。
本发明的另一目的在于提供一种 OLED高温炉， 其结构筒单， 根据三 角公式将石英底板圓孔的直径扩大， 避免了 OLED高温炉内的石英卡夹装 置的石英底板因触碰产生裂纹而破裂， 避免设备损坏影响生产， 同时使石 英底板圓孔的直径不至于过大进而避免石英底板上部制程部的温度不均。
为实现上述目的， 本发明提供一种石英卡夹装置， 包括： 一底座、 固 定安装于底座上的数根石英柱、 位于底座上方的石英底板及位于石英底板 上方且卡夹于石英柱上的数层石英卡板； 所述石英底板上对应石英柱设有 数个圓孔， 该圆孔的直径大于所述石英柱的直径， 所述石英柱穿过所述圓 孔并在圓孔下方设有紧固部件， 进而使石英底板支撑于所述石英柱上。
所述底座上对应石英柱设有数个固定部， 所述石英柱固定安装于该固 定部上。
所述石英底板包括下底板和上底板， 所述下底板与上底板一体成型制 成， 所述圓孔为贯穿于上、 下底板的通扎； 所述下底板抵靠于所述紧固部 件上。
所述圓孔直径公式为： D d 2h*arctan( (x ) , 其中， d 为石英柱的直 径， h为石英底板的上底板 Ji巨离底座的高度， α为石英柱固定于固定部上 后的最大倾斜角度。
本发明还提供一种石英卡夹装置的制作方法， 包括：
步骤 1 : 提供一底座；
步骤 2: 提供数个石英柱， 将所述数个石英柱安装于所述底座上； 步骤 3 : 提供石英底板， 并在石英底板上相对所述石英柱设置数个圓 孔， 所述圓孔的直径大于石英柱的直径；
步骤 4: 在每一所述石英柱离底座一预定高度上安装一紧固部件， 将 所述石英底板通过圆孔套入所述石英柱上并抵靠于紧固部件， 进而将所述 石英底板支撑于所述石英柱上；
步骤 5 : 提供数块石英卡板， 将所述数块石英卡板分别卡夹于所述石 英柱的不同高度上， 完成石英卡夹装置的制作。
所述底座上对应石英柱设有数个固定部， 所述石英柱固定安装于该固 定部上； 所述石英底板包括下底板和上底板， 所述下底板与上底板一体成 型制成， 所述圓孔为贯穿于上、 下底板的通扎。
所述圓孔直径公式为： D=d+2h*arctan( α ) , 其中， d 为石英柱的直 径， h为石英底板的上底板距离底座的高度， α为石英柱固定于固定部上 后的最大倾斜角度。
本发明还提供一种 OLED高温炉， 包括： 炉体及设于炉体内的石英卡 夹装置， 所述石英卡夹装置包括一底座、 固定安装于底座上的数根石英 柱、 位于.底座.上方的石英 , :板及'立于石英底板上方 JL卡夹于石英.柱上的数 层石英卡板； 所述石英底板上对应石英柱设有数个圓孔， 该圓孔的直径大 于所述石英柱的直径， 所述石英柱穿过所述圓孔并在圓孔下方设有紧固部 件， 进而使石英底板支撑于所述石英柱上。
所述底座上对应石英柱设有数个固定部， 所述石英柱固定安装于该固 定部上； 所述石英底板包括下底板和上底板， 所述下底板与上底板一体成 型制成， 所述圆孔为贯穿于上、 下底板的通孔； 所述下底板 靠于所述紧 固部件上。
所述圓孔直径公式为： D d 2h*arctan( (x ) , 其中， d 为石英柱的直 径， h为石英底板的上底板距离底座的高度， α为石英柱固定于固定部上 后的最大倾斜角度。
本发明的有益效果： 本发明石英卡夹装置及其制作方法与带该石英卡 夹装置的 OLED高温炉， 根据三角公式扩大石英底板圆孔的直径， 保证石 英柱轻微倾斜时不会与石英底板发生触碰， 避免石英底板因触碰产生裂 纹， 进而避免 OLED高温炉内石英卡夹装置的石英底板破裂， 避免设备损 坏影响生产， 同时使石英底板圓孔的直径不至于过大进而避免石英底板上 部制程部的温度不均。
为了能更进一步了解本发明的特征以及技术内容， 请参阅以下有关本 发明的详细说明与附图， 然而附图仅提供参考与说明用， 并非用来对本发 明加以限制。 附图说明
下面结合附图， 通过对本发明的具体实施方式详细描述， 将使本发明 的技术方案及其它有益效果显, 易见。
附图中，
图 i为现有的石英卡夹装置的结构示意图；
图 2为图 i中石英底板的剖«J图；
图 3为图 i中石英底板的俯视图；
图 4为本发明石英卡夹装置的结构示意图；
图 5为本发明石英卡夹装置中石英底板的剖视图；
图 6为本发明石英卡夹装置中石英底板的上底板的俯视图；
图 7为本发明石英卡夹装置中底座、 石英柱与石英底板的位置关系示 急图 - 图 8为本发明石英卡夹装置中石英底板圓孔直径的设置原理图； 图 9为本发明石英卡夹装置的制作方法流程图；
图 10为本发明带石英卡夹装置的 OLED高温炉的结构示意图。 具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果， 以下结合本发明 的优选实施例及其附图进行详细描述。
请参阅图 4 至图 ，, 本发明提供一种石英卡夹装置， 包括： 一底座 20、 固定安装于底座 20上的数根石英柱 30、 位于底座 20上方的石英底板 40及位于石英底板 40上方且卡夹于石英柱 30上的数层石英卡板 50。
所述.底座 20上对应石英柱 30设有数个固定部 22 , 所述石英柱 30固 定安装于该固定部 22上。
所述底座 20由金属制成， 本实施例中， 所述底座 20由铁制成。 所述 固定部 22与底座 20可以一体成型制成， 也可以通过焊接的方式设置于底 座 20上， 本实施例中， 所述固定部 22与底座 20—体成型制成。 所述石英底板 40包括下底板 44和上底板 46， 所述下底板 44与上底 板 46 —体成型制成。 所述石英底板 40 上对应石英柱 30设有数个圓孔 42, 该圆孔 42为贯穿于上、 下底板 46、 44的通孔， 所述下底板 44和上 底板 46通过形成该通孔的圆柱相连， 进而构成石英底板 40。
所述石英底板 40的作用是辅助固定所述石英柱 30， 避免石英柱 30倾 斜过大， 同时阻隔石英底板 40 上部制程与其下部制程之间的热量流动， 保证所述石英卡板 50上各片基板间温度的均一性。
所述圓孔 42的直径略大于所述石英柱 30的直径， 所述石英柱 30穿 过该圓孔 42并在圓孔 42下方设有紧固部件 60, 所述下底板 44抵靠于所 述紧固部件 60上， 进而使石英底板 40支撑于所述石荚柱 30上。
所述石英卡板 50上相对石英柱 30设有卡合部， 所述石英卡板 50通 过该卡合部卡夹于所述石英柱 30上。 所述石英卡板 50用于放置涂有待烘 烤玻璃胶的基板， 不同石英卡板 50分别卡夹于所述.石英柱 30的不同高度 上， 进而实现在 OLED高温炉内同时高温加热多片 .基板„
请参阅图 8 , 并结合参阅图 7， 所述圓孔 42 的直径根据公式
D-d+2x-d+2h*arctan( α )设置， D为圓孔 42的直径， d为石英柱 30的直 径， 因此， 圓孔 42 直径与石英柱 30 直径的差值 Ad 根据公式 Ad-2x-2h*arctan( α )设置， 其中 h为石英底板 40的上底板 46距离底座 20 的高度， α为石英柱 30固定于固定部 22上后的最大倾斜角度， 由此可以 根据三角公式计算得到石英柱 30在移动时最大可能的偏移距离 χ， 进而将 圓孔 42直径 D在石英柱 30直径 d的基础上增加 2x , 如此可保证石英柱 30轻微倾斜时不会与石英底板 40发生触碰， 避免因触碰产生裂紋， 同时 可使石英底板 40 圓孔 42的直径不至于过大 导致石英底板 40上部制程 部的温度不均。
请参阅图 9， 并结合参阔图 4 至图 8 , 本发明提供一种石英卡夹装置 的制作方法， 包括：
步骤 1 : 提供一底座 20。
所述底座 20上设有数个固定部 22。 所述底座 20由金属制成， 本实施 例中， 所述底座 20由铁制成。 所述固定部 22与底座 20可以一体成型制 成， 也可以通过焊接的方式设置于底座 20 上， 本实施例中， 所述固定部 22与底座 20—体成型制成。
步骤 2: 提供数个石英柱 30， 将所述数个石英柱 30安装于所述底座 20上。
所述数个固定部 22对应石英柱 30设置， 所述石英柱 30 固定安装于 该固定部 22上。
步骤 3 : 提供石英底板 40， 并在石英底板 40上相对所述石英柱 30设 置数个圆孔 42 , 所述圆孔 42的直径略大于石英柱 30的直径。
所述石英底板 40包括下底板 44和上底板 46， 所述下底板 44与上底 板 46 —体成型制成。 所述圆孔 42为贯穿于上、 下底板 46、 44的通孔， 所述下底板 44和上底板 46通过形成该通孔的圆柱相连， 进而构成石英底 板 40。
所述石英底板 40的作用是.辅助固定所述石英柱 30， 避免石英柱 30倾 斜过大， 同时阻隔石英底板 40上部制程与其下部制程之间的热量流动。
步骤 4: 在每一所述石荚柱 30 离底座 20一预定高度上安装一紧固部 件 60， 将所述石英底板 40通过圓孔 42套入所述石英柱 30上并 4氏靠于紧 固部件 60, 进而将所述石英底板 40支撑于所述石英柱 30上。
所述紧固部件 60设于所述圆孔 42下方„
步骤 5: 提供数块石英卡板 50， 将所述数块石英卡板 50分别卡夹于 所述石英柱 30的不同高度上， 完成石英卡夹装置的制作。
所述石英卡板 50上相对石英柱 30设有卡合部， 所述石英卡板 50通 过该卡合部卡夹于所述石英柱 30上。 所述石英卡板 50用于放置涂有待烘 烤玻璃胶的基板， 进而实现在 OLED高温炉内同时高温加热多片基板。
所述圓孔 42的直径根据公式 D==d+2x==d+2h*arctan( α )设置， D为圆孔 42的直径， d为石英柱 30的直径， 因此， 圆孔 42直径与石英柱 30直径 的差值 Ad根据公式 AcH2x=2ii*arctan( a )设置， 其中 h为石英底板 40的上 底板 46距离底座 20的高度， a为石英柱 30固定于固定部 22上后的最大 倾斜角度， 由此可以根据三角公式计算得到石英柱 30 在移动时最大可能 的偏移距离 X , 进而将圓孔 42直径 D在石英柱 30直径 d的基础上增加 2x, 如此可保证石英柱 30轻微倾斜时不会与石英底板 40发生触碰， 避免 因触碰产生裂纹， 同时可使石英底板 40圆孔 42的直径不至于过大而导致 石英底板 40上部制程部的温度不均。
请参阅图 10, 并结合参阅图 4至图 8， 本发明提供一种 OLED 高温 炉， 包括： 炉体 10及设于炉体 10内的石英卡夹装置 12， 所述石英卡夹装 置 12 包括一底座 20、 固定安装于底座 20上的数根石英柱 30、 位于底座 20上方的石英底板 40及位于石英底板 40上方且卡夹于石英柱 30上的数 层石英卡板 50。
所述底座 20上对应石英柱 30设有数个固定部 22， 所述石英柱 30固 定安装于该固定部 22上。 所述.底座 20由金属制成， 本实施例中， 所述底座 20由铁制成。 所述 固定部 22与底座 20可以一体成型制成， 也可以通过焊接的方式设置于底 座 20上， 本实施例中， 所述固定部 22与底座 20—体成型制成。
所述石英底板 40包括下底板 44和上底板 46， 所述下底板 44与上底 板 46 —体成型制成。 所述石英底板 40 上对应石英柱 30设有数个圆孔 42 , 该圓孔 42为贯穿于上、 下底板 46、 44的通孔， 所述下底板 44和上 底板 46通过形成该通孔的圓柱相连， 进而构成石英底板 40。
所述石英底板 40的作用是.辅助固定所述石英柱 30， 避免石英柱 30倾 斜过大, 同时阻隔石英底板 40上部制程与其下部制程之间的热量流动, 保证所述石英卡板 50上各片基板间温度的均一性。
所述圓孔 42的直径略大于所述石英柱 30的直径， 所述石荚柱 30穿 过该圓孔 42并在圓孔 42下方设有紧固部件 60, 所述下底板 44抵靠于所 述紧固部件 60上， 进而使石英底板 40支撑于所述.石英柱 30上。
所述石英卡板 50上相对石英柱 30设有卡合部， 所述石英卡板 50通 过该卡合部卡夹于所述石英柱 30上。 所述石英卡板 50用于放置涂有待烘 烤玻璃胶的基板， 不同石英卡板 50分别卡夹于所述石英柱 30的不同高度 上， 进而实现在 OLED高温炉内同时高温加热多片基板。
所述圓孔 42的直径根据公式 D=d+2x=d+2h*arctan( ot )设置， D为圆孔 42的直径， d为石英柱 30的直径， 因此， 圆孔 42直径与石英柱 30直径 的差值 Ad根据公式 Ad=2x=2h*arctan( )设置， 其中 h为石英底板 40的上 底板 46距离底座 20的高度， （X为石英柱 30固定于固定部 22上后的最大 倾斜角度， 由此可以根据三角公式计算得到石英柱 30 在移动时最大可能 的偏移距离 X , 进而将圓孔直径 D在石英柱 30直径 d的基础上增加 2x, 如此可保证石英柱 30轻微倾斜时不会与石英底板 40发生触碰， 避免因触 碰产生裂纹， 同时可使石英底板 40圆孔 42的直径不至于过大而导致石英 底板 40上部制程部的温度不均。
综上所述， 本发明石英卡夹装置及其制作方法与带该石英卡夹装置的 OLED 高温炉， 根据三角公式扩大石英底板圓孔的直径， 保证石英柱轻微 倾斜时不会与石英底板发生触碰， 避免石英底板因触碰产生裂紋， 进而避 免 OLED 高温炉内石英卡夹装置的石英底板破裂， 避免设备损坏影响生 产， 同时使石英底板圆孔的直径不至于过大进而避免石英底板上部制程部 的温度不均。
以上所述， 对于本领域的普通技术人员来说， 可以根据本发明的技术 方案和技术构思作出其他各种相应的改变和变形， 而所有这些改变和变形

Claims

权 利 要 求 一种石英卡夹装置， 包括： 一底座、 固定安装于底座上的数根石 英柱、 位于底座上方的石英, 反及^立于石英.底> 上方且.卡夹于石荚柱上的 数层石英卡板； 所述石英底板上对应石英柱设有数个圓孔， 该圓孔的直径 大于所述石英柱的直径， 所述石英柱穿过所述圓孔并在圆孔下方设有紧固 部件， 进而使石英底板支撑于所述石英柱上。
2、 如权利要求 1 所述的石英卡夹装置， 其中， 所述底座上对应石英 柱设有数个固定部， 所述石英柱固定安装于该固定部上。
3、 如权利要求 2 所述的石英卡夹装置， 其中， 所述石英底板包括下 底板和上底板， 所述下底板与上底板一体成型制成， 所述圓孔为贯穿于 上、 下底板的通孔； 所述下底板抵靠于所述紧固部件上。
4、 如权利要求 3 所述的石英卡夹装置， 其中， 所述圓孔直径公式 为: D==d+2h*arctan( a ), 其中, d为石英柱的直径， h为石英底板的上底 板距离底座的高度， a为石英柱固定于固定部上后的最大倾斜角度。
5、 一种石英卡夹装置的制作方法， 包括：
步骤 1 : 提供一底座；
步骤 2: 提供数个石英柱， 将所述数个石英柱安装于所述底座上； 步骤 3 : 提供石英底板， 并在石英底板上相对所述石英柱设置数个圆 孔， 所述圓孔的直径大于石英柱的直径；
步骤 4: 在每一所述石英柱离底座一预定高度上安装一紧固部件， 将 所述石英底板通过圓孔套入所述石英柱上并抵靠于紧固部件， 进而将所述 石英底板支撑于所述石英柱上；
步骤 5 : 提供数块石英卡板， 将所述数块石英卡板分别卡夹于所述石 英柱的不同高度上， 完成石英卡夹装置的制作。
6、 如权利要求 5 所述的石英卡夹装置的制作方法， 其中， 所述底座 上对应石英柱设有数个固定部， 所述石英柱固定安装于该固定部上； 所述 石英底板包括下底板和上底板， 所述下底板与上底板一体成型制成， 所述 圓孔为贯穿于上、 下底板的通孔。
7、 如权利要求 6 所述的石英卡夹装置的制作方法， 其中， 所述圆孔 直径公式为： D=d十 2h*arctan( α ), 其中， d为石英柱的直径， h为石英底 板的上底板距离底座的高度， α为石英柱固定于固定部上后的最大倾斜角 度。
8 , —种 OLED 高温炉， 包括： 炉体及设于炉体内的石英卡夹装置， 所述石英卡夹装置包括一底座、 固定安装于底座上的数根石英柱、 位于底 座上方的石英底板及位.于石英底板上方且卡夹于石英柱上的数层石英卡 板； 所述石英底板上对应石英柱设有数个圆孔， 该圓孔的直径大于所述石 英柱的直径， 所述石英柱穿过所述圓孔并在圓孔下方设有紧固部件， 进,¾ 使石英底板支撑于所述石英柱上。
9、 如权利要求 8所述的 OLED 高温炉， 其中， 所述底座上对应石英 柱设有数个固定部， 所述石英柱固定安装于该固定部上； 所述石英底板包 括下底板和上底板， 所述下底板与上底板一体成型制成， 所述圓孔为贯穿 于上、 下底板的通孔； 所述下底板抵靠于所述紧固部件上。
】0、 如权利要求 9 所述的 OLED 高温炉， 其中， 所述圓孔直径公式 为： D-d+2h*arctan( α ), 其中， d为石英柱的直径， h为石英底板的上底 板距离底座的高度， α为石英柱固定于固定部上后的最大倾斜角度。
PCT/CN2014/071142 2013-12-27 2014-01-22 石英卡夹装置及其制作方法与带该石英卡夹装置的oled高温炉 WO2015096254A1 (zh)

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