WO2016011690A1 - 用于oled高温炉的石英卡夹装置及石英卡夹底板 - Google Patents

用于oled高温炉的石英卡夹装置及石英卡夹底板 Download PDF

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Publication number
WO2016011690A1
WO2016011690A1 PCT/CN2014/084456 CN2014084456W WO2016011690A1 WO 2016011690 A1 WO2016011690 A1 WO 2016011690A1 CN 2014084456 W CN2014084456 W CN 2014084456W WO 2016011690 A1 WO2016011690 A1 WO 2016011690A1
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Prior art keywords
quartz
bottom plate
clip
lower bottom
column
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PCT/CN2014/084456
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English (en)
French (fr)
Inventor
余威
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深圳市华星光电技术有限公司
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Publication of WO2016011690A1 publication Critical patent/WO2016011690A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Definitions

  • Quartz clip device and quartz clip plate for OLED high temperature furnace Quartz clip device and quartz clip plate for OLED high temperature furnace
  • the present invention relates to the field of flat display, and more particularly to a quartz clip device for a OLED high temperature furnace and a quartz clip bottom plate. Background technique
  • An OLED display is a new generation of display.
  • an organic film By making an organic film on a substrate, in which an organic film is wrapped between a cathode and an anode metal, and an electric voltage is applied to both electrodes, the organic film emits light.
  • Organic films are sensitive to moisture and oxygen, and are prone to aging due to water and oxygen, and their brightness and life are significantly attenuated. Therefore, it is necessary to package the OLED device.
  • the general packaging method is to apply UV glue on each periphery of the flat glass, and then adhere to the OLED substrate pair to be cured by UV lamp irradiation.
  • the ability of glass glue to block water oxygen is much stronger than that of UV glue.
  • the glass plastic packaging process is to apply glass glue on the package cover plate, and the glass glue is baked at a high temperature in an OLED high temperature furnace (temperature is about 550 ° C), and the baked glass cover is coated with UV glue, and then The OLED substrate is attached to the group, and the UV lamp is used to cure the UV glue (the function of the UV glue is to temporarily bond the two glasses and temporarily seal the effect), and the final package is to melt the dried glass glue with a laser and then condense. Bonding two glasses to achieve the package effect.
  • the OLED high-temperature furnace used for baking glass glue is usually very hot, requires 500 ⁇ 600 °C, and has a long processing time. Therefore, it is necessary to put a plurality of package substrates into the OLED high-temperature furnace at the same time to save the processing time of each substrate. Therefore, the method of fabricating a quartz clip device in an OLED high-temperature furnace can be employed to meet the demand for simultaneous high-temperature heating of a plurality of substrates.
  • the existing quartz clip device for an OLED high temperature furnace includes a plurality of quartz card plates (500), a quartz clip plate bottom plate (400), and a base (100) fixed to the base (100). ) A number of quartz columns (300).
  • the quartz card board (500) is used for placing the substrate to heat the multi-piece substrate at the same time in the high temperature furnace of the OLED, and the quartz clip bottom plate (400) is used to assist the fixed quartz column (300) to prevent the quartz column (300) from tilting. Large, at the same time blocking the heat flow between the upper part of the quartz chuck plate (400) and the process below it, ensuring the uniformity of temperature between the substrates on the quartz card (500).
  • the quartz chuck bottom plate (400) includes upper and lower bottom plates (410) and (420), and the quartz chuck bottom plate (400) is welded to the upper and lower bottom plates (410) at positions corresponding to the quartz columns (300). (420) Quartz empty column (700). Quartz column (300) with quartz clip bottom plate
  • the lower base plate (420) of (400) is fixed by a fixing member (600), and a supporting piece (610) is disposed between the fixing member (600) and the lower bottom plate (420) of the quartz chuck bottom plate (400) to disperse the quartz card. Gravity of the clamp base plate (400).
  • the upper bottom plate (410) of the quartz clip bottom plate (400) is supported by only a few quartz empty columns (700), so when the quartz clip is vibrated, the quartz column will be slightly tilted, which occurs with the quartz clip bottom plate (400). Touching, the weld between the upper bottom plate (410) of the quartz clip bottom plate (400) and the quartz empty column (700) is easily broken. Summary of the invention
  • the object of the present invention is to provide a quartz clip device for an OLED high-temperature furnace, in which a plurality of connecting columns are arranged as a support between the bottom plate and the bottom plate of the quartz clip, and the same is attached to the bottom plate of the quartz clip by the welding method.
  • the lower bottom plate is fixed, and the supporting force of the upper bottom plate is increased by the lower bottom plate to prevent the upper bottom plate from being broken when the quartz clip device is vibrated.
  • Another object of the present invention is to provide a quartz clip bottom plate for an OLED high-temperature furnace, wherein a plurality of connecting columns are arranged as a support between the upper and lower bottom plates, and the upper and lower sides of the quartz chuck plate are welded together by the welding method.
  • the bottom plate is fixed, and the supporting force of the upper bottom plate is increased by the lower bottom plate to prevent the upper bottom plate from being broken when the quartz clip device is vibrated.
  • the present invention provides a quartz clip device for an OLED high-temperature furnace, comprising a base, a plurality of quartz columns fixedly mounted on the base, a quartz clip bottom plate located above the base, and a plurality of layers located on the quartz card a quartz card plate above the bottom plate and clamped on the quartz column;
  • the quartz clip bottom plate comprises an upper bottom plate, a lower bottom plate and a quartz empty column connecting the upper and lower bottom plates, and corresponding to each quartz empty column, a through hole penetrating through the bottom plate of the quartz clip, the diameter of the through hole being larger than the quartz The diameter of the column;
  • a plurality of first connecting columns are disposed between the upper bottom plate and the lower bottom plate.
  • the corresponding quartz column on the base is provided with a plurality of fixing portions, and the quartz column is fixedly mounted on the fixing portion.
  • the first connecting columns are hooked on the edges of the upper and lower bottom plates, and are made of quartz.
  • a plurality of second connecting columns disposed at the center of the upper and lower bottom plates are further disposed between the upper bottom plate and the lower bottom plate, and the second connecting posts are made of quartz.
  • the diameters of the first and second connecting columns are lcm, and the quartz empty columns and the first and second connecting columns are fixed on the upper and lower bottom plates by welding.
  • the quartz column is provided with a fastener corresponding to the lower bottom plate, and a support piece is disposed between the lower bottom plate and the fastening member, so that the lower bottom plate is supported on the quartz column.
  • the invention also provides a quartz clip bottom plate for an OLED high temperature furnace, comprising an upper bottom plate, The lower bottom plate and the quartz empty column connecting the upper and lower bottom plates are provided with a through hole penetrating through the bottom plate of the quartz clip for each quartz empty column, and a plurality of first connecting columns are disposed between the upper bottom plate and the lower bottom plate.
  • the first connecting columns are hooked on the edges of the upper and lower bottom plates, and are made of quartz.
  • a plurality of second connecting columns disposed at the center of the upper and lower bottom plates are further disposed between the upper bottom plate and the lower bottom plate, and the second connecting posts are made of quartz.
  • the diameters of the first and second connecting columns are lcm, and the quartz empty columns and the first and second connecting columns are fixed on the upper and lower bottom plates by welding.
  • the quartz clip device and the quartz clip bottom plate for the OLED high-temperature furnace of the present invention are provided with a plurality of connecting columns between the upper and lower bottom plates of the quartz chuck base plate as support, and the same manner by welding
  • the upper and lower bottom plates of the quartz clip bottom plate are fixed, and the support force of the upper bottom plate is increased by the lower bottom plate to avoid the upper bottom plate from being broken when the quartz clip device is vibrated, thereby effectively reducing the high cost and reduction of the crack of the quartz clip device.
  • the delay in the development of OLEDs caused by the cracking of the clips increases production efficiency and saves costs.
  • FIG. 1 is a schematic perspective view of a conventional quartz card holder device for an OLED high-temperature furnace
  • FIG. 2 is a bottom view of a quartz column and a quartz clip plate bottom plate of the quartz clip device for the OLED high-temperature furnace of FIG. ;
  • Figure 3 is a top plan view of the quartz clip bottom plate of the quartz clip device for the OLED high temperature furnace of Figure 1;
  • Figure 4 is a side elevational view of the quartz clip bottom plate of the quartz clip device for the OLED high temperature furnace of Figure 1;
  • FIG. 5 is a schematic perspective view showing a first embodiment of a quartz clip device for an OLED high-temperature furnace according to the present invention
  • FIG. 6 is a bottom view of a quartz column and a quartz clip bottom plate fixed to a first embodiment of a quartz clip device for an OLED high temperature furnace according to the present invention
  • FIG. 7 is a top plan view of a quartz clip bottom plate of a first embodiment of a quartz clip device for an OLED high temperature furnace according to the present invention.
  • Figure 8 is a side view of the quartz clip bottom plate of the first embodiment of the quartz clip device for an OLED high temperature furnace of the present invention
  • FIG. 9 is a quartz card of a second embodiment of a quartz clip device for an OLED high temperature furnace according to the present invention. Top view of the bottom plate
  • the present invention provides a quartz clip device for an OLED high-temperature furnace, comprising a base 10, a plurality of quartz columns 30 fixedly mounted on the base 10, and a quartz clip located above the base 10.
  • the bottom plate 40 and the plurality of layers are located above the quartz clip bottom plate 40 and are clamped to the quartz card plate 50 on the quartz column 30.
  • the quartz card board 50 is used for placing a substrate coated with a glass glue to be baked, and different quartz card plates 50 are respectively clamped on different heights of the quartz column 30, thereby realizing simultaneous heating of a plurality of substrates in the OLED high-temperature furnace at a high temperature. .
  • the quartz chuck bottom plate 40 includes an upper bottom plate 41, a lower bottom plate 42 and a quartz empty column 70 connecting the upper and lower bottom plates.
  • a corresponding through hole 43 penetrating through the quartz clip bottom plate 40 is provided for each quartz empty column 70.
  • the diameter of the hole 43 is larger than the diameter of the quartz column 30.
  • a plurality of first connecting posts 80 are disposed between the upper bottom plate 41 and the lower bottom plate 42.
  • the corresponding quartz column 30 on the base 10 is provided with a plurality of fixing portions 20, and the quartz column 30 is fixedly mounted on the fixing portion 20.
  • the first connecting posts 80 are hooked on the edges of the upper and lower bottom plates 41, 42 and are made of quartz.
  • the first connecting post 80 has a diameter of lcm, and the quartz empty post 70 and the first connecting post 80, 81 are fixed to the upper and lower bottom plates 41, 42 by welding.
  • the quartz column 30 is provided with a fastener 60 corresponding to the lower bottom plate 42 , and a support piece 61 is disposed between the lower bottom plate 42 and the fastening component 60 to support the lower bottom plate 42 on the quartz column 30 .
  • the function of the quartz clip bottom plate 40 is to assist the fixing of the quartz column 30 to prevent the quartz column 30 from being excessively inclined, and to block the heat flow between the process of the upper portion of the quartz bottom plate 40 and the process of the lower portion thereof, thereby ensuring the respective loads carried on the quartz card plate 50.
  • a plurality of second connecting columns 81 disposed at the center of the upper and lower bottom plates 41 , 42 are further disposed between the upper bottom plate 41 and the lower bottom plate 42 , and the second connection is
  • the column 81 is made of quartz.
  • the second connecting post 81 has a diameter of lcm, and the second connecting post 81 is fixed to the upper and lower bottom plates 41, 42 by welding.
  • the present invention also provides a quartz clip bottom for an OLED high temperature furnace.
  • the plate 40 includes an upper bottom plate 41, a lower bottom plate 42 and a quartz empty column 70 connecting the upper and lower bottom plates.
  • Each quartz empty column 70 is provided with a through hole 43 penetrating through the quartz clip bottom plate 40, the upper bottom plate 41 and the lower portion.
  • a plurality of first connecting posts 80 are disposed between the bottom plates 42.
  • the first connecting posts 80 are hooked on the edges of the upper and lower bottom plates 41, 42 and are made of quartz.
  • a plurality of second connecting columns 81 disposed at the center of the upper and lower bottom plates 41 , 42 are further disposed between the upper bottom plate 41 and the lower bottom plate 42 , and the second connection is
  • the column 81 is made of quartz.
  • the first and second connecting posts 80, 81 have a diameter of 1 cm, and the quartz empty post 70 and the first and second connecting posts 80, 81 are fixed to the upper and lower bottom plates 41, 42 by welding. .
  • the quartz clip device and the quartz clip bottom plate for the OLED high-temperature furnace of the present invention are provided with a plurality of connecting columns between the upper and lower bottom plates of the bottom plate of the quartz clip, and are welded together.
  • the upper and lower bottom plates of the quartz clip bottom plate are fixed, and the support force of the upper bottom plate is increased by the lower bottom plate to avoid the upper bottom plate from being broken when the quartz clip device is vibrated, thereby effectively reducing the high cost and reduction of the crack of the quartz clip device.
  • the delay in the development of OLEDs caused by the rupture of the clip device increases the production efficiency and saves costs.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

一种用于OLED高温炉的石英卡夹装置及石英卡夹底板（40），所述石英卡夹装置包括一底座（10）、固定安装于底座（10）上的数根石英柱（30）、位于底座（10）上方的石英卡夹底板（40）及数层位于石英卡夹底板（40）上方且卡夹于石英柱（30）上的石英卡板（50）；所述石英卡夹底板（40）包括上底板（41）、下底板（42）及连接上、下底板的石英空柱（70），对应每一石英空柱（70）设有一贯穿所述石英卡夹底板（40）的通孔（43），所述通孔（43）的直径大于所述石英柱（30）的直径；所述上底板（41）与下底板（42）之间设有数根第一连接柱（80），借由下底板（42）增加对上底板（41）的支撑力，避免当石英卡夹装置发生震动时上底板（41）破裂，进而有效减少石英卡夹装置破裂产生的高昂费用及减少卡夹装置破裂造成的OLED开发进度的延误，提高生产效率，节约成本。

Description

用于 OLED高温炉的石英卡夹装置及石英卡夹底板
技术领域
本发明涉及平面显示领域， 尤其涉及一种用于 OLED 高温炉的石英卡 夹装置及石英卡夹底板。 背景技术
OLED 显示器是新一代的显示器， 通过在基板上制作有机薄膜， 其中 有机薄膜被包在阴极和阳极金属之间， 给两电极加电压， 则有机薄膜会发 光。 有机薄膜对水气和氧气很敏感， 容易因水氧发生老化变性， 亮度和寿 命会出现明显衰减。 所以需要对 OLED器件进行封装制程。 一般的封装方 式为在平板玻璃上各周边涂布 UV胶， 然后与 OLED基板对组贴合后 UV 灯照射进行固化。
除 UV 胶封装外， 有一种封装效果更好的封装方式， 即玻璃胶封装。 玻璃胶阻隔水氧的能力远强于 UV胶。 玻璃胶封装过程是在封装盖板上涂 布玻璃胶， 玻璃胶在 OLED高温炉进行高温烘烤 (温度在 550°C左右）， 烘烤 后的玻璃胶盖板再涂布 UV胶， 然后与 OLED基板对组贴合， UV灯照射固 化 UV胶 (UV胶的作用为暂时粘合两张玻璃以及临时起到密封效果)， 最终 的封装是用激光将烤干的玻璃胶融化后再凝结， 粘合两张玻璃达到封装效 果。
用于玻璃胶烘烤的 OLED 高温炉通常温度很高， 需 500〜600°C， 制程 时间长， 所以需将多片封装基板同时放入 OLED 高温炉烘烤以节省每片基 板的制程时间， 因而， 可采用在 OLED 高温炉中制作石英卡夹装置的方式 来满足多片基板同时高温加热的需求。
如图 1-4所示， 现有的用于 OLED 高温炉的石英卡夹装置包括数层石 英卡板（500)、石英卡夹底板（400)及通过固定部（200) 固定在底座（100) 上的数根石英柱 （300)。 石英卡板 （500) 用于放置基板， 以实现在 OLED 高温炉内同时高温加热多片基板， 石英卡夹底板 （400) 的作用是辅助固定 石英柱 （300) 避免石英柱 （300) 倾斜过大， 同时阻隔石英卡夹底板 （400) 上部的制程与其下部的制程之间的热量流动， 保证石英卡板 （500) 上各片 基板间温度的均一性。 其中， 石英卡夹底板 （400) 包括上、 下底板 （410)、 (420)， 石英卡夹底板 （400) 上对应石英柱 （300) 的位置设有熔接于上、 下底板 （410)、 (420) 的石英空柱 （700)。 石英柱 （300) 与石英卡夹底板 (400) 的下底板 （420) 采用一固定件 （600) 固定， 且固定件 （600) 与 石英卡夹底板 （400) 的下底板 （420) 间设有一支撑片 （610) 以分散石英 卡夹底板 （400) 的重力。
但石英卡夹底板 （400) 的上底板 （410) 只由数个石英空柱 （700) 支 撑，所以当石英卡夹发生震动时，石英柱会轻微倾斜，与石英卡夹底板（400) 发生触碰， 从而石英卡夹底板 （400) 的上底板 （410) 与石英空柱 （700) 的熔接处极易发生破裂。 发明内容
本发明的目的在于提供一种用于 OLED 高温炉的石英卡夹装置， 在石 英卡夹底板上、 下底板之间设置数根连接柱作为支撑， 并通过熔接方式同 石英卡夹底板的上、 下底板固定， 借由下底板增加对上底板的支撑力， 避 免当石英卡夹装置发生震动时上底板破裂。
本发明的另一目的在于提供一种该用于 OLED 高温炉的石英卡夹底 板， 在上、 下底板之间设置数根连接柱作为支撑， 并通过熔接方式同石英 卡夹底板的上、 下底板固定， 借由下底板增加对上底板的支撑力， 避免当 石英卡夹装置发生震动时上底板破裂。
为实现上述目的， 本发明提供一种用于 OLED高温炉的石英卡夹装置， 包括一底座、 固定安装于底座上的数根石英柱、 位于底座上方的石英卡夹 底板及数层位于石英卡夹底板上方且卡夹于石英柱上的石英卡板；
所述石英卡夹底板包括上底板、 下底板及连接上下底板的石英空柱， 对应每一石英空柱设有一贯穿所述石英卡夹底板的通孔， 所述通孔的直径 大于所述石英柱的直径；
所述上底板与下底板之间设有数根第一连接柱。
所述底座上对应石英柱设有数个固定部， 所述石英柱固定安装于该固 定部上。
所述第一连接柱均勾分布于所述上、 下底板的边缘， 其由石英制成。 所述上底板与下底板之间还设有设置于所述上、 下底板的中心的数根 第二连接柱， 该第二连接柱由石英制成。
所述第一与第二连接柱的直径为 lcm， 所述石英空柱与所述第一与第 二连接柱均通过熔接方式固定在上、 下底板上。
所述石英柱对应于下底板设有紧固件， 且于所述下底板与所述紧固部 件之间设有一支撑片， 使下底板支撑于所述石英柱上。
本发明还提供一种该用于 OLED高温炉的石英卡夹底板， 包括上底板、 下底板及连接上下底板的石英空柱， 对应每一石英空柱设有一贯穿所述石 英卡夹底板的通孔， 所述上底板与下底板之间设有数根第一连接柱。
所述第一连接柱均勾分布于所述上、 下底板的边缘， 其由石英制成。 所述上底板与下底板之间还设有设置于所述上、 下底板的中心的数根 第二连接柱， 该第二连接柱由石英制成。
所述第一与第二连接柱的直径为 lcm， 所述石英空柱与所述第一与第 二连接柱均通过熔接方式固定在上、 下底板上。
本发明的有益效果： 本发明的用于 OLED 高温炉的石英卡夹装置及石 英卡夹底板， 通过在石英卡夹底板上、 下底板之间设置数根连接柱作为支 撑， 并通过熔接方式同石英卡夹底板的上、 下底板固定， 借由下底板增加 对上底板的支撑力， 避免当石英卡夹装置发生震动时上底板破裂， 进而有 效减少石英卡夹装置破裂产生的高昂费用及减少卡夹破裂造成的 OLED开 发进度的延误， 提高生产效率， 节约成本。 附图说明
下面结合附图， 通过对本发明的具体实施方式详细描述， 将使本发明 的技术方案及其它有益效果显而易见。
附图中，
图 1为一种现有用于 OLED高温炉的石英卡夹装置的立体结构示意图； 图 2为图 1 中用于 OLED高温炉的石英卡夹装置的石英柱与石英卡夹 底板固定处的仰视图；
图 3为图 1 中用于 OLED高温炉的石英卡夹装置的石英卡夹底板的俯 视图；
图 4为图 1 中用于 OLED高温炉的石英卡夹装置的石英卡夹底板的侧 视图；
图 5为本发明用于 OLED高温炉的石英卡夹装置第一实施例的立体结 构示意图；
图 6为本发明用于 OLED高温炉的石英卡夹装置第一实施例的石英柱 与石英卡夹底板固定处的仰视图；
图 7为本发明用于 OLED高温炉的石英卡夹装置第一实施例的石英卡 夹底板的俯视图；
图 8为本发明用于 OLED高温炉的石英卡夹装置第一实施例的石英卡 夹底板的侧视图；
图 9为本发明用于 OLED高温炉的石英卡夹装置第二实施例的石英卡 夹底板的俯视图 具体实施方式
为更进一步阐述本发明所采取的技术手段及其技术效果， 以下结合本 发明的优选实施例及其附图进行详细描述。
请参阅图 5-8， 本发明提供的一种用于 OLED高温炉的石英卡夹装置， 包括一底座 10、 固定安装于底座 10上的数根石英柱 30、 位于底座 10上方 的石英卡夹底板 40及数层位于石英卡夹底板 40上方且卡夹于石英柱 30上 的石英卡板 50。
所述石英卡板 50用于放置涂有待烘烤玻璃胶的基板，不同石英卡板 50 分别卡夹于所述石英柱 30的不同高度上，进而实现在 OLED高温炉内同时 高温加热多片基板。
所述石英卡夹底板 40包括上底板 41、 下底板 42及连接上下底板的石 英空柱 70， 对应每一石英空柱 70设有一贯穿所述石英卡夹底板 40的通孔 43， 所述通孔 43的直径大于所述石英柱 30的直径。
所述上底板 41与下底板 42之间设有数根第一连接柱 80。
所述底座 10上对应石英柱 30设有数个固定部 20，所述石英柱 30固定 安装于该固定部 20上。
所述第一连接柱 80均勾分布于所述上、 下底板 41、 42的边缘， 其由 石英制成。
所述第一连接柱 80的直径为 lcm， 所述石英空柱 70与所述第一连接 柱 80、 81均通过熔接方式固定在上、 下底板 41、 42上。
所述石英柱 30对应于下底板 42设有紧固件 60，且于所述下底板 42与 所述紧固部件 60之间设有一支撑片 61， 使下底板 42支撑于所述石英柱 30 _h o
所述石英卡夹底板 40的作用是辅助固定石英柱 30避免石英柱 30倾斜 过大， 同时阻隔石英底板 40上部的制程与其下部的制程之间的热量流动， 保证石英卡板 50上承载的各片基板间温度的均一性。
如图 9所示， 可选择地， 所述上底板 41 与下底板 42之间还设有设置 于所述上、 下底板 41、 42的中心的数根第二连接柱 81， 该第二连接柱 81 由石英制成。
所述第二连接柱 81 的直径为 lcm， 所述第二连接柱 81 通过熔接方式 固定在上、 下底板 41、 42上。
如图 5-8所示， 本发明也提供一种该用于 OLED 高温炉的石英卡夹底 板 40， 包括上底板 41、 下底板 42及连接上下底板的石英空柱 70， 对应每 一石英空柱 70设有一贯穿所述石英卡夹底板 40的通孔 43， 所述上底板 41 与下底板 42之间设有数根第一连接柱 80。
所述第一连接柱 80均勾分布于所述上、 下底板 41、 42的边缘， 其由 石英制成。
如图 9所示， 可选择地， 所述上底板 41 与下底板 42之间还设有设置 于所述上、 下底板 41、 42的中心的数根第二连接柱 81， 该第二连接柱 81 由石英制成。
所述第一与第二连接柱 80、 81 的直径为 lcm， 所述石英空柱 70与所 述第一与第二连接柱 80、 81均通过熔接方式固定在上、 下底板 41、 42上。
综上所述， 本发明的用于 OLED 高温炉的石英卡夹装置及石英卡夹底 板， 通过在石英卡夹底板的上、 下底板之间设置数根连接柱作为支撑， 并 通过熔接方式同石英卡夹底板的上、 下底板固定， 借由下底板增加对上底 板的支撑力， 避免当石英卡夹装置发生震动时上底板破裂， 进而有效减少 石英卡夹装置破裂产生的高昂费用及减少卡夹装置破裂造成的 OLED开发 进度的延误， 提高生产效率， 节约成本。
以上所述， 对于本领域的普通技术人员来说， 可以根据本发明的技术 方案和技术构思作出其他各种相应的改变和变形， 而所有这些改变和变形 都应属于本发明后附的权利要求的保护范围。

Claims

权 利 要 求
1、 一种用于 OLED高温炉的石英卡夹装置， 包括一底座、 固定安装于 底座上的数根石英柱、 位于底座上方的石英卡夹底板及数层位于石英卡夹 底板上方且卡夹于石英柱上的石英卡板；
所述石英卡夹底板包括上底板、 下底板及连接上、 下底板的石英空柱， 对应每一石英空柱设有一贯穿所述石英卡夹底板的通孔， 所述通孔的直径 大于所述石英柱的直径；
所述上底板与下底板之间设有数根第一连接柱。
2、 如权利要求 1所述的用于 OLED高温炉的石英卡夹装置， 其中， 所 述底座上对应石英柱设有数个固定部， 所述石英柱固定安装于该固定部上。
3、 如权利要求 1所述的用于 OLED高温炉的石英卡夹装置， 其中， 所 述第一连接柱均勾分布于所述上、 下底板的边缘， 其由石英制成。
4、 如权利要求 3所述的用于 OLED高温炉的石英卡夹装置， 其中， 所 述上底板与下底板之间还设有设置于所述上、 下底板的中心的数根第二连 接柱， 该第二连接柱由石英制成。
5、 如权利要求 4所述的用于 OLED高温炉的石英卡夹装置， 其中， 所 述第一与第二连接柱的直径为 lcm， 所述石英空柱与所述第一与第二连接 柱均通过熔接方式固定在上、 下底板上。
6、 如权利要求 1所述的用于 OLED高温炉的石英卡夹装置， 其中， 所 述石英柱对应于下底板设有紧固件， 且于所述下底板与所述紧固部件之间 设有一支撑片， 使下底板支撑于所述石英柱上。
7、 一种用于 OLED高温炉的石英卡夹底板， 包括上底板、 下底板及连 接上下底板的石英空柱， 对应每一石英空柱设有一贯穿所述石英卡夹底板 的通孔， 所述上底板与下底板之间设有数根第一连接柱。
8、 如权利要求 7所述的用于 OLED高温炉的石英卡夹底板， 其中， 所 述第一连接柱均勾分布于所述上、 下底板的边缘， 其由石英制成。
9、 如权利要求 8所述的用于 OLED高温炉的石英卡夹底板， 其中， 所 述上底板与下底板之间还设有设置于所述上、 下底板的中心的数根第二连 接柱， 该第二连接柱由石英制成。
10、 如权利要求 7所述的用于 OLED高温炉的石英卡夹底板， 其中， 所述第一与第二连接柱的直径为 lcm， 所述石英空柱与所述第一与第二连 接柱均通过熔接方式固定在上、 下底板上。
11、 一种用于 OLED高温炉的石英卡夹底板， 包括上底板、 下底板及 连接上下底板的石英空柱， 对应每一石英空柱设有一贯穿所述石英卡夹底 板的通孔， 所迷上底板与下底板之间设有数根第一连接柱；
其中， 所述第一连接柱均勾分布于所述上、 下底板的边缘， 其由石英 制成。
PCT/CN2014/084456 2014-07-24 2014-08-15 用于oled高温炉的石英卡夹装置及石英卡夹底板 WO2016011690A1 (zh)

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