JP2013534725A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2013534725A5 JP2013534725A5 JP2013515416A JP2013515416A JP2013534725A5 JP 2013534725 A5 JP2013534725 A5 JP 2013534725A5 JP 2013515416 A JP2013515416 A JP 2013515416A JP 2013515416 A JP2013515416 A JP 2013515416A JP 2013534725 A5 JP2013534725 A5 JP 2013534725A5
- Authority
- JP
- Japan
- Prior art keywords
- plate
- turbulence inducing
- cleaning
- inducing structures
- circular ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US35642210P | 2010-06-18 | 2010-06-18 | |
| US61/356,422 | 2010-06-18 | ||
| US13/041,230 | 2011-03-04 | ||
| US13/041,230 US8910644B2 (en) | 2010-06-18 | 2011-03-04 | Method and apparatus for inducing turbulent flow of a processing chamber cleaning gas |
| PCT/US2011/040197 WO2011159615A2 (en) | 2010-06-18 | 2011-06-13 | Method and apparatus for inducing turbulent flow of a processing chamber cleaning gas |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013534725A JP2013534725A (ja) | 2013-09-05 |
| JP2013534725A5 true JP2013534725A5 (enExample) | 2015-08-27 |
| JP5813104B2 JP5813104B2 (ja) | 2015-11-17 |
Family
ID=45327564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013515416A Active JP5813104B2 (ja) | 2010-06-18 | 2011-06-13 | 処理チャンバ洗浄ガスの乱流を誘発するための方法および装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8910644B2 (enExample) |
| JP (1) | JP5813104B2 (enExample) |
| KR (1) | KR101717899B1 (enExample) |
| CN (1) | CN102934204B (enExample) |
| TW (1) | TWI542725B (enExample) |
| WO (1) | WO2011159615A2 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7976631B2 (en) * | 2007-10-16 | 2011-07-12 | Applied Materials, Inc. | Multi-gas straight channel showerhead |
| WO2011044451A2 (en) * | 2009-10-09 | 2011-04-14 | Applied Materials, Inc. | Multi-gas centrally cooled showerhead design |
| USD664170S1 (en) * | 2011-03-04 | 2012-07-24 | Applied Materials, Inc. | Cleaning plate for inducing turbulent flow of a processing chamber cleaning glass |
| DE102011056589A1 (de) * | 2011-07-12 | 2013-01-17 | Aixtron Se | Gaseinlassorgan eines CVD-Reaktors |
| CN103388127B (zh) * | 2012-05-10 | 2016-04-13 | 上海华虹宏力半导体制造有限公司 | 高密度等离子体化学气相沉积设备腔体刻蚀清洗方法 |
| US10316409B2 (en) | 2012-12-21 | 2019-06-11 | Novellus Systems, Inc. | Radical source design for remote plasma atomic layer deposition |
| US9748121B2 (en) * | 2013-03-05 | 2017-08-29 | Applied Materials, Inc. | Thermal coupled quartz dome heat sink |
| US10403521B2 (en) * | 2013-03-13 | 2019-09-03 | Applied Materials, Inc. | Modular substrate heater for efficient thermal cycling |
| US9677176B2 (en) * | 2013-07-03 | 2017-06-13 | Novellus Systems, Inc. | Multi-plenum, dual-temperature showerhead |
| CN107546157A (zh) * | 2013-11-22 | 2018-01-05 | 应用材料公司 | 易取灯头 |
| JP6123688B2 (ja) * | 2014-01-29 | 2017-05-10 | 東京エレクトロン株式会社 | 成膜装置 |
| US10023959B2 (en) | 2015-05-26 | 2018-07-17 | Lam Research Corporation | Anti-transient showerhead |
| JP6442622B2 (ja) | 2015-11-30 | 2018-12-19 | 東京エレクトロン株式会社 | 基板処理装置のチャンバークリーニング方法 |
| US10604841B2 (en) | 2016-12-14 | 2020-03-31 | Lam Research Corporation | Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition |
| JP7546483B2 (ja) | 2017-12-08 | 2024-09-06 | ラム リサーチ コーポレーション | 遠隔プラズマ膜蒸着を可能にするためにラジカルおよび前駆体ガスを下流チャンバに供給するための改良された孔パターンを備える統合シャワーヘッド |
| JP6920245B2 (ja) * | 2018-04-23 | 2021-08-18 | 東京エレクトロン株式会社 | 温度制御方法 |
| JP6575641B1 (ja) * | 2018-06-28 | 2019-09-18 | 株式会社明電舎 | シャワーヘッドおよび処理装置 |
| US10734219B2 (en) * | 2018-09-26 | 2020-08-04 | Asm Ip Holdings B.V. | Plasma film forming method |
| US10883174B2 (en) * | 2018-11-27 | 2021-01-05 | Applied Materials, Inc. | Gas diffuser mounting plate for reduced particle generation |
| CN114258436A (zh) | 2019-08-16 | 2022-03-29 | 朗姆研究公司 | 空间可调沉积以在晶片差异弯曲中进行补偿 |
| US12272608B2 (en) | 2020-01-03 | 2025-04-08 | Lam Research Corporation | Station-to-station control of backside bow compensation deposition |
| US12394603B2 (en) | 2020-01-13 | 2025-08-19 | Lam Research Corporation | Multizone gas distribution plate for trench profile optimization |
| WO2021154641A1 (en) | 2020-01-30 | 2021-08-05 | Lam Research Corporation | Uv cure for local stress modulation |
| KR20210125420A (ko) * | 2020-04-07 | 2021-10-18 | 에이에스엠 아이피 홀딩 비.브이. | 샤워헤드용 플러싱 고정구 |
| US20210335586A1 (en) * | 2020-04-22 | 2021-10-28 | Applied Materials, Inc. | Methods and apparatus for cleaning a showerhead |
| CN111501024A (zh) * | 2020-05-08 | 2020-08-07 | Tcl华星光电技术有限公司 | 气相沉积装置 |
| CN112331588B (zh) * | 2020-10-26 | 2024-05-17 | 北京北方华创微电子装备有限公司 | 半导体设备中的卡盘组件及半导体工艺设备 |
| KR20230043457A (ko) * | 2021-09-24 | 2023-03-31 | 주성엔지니어링(주) | 기판 처리 장치의 세정 방법 |
| US20250305128A1 (en) * | 2022-05-13 | 2025-10-02 | Lam Research Corporation | Multi-zone gas distribution for asymmetric wafer bow compensation |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5855326A (ja) * | 1981-09-24 | 1983-04-01 | Toshiba Corp | 減圧cvd反応炉 |
| JPS6464322A (en) * | 1987-09-04 | 1989-03-10 | Hitachi Ltd | Method of removing organic material |
| USD320361S (en) | 1989-06-02 | 1991-10-01 | Tokyo Electron Limited | Wafer probe plate holder |
| US5882414A (en) * | 1996-09-09 | 1999-03-16 | Applied Materials, Inc. | Method and apparatus for self-cleaning a blocker plate |
| US6098637A (en) * | 1998-03-03 | 2000-08-08 | Applied Materials, Inc. | In situ cleaning of the surface inside a vacuum processing chamber |
| US6277235B1 (en) | 1998-08-11 | 2001-08-21 | Novellus Systems, Inc. | In situ plasma clean gas injection |
| JP4162773B2 (ja) * | 1998-08-31 | 2008-10-08 | 東京エレクトロン株式会社 | プラズマ処理装置および検出窓 |
| US6835278B2 (en) | 2000-07-07 | 2004-12-28 | Mattson Technology Inc. | Systems and methods for remote plasma clean |
| US6827092B1 (en) * | 2000-12-22 | 2004-12-07 | Lam Research Corporation | Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same |
| JP2003142465A (ja) * | 2001-11-08 | 2003-05-16 | Shibaura Mechatronics Corp | マイクロ波プラズマ処理装置 |
| JP4421238B2 (ja) | 2003-08-26 | 2010-02-24 | 大日本スクリーン製造株式会社 | 熱処理装置および熱処理装置の洗浄方法 |
| US7431772B2 (en) | 2004-03-09 | 2008-10-07 | Applied Materials, Inc. | Gas distributor having directed gas flow and cleaning method |
| MX2007005780A (es) * | 2004-11-15 | 2007-10-08 | Bisio Progetti Spa | Rallador contenedor para un producto de alimento para fritura. |
| DE602006021108D1 (de) * | 2005-09-05 | 2011-05-19 | Japan Pionics | Vorrichtung zur chemischen Dampfabscheidung |
| JP4874743B2 (ja) * | 2005-09-05 | 2012-02-15 | 日本パイオニクス株式会社 | 窒化ガリウム系化合物半導体の気相成長装置 |
| KR20120028672A (ko) * | 2010-09-15 | 2012-03-23 | 삼성전자주식회사 | 기판 처리 장치 및 이를 이용한 기판 처리 방법 |
-
2011
- 2011-03-04 US US13/041,230 patent/US8910644B2/en active Active
- 2011-06-13 KR KR1020137001264A patent/KR101717899B1/ko active Active
- 2011-06-13 JP JP2013515416A patent/JP5813104B2/ja active Active
- 2011-06-13 TW TW100120573A patent/TWI542725B/zh active
- 2011-06-13 CN CN201180028838.6A patent/CN102934204B/zh active Active
- 2011-06-13 WO PCT/US2011/040197 patent/WO2011159615A2/en not_active Ceased
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2013534725A5 (enExample) | ||
| US11043403B2 (en) | Substrate support unit and substrate processing apparatus having the same including reflective member configured to reflect light toward substrate | |
| JP6752797B2 (ja) | 基板裏側の変色制御のための支持組立体 | |
| JP2010508656A5 (enExample) | ||
| CN107109645B (zh) | 处理腔室 | |
| TWI542725B (zh) | 誘導處理室清潔氣體之紊流的方法及設備 | |
| TWI624893B (zh) | 用於熱處理腔室之邊緣環 | |
| JP2014070249A5 (enExample) | ||
| EP3488464B1 (en) | Heating modulators to improve epi uniformity tuning | |
| SG185214A1 (en) | Method and apparatus for depositing a material layer originating from process gas on a substrate wafer | |
| TW201611168A (zh) | 用於基板熱處理的基座與預熱環 | |
| JP2016213456A5 (enExample) | ||
| CN105261579A (zh) | 基板处理装置 | |
| CN105518839A (zh) | Epi预热环 | |
| JP7008509B2 (ja) | 高成長率のepiチャンバのための遮熱リング | |
| CN106796867A (zh) | 用于epi腔室的上圆顶 | |
| TWI695086B (zh) | 具有反射體之處理腔室 | |
| JP2016532630A5 (enExample) | ||
| JP2011233865A (ja) | 有機金属化学気相堆積装置 | |
| JP2011233866A (ja) | 有機金属化学気相堆積装置 | |
| JP2016164973A (ja) | 回転式ガスシャワーヘッドを備えたスピンチャック | |
| KR102616076B1 (ko) | 발열부가 장착된 기판 처리장치 | |
| KR102009864B1 (ko) | 기판 처리 장치 | |
| JP2018517286A5 (ja) | 静電クランプ | |
| KR20150015714A (ko) | 서셉터 및 이를 포함하는 막 증착장치 |