JP2014070249A5 - - Google Patents

Download PDF

Info

Publication number
JP2014070249A5
JP2014070249A5 JP2012217035A JP2012217035A JP2014070249A5 JP 2014070249 A5 JP2014070249 A5 JP 2014070249A5 JP 2012217035 A JP2012217035 A JP 2012217035A JP 2012217035 A JP2012217035 A JP 2012217035A JP 2014070249 A5 JP2014070249 A5 JP 2014070249A5
Authority
JP
Japan
Prior art keywords
gas
shower head
film forming
forming apparatus
gas supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012217035A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014070249A (ja
JP6123208B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012217035A priority Critical patent/JP6123208B2/ja
Priority claimed from JP2012217035A external-priority patent/JP6123208B2/ja
Priority to US14/030,422 priority patent/US20140090599A1/en
Priority to TW102134078A priority patent/TWI599676B/zh
Priority to KR1020130114205A priority patent/KR101804597B1/ko
Publication of JP2014070249A publication Critical patent/JP2014070249A/ja
Publication of JP2014070249A5 publication Critical patent/JP2014070249A5/ja
Application granted granted Critical
Publication of JP6123208B2 publication Critical patent/JP6123208B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012217035A 2012-09-28 2012-09-28 成膜装置 Active JP6123208B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012217035A JP6123208B2 (ja) 2012-09-28 2012-09-28 成膜装置
US14/030,422 US20140090599A1 (en) 2012-09-28 2013-09-18 Film forming apparatus
TW102134078A TWI599676B (zh) 2012-09-28 2013-09-23 Film-forming device
KR1020130114205A KR101804597B1 (ko) 2012-09-28 2013-09-26 성막 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012217035A JP6123208B2 (ja) 2012-09-28 2012-09-28 成膜装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017075941A Division JP6308318B2 (ja) 2017-04-06 2017-04-06 成膜装置

Publications (3)

Publication Number Publication Date
JP2014070249A JP2014070249A (ja) 2014-04-21
JP2014070249A5 true JP2014070249A5 (enExample) 2015-10-08
JP6123208B2 JP6123208B2 (ja) 2017-05-10

Family

ID=50384029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012217035A Active JP6123208B2 (ja) 2012-09-28 2012-09-28 成膜装置

Country Status (4)

Country Link
US (1) US20140090599A1 (enExample)
JP (1) JP6123208B2 (enExample)
KR (1) KR101804597B1 (enExample)
TW (1) TWI599676B (enExample)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8673080B2 (en) 2007-10-16 2014-03-18 Novellus Systems, Inc. Temperature controlled showerhead
US10128087B2 (en) 2014-04-07 2018-11-13 Lam Research Corporation Configuration independent gas delivery system
US10741365B2 (en) * 2014-05-05 2020-08-11 Lam Research Corporation Low volume showerhead with porous baffle
US10465288B2 (en) * 2014-08-15 2019-11-05 Applied Materials, Inc. Nozzle for uniform plasma processing
US10557197B2 (en) * 2014-10-17 2020-02-11 Lam Research Corporation Monolithic gas distribution manifold and various construction techniques and use cases therefor
US20160111257A1 (en) * 2014-10-17 2016-04-21 Lam Research Corporation Substrate for mounting gas supply components and methods thereof
US9951421B2 (en) * 2014-12-10 2018-04-24 Lam Research Corporation Inlet for effective mixing and purging
JP6503730B2 (ja) * 2014-12-22 2019-04-24 東京エレクトロン株式会社 成膜装置
US10167552B2 (en) * 2015-02-05 2019-01-01 Lam Research Ag Spin chuck with rotating gas showerhead
EP3054032B1 (en) * 2015-02-09 2017-08-23 Coating Plasma Industrie Installation for film deposition onto and/or modification of the surface of a moving substrate
US10378107B2 (en) * 2015-05-22 2019-08-13 Lam Research Corporation Low volume showerhead with faceplate holes for improved flow uniformity
US10023959B2 (en) 2015-05-26 2018-07-17 Lam Research Corporation Anti-transient showerhead
JP6054471B2 (ja) 2015-05-26 2016-12-27 株式会社日本製鋼所 原子層成長装置および原子層成長装置排気部
JP5990626B1 (ja) * 2015-05-26 2016-09-14 株式会社日本製鋼所 原子層成長装置
JP6054470B2 (ja) 2015-05-26 2016-12-27 株式会社日本製鋼所 原子層成長装置
US10022689B2 (en) 2015-07-24 2018-07-17 Lam Research Corporation Fluid mixing hub for semiconductor processing tool
US10118263B2 (en) 2015-09-02 2018-11-06 Lam Researech Corporation Monolithic manifold mask and substrate concepts
US10215317B2 (en) 2016-01-15 2019-02-26 Lam Research Corporation Additively manufactured gas distribution manifold
KR102156390B1 (ko) 2016-05-20 2020-09-16 어플라이드 머티어리얼스, 인코포레이티드 반도체 처리를 위한 가스 분배 샤워헤드
JP2018011032A (ja) * 2016-07-15 2018-01-18 株式会社東芝 流路構造及び処理装置
JP6988083B2 (ja) * 2016-12-21 2022-01-05 東京エレクトロン株式会社 ガス処理装置及びガス処理方法
JP6597732B2 (ja) 2017-07-24 2019-10-30 東京エレクトロン株式会社 ガス処理装置
KR102501472B1 (ko) * 2018-03-30 2023-02-20 에이에스엠 아이피 홀딩 비.브이. 기판 처리 방법
US10943769B2 (en) * 2018-07-19 2021-03-09 Lam Research Corporation Gas distributor and flow verifier
JP7119747B2 (ja) * 2018-08-10 2022-08-17 東京エレクトロン株式会社 ガス処理装置及びガス処理方法
JP2022545273A (ja) 2019-08-23 2022-10-26 ラム リサーチ コーポレーション 温度制御型のシャンデリア型シャワーヘッド
KR20220052996A (ko) 2019-08-28 2022-04-28 램 리써치 코포레이션 금속 증착
JP2021044285A (ja) * 2019-09-06 2021-03-18 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP6987821B2 (ja) 2019-09-26 2022-01-05 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法およびプログラム
US11236424B2 (en) * 2019-11-01 2022-02-01 Applied Materials, Inc. Process kit for improving edge film thickness uniformity on a substrate
CN115956136A (zh) 2020-06-15 2023-04-11 朗姆研究公司 用于半导体处理工具的具有斜角气体分配通道的喷头面板
JP7573466B2 (ja) * 2021-03-17 2024-10-25 東京エレクトロン株式会社 ガス処理装置
JP7590082B2 (ja) 2021-06-10 2024-11-26 東京エレクトロン株式会社 シャワーヘッド及び基板処理装置
JP7590081B2 (ja) 2021-06-10 2024-11-26 東京エレクトロン株式会社 シャワーヘッド及び基板処理装置
US12338530B2 (en) * 2021-07-09 2025-06-24 Applied Materials, Inc. Shaped showerhead for edge plasma modulation
KR20250033571A (ko) * 2023-09-01 2025-03-10 한화세미텍 주식회사 기판 처리 장치
CN119663241A (zh) * 2024-12-24 2025-03-21 拓荆创益(沈阳)半导体设备有限公司 一种匀气混气结构

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5284805A (en) * 1991-07-11 1994-02-08 Sematech, Inc. Rapid-switching rotating disk reactor
US5565382A (en) * 1993-10-12 1996-10-15 Applied Materials, Inc. Process for forming tungsten silicide on semiconductor wafer using dichlorosilane gas
KR100267885B1 (ko) * 1998-05-18 2000-11-01 서성기 반도체 박막증착장치
US20030019428A1 (en) * 2001-04-28 2003-01-30 Applied Materials, Inc. Chemical vapor deposition chamber
WO2004109761A2 (en) * 2003-05-30 2004-12-16 Aviza Technology Inc. Gas distribution system
WO2004111297A1 (ja) * 2003-06-10 2004-12-23 Tokyo Electron Limited 処理ガス供給機構、成膜装置および成膜方法
US7408225B2 (en) * 2003-10-09 2008-08-05 Asm Japan K.K. Apparatus and method for forming thin film using upstream and downstream exhaust mechanisms
WO2009104732A1 (ja) * 2008-02-20 2009-08-27 東京エレクトロン株式会社 ガス供給装置

Similar Documents

Publication Publication Date Title
JP2014070249A5 (enExample)
JP2012253313A5 (ja) 成膜装置、プラズマ処理装置、成膜方法及び記憶媒体
JP2011100956A5 (enExample)
JP2011517116A5 (enExample)
JP2016042561A5 (enExample)
CN104916564B (zh) 反应腔室以及等离子体加工设备
TWI717355B (zh) 在處理腔室中的氣體控制
JP2012146939A5 (enExample)
JP2013534725A5 (enExample)
JP2013513239A5 (enExample)
JP2011103495A5 (enExample)
TW201612953A (en) Substrate support with more uniform edge purge
EP2543063A4 (en) WAF CARRIER WITH BELOW END
JP2014012891A5 (ja) 基板処理システム及び原子層蒸着システム
JP2015183224A5 (enExample)
JP5985581B2 (ja) 処理装置及びコリメータ
WO2011027987A3 (ko) 가스분사장치 및 이를 이용한 기판처리장치
TWD178424S (zh) 用於半導體製造設備的氣流控制板
CN103194737B (zh) 一种用于原子层沉积设备的气体分配器
TWM446412U (zh) 易清潔的排氣環
JP2016519844A5 (enExample)
JP2015514954A5 (enExample)
TWI661462B (zh) Plasma processing device and gas supply member
TW200732500A (en) Apparatus and process for plasma-enhanced atomic layer deposition
JP2018505561A5 (enExample)