JP5281408B2 - ドープされた窒化アルミニウム結晶及びそれを製造する方法 - Google Patents
ドープされた窒化アルミニウム結晶及びそれを製造する方法 Download PDFInfo
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- JP5281408B2 JP5281408B2 JP2008543541A JP2008543541A JP5281408B2 JP 5281408 B2 JP5281408 B2 JP 5281408B2 JP 2008543541 A JP2008543541 A JP 2008543541A JP 2008543541 A JP2008543541 A JP 2008543541A JP 5281408 B2 JP5281408 B2 JP 5281408B2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/854—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs further characterised by the dopants
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
- H10P14/3416—Nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
- H10P14/3444—P-type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
- H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
- H10P32/14—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
- H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
- H10P32/17—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material
- H10P32/174—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material being Group III-V material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
- H10H20/8252—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN characterised by the dopants
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US74170105P | 2005-12-02 | 2005-12-02 | |
| US60/741,701 | 2005-12-02 | ||
| PCT/US2006/046300 WO2007065018A2 (en) | 2005-12-02 | 2006-12-04 | Doped aluminum nitride crystals and methods of making them |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012250881A Division JP5312664B2 (ja) | 2005-12-02 | 2012-11-15 | ドープされた窒化アルミニウム結晶及びそれを製造する方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009518263A JP2009518263A (ja) | 2009-05-07 |
| JP2009518263A5 JP2009518263A5 (https=) | 2010-01-28 |
| JP5281408B2 true JP5281408B2 (ja) | 2013-09-04 |
Family
ID=38011100
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008543541A Expired - Fee Related JP5281408B2 (ja) | 2005-12-02 | 2006-12-04 | ドープされた窒化アルミニウム結晶及びそれを製造する方法 |
| JP2012250881A Expired - Fee Related JP5312664B2 (ja) | 2005-12-02 | 2012-11-15 | ドープされた窒化アルミニウム結晶及びそれを製造する方法 |
| JP2013098203A Expired - Fee Related JP5436710B2 (ja) | 2005-12-02 | 2013-05-08 | ドープされた窒化アルミニウム結晶及びそれを製造する方法 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012250881A Expired - Fee Related JP5312664B2 (ja) | 2005-12-02 | 2012-11-15 | ドープされた窒化アルミニウム結晶及びそれを製造する方法 |
| JP2013098203A Expired - Fee Related JP5436710B2 (ja) | 2005-12-02 | 2013-05-08 | ドープされた窒化アルミニウム結晶及びそれを製造する方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (6) | US7641735B2 (https=) |
| EP (1) | EP1954857B1 (https=) |
| JP (3) | JP5281408B2 (https=) |
| CN (1) | CN101331249B (https=) |
| WO (1) | WO2007065018A2 (https=) |
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| US8545629B2 (en) | 2001-12-24 | 2013-10-01 | Crystal Is, Inc. | Method and apparatus for producing large, single-crystals of aluminum nitride |
| EP1960570A2 (en) | 2005-11-28 | 2008-08-27 | Crystal Is, Inc. | Large aluminum nitride crystals with reduced defects and methods of making them |
| JP5281408B2 (ja) * | 2005-12-02 | 2013-09-04 | クリスタル・イズ,インコーポレイテッド | ドープされた窒化アルミニウム結晶及びそれを製造する方法 |
| US9034103B2 (en) | 2006-03-30 | 2015-05-19 | Crystal Is, Inc. | Aluminum nitride bulk crystals having high transparency to ultraviolet light and methods of forming them |
| EP2007933B1 (en) * | 2006-03-30 | 2017-05-10 | Crystal Is, Inc. | Methods for controllable doping of aluminum nitride bulk crystals |
| US9771666B2 (en) | 2007-01-17 | 2017-09-26 | Crystal Is, Inc. | Defect reduction in seeded aluminum nitride crystal growth |
| US8323406B2 (en) | 2007-01-17 | 2012-12-04 | Crystal Is, Inc. | Defect reduction in seeded aluminum nitride crystal growth |
| CN101652832B (zh) * | 2007-01-26 | 2011-06-22 | 晶体公司 | 厚的赝晶氮化物外延层 |
| US8080833B2 (en) * | 2007-01-26 | 2011-12-20 | Crystal Is, Inc. | Thick pseudomorphic nitride epitaxial layers |
| US8088220B2 (en) * | 2007-05-24 | 2012-01-03 | Crystal Is, Inc. | Deep-eutectic melt growth of nitride crystals |
| JP5303941B2 (ja) * | 2008-01-31 | 2013-10-02 | 住友電気工業株式会社 | AlxGa1−xN単結晶の成長方法 |
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| JP5665745B2 (ja) * | 2009-08-04 | 2015-02-04 | Dowaエレクトロニクス株式会社 | 電子デバイス用エピタキシャル基板およびその製造方法 |
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| WO2012012384A1 (en) | 2010-07-20 | 2012-01-26 | Hexatech, Inc. | Polycrystalline aluminum nitride material and method of production thereof |
| US8654807B2 (en) | 2010-11-18 | 2014-02-18 | The Board Of Trustees Of The Leland Stanford Junior University | Electrical devices formed using ternary semiconducting compounds |
| WO2012082729A1 (en) | 2010-12-14 | 2012-06-21 | Hexatech, Inc. | Thermal expansion engineering for polycrystalline aluminum nitride sintered bodies, and application to the manufacture of semi-conductors |
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| CN103361729B (zh) * | 2012-04-10 | 2016-08-03 | 深圳大学 | 一种制备p型氮化铝晶体的方法 |
| JP6042545B2 (ja) | 2012-08-23 | 2016-12-14 | 国立大学法人東京農工大学 | 高透明性窒化アルミニウム単結晶層、及びこれからなる素子 |
| JP6190582B2 (ja) * | 2012-10-26 | 2017-08-30 | 古河電気工業株式会社 | 窒化物半導体装置の製造方法 |
| US9299883B2 (en) | 2013-01-29 | 2016-03-29 | Hexatech, Inc. | Optoelectronic devices incorporating single crystalline aluminum nitride substrate |
| JP2016520992A (ja) | 2013-03-14 | 2016-07-14 | ヘクサテック,インコーポレイテッド | 窒化アルミニウム単結晶基板を組込んだパワー半導体デバイス |
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| CN110137321A (zh) * | 2019-04-19 | 2019-08-16 | 西安电子科技大学 | 基于体氮化铝衬底的垂直结构紫外发光二极管及制备方法 |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2007065018A2 (en) | 2007-06-07 |
| US20170084702A1 (en) | 2017-03-23 |
| JP2013032287A (ja) | 2013-02-14 |
| EP1954857A2 (en) | 2008-08-13 |
| US11183567B2 (en) | 2021-11-23 |
| JP2009518263A (ja) | 2009-05-07 |
| CN101331249B (zh) | 2012-12-19 |
| EP1954857B1 (en) | 2018-09-26 |
| US20190035898A1 (en) | 2019-01-31 |
| WO2007065018A3 (en) | 2007-08-02 |
| US10068973B2 (en) | 2018-09-04 |
| US20200350411A1 (en) | 2020-11-05 |
| JP2013155112A (ja) | 2013-08-15 |
| US20100187541A1 (en) | 2010-07-29 |
| US9525032B2 (en) | 2016-12-20 |
| US20140231725A1 (en) | 2014-08-21 |
| JP5312664B2 (ja) | 2013-10-09 |
| US20070131160A1 (en) | 2007-06-14 |
| JP5436710B2 (ja) | 2014-03-05 |
| US10692980B2 (en) | 2020-06-23 |
| CN101331249A (zh) | 2008-12-24 |
| US8747552B2 (en) | 2014-06-10 |
| US7641735B2 (en) | 2010-01-05 |
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