JP5004410B2 - 光素子の樹脂封止成形方法および樹脂封止成形装置 - Google Patents

光素子の樹脂封止成形方法および樹脂封止成形装置 Download PDF

Info

Publication number
JP5004410B2
JP5004410B2 JP2004129395A JP2004129395A JP5004410B2 JP 5004410 B2 JP5004410 B2 JP 5004410B2 JP 2004129395 A JP2004129395 A JP 2004129395A JP 2004129395 A JP2004129395 A JP 2004129395A JP 5004410 B2 JP5004410 B2 JP 5004410B2
Authority
JP
Japan
Prior art keywords
mold
resin
cavity
release film
lower mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004129395A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005305954A (ja
JP2005305954A5 (https=
Inventor
慎二 高瀬
一輝 川窪
洋平 大西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2004129395A priority Critical patent/JP5004410B2/ja
Priority to US11/178,400 priority patent/US7811491B2/en
Publication of JP2005305954A publication Critical patent/JP2005305954A/ja
Priority to US11/702,638 priority patent/US8696951B2/en
Publication of JP2005305954A5 publication Critical patent/JP2005305954A5/ja
Priority to US12/210,148 priority patent/US8193558B2/en
Application granted granted Critical
Publication of JP5004410B2 publication Critical patent/JP5004410B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H10W74/017—Auxiliary layers for moulds, e.g. release layers or layers preventing residue
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • B29C2043/5076—Removing moulded articles using belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B29L2011/0016—Lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/747—Lightning equipment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2004129395A 2004-04-26 2004-04-26 光素子の樹脂封止成形方法および樹脂封止成形装置 Expired - Lifetime JP5004410B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004129395A JP5004410B2 (ja) 2004-04-26 2004-04-26 光素子の樹脂封止成形方法および樹脂封止成形装置
US11/178,400 US7811491B2 (en) 2004-04-26 2005-07-12 Method for manufacturing optical electronic component
US11/702,638 US8696951B2 (en) 2004-04-26 2007-02-06 Manufacturing method of optical electronic components and optical electronic components manufactured using the same
US12/210,148 US8193558B2 (en) 2004-04-26 2008-09-12 Optical electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004129395A JP5004410B2 (ja) 2004-04-26 2004-04-26 光素子の樹脂封止成形方法および樹脂封止成形装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007095948A Division JP5036372B2 (ja) 2007-04-02 2007-04-02 光電子部品および光電子部品の製造方法

Publications (3)

Publication Number Publication Date
JP2005305954A JP2005305954A (ja) 2005-11-04
JP2005305954A5 JP2005305954A5 (https=) 2007-05-24
JP5004410B2 true JP5004410B2 (ja) 2012-08-22

Family

ID=35186236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004129395A Expired - Lifetime JP5004410B2 (ja) 2004-04-26 2004-04-26 光素子の樹脂封止成形方法および樹脂封止成形装置

Country Status (2)

Country Link
US (3) US7811491B2 (https=)
JP (1) JP5004410B2 (https=)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5004410B2 (ja) * 2004-04-26 2012-08-22 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法および樹脂封止成形装置
JP5128047B2 (ja) * 2004-10-07 2013-01-23 Ｔｏｗａ株式会社 光デバイス及び光デバイスの生産方法
US7344902B2 (en) * 2004-11-15 2008-03-18 Philips Lumileds Lighting Company, Llc Overmolded lens over LED die
US7985357B2 (en) * 2005-07-12 2011-07-26 Towa Corporation Method of resin-sealing and molding an optical device
JP5192646B2 (ja) * 2006-01-16 2013-05-08 Ｔｏｗａ株式会社 光素子の樹脂封止方法、その樹脂封止装置、および、その製造方法
JP4836661B2 (ja) * 2006-05-17 2011-12-14 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び樹脂封止成形用金型
US7795632B2 (en) 2006-06-26 2010-09-14 Osram Sylvania Inc. Light emitting diode with direct view optic
US20080031991A1 (en) * 2006-08-02 2008-02-07 Moya International Co., Ltd. Injection mold for glass encapsulation
JP4858966B2 (ja) * 2006-11-02 2012-01-18 Ｔｏｗａ株式会社 電子部品の圧縮成形方法及び成形装置
TW200830573A (en) * 2007-01-03 2008-07-16 Harvatek Corp Mold structure for packaging light-emitting diode chip and method for packaging light-emitting diode chip
JP2008205149A (ja) * 2007-02-20 2008-09-04 Towa Corp 発光体の形成方法及び金型
JP2008207450A (ja) * 2007-02-27 2008-09-11 Towa Corp 発光素子の圧縮成形方法
CN101681010A (zh) * 2007-07-03 2010-03-24 柯尼卡美能达精密光学株式会社 摄影装置的制造方法、摄影装置以及光学元件
JP5192749B2 (ja) * 2007-08-10 2013-05-08 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法及び装置
JP2009094199A (ja) * 2007-10-05 2009-04-30 Sharp Corp 発光装置、面光源、表示装置と、その製造方法
JP2009117536A (ja) * 2007-11-05 2009-05-28 Towa Corp 樹脂封止発光体及びその製造方法
WO2010080382A1 (en) * 2008-12-18 2010-07-15 Novartis Ag Method of making an injection molded ophthalmic lens mold and of making an ophthalmic lens
HUE039327T2 (hu) * 2008-12-18 2018-12-28 Novartis Ag Szerszám és eljárás szemészeti lencsék gyártására
JP5672652B2 (ja) * 2009-03-17 2015-02-18 凸版印刷株式会社 半導体素子用基板の製造方法および半導体装置
JP2010245477A (ja) 2009-04-10 2010-10-28 Dow Corning Toray Co Ltd 光デバイス及びその製造方法
JP5163721B2 (ja) * 2010-09-17 2013-03-13 第一精工株式会社 樹脂封止装置および樹脂封止方法
JP5562273B2 (ja) * 2011-03-02 2014-07-30 Ｔｏｗａ株式会社 光電子部品の製造方法及び製造装置
DE202011000852U1 (de) * 2011-04-12 2011-06-09 Flextronics Automotive GmbH & Co.KG, 72636 LED-Leuchte
US20130037931A1 (en) * 2011-08-08 2013-02-14 Leo M. Higgins, III Semiconductor package with a heat spreader and method of making
JP5658108B2 (ja) * 2011-08-23 2015-01-21 Ｔｏｗａ株式会社 反射体付基板の製造方法及び製造装置
US9618185B2 (en) 2012-03-08 2017-04-11 Flextronics Ap, Llc LED array for replacing flourescent tubes
JP2013230618A (ja) 2012-04-27 2013-11-14 Dow Corning Toray Co Ltd 離型フィルム、圧縮成型方法、および圧縮成型装置
US9366394B2 (en) 2012-06-27 2016-06-14 Flextronics Ap, Llc Automotive LED headlight cooling system
CN105393374B (zh) * 2013-07-19 2019-05-28 亮锐控股有限公司 具有光学元件并且没有衬底载体的pc led
US9395067B2 (en) 2013-10-07 2016-07-19 Flextronics Ap, Llc Method of and apparatus for enhanced thermal isolation of low-profile LED lighting fixtures
JP6057880B2 (ja) * 2013-11-28 2017-01-11 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給方法及び供給装置
US9620436B2 (en) 2014-04-09 2017-04-11 Invensas Corporation Light emitting diode device with reconstituted LED components on substrate
JP6310773B2 (ja) * 2014-05-22 2018-04-11 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
EP2960036A1 (en) * 2014-06-26 2015-12-30 TCTech Sweden AB Method and device for embossing/pressing
CN104253194A (zh) * 2014-09-18 2014-12-31 易美芯光（北京）科技有限公司 一种芯片尺寸白光led的封装结构及方法
EP3001096B1 (en) * 2014-09-26 2018-04-18 OSRAM GmbH A lighting device and corresponding method
JP6236486B2 (ja) * 2016-03-07 2017-11-22 Ｔｏｗａ株式会社 位置調節機構、樹脂封止装置、樹脂封止方法、及び樹脂封止製品の製造方法。
JP7018377B2 (ja) * 2018-11-26 2022-02-10 Ｔｏｗａ株式会社 成形型、樹脂成形装置、樹脂成形品の製造方法
JP7149238B2 (ja) * 2019-08-09 2022-10-06 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
CN114206573A (zh) * 2019-08-13 2022-03-18 美国陶氏有机硅公司 制造弹性体制品的方法
JP7121763B2 (ja) * 2020-02-14 2022-08-18 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法
CN115877607B (zh) * 2021-09-28 2024-11-12 青岛智动精工电子有限公司 灯板的成型方法、背光模组和显示设备
CN117283816B (zh) * 2023-10-16 2025-03-14 宁波吉海模具有限公司 一种无顶出易脱模的注塑模具及其注塑方法

Family Cites Families (85)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2796634A (en) * 1953-12-21 1957-06-25 Ibm Reverse forming process for making shaped articles from plastic sheet material
JPS611067A (ja) 1984-06-13 1986-01-07 Stanley Electric Co Ltd プリント基板に装着されたｌｅｄチツプのモ−ルド方法
US5238640A (en) * 1984-12-10 1993-08-24 Sumitomo Chemical Co., Limited Method of manufacturing a laminated body
US4944908A (en) * 1988-10-28 1990-07-31 Eaton Corporation Method for forming a molded plastic article
EP0424969A3 (en) * 1989-10-27 1992-08-19 Brother Kogyo Kabushiki Kaisha Method for forming lens at end portion of optical apparatus, optical signal transmission apparatus, and optical information processing apparatus
US5147821A (en) * 1990-09-28 1992-09-15 Motorola, Inc. Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation
JPH04348088A (ja) 1991-05-24 1992-12-03 Nec Corp 光電変換装置
JP2912988B2 (ja) 1992-06-23 1999-06-28 アルプス電気株式会社 真空成形金型
JP3575812B2 (ja) * 1992-07-31 2004-10-13 住友化学工業株式会社 多層成形品およびその製造方法
JP2968896B2 (ja) * 1993-02-16 1999-11-02 高島屋日発工業株式会社 表皮一体積層体の製造法およびこれに用いる金型装置
EP0687538B1 (en) * 1994-01-06 2002-03-27 Otsuka Kagaku Kabushiki Kaisha Resin composition for a mold, mold and molding method using the same mold
EP1213754A3 (en) * 1994-03-18 2005-05-25 Hitachi Chemical Co., Ltd. Fabrication process of semiconductor package and semiconductor package
JP2994219B2 (ja) * 1994-05-24 1999-12-27 シャープ株式会社 半導体デバイスの製造方法
US5744087A (en) * 1994-09-26 1998-04-28 Becton, Dickinson And Company Medical articles and method therefor
US5846477A (en) * 1994-12-08 1998-12-08 Nitto Denko Corporation Production method for encapsulating a semiconductor device
US5795529A (en) * 1995-05-31 1998-08-18 Acushnet Company Fast thermal response mold
JPH09123206A (ja) * 1995-10-30 1997-05-13 Towa Kk 電子部品の樹脂封止成形装置
US5876765A (en) * 1995-11-09 1999-03-02 Micron Technology, Inc. Injection molding equipment for encapsulating semiconductor die and the like
US6881611B1 (en) * 1996-07-12 2005-04-19 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
US5776514A (en) * 1996-09-20 1998-07-07 Johnson & Johnson Vision Products, Inc. On-demand fast cycle mold
JP3282988B2 (ja) * 1997-05-01 2002-05-20 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
JP3017470B2 (ja) * 1997-07-11 2000-03-06 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
JP3680005B2 (ja) * 1998-07-10 2005-08-10 アピックヤマダ株式会社 半導体装置の製造方法及び樹脂封止装置
EP0971401B1 (en) * 1998-07-10 2010-06-09 Apic Yamada Corporation Method of manufacturing semiconductor devices and a resin molding machine therefor
JP3494586B2 (ja) * 1999-03-26 2004-02-09 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP3580732B2 (ja) * 1999-06-30 2004-10-27 富士通株式会社 色温度若しくは色偏差を一定にするプラズマ・ディスプレイ・パネル
JP4416218B2 (ja) * 1999-09-14 2010-02-17 アピックヤマダ株式会社 樹脂封止方法及び樹脂封止装置
JP2001168117A (ja) * 1999-12-06 2001-06-22 Idemitsu Petrochem Co Ltd 半導体素子の封止用離型フィルム及びそれを用いる半導体素子の封止方法
JP2001176902A (ja) * 1999-12-16 2001-06-29 Apic Yamada Corp 樹脂封止方法
JP3581814B2 (ja) * 2000-01-19 2004-10-27 Ｔｏｗａ株式会社 樹脂封止方法及び樹脂封止装置
JP2001223285A (ja) 2000-02-09 2001-08-17 Rohm Co Ltd チップ型半導体装置及びその製造方法
US6438826B2 (en) * 2000-02-10 2002-08-27 Towa Corporation Electronic component, method of sealing electronic component with resin, and apparatus therefor
JP3956335B2 (ja) * 2000-03-06 2007-08-08 シャープ株式会社 樹脂注型用金型を用いた半導体装置の製造方法
US20020014693A1 (en) * 2000-03-21 2002-02-07 Pollock Jeffrey James Molded array package for facilitating device singulation
US20020123163A1 (en) * 2000-04-24 2002-09-05 Takehiro Fujii Edge-emitting light-emitting semiconductor device and method of manufacture thereof
US20030039717A1 (en) * 2000-05-01 2003-02-27 Hwang C. Robin Injection molding of thermoplastic parts
JP4230679B2 (ja) * 2000-06-26 2009-02-25 株式会社東芝 半導体樹脂モールド装置および半導体樹脂モールド方法
JP4484329B2 (ja) 2000-07-21 2010-06-16 アピックヤマダ株式会社 樹脂封止方法及び樹脂封止装置
US6439869B1 (en) * 2000-08-16 2002-08-27 Micron Technology, Inc. Apparatus for molding semiconductor components
US6614103B1 (en) * 2000-09-01 2003-09-02 General Electric Company Plastic packaging of LED arrays
JP2002166448A (ja) 2000-12-01 2002-06-11 Sony Corp 成形用金型装置および成形方法
AUPR245601A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus (WSM09)
US6734571B2 (en) * 2001-01-23 2004-05-11 Micron Technology, Inc. Semiconductor assembly encapsulation mold
DE10107743A1 (de) * 2001-02-16 2002-09-05 Webasto Vehicle Sys Int Gmbh Vorrichtung zum Umschäumen einer transparenten Scheibe für ein Fahrzeugdach
JP2002314100A (ja) 2001-04-19 2002-10-25 Yazaki Corp 樹脂封止型半導体装置の製造方法
JP2002319711A (ja) 2001-04-20 2002-10-31 Citizen Electronics Co Ltd 表面実装型発光ダイオード及びその製造方法
US6949771B2 (en) * 2001-04-25 2005-09-27 Agilent Technologies, Inc. Light source
US6989412B2 (en) * 2001-06-06 2006-01-24 Henkel Corporation Epoxy molding compounds containing phosphor and process for preparing such compositions
JP4789350B2 (ja) * 2001-06-11 2011-10-12 シチズン電子株式会社 発光ダイオードの製造方法
JP3844196B2 (ja) * 2001-06-12 2006-11-08 シチズン電子株式会社 発光ダイオードの製造方法
TW552726B (en) * 2001-07-26 2003-09-11 Matsushita Electric Works Ltd Light emitting device in use of LED
TW567619B (en) * 2001-08-09 2003-12-21 Matsushita Electric Industrial Co Ltd LED lighting apparatus and card-type LED light source
US6531328B1 (en) * 2001-10-11 2003-03-11 Solidlite Corporation Packaging of light-emitting diode
JP2003163382A (ja) 2001-11-29 2003-06-06 Matsushita Electric Ind Co Ltd 受光素子または発光素子用パッケージ
JP2003244077A (ja) * 2002-02-18 2003-08-29 Sharp Corp リモコン送信機能付き赤外線通信用モジュール
DE50310139D1 (de) * 2002-03-25 2008-08-28 Awm Mold Tech Ag Spritzgusswerkzeug für die Herstellung von scheibenförmigen Informationsträgern
JP3709175B2 (ja) 2002-05-02 2005-10-19 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法
TW546799B (en) * 2002-06-26 2003-08-11 Lingsen Precision Ind Ltd Packaged formation method of LED and product structure
JP2004088713A (ja) 2002-06-27 2004-03-18 Olympus Corp 撮像レンズユニットおよび撮像装置
JP4174263B2 (ja) * 2002-08-12 2008-10-29 アピックヤマダ株式会社 樹脂モールド方法
US6599768B1 (en) * 2002-08-20 2003-07-29 United Epitaxy Co., Ltd. Surface mounting method for high power light emitting diode
JP4268389B2 (ja) 2002-09-06 2009-05-27 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
KR20070096020A (ko) 2002-09-17 2007-10-01 앤터온 비.브이. 카메라 디바이스, 카메라 디바이스 제조 방법, 웨이퍼스케일 패키지 및 광학 어셈블리
JP2004134672A (ja) * 2002-10-11 2004-04-30 Sony Corp 超薄型半導体装置の製造方法および製造装置、並びに超薄型の裏面照射型固体撮像装置の製造方法および製造装置
JP4262468B2 (ja) * 2002-10-30 2009-05-13 アピックヤマダ株式会社 樹脂モールド方法、樹脂モールド装置およびこれに用いる支持治具
TW200414572A (en) * 2002-11-07 2004-08-01 Matsushita Electric Industrial Co Ltd LED lamp
CN100352069C (zh) * 2002-11-25 2007-11-28 松下电器产业株式会社 Led照明光源
JP4519398B2 (ja) * 2002-11-26 2010-08-04 Ｔｏｗａ株式会社 樹脂封止方法及び半導体装置の製造方法
JP4052939B2 (ja) 2002-12-17 2008-02-27 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP4336499B2 (ja) 2003-01-09 2009-09-30 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP2004233482A (ja) 2003-01-29 2004-08-19 Sanyo Electric Co Ltd カメラモジュールの製造方法
US7095053B2 (en) * 2003-05-05 2006-08-22 Lamina Ceramics, Inc. Light emitting diodes packaged for high temperature operation
US7157745B2 (en) * 2004-04-09 2007-01-02 Blonder Greg E Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them
JP4731102B2 (ja) 2003-05-09 2011-07-20 Ｔｏｗａ株式会社 樹脂封止用型及び樹脂封止方法
JP4106003B2 (ja) * 2003-09-03 2008-06-25 松下電器産業株式会社 固体撮像装置の製造方法
KR100586944B1 (ko) * 2003-12-26 2006-06-07 삼성전기주식회사 고출력 발광다이오드 패키지 및 제조방법
JP4373237B2 (ja) * 2004-02-13 2009-11-25 Ｔｏｗａ株式会社 半導体チップの樹脂封止成形方法および樹脂封止成形用金型
JP3983793B2 (ja) * 2004-04-19 2007-09-26 松下電器産業株式会社 Ｌｅｄ照明光源の製造方法およびｌｅｄ照明光源
JP5004410B2 (ja) 2004-04-26 2012-08-22 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法および樹脂封止成形装置
KR20070012501A (ko) * 2004-04-28 2007-01-25 마츠시타 덴끼 산교 가부시키가이샤 발광장치 및 그 제조방법
KR100576866B1 (ko) * 2004-06-16 2006-05-10 삼성전기주식회사 발광다이오드 및 그 제조방법
US6881980B1 (en) * 2004-06-17 2005-04-19 Chunghwa Picture Tubes, Ltd. Package structure of light emitting diode
US7473933B2 (en) * 2004-10-29 2009-01-06 Ledengin, Inc. (Cayman) High power LED package with universal bonding pads and interconnect arrangement
US7452737B2 (en) * 2004-11-15 2008-11-18 Philips Lumileds Lighting Company, Llc Molded lens over LED die
US7985357B2 (en) * 2005-07-12 2011-07-26 Towa Corporation Method of resin-sealing and molding an optical device

Also Published As

Publication number Publication date
JP2005305954A (ja) 2005-11-04
US20070132135A1 (en) 2007-06-14
US7811491B2 (en) 2010-10-12
US8696951B2 (en) 2014-04-15
US8193558B2 (en) 2012-06-05
US20050242452A1 (en) 2005-11-03
US20090258189A1 (en) 2009-10-15

Similar Documents

Publication Publication Date Title
JP5004410B2 (ja) 光素子の樹脂封止成形方法および樹脂封止成形装置
JP2005305954A5 (https=)
JP5036372B2 (ja) 光電子部品および光電子部品の製造方法
US7618573B2 (en) Resin sealing method for electronic part and mold used for the method
JP4268389B2 (ja) 電子部品の樹脂封止成形方法及び装置
KR100822944B1 (ko) 전자부품의 수지 밀봉 성형 방법
US8771563B2 (en) Manufacturing method of optical electronic components and optical electronic components manufactured using the same
KR101764525B1 (ko) 수지 밀봉 방법 및 수지 밀봉 장치
JP5192646B2 (ja) 光素子の樹脂封止方法、その樹脂封止装置、および、その製造方法
TWI463707B (zh) 光電部件製造方法、光電部件製造系統和光電部件
KR20080096749A (ko) 전자 부품의 수지 밀봉 성형 방법
JP2009051107A (ja) 光素子の樹脂封止成形方法及び装置
JP6304517B1 (ja) 樹脂封止方法及び樹脂封止装置
JP5364944B2 (ja) モールド金型
JP4358501B2 (ja) 電子部品の樹脂封止成形方法及び金型
TWI466340B (zh) 封膠材料形成裝置及其方法
JP4058330B2 (ja) 真空吐出成形装置及び真空吐出成形方法
JP5027451B2 (ja) 半導体チップの樹脂封止成形方法
JP2005150458A (ja) 半導体チップの樹脂封止成形方法および樹脂封止成形用金型
JP2005236133A (ja) 樹脂封止成形方法
JP2005150476A (ja) 電子部品の樹脂封止成形方法及び金型

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070324

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070402

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070402

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090924

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100119

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100311

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110405

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110527

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120228

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120417

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120515

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120522

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150601

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 5004410

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term