JP4927526B2 - 二酸化ケイ素層及び窒化ケイ素層を有する基材の研磨方法、及び化学機械的研磨系 - Google Patents

二酸化ケイ素層及び窒化ケイ素層を有する基材の研磨方法、及び化学機械的研磨系 Download PDF

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Publication number
JP4927526B2
JP4927526B2 JP2006503246A JP2006503246A JP4927526B2 JP 4927526 B2 JP4927526 B2 JP 4927526B2 JP 2006503246 A JP2006503246 A JP 2006503246A JP 2006503246 A JP2006503246 A JP 2006503246A JP 4927526 B2 JP4927526 B2 JP 4927526B2
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acid
polishing
substrate
group
layer
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JP2006520530A (ja
JP2006520530A5 (https=
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ダブリュ． カーター，フィリップ
ピー． ジョーンズ，ティモシー
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CMC Materials LLC
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Cabot Microelectronics Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2006503246A 2003-02-03 2004-02-02 二酸化ケイ素層及び窒化ケイ素層を有する基材の研磨方法、及び化学機械的研磨系 Expired - Lifetime JP4927526B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/356,970 2003-02-03
US10/356,970 US7071105B2 (en) 2003-02-03 2003-02-03 Method of polishing a silicon-containing dielectric
PCT/US2004/002908 WO2004069947A1 (en) 2003-02-03 2004-02-02 Method of polishing a silicon-containing dielectric

Publications (3)

Publication Number Publication Date
JP2006520530A JP2006520530A (ja) 2006-09-07
JP2006520530A5 JP2006520530A5 (https=) 2007-03-29
JP4927526B2 true JP4927526B2 (ja) 2012-05-09

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JP2006503246A Expired - Lifetime JP4927526B2 (ja) 2003-02-03 2004-02-02 二酸化ケイ素層及び窒化ケイ素層を有する基材の研磨方法、及び化学機械的研磨系

Country Status (7)

Country Link
US (4) US7071105B2 (https=)
EP (1) EP1601735B1 (https=)
JP (1) JP4927526B2 (https=)
KR (2) KR20050098288A (https=)
CN (1) CN1742066B (https=)
TW (1) TWI283022B (https=)
WO (1) WO2004069947A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015113399A (ja) * 2013-12-11 2015-06-22 旭硝子株式会社 研磨剤および研磨方法

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