SG191038A1 - Composition for polishing glass substrate, and polishing slurry - Google Patents
Composition for polishing glass substrate, and polishing slurry Download PDFInfo
- Publication number
- SG191038A1 SG191038A1 SG2013043716A SG2013043716A SG191038A1 SG 191038 A1 SG191038 A1 SG 191038A1 SG 2013043716 A SG2013043716 A SG 2013043716A SG 2013043716 A SG2013043716 A SG 2013043716A SG 191038 A1 SG191038 A1 SG 191038A1
- Authority
- SG
- Singapore
- Prior art keywords
- composition
- polishing
- glass substrate
- group
- weight
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 88
- 239000000203 mixture Substances 0.000 title claims abstract description 48
- 239000011521 glass Substances 0.000 title claims abstract description 47
- 239000000758 substrate Substances 0.000 title claims abstract description 47
- 239000002002 slurry Substances 0.000 title claims abstract description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 13
- 229920001282 polysaccharide Polymers 0.000 claims abstract description 13
- 125000004414 alkyl thio group Chemical group 0.000 claims abstract description 11
- 150000004676 glycans Chemical class 0.000 claims abstract description 11
- 239000005017 polysaccharide Substances 0.000 claims abstract description 11
- 150000001412 amines Chemical class 0.000 claims abstract description 10
- 125000003396 thiol group Chemical group [H]S* 0.000 claims abstract description 9
- 150000003536 tetrazoles Chemical class 0.000 claims abstract description 8
- 239000006061 abrasive grain Substances 0.000 claims abstract description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims description 11
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 claims description 6
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 claims description 6
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 230000003746 surface roughness Effects 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 13
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 12
- 230000007547 defect Effects 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- KJUGUADJHNHALS-UHFFFAOYSA-N 1H-tetrazole Chemical compound C=1N=NNN=1 KJUGUADJHNHALS-UHFFFAOYSA-N 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- XZGLNCKSNVGDNX-UHFFFAOYSA-N 5-methyl-2h-tetrazole Chemical compound CC=1N=NNN=1 XZGLNCKSNVGDNX-UHFFFAOYSA-N 0.000 description 5
- 239000008119 colloidal silica Substances 0.000 description 5
- -1 cyclic alkylamines Chemical class 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 229920001218 Pullulan Polymers 0.000 description 3
- 239000004373 Pullulan Substances 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 3
- 229910001950 potassium oxide Inorganic materials 0.000 description 3
- 235000019423 pullulan Nutrition 0.000 description 3
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 3
- 229910001948 sodium oxide Inorganic materials 0.000 description 3
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- KIUKXJAPPMFGSW-DNGZLQJQSA-N (2S,3S,4S,5R,6R)-6-[(2S,3R,4R,5S,6R)-3-Acetamido-2-[(2S,3S,4R,5R,6R)-6-[(2R,3R,4R,5S,6R)-3-acetamido-2,5-dihydroxy-6-(hydroxymethyl)oxan-4-yl]oxy-2-carboxy-4,5-dihydroxyoxan-3-yl]oxy-5-hydroxy-6-(hydroxymethyl)oxan-4-yl]oxy-3,4,5-trihydroxyoxane-2-carboxylic acid Chemical compound CC(=O)N[C@H]1[C@H](O)O[C@H](CO)[C@@H](O)[C@@H]1O[C@H]1[C@H](O)[C@@H](O)[C@H](O[C@H]2[C@@H]([C@@H](O[C@H]3[C@@H]([C@@H](O)[C@H](O)[C@H](O3)C(O)=O)O)[C@H](O)[C@@H](CO)O2)NC(C)=O)[C@@H](C(O)=O)O1 KIUKXJAPPMFGSW-DNGZLQJQSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- OMAFFHIGWTVZOH-UHFFFAOYSA-N 1-methyltetrazole Chemical compound CN1C=NN=N1 OMAFFHIGWTVZOH-UHFFFAOYSA-N 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N 1-propanol Substances CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 229940044613 1-propanol Drugs 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- BFSVOASYOCHEOV-UHFFFAOYSA-N 2-diethylaminoethanol Chemical compound CCN(CC)CCO BFSVOASYOCHEOV-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- DBTMGCOVALSLOR-UHFFFAOYSA-N 32-alpha-galactosyl-3-alpha-galactosyl-galactose Natural products OC1C(O)C(O)C(CO)OC1OC1C(O)C(OC2C(C(CO)OC(O)C2O)O)OC(CO)C1O DBTMGCOVALSLOR-UHFFFAOYSA-N 0.000 description 1
- KYRMPMCAOPMOIR-UHFFFAOYSA-N 5-ethyl-2h-tetrazole Chemical compound CCC=1N=NNN=1 KYRMPMCAOPMOIR-UHFFFAOYSA-N 0.000 description 1
- ZBXNFTFKKOSPLD-UHFFFAOYSA-N 5-methylsulfanyl-2h-tetrazole Chemical compound CSC1=NN=NN1 ZBXNFTFKKOSPLD-UHFFFAOYSA-N 0.000 description 1
- 229920000945 Amylopectin Polymers 0.000 description 1
- 229920000856 Amylose Polymers 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- RXVWSYJTUUKTEA-UHFFFAOYSA-N D-maltotriose Natural products OC1C(O)C(OC(C(O)CO)C(O)C(O)C=O)OC(CO)C1OC1C(O)C(O)C(O)C(CO)O1 RXVWSYJTUUKTEA-UHFFFAOYSA-N 0.000 description 1
- 229920001353 Dextrin Polymers 0.000 description 1
- 239000004375 Dextrin Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229920002527 Glycogen Polymers 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 description 1
- 241000812633 Varicus Species 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 235000019425 dextrin Nutrition 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- LVTYICIALWPMFW-UHFFFAOYSA-N diisopropanolamine Chemical compound CC(O)CNCC(C)O LVTYICIALWPMFW-UHFFFAOYSA-N 0.000 description 1
- 229940043276 diisopropanolamine Drugs 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 229940096919 glycogen Drugs 0.000 description 1
- ZEKANFGSDXODPD-UHFFFAOYSA-N glyphosate-isopropylammonium Chemical compound CC(C)N.OC(=O)CNCP(O)(O)=O ZEKANFGSDXODPD-UHFFFAOYSA-N 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 229920002674 hyaluronan Polymers 0.000 description 1
- 229960003160 hyaluronic acid Drugs 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 1
- FYGDTMLNYKFZSV-UHFFFAOYSA-N mannotriose Natural products OC1C(O)C(O)C(CO)OC1OC1C(CO)OC(OC2C(OC(O)C(O)C2O)CO)C(O)C1O FYGDTMLNYKFZSV-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- FYGDTMLNYKFZSV-BYLHFPJWSA-N β-1,4-galactotrioside Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1O[C@@H]1[C@H](CO)O[C@@H](O[C@@H]2[C@@H](O[C@@H](O)[C@H](O)[C@H]2O)CO)[C@H](O)[C@H]1O FYGDTMLNYKFZSV-BYLHFPJWSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
OF THE DISCLOSUREA composition for polishing glass substrate comprising components (A), (B) and optionally (C) and/or (D), and polishing 5 slurry comprising the composition and abrasive grains.a tetrazole derivative having at least one group selected from mercapto group, alkylthio group and alkyl group,water,a high molecular polysaccharide,10 (D) an amine
Description
SPECIFICATION
COMPOSITION FOR POLISHING
GLASS SUBSTRATES, AND POLISHING SLURRY
The present invention relates to a composition for polishing glass substrate (hereinafter referred to as “composition for polishing”) such as hard disk glass substrate, optical disk glass substrate, glass substrate for plasma display (PDP), glass substrate for liquid crystal display (LCD) and glass substrate for photomask, and a polishing slurry using the composition. More particularly, the present invention relates to a composition for polishing and a polishing slurry which are excellent in improvement of surface roughness, and of convex and concave defects on the surface,
In recent years, the hard disk is required to have high recording density. It is necessary to narrow flying height of a magnetic head and a magnetic disk to improve the detectivity of the magnetic signal and to improve the recording density of the hard disk drive. Therefore, it is an important issue for glass substrate to improve surface roughness, and to improve convex and concave defects on the surface.
With an increase in the recording density of hard disks year by year, a polishing slurry for glass substrate is demanded to have high performance. For example, the slurry is first demanded to have low surface roughness, and further ils required to have no surface defects such as micropit, microspike and microscratch, and excellent polishing speed in order to enhance productivity of glass substrates.
As the composition for polishing, varicus compositions are proposed to obtain glass substrates having high-quality.
For example, a composition for polishing is proposed which contains ammonia or an aliphatic amine having primary amino group (patent literature 1). A composition for pelishing is proposed which contains carbonate or sulfate (patent literature 2).
However, the conventional composition for polishing can not provide a glass substrate having low surface roughness which is suitable for high recording density, and the problems remain.
PRIOR ART
PATENT LITERATURE
Patent Literature 1: WO 2004/100242
Patent Literature 2: JP 2006-315160 A
Bn object of the present invention is to provide a polishing slurry which can improve surface roughness and improve convex and concave defects on the surface, and a compositicn for polishing for preparing the polishing slurry.
The present inventors have found a specific composition for polishing and a polishing slurry containing abrasive grains have dissolved the above prcoblem and have achieved the present invention.
MEANS FOR SOLVING THE PROBLEM
The present invention provides the following. 1. A composition for polishing glass substrate comprising components (A) and (B). {A) a tetrazole derivative having at least one group selected from mercapto group, alkylthio group and alkyl group, and (B) water 2. A composition for pelishing glass substrate comprising components (A), (B) and (C). {A) a tetrazcle derivative having at least one group selected from mercapto group, alkylthio group and alkyl group, (B) water and (C} a high molecular polysaccharide 3. A composition for polishing glass substrate comprising components (A), (B), (C) and (D). (A) a tetrazole derivative having at least cone group selected from mercapto group, alkylthio group and alkyl group, {B} water, {C) a high molecular polysaccharide and {(D) an amine 4. A composition as defined in any of the above 1 to 3 wherein the composition is consisting of 0.01 to 20 weight % of (ay, 0.01 to 20 weight % of (C), 0.01 to 20 weight % of (D) and balance of {(B). 5. A composition as defined in any of the above 1 to 4 ’ wherein the glass substrate is hard disk glass substrate. 6. A polishing slurry comprising any of the above composition for polishing, and abrasive grains.
The peclishing slurry of the present invention can improve surface roughness and improve convex and concave defects on the surface in the processing of various glass substrate. Further, it is possible to increase polishing speed.
Detail explanation is given below about each component of the compesition for polishing glass substrate of the present invention. {A) Examples of alkylthio groups, in the tetrazocle derivative having at least one group selected from mercapto group, alkylthio group and alkyl group, are lower alkylthio group having 1 to 4 carben atoms. Examples of alkyl groups are lower alkyl group having 1 to 4 carbon atoms. Concrete examples of the tetrazole derivatives are 5S-mercapto-l-methyltetrazole, 1-[2- (dimethylamino) ethyl} -5-mercapto-lH-tetrazole, 5-(methylthio)-1H- tetrazole, 5-({ethylthio)-lH-tetrazole, 5-methyltetrazole and 5- ethyltetrazole. (B) As water is preferable purified water such as ion-exchanged water or pure water. {C) Examples of high molecular polysaccharide are pullulan, amylose, amylopectin, glycogen, dextrin and hyaluronic acid. {(D) The amine is not particularly limited. Examples thereof are linear or cyclic alkylamines having 1 to 10 carbon atoms such as isopropylamine, cyclohexylamine, diethylamine and triethylamine; alkanclamines having 1 to 10 carbon atoms such as monoethanclamine, diethanolamine, triethanolamine, monoiscpropanolamine, diisopropanolamine, triisopropanolamine, N-methylmonoethanolamine,
N-methyldiethanolamine, N-ethyidiethanolamine, N,N-dimethylethanol- amine, N,N-diethylethanol-amine, diglycclamine, Z2-amino=-Z-methyl-1- propanol, n-butanolamine, isobutanclamine and tert-butanolmine; cyclic alkylamines having 4 to 10 carbon atoms, preferably 4 to 6 carbon atoms such as morpholine and N-(2-amincethyl) piperazine,
Among these amines preferable are morpholine, N-(2- aminoethyl) piperazine, and amines of the formula (R*)mN (~-R'-OH) n wherein R! is linear or branched alkylene group having 2 to 5 carbon atoms, R® is hydrogen atom or alkyl group having 1 to 3 carbon atoms, m is 0, 1 or 2, n is an integer 1 to 3, m+tn=3.
Further, polyvalent alcchols are suitably usable. As the polyvalent alcohols are exemplified polyvalent alcchol and its alkyl ether. Examples thereof are ethylene glycecl, diethylene glycol, triethylene glycol, tetraethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, butyl carbitol, hexylene glycol, butanediol, butyl diglycocl, glycerin, ethylene glycol monomethyl ether, diethylene glycol dimethyl ether, ethylene glycol moncisopropyl ether, ethylene glycol moncbutyl ether, ethylene glycol dimethyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, propylene glycol monobutyl ether, diethylene glycel dimethyl ether, diethylene glycol diethyl ether, sorbitol and sucrose.
Contents of the components (A) to (D) are not particularly iimited. The component (A) is contained in the composition preferably in an amount of 0.01 to 20 wt.%, more preferably 0.05 to 10 wt.%, further preferably 0.1 to 5 wt.%, most preferably 1 to 5 wt.%. In case the content of the components (A) is in the above range, the polishing slurry exhibits effect of improving surface roughness and convex and concave defects on the surface. Further, it is possible to increase polishing speed.
The high molecular polysaccharide (C) is contained in the composition preferably in an amount of 0.01 to 20 wt.%, more preferably 0.05 to 10 wt.%, further preferably 0.1 to 5 wt.%, most preferably 1 to 5 wt.%. In case the content of the component (C) is in the above range, it is possible particularly to improve convex and concave defects on the surface.
The amine (D) is contained in the composition preferably in an amount of 0.01 to 20 wt.%, more preferably 0.05 to 10 wt.$%, further preferably 0.1 to 5 wt.%, most preferably 1 to 5 wt.%. In case the content of the component (D) is in the above range, it is possible to adjust pH in alkaline zone and to improve surface roughness and improve convex and concave defects on the surface.
Preferable PH range is 8 to 13.
The content of water (B) 1s residue.
The polishing slurry of the invention can be prepared by dispersing abrasive grains to the present composition for pclishing. Examples of the abrasive grains are colleidal silica, fumed silica, diamond, alumina, ceria, zirconia, titania and like various known abrasive grains. Preferable are colloidal silica and zirconia. Generally, average particle diameter of colloidal silica is about 0.001 to 1 um, preferably about 0.001 to 0.5 um, more preferably about 0.001 to 0.2 pm. The content of colloidal silica in the polishing slurry is not particularly limited but is usually up to 40 wt. %, preferably 0.1 to 20 wi. %. Generally, average particle diameter of zirconia is about 0.1 to 15 um, preferably about 0.1 to 10 pm, more preferably about 0.1 to 5 pum. The content of zirconia in the polishing slurry is not particularly limited but is usually up to 20 wt. %, preferably 0.1 to 10 wt. %.
The glass substrate te be polished by the present compesition for polishing glass substrate and the polishing slurry is not particularly limited. Examples of the glass substrate are those containing silicic acid as a main component, and containing alumina, sodium oxide or potassium oxide and like metal compound as required.
The present. polishing slurry is a slurry for processing glass substrate and is distinguished from a polishing slurry for processing a hard disk NiP alloy substrate, or usual water-soluble cutting solution, water-soluble grinding sclution or water-soluble polishing sclution for processing iron or aluminum material. In the above usual processing, the solution is usually used in circulation and is greatly different from the present siurry in the required secondary performance of preventing, for example, decay, foam and rust.
In Examples and Comparative Examples, the following pelishing evaluation was conducted. The invention is not limited to Examples.
Examples 1 to 8 and Comparative Examples 1 to ©
Compositions for polishing glass substrate were prepared by mixing ingredients shown in Takles 1 to 3 (numerical value: weight %). Water used was pure water. N=-{(Z2-amincethyl)piperazine (AEP) used in Comparative Example 1 was an aliphatic amine having a primary amino group used in WO 2004/100,242 (Patent literature 1}, and potassium carbonate in Comparative Example 2 was a carbonate used in JP 2006-315,160 A (Patent literature 2}. 1H-tetrazole,
imidazole and benzotriazole used in Comparative Examples 4 to 6 were heterocyclic compounds usually used in polishing slurry for metal materials.
A quantity of 250 g of polishing composition was diluted with 2875 g of pure water and thereto was added 1875 g of colloidal silica slurry (Adelite AT-40: silica concentration 40 %, primary particle size 10-20nm) to obtain a polishing slurry for glass substrate containing 15 wt. % of colloidal silica. Using this polishing slurry, evaluation of polishing hard disk glass substrate was conducted. The results were given in Tables 1 to 3. Surface roughness after polishing, maximum pitch difference and polishing speed in Tables 1 to 3 were evaluated relative to performance of
Compariscon Example 1 using N- (2-aminoethyl)piperazine (REP) which was taken as 1.00.
Properties of polishing slurry of Examples 1 to 8 and
Comparative Examples 1 to 6 were measured by the following methods.
Evaluation of pelishing properties
A Suede cloth pad (Nitta Haas Incorporated, Supreme RN-R) was placed on a CMP polishing device (Nano Factor Co., Ltd., NF- 300), and a hard disk glass substrate (containing silicic acid, alumina, sodium oxide, potassium oxide, etc.) of 2.5 inches in diameter was polished by supplying a polishing slurry at speed of 150 ml/min. for 5 minutes under conditions of platen revolution of 30 rotations/min., head revolution of 30 rotations/min., and polishing pressure of 20 g/cm®’. Polishing properties were evaluated by measuring surface roughness after polishing, maximum pitch difference and polishing speed by the following methods.
Surface roughness:
Surface roughness (Ra) after polishing was measured using a scanning probe microscope (SII Nano Technology Inc., SPA-400) in an
AFM mode.
Maximum pitch difference:
Maximum pitch difference is a distance between maximum mountain (Rp) and maximum valley {Rv) on glass surface. This is a method of evaluating convex and concave defects cn the surface.
Maximum pitch difference after polishing was measured using a scanning probe microscope {SPA-400) in an AFM mode.
Polishing speed:
The glass substrate was checked for weight change before and after polishing by electronic balance (SARTORIUS K.K., LE225D) to obtain polishing amount and peclishing speed.
Table 1 tetrazole | S-mercapto-1- 2 4 5 derivative| methyltetrazole \ N- (Z—aminoethyl) ml inorganic | potassium 5 salts carbonate {relative comparison with 0.47 0.51 1.00 1.30 1.28
Cam, Ex. 1)
Maximum pitch difference {relative comparison with 0.81 0.80 0.67 1.00 2.64 1.49
Cam. Ex. 1) polishing speed {relative comparison with 1.28 1.94 1.99 1.00 1.64 1.01
Com. Ex. 1}
Table 2
Comparative 2 | sss] 4] 56] 5mercepto-1- F717 17 1 1 1 1 methyltetrazole 5-(methylthio)- 1H-tetrazole tetrazole | 5-(ethylthio)- derivative; 1H-tetrazole > 4 methyltetrazole poems || | | [0] |] oe mae | | | | | [ cyclic
To fom] ||| 1
Surface roughness | } TT IR (relative comparison with 0.47) 0.47] 0.30! 0.33 0.65] 0.68 | 0.58
Com. Ex. 1)
Maximum pitch difference {relative comparison with 0.80] 0.970.431 0.53} 1.13] 1.70} 1.52
Com. Ex. 1) polishing speed (relative comparison with 1.94 | 1.77 1.521.841 1.99 1.51
Com. Ex. 1)
Table 3
EEE tetrazole S5-mercapto-1i- 2 2 5 derivative methyltetrazole high pullulan molecular (maltotriose 1,6 bond 1 1 polysaccaride | polysaccharide
Surface roughness 0.71 0.52 (relative comparison with Com. Ex. 1)
Maximum pitch difference {relative comparison with Com. Ex. 1) polishing speed (relative comparison with Com. Ex. 1) 1.28 1.24 1.53
Table 1 shows polishing compositions of Examples 1 to 3 are confirmed tc be improved than Comparative Examples 1 to 3 in surface roughness and maximum pitch difference,
Table 2 shows polishing compositions of Examples 2, 4 to 6 are confirmed to ke improved than Comparative Examples 4 to 6 in which 1H-tetrazole, imidazole and benzotriazole were used in surface roughness and maximum pitch difference.
Table 3 shows maximum pitch difference was confirmed to be greatly improved by adding high molecular polysaccharide.
Further, it is confirmed both of surface roughness and maximum pitch difference were improved by adding high molecular polysaccharide and amine.
Examples 9 and 10, and Comparative Example 7
Compositions for polishing glass substrate were prepared by mixing ingredients shown in Table 4 (numerical value: weight %).
Water used was pure water. Comparative Example 7 contains only water.
A quantity of 10 g of polishing composition was diluted with 170 g of pure water and thereto was added 20 g of zirconia {(Kishida
Chemical Co., Ltd.: particle size 4 um) to obtain a polishing slurry for glass substrate containing 10 wt. % of zirconia. Using this polishing slurry, evaluation of polishing hard disk glass substrate was conducted. The results were given in Table 4.
Surface roughness after polishing, maximum pitch difference and pelishing speed in Table 4 were evaluated relative to performance of Comparison Example 1 which was taken as 1.00.
Properties of polishing slurry of Examples 9 and 10, and
Comparative Example 7 were measured by the following methods.
Evaluation of polishing properties
An urethane pad (Nitta Haas Incorporated, IC 1000) was placed on a CMP polishing device {Nanc Factor Co., Ltd., NF-300), and a hard disk glass substrate (containing silicic acid, alumina, sodium oxide, potassium oxide, etc.) of 2.5 inches in diameter was polished by supplying a polishing slurry at speed of 50 ml/min. for 2 minutes under conditions of platen revocluticn of 50 rotations/min., head revolution of 50 rotations/min., and polishing pressure of 360 g/cm’. Polishing properties were evaluated by measuring surface roughness after polishing, maximum pitch difference and polishing speed by the following methods.
Surface roughness:
Surface roughness (Ra) after polishing was measured using a scanning probe microsceps {Shimadzu Corporation, SPEM-9700) in a DFM mode.
Maximum pitch difference:
Maximum pitch difference is a distance between maximum mountain (Rp) and maximum valley (Rv) on glass surface. This is a method of evaluating convex and concave defects on the surface.
Maximum pitch difference after polishing was measured using a scanning probe microscope (Shimadzu Corporation, SPM-9700) in a DFM mode.
Polishing speed:
The glass substrate was checked for weight change before and after polishing by electronic balance (SARTORIUS K.K., LE225D) to obtain polishing amcunt and polishing speed.
Table 4
Cs [ws | 7
TEE wn, |]: derivative methyltetrazole high pullulan ee polysaccaride | polysaccharide in Jem || 5 eintive compasismn mith con, 5 7 | 0-66 | 0-42 | 100 {relative comparison with Com. Ex. 7)
Table 4 shows peclishing compositions of Examples 9 and 10 are confirmed to be improved than Comparative Example 7 in surface roughness, maximum pitch difference and polishing speed.
The present composition and polishing slurry are applicable, for example, to grind and cut glass substrate for hard disk glass substrate, optical disk glass substrate, glass substrate for plasma display (PDP), glass substrate for liquid crystal display (LCD) and glass substrate for photomask.
Claims (11)
1. A composition for polishing glass substrate comprising components (A) and (B). (A) a tetrazole derivative having at least one group selected from mercapto group, alkylthio group and alkyl group, and (B) water
2. A composition for peclishing glass substrate comprising components (A), (B) and (C). (A) a tetrazole derivative having at least one group selected from mercapto group, alkylthio group znd alkyl group, 5 (B} water and (C) a high molecular polysaccharide
3. A composition for polishing glass substrate comprising components (A), (B), (C) and (D}. {AR} a tetrazcle derivative having at least one group selected from mercapto group, alkylthio group and alkyl group, 5 (B) water, (C) a high molecular polysaccharide and (D} an amine
4, BA composition as defined in any of claims 1 to 3 wherein the tetrazcle derivative is a tetrazole derivative having at least one group selected from mercapto group, alkylthio group having 1 to 4 carbon atoms and alkyl group having 1 to 4 carbon atoms.
5. A composition as defined in claim 3 wherein the amine is an amine of the formula (R?) mN (-R*-OH) n (wherein R'! is linear or branched alkylene group having 2 to 5 5 carbon atoms, R? is hydrogen atom or alkyl group having 1 to 3 carbon atoms, m is 0, I or 2, n is an integer 1 to 3, mtn=3}, morpholine or N-(Z2-aminoethyl)piperazine.
6. A composition as defined in any of claims 1 to 5 wherein the composition is consisting of 0.01 to 20 weight % of (A), 0.01 to 20 weight % of (C), 0.01 to 20 weight % of {D) and balance of
(B).
7. A composition as defined in claim 1 wherein the composition is consisting of 0.1 to 5 weight % of (A) and balance of (B}.
8. A composition as defined in claim 2 wherein the composition is consisting of 0.1 to 5 weight & of (A), 0.1 to 5 weight % of (C) and balance of (B).
9. A composition as defined in claim 3 wherein the composition is consisting of 0.1 to 5 weight % of (A), 0.1 to 5 weight % of (C), 0.05 to 10 weight % of (D) and balance of (B).
10. A composition as defined in any of claims 1 to 9 wherein the giass substrate is hard disk glass substrate.
11. A polishing slurry comprising a polishing composition of any of claims 1 to 10, and abrasive grains.
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|---|---|---|---|
| JP2010271434 | 2010-12-06 | ||
| PCT/JP2011/078231 WO2012077693A1 (en) | 2010-12-06 | 2011-11-30 | Composition for polishing glass substrate, and polishing slurry |
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| CN (1) | CN103249525B (en) |
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| JP4273475B2 (en) * | 1999-09-21 | 2009-06-03 | 株式会社フジミインコーポレーテッド | Polishing composition |
| JP2001269859A (en) * | 2000-03-27 | 2001-10-02 | Jsr Corp | Aqueous dispersing element for polishing chemical machine |
| JP2004031446A (en) * | 2002-06-21 | 2004-01-29 | Hitachi Chem Co Ltd | Polishing solution and polishing method |
| US7553345B2 (en) * | 2002-12-26 | 2009-06-30 | Kao Corporation | Polishing composition |
| US7071105B2 (en) * | 2003-02-03 | 2006-07-04 | Cabot Microelectronics Corporation | Method of polishing a silicon-containing dielectric |
| JP2007095841A (en) * | 2005-09-27 | 2007-04-12 | Fujifilm Corp | Chemical mechanical polishing method |
| JP5080012B2 (en) * | 2006-02-24 | 2012-11-21 | 富士フイルム株式会社 | Polishing liquid for metal |
| JP5401766B2 (en) * | 2006-04-21 | 2014-01-29 | 日立化成株式会社 | CMP polishing agent and substrate polishing method |
| JP2009094430A (en) * | 2007-10-12 | 2009-04-30 | Adeka Corp | Polishing composition for cmp |
| JP5277640B2 (en) * | 2007-10-17 | 2013-08-28 | 日立化成株式会社 | Polishing liquid and polishing method for CMP |
| JP5473587B2 (en) * | 2009-12-24 | 2014-04-16 | 花王株式会社 | Polishing liquid composition for magnetic disk substrate |
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| WO2012077693A1 (en) | 2012-06-14 |
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