CN103249525B - Polished glass substrate composition and polishing slurries - Google Patents
Polished glass substrate composition and polishing slurries Download PDFInfo
- Publication number
- CN103249525B CN103249525B CN201180058490.5A CN201180058490A CN103249525B CN 103249525 B CN103249525 B CN 103249525B CN 201180058490 A CN201180058490 A CN 201180058490A CN 103249525 B CN103249525 B CN 103249525B
- Authority
- CN
- China
- Prior art keywords
- polishing
- glass substrate
- composition
- polishing slurries
- surface roughness
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Abstract
The invention provides and a kind ofly can improve the polishing slurries of polished surface roughness and concave-convex surface defect and the composition for use in polishing for the preparation of this polishing slurries in the processing of glass substrate.Polished glass substrate composition of the present invention and the polishing slurries containing this composition for use in polishing and polishing abrasive particle contain (A), (B) and (C) and/or (D) composition as required.(A) there is the terazole derivatives of at least one group in selected from mercapto, alkylthio group and alkyl; (B) water; (C) high molecular polysaccharide; (D) amine.
Description
Technical field
The present invention relates to hard disk glass substrate, CD glass substrate, plasma scope (PDP) glass substrate, liquid crystal display (LCD) the various polished glass substrate compositions (hereinafter referred to as composition for use in polishing) such as glass substrate and photomask glass substrate and the polishing slurries using it.In more detail, composition for use in polishing and the polishing slurries of the improvement excellence of polished surface roughness and concave-convex surface defect is related to.
Background technology
In recent years, the high record density of hard disk is day by day required.In order to improve the packing density of hard disk drive, and in order to improve the detection sensitivity of magnetic signal, be necessary the flying height reduced further between magnetic head and disk.For this reason, in glass substrate, polished surface roughness is improved and concave-convex surface defect becomes important topic.
The trend of this high record density is accelerated year by year, day by day increases the requirement of polished glass substrate slurry.Required project is low for representative with polished surface roughness, disappears and improve the production capacity of glass substrate to make the blemish such as micro-hole, microspike and microscratch, is requiring to improve polishing velocity.
As above-mentioned composition for use in polishing, propose the various composition for use in polishing for obtaining high quality glass substrate.
Such as in patent document 1, propose containing ammonia or the polishing slurries of aliphatic amine with primary amino radical.In addition, in patent document 2, propose the polishing slurries containing carbonate or sulfate.But, in the composition for use in polishing using prior art, can not obtain the polished surface roughness that is suitable for high record density in there is problem.
Prior art document
Patent document
Patent document 1:WO2004/100242
Patent document 2: JP 2006-315160
Summary of the invention
The problem that invention will solve
Problem of the present invention is to provide: in the processing of glass substrate, can improve the polishing slurries of polished surface roughness and concave-convex surface defect and the composition for use in polishing for the preparation of this polishing slurries.
The present inventor finds, specific composition for use in polishing and the polishing slurries containing polishing abrasive particle can solve above-mentioned problem, so far complete the present invention.
Solve the means of problem
The present invention relates to following invention.
1. polished glass substrate composition, containing (A) and (B) composition,
(A) there is the terazole derivatives of at least one group in selected from mercapto, alkylthio group and alkyl
(B) water.
2. polished glass substrate composition, containing (A), (B) and (C) composition,
(A) there is the terazole derivatives of at least one group in selected from mercapto, alkylthio group and alkyl
(B) water
(C) high molecular polysaccharide.
3. polished glass substrate composition, containing (A), (B), (C) and (D) composition,
(A) there is the terazole derivatives of at least one group in selected from mercapto, alkylthio group and alkyl,
(B) water
(C) high molecular polysaccharide
(D) amine.
4. the composition described in above-mentioned 1 ~ 3 any one, containing (A) 0.01 ~ 20 % by weight, (C) 0.01 ~ 20 % by weight, (D) 0.01 ~ 20 % by weight, (B) surplus.
5. the composition described in above-mentioned 1 ~ 4 any one, wherein, glass substrate is hard disk glass substrate.
6. polishing slurries, containing the composition for use in polishing described in above-mentioned any one and polishing abrasive particle.
Invention effect
According to the present invention, in the processing of various glass substrate, polished surface roughness and concave-convex surface defect can be improved.And then can polishing velocity be improved.
Detailed description of the invention
Below describe each composition of polished glass substrate composition of the present invention in detail.
(A) in the terazole derivatives of at least one group with selected from mercapto, alkylthio group and alkyl, as alkylthio group, such as, the lower alkylthio of carbon number 1 ~ 4 can be enumerated, as alkyl, such as, the low alkyl group of carbon number 1 ~ 4 can be enumerated.Specifically can enumerate 5-sulfydryl-1-methyl tetrazolium, 1-[2-(dimethylamino) ethyl]-5-sulfydryl-1H-TETRAZOLE, 5-(methyl mercapto)-1H-TETRAZOLE, 5-(ethylmercapto group)-1H-TETRAZOLE, 5-methyl tetrazolium, 5-ethyl tetrazolium etc.
(B) as water, the Purified Waters such as preferred ion exchanged water or pure water.
(C) as high molecular polysaccharide, such as, pulullan polysaccharide, amylose, amylopectin, glycogen, dextrin, hyaluronic acid etc. can be enumerated.
(D) amine is not particularly limited, such as isopropylamine can be enumerated, cyclohexylamine, diethylamine, the chain of the carbon numbers such as triethylamine 1 ~ 10 or the alkylamine of ring-type, MEA, diethanol amine, triethanolamine, monoisopropanolamine, diisopropanolamine (DIPA), triisopropanolamine, (2-hydroxyethyl)methylamine), N methyldiethanol amine, N-ethyldiethanolamine, N, N-dimethylethanolamine, N, N-diethyl ethylene diamine, diglycolamine, 2-amino-2-methyl-1-propanol, n-butanol amine, isobutyl hydramine, the alkanolamine of the carbon numbers 1 ~ 10 such as tert-butyl alcohol amine, morpholine, the carbon numbers 4 ~ 10 such as N-(2-amino-ethyl) piperazine, be preferably the cyclic amine etc. of carbon number 4 ~ 6.In these amine, preferred formula
(R
2)mN(-R
1-OH)n
(R
1represent the alkylidene of the straight or branched of carbon number 2 ~ 5, R
2represent the alkyl of hydrogen atom or carbon number 1 ~ 3.M be 0,1 or 2, n be the integer of 1 ~ 3, m+n=3.) amine, morpholine, N-(2-amino-ethyl) piperazine that represent.
And then, except these compositions, can also be suitable for using polyalcohols.As polyalcohols, the alkyl ether of polyalcohol and polyalcohol can be enumerated, such as, can enumerate ethylene glycol, diethylene glycol (DEG), triethylene glycol, tetraethylene glycol, propane diols, dipropylene glycol, tripropylene glycol, BC, hexylene glycol, butanediol, butyldiglycol, glycerine, ethylene glycol monomethyl ether, diethylene glycol dimethyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether, ethylene glycol dimethyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, glycol monobutyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, D-sorbite, sucrose etc.
The content of composition (A) ~ (D) in composition for use in polishing is not particularly limited, and as the content of composition (A), is preferably 0.01 ~ 20 % by weight, is more preferably 0.05 ~ 10 % by weight, more preferably 0.1 ~ 5 % by weight, most preferably be 1 ~ 5 % by weight.As long as the content of composition (A) is in above-mentioned scope, the improvement effect of polished surface roughness and concave-convex surface defect just can be obtained.And then can also polishing velocity be improved.
As the content of high molecular polysaccharide (C), be preferably 0.01 ~ 20 % by weight, be more preferably 0.05 ~ 10 % by weight, more preferably 0.1 ~ 5 % by weight, most preferably be 1 ~ 5 % by weight.As long as the content of composition (C) is in above-mentioned scope, the improvement effect of concave-convex surface defect particularly can be obtained.
As the content of amine (D), be preferably 0.01 ~ 20 % by weight, be more preferably 0.05 ~ 10 % by weight, more preferably 0.1 ~ 5 % by weight, most preferably be 1 ~ 5 % by weight.As long as pH, in above-mentioned scope, can be adjusted to alkalescence by the content of composition (D), obtain the improvement effect of polished surface roughness and concave-convex surface defect.Preferred pH scope is 8 ~ 13.
The content of water (B) is surplus.
By disperseing polishing abrasive particle in composition for use in polishing of the present invention, polishing slurries of the present invention can be obtained.As polishing abrasive particle, such as, can adopt the various known polishing abrasive particles such as cataloid, fumed silica, diamond, aluminium oxide, ceria, zirconia, titanium oxide.Wherein, as polishing abrasive particle, preferred cataloid and zirconia.As the size of cataloid, generally, average grain diameter can be 0.001 ~ 1 μm, is preferably 0.001 ~ 0.5 μm, is more preferably about 0.001 ~ 0.2 μm.The content of the cataloid in polishing slurries is not particularly limited, and is generally less than 40 % by weight, is preferably 0.1 ~ 20 % by weight.As zirconic size, generally, average grain diameter can be 0.1 ~ 15 μm, is preferably 0.1 ~ 10 μm, is more preferably about 0.1 ~ 5 μm.Zirconic content in polishing slurries is not particularly limited, and usual less than 20 % by weight, be preferably 0.1 ~ 10 % by weight.
Be not particularly limited by polished glass substrate composition of the present invention and the polished glass substrate of polishing slurries, such as, be principal component with silicic acid, can also the metallic compounds such as aluminium oxide, sodium oxide molybdena, potassium oxide be contained in glass.
Polishing slurries of the present invention is the polishing slurries for processed glass substrate, from for the polishing slurries of processing hard disk NiP alloy substrate or common water-soluble machining for processing iron or aluminum, water-soluble grinding or water-soluble polishing liquid different.In above-mentioned common processing, liquid generally recycles, large with polishing slurries of the present invention difference in the performance that anticorrosion, froth breaking, the secondary performance such as antirust etc. are required.
Embodiment
In embodiment shown below and comparative example, carry out polishing evaluation shown below.But the present invention is not limited to embodiment.
Embodiment 1 ~ 8 and comparative example 1 ~ 6
Mix the composition (numerical value is % by weight) shown in following table 1 ~ 3, prepare polished glass substrate composition.Water uses pure water.The N-(2-amino-ethyl) piperazine (AEP) of comparative example 1 is at WO2004/100242(patent document 1) the middle aliphatic amine with primary amino radical used.The potash of comparative example 2 is JP 2006-315160(patent documents 2) the middle carbonate used.The 1H-TETRAZOLE of comparative example 4 ~ 6, imidazoles, BTA are the heterocyclic compounds usually used in the polishing slurries of metal material.
Glass substrate polishing slurries is by after use 2875g pure water dilution 250g composition for use in polishing, add 1875g cataloid slurry (AdeliteAT-40: silica concentration 40%, primary particle size 10-20nm), the content preparing cataloid is thus the polishing slurries of 15 % by weight.Use this polishing slurries, carry out the polishing evaluation of hard disk glass substrate.Result is shown in table 1 ~ 3.The result of the surface roughness (polished surface roughness) after the polishing of table 1 ~ 3, maximum difference of height and polishing velocity be using each performance of the N-of comparative example 1 (2-amino-ethyl) piperazine (AEP) as 1.00 time relatively.
The characteristic of embodiment 1 ~ 8 and comparative example 1 ~ 6 measures by the following method.
Polishing evaluating characteristics
Glove suede cloth (NittaHaas Co., Ltd. SupremeRN-R) is arranged on CMP burnishing device (NanoFactor Inc. NF-300), at revolution 30 rev/min, rotation number 30 revs/min, the polish pressure 90g/cm of spiraling
2condition under, with the speed of 150ml/ minute supply polishing slurries, under 5 minutes, polishing evaluation is carried out to the hard disk glass substrate of diameter 2.5 inches at polishing time.By evaluating surface roughness (polished surface roughness), maximum difference of height and the polishing velocity after polishing, carry out polishing evaluation.Be explained, the assay method of the surface roughness after polishing, maximum difference of height and polishing velocity measures by the following method.
Surface roughness
Surface roughness (Ra) after polishing uses scanning probe microscopy (SPA-400 of SIINanoTechnology Inc.), measures by AFM pattern.
Maximum difference of height
Maximum difference of height refers to the distance between the highest mountain peak (Rp) of glass surface and minimum mountain valley (Rv), is the evaluation method of concave-convex surface defect.Maximum difference of height after polishing uses scanning probe microscopy (SPA-400), measures by AFM pattern.
Polishing velocity
The weight change of the glass substrate before and after polishing is measured by electronics Libra (LE225D of SARTORIUSK.K. Inc.), obtains polished amount and polishing velocity.
[table 1]
[table 2]
[table 3]
Can be confirmed by table 1, the composition for use in polishing of embodiment 1 ~ 3, in surface roughness (polished surface roughness) and maximum difference of height, improves than comparative example 1 ~ 3.
Can be confirmed by table 2, the composition for use in polishing of embodiment 2 and 4 ~ 6, in surface roughness (polished surface roughness) and maximum difference of height, improves than the 1H-TETRAZOLE of comparative example 4 ~ 6, imidazoles, BTA.
Can being confirmed by table 3, by adding high molecular polysaccharide, can significantly improve maximum difference of height.And then confirm, by adding high molecular polysaccharide and amine, surface roughness (polished surface roughness) and maximum difference of height can be taken into account.
Embodiment 9 ~ 10 and comparative example 7
Mix the composition (numerical value is % by weight) shown in following table 4, prepare polished glass substrate composition.Water uses pure water.Comparative example 7 is only water.
Glass substrate polishing slurries is by with after 170g pure water dilution 10g composition for use in polishing, adds 20g zirconia (KishidaChemical Inc., particle diameter about 4 μm), prepares the polishing slurries that zirconic content is 10 % by weight thus.Use this polishing slurries, carry out the polishing evaluation of hard disk glass substrate.Result is as shown in table 4.Relatively the illustrating when result of the surface roughness (polished surface roughness) after the polishing of table 4, maximum difference of height and polishing velocity is by being 1.00 with each performance of comparative example 1.
The characteristic of embodiment 9 ~ 10 and comparative example 7 measures by the following method.
Polishing evaluating characteristics
Urethane pad (NittaHaas Co., Ltd. IC1000) is arranged on CMP burnishing device (NanoFactor Inc. NF-300), at revolution 50 rev/min, rotation number 50 revs/min, the polish pressure 360g/cm of spiraling
2condition under, with the speed of 50ml/ minute supply polishing slurries, under 2 minutes, polishing evaluation is carried out to the hard disk glass substrate of diameter 2.5 inches at polishing time.By evaluating surface roughness (polished surface roughness), maximum difference of height and the polishing velocity after polishing, carry out polishing evaluation.Be explained, the assay method of the surface roughness after polishing, maximum difference of height and polishing velocity measures by the following method.
Surface roughness
Surface roughness (Ra) after polishing uses scanning probe microscopy (Shimadzu Seisakusho Ltd. SPM-9700), measures by DFM pattern.
Maximum difference of height
Maximum difference of height refers to the distance between the highest mountain peak (Rp) of glass surface and minimum mountain valley (Rv), is the evaluation method of concave-convex surface defect.Maximum difference of height after polishing uses scanning probe microscopy (Shimadzu Seisakusho Ltd. SPM-9700), measures by DFM pattern.
Polishing velocity
The weight change of the glass substrate before and after polishing is measured by electronics Libra (LE225D of SARTORIUSK.K. Inc.), obtains polished amount and polishing velocity.
[table 4]
Can be confirmed by table 4, the composition for use in polishing of embodiment 9 ~ 10 improves than comparative example 7 in surface roughness (polished surface roughness), maximum difference of height and polishing velocity.
Industrial applicability
According to the present invention, can be used for hard disk glass substrate, CD glass substrate, plasma scope (PDP) glass substrate, the grinding of liquid crystal display (LCD) the various glass substrate such as glass substrate and photomask glass substrate and cutting etc.
Claims (5)
1. polished glass substrate slurry, is made up of (A), (B), (C), (D) composition and cataloid,
(A) there is the terazole derivatives of at least one group of selected from mercapto and alkylthio group
(B) water
(C) high molecular polysaccharide
(D) amine.
2. polishing slurries according to claim 1, wherein, terazole derivatives is the terazole derivatives of at least one group of the alkylthio group with selected from mercapto and carbon number 1 ~ 4.
3. the polishing slurries described in any one of claim 1 ~ 2, wherein, amine is by general formula (R
2) mN (-R
1-OH) the n amine, morpholine, N-(2-amino-ethyl) piperazine that represent, in above-mentioned general formula, R
1represent the alkylidene of the straight or branched of carbon number 2 ~ 5, R
2represent the alkyl of hydrogen atom or carbon number 1 ~ 3, m be 0,1 or 2, n be the integer of 1 ~ 3, m+n=3.
4. the polishing slurries described in any one of claim 1 ~ 2, wherein, glass substrate is hard disk glass substrate.
5. polishing slurries according to claim 3, wherein, glass substrate is hard disk glass substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010271434 | 2010-12-06 | ||
| JP2010-271434 | 2010-12-06 | ||
| PCT/JP2011/078231 WO2012077693A1 (en) | 2010-12-06 | 2011-11-30 | Composition for polishing glass substrate, and polishing slurry |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103249525A CN103249525A (en) | 2013-08-14 |
| CN103249525B true CN103249525B (en) | 2016-01-06 |
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ID=46207180
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180058490.5A Expired - Fee Related CN103249525B (en) | 2010-12-06 | 2011-11-30 | Polished glass substrate composition and polishing slurries |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5531236B2 (en) |
| CN (1) | CN103249525B (en) |
| MY (1) | MY160307A (en) |
| SG (1) | SG191038A1 (en) |
| WO (1) | WO2012077693A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6411759B2 (en) * | 2014-03-27 | 2018-10-24 | 株式会社フジミインコーポレーテッド | Polishing composition, method for using the same, and method for producing a substrate |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1288920A (en) * | 1999-09-21 | 2001-03-28 | 不二见株式会社 | Polishing composition |
| JP2001269859A (en) * | 2000-03-27 | 2001-10-02 | Jsr Corp | Aqueous dispersing element for polishing chemical machine |
| JP2004031446A (en) * | 2002-06-21 | 2004-01-29 | Hitachi Chem Co Ltd | Polishing solution and polishing method |
| CN1517389A (en) * | 2002-12-26 | 2004-08-04 | ������������ʽ���� | Grinding liquid composition |
| CN1742066A (en) * | 2003-02-03 | 2006-03-01 | 卡伯特微电子公司 | Method of polishing a silicon-containing dielectric |
| JP2007095841A (en) * | 2005-09-27 | 2007-04-12 | Fujifilm Corp | Chemical mechanical polishing method |
| JP2007311779A (en) * | 2006-04-21 | 2007-11-29 | Hitachi Chem Co Ltd | Cmp abrasive, and method of polishing substrate |
| JP2009094430A (en) * | 2007-10-12 | 2009-04-30 | Adeka Corp | Polishing composition for cmp |
| JP2009117789A (en) * | 2007-10-17 | 2009-05-28 | Hitachi Chem Co Ltd | Polishing solution for cmp and polishing method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5080012B2 (en) * | 2006-02-24 | 2012-11-21 | 富士フイルム株式会社 | Polishing liquid for metal |
| JP5473587B2 (en) * | 2009-12-24 | 2014-04-16 | 花王株式会社 | Polishing liquid composition for magnetic disk substrate |
-
2011
- 2011-11-30 MY MYPI2013001922A patent/MY160307A/en unknown
- 2011-11-30 SG SG2013043716A patent/SG191038A1/en unknown
- 2011-11-30 WO PCT/JP2011/078231 patent/WO2012077693A1/en active Application Filing
- 2011-11-30 CN CN201180058490.5A patent/CN103249525B/en not_active Expired - Fee Related
- 2011-11-30 JP JP2012547881A patent/JP5531236B2/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1288920A (en) * | 1999-09-21 | 2001-03-28 | 不二见株式会社 | Polishing composition |
| JP2001269859A (en) * | 2000-03-27 | 2001-10-02 | Jsr Corp | Aqueous dispersing element for polishing chemical machine |
| JP2004031446A (en) * | 2002-06-21 | 2004-01-29 | Hitachi Chem Co Ltd | Polishing solution and polishing method |
| CN1517389A (en) * | 2002-12-26 | 2004-08-04 | ������������ʽ���� | Grinding liquid composition |
| CN1742066A (en) * | 2003-02-03 | 2006-03-01 | 卡伯特微电子公司 | Method of polishing a silicon-containing dielectric |
| JP2007095841A (en) * | 2005-09-27 | 2007-04-12 | Fujifilm Corp | Chemical mechanical polishing method |
| JP2007311779A (en) * | 2006-04-21 | 2007-11-29 | Hitachi Chem Co Ltd | Cmp abrasive, and method of polishing substrate |
| JP2009094430A (en) * | 2007-10-12 | 2009-04-30 | Adeka Corp | Polishing composition for cmp |
| JP2009117789A (en) * | 2007-10-17 | 2009-05-28 | Hitachi Chem Co Ltd | Polishing solution for cmp and polishing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103249525A (en) | 2013-08-14 |
| JPWO2012077693A1 (en) | 2014-05-19 |
| WO2012077693A1 (en) | 2012-06-14 |
| MY160307A (en) | 2017-02-28 |
| SG191038A1 (en) | 2013-07-31 |
| JP5531236B2 (en) | 2014-06-25 |
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