SG188621A1 - Lubricant composition for polishing glass substrates and polishing slurry - Google Patents
Lubricant composition for polishing glass substrates and polishing slurry Download PDFInfo
- Publication number
- SG188621A1 SG188621A1 SG2013020862A SG2013020862A SG188621A1 SG 188621 A1 SG188621 A1 SG 188621A1 SG 2013020862 A SG2013020862 A SG 2013020862A SG 2013020862 A SG2013020862 A SG 2013020862A SG 188621 A1 SG188621 A1 SG 188621A1
- Authority
- SG
- Singapore
- Prior art keywords
- polishing
- acid
- glass substrate
- lubricant composition
- slurry
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 82
- 239000011521 glass Substances 0.000 title claims abstract description 63
- 239000000758 substrate Substances 0.000 title claims abstract description 55
- 239000000203 mixture Substances 0.000 title claims abstract description 41
- 239000000314 lubricant Substances 0.000 title claims abstract description 31
- 239000002002 slurry Substances 0.000 title claims abstract description 28
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- -1 cyclic oligosaccharide Chemical class 0.000 claims abstract description 14
- 229920001542 oligosaccharide Polymers 0.000 claims abstract description 13
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 claims abstract description 6
- 239000006061 abrasive grain Substances 0.000 claims description 8
- 229920000858 Cyclodextrin Polymers 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 14
- 230000003746 surface roughness Effects 0.000 description 14
- 239000002253 acid Substances 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 235000014113 dietary fatty acids Nutrition 0.000 description 7
- 229930195729 fatty acid Natural products 0.000 description 7
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- 229910003460 diamond Inorganic materials 0.000 description 6
- 239000010432 diamond Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 6
- 229910001950 potassium oxide Inorganic materials 0.000 description 6
- ULQISTXYYBZJSJ-UHFFFAOYSA-N 12-hydroxyoctadecanoic acid Chemical class CCCCCCC(O)CCCCCCCCCCC(O)=O ULQISTXYYBZJSJ-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 235000001727 glucose Nutrition 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 5
- 229910001948 sodium oxide Inorganic materials 0.000 description 5
- 150000002304 glucoses Chemical class 0.000 description 4
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- 239000004973 liquid crystal related substance Substances 0.000 description 4
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- 238000005516 engineering process Methods 0.000 description 2
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- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- KHAVLLBUVKBTBG-UHFFFAOYSA-N caproleic acid Natural products OC(=O)CCCCCCCC=C KHAVLLBUVKBTBG-UHFFFAOYSA-N 0.000 description 1
- 150000001720 carbohydrates Chemical class 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- BHQCQFFYRZLCQQ-OELDTZBJSA-N cholic acid Chemical compound C([C@H]1C[C@H]2O)[C@H](O)CC[C@]1(C)[C@@H]1[C@@H]2[C@@H]2CC[C@H]([C@@H](CCC(O)=O)C)[C@@]2(C)[C@@H](O)C1 BHQCQFFYRZLCQQ-OELDTZBJSA-N 0.000 description 1
- 235000019416 cholic acid Nutrition 0.000 description 1
- 229960002471 cholic acid Drugs 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- KXGVEGMKQFWNSR-LLQZFEROSA-N deoxycholic acid Chemical compound C([C@H]1CC2)[C@H](O)CC[C@]1(C)[C@@H]1[C@@H]2[C@@H]2CC[C@H]([C@@H](CCC(O)=O)C)[C@@]2(C)[C@@H](O)C1 KXGVEGMKQFWNSR-LLQZFEROSA-N 0.000 description 1
- 229960003964 deoxycholic acid Drugs 0.000 description 1
- VILAVOFMIJHSJA-UHFFFAOYSA-N dicarbon monoxide Chemical compound [C]=C=O VILAVOFMIJHSJA-UHFFFAOYSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- LVTYICIALWPMFW-UHFFFAOYSA-N diisopropanolamine Chemical compound CC(O)CNCC(C)O LVTYICIALWPMFW-UHFFFAOYSA-N 0.000 description 1
- 229940043276 diisopropanolamine Drugs 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- DPUOLQHDNGRHBS-KTKRTIGZSA-N erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 1
- BEFDCLMNVWHSGT-UHFFFAOYSA-N ethenylcyclopentane Chemical compound C=CC1CCCC1 BEFDCLMNVWHSGT-UHFFFAOYSA-N 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 1
- 239000000174 gluconic acid Substances 0.000 description 1
- 235000012208 gluconic acid Nutrition 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229940099563 lactobionic acid Drugs 0.000 description 1
- 229960004488 linolenic acid Drugs 0.000 description 1
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- 229960002969 oleic acid Drugs 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 235000003441 saturated fatty acids Nutrition 0.000 description 1
- HFHDHCJBZVLPGP-UHFFFAOYSA-N schardinger α-dextrin Chemical compound O1C(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(O)C2O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC2C(O)C(O)C1OC2CO HFHDHCJBZVLPGP-UHFFFAOYSA-N 0.000 description 1
- JXOHGGNKMLTUBP-HSUXUTPPSA-N shikimic acid Chemical compound O[C@@H]1CC(C(O)=O)=C[C@@H](O)[C@H]1O JXOHGGNKMLTUBP-HSUXUTPPSA-N 0.000 description 1
- JXOHGGNKMLTUBP-JKUQZMGJSA-N shikimic acid Natural products O[C@@H]1CC(C(O)=O)=C[C@H](O)[C@@H]1O JXOHGGNKMLTUBP-JKUQZMGJSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004334 sorbic acid Substances 0.000 description 1
- 235000010199 sorbic acid Nutrition 0.000 description 1
- 229940075582 sorbic acid Drugs 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000013518 transcription Methods 0.000 description 1
- 230000035897 transcription Effects 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- 229960002703 undecylenic acid Drugs 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Abstract
OF THE DISCLOSUREA lubricant composition and polishing slurry for polishing glass substrate comprising components (A), (B) and optionally (C)5 and/or (D).(A) a cyclic oligosaccharide,water,an alkanolamine,an aliphatic carboxylic acid having 6 to 24 carbon atoms
Description
SPECIFICATION
LUBRICANT COMPOSITION FOR POLISHING
GLASS SUBSTRATES AND POLISHING SLURRY
The present invention relates to a lubricant composition for polishing glass substrate (hereinafter referred to as “lubricant composition for polishing”) and a polishing slurry using the composition. More particularly, the present invention relates to a lubricant composition for polishing which is improved in processing rate and surface roughness in polishing a glass substrate and a polishing slurry.
In recent years, electronic device, optical device, energy device or the like are positively developed. One of important materials is glass in developing them. For example, in the electronic materials, glass is used in a hard disk glass substrate of the hard disk drive, or in flat panel glass of a liquid crystal display or organic EL display. In the optical device, glass is used in a photomask of light transcription device, in a lens of the camera or in a glass of LED light. In the energy device, glass is used in glass panels for solar power generation. Thus, glass substrate is used for the various highest technological devices.
These glass substrates are prepared through various processes. In the process, polishing is an important process.
It is necessary to polish the glass surface precisely to obtain it in a desired shape and precision. The highest technology is supported by the glass substrate polished precisely.
For example, in these days, it is necessary to narrow the distance between the magnetic head and the magnetic disk to increase the recording density of the hard disk drive. The processing of the hard disk glass substrate involves the problem of increase of the polishing speed, improvement of the surface roughness and reduction of residue on the surface to achieve improvement of the recording density of the hard disk drive. Further, the surface of flat panel glass, photomask glass or optical lens is polished accoxding to various requirements such as optical transparency.
Generally, glass is mainly composed of silicic acid (8103), but is adjusted according to desired duality to have desired functionality by being added various kinds of elements. Specifically, boric acid, alumina, sodium oxide, potassium oxide, calcium oxide or magnesium oxide is added to glass.
With an increase in the recording density of magnetic disks year by year, a polishing slurry for use in processing a disk substrate is demanded to have more complicated quality and high performance. Requirements for the slurry widely diverge. For example, the slurry ls first demanded to have excellent polishing speed, and further is required to have low surface roughness and no surface defects such as micropit,
microspike and microscratch.
As the lubricant composition for polishing, various compositions are proposed which are improved in polishing speed and provide high-quality surface.
As a lubricant composition for polishing which can remove “polish lines” or “polish scratches” and provide smaller surface roughness 1s proposed, for example, a composition comprising a fatty acid having 10 to 22 carbon atoms and various alcohols (patent literature 1). However, the fatty acid having 10 to 22 carbon atoms used in patent literature 1 is a saturated or unsaturated fatty acid, and is not a fatty acid having a hydroxyl group. Furthermore, as a lubricant composition for polishing which has high efficiency and high polishing speed is proposed, for example, a composition comprising a phosphorus surfactant containing no phenyl group, glycol solvent, carboxylic acid or dicarboxylic acid having 16 to 40 carbon atoms, and alkanolamine (patent literature 2).
However, the conventional composition for polishing can not afford sufficient polishing speed and can not provide a high-quality hard disk glass substrate having low surface roughness which is suitable for high recording density.
PRIOR ART
PATENT LITERATURE
Patent Literature 1: JP 2004-515609 A
Patent Literature 2: JP 2004-306248 A
An object of the present invention is to provide a polishing slurry which increases polishing speed, improves surface roughness and reduces residue on the surface in polishing a glass substrate, and a lubricant composition for polishing for preparing the polishing slurry.
The present inventors have found a specific lubricant composition for polishing and a polishing slurry containing abrasive grains have dissolved the above problem and have achieved the present invention.
MEANS FOR SOLVING THE PROBLEM
The present invention provides the following. 1. A lubricant composition for polishing glass substrate comprising components (A) and (B). (A) a cyclic oligosaccharide and (BR) water 2. A lubricant composition for polishing glass substrate comprising components (A), (B) and (C). (A) a cyclic oligosaccharide, (B) water and. (CC) an alkanolamine 3. A lubricant composition for polishing glass substrate comprising components (A), (B), (C) and (D). {ap) a cyclic oligosaccharide, (B) water, {C) an alkanolamine and
(D} an aliphatic carboxylic acid having 6 to 24 carbon atoms 4. A lubricant composition as defined in any of the above wherein the cyclic oligosaccharide is @-cyclodextrin. 5. A lubricant composition as defined in any of the 5 above wherein the composition is consist of 0.1 to 40 weight $ of (A), 1 to 90 weight % of (C), 0.1 to 30 weight % of (D) and balance of (B). 6. A polishing slurry comprising any of the above lubricant composition for polishing, and abrasive grains.
The polishing slurry of the present invention exhibits excellent processing properties particularly in increase of the polishing speed and improvement of the surface roughness in the processing of the glass substrate. Further, it is possible to reduce the residue on the surface.
Detail explanation is given below about each component of the lubricant composition for polishing glass substrate. (A) Examples of the cyclic oligosaccharides are @-cyclodextrin (@-CD, cyclic bonding of six glucoses), B-cyclodextrin (f-CD, cyclic bonding of seven glucoses) and 7-cyclodextrin (y-CD, cyclic bonding of eight glucoses). Among them, @-cyclodextrin is preferable. Units of constituting cyclic oligosaccharides are not particularly limited. Pattern of bonding glucoses are also not particularly limited. The cyclic oligosaccharides include structure isomers and steric isomers.
(B) As water is preferable purified water such as ion- exchanged water or pure water. (C) The alkanolamine is not particularly limited. Examples thereof are amines of the formula (R*) mN (-R*-OH)n wherein R' is linear or branched alkylene group having 2 to 5 carbon atoms, R® is hydrogen atom or alkyl group having 1 to 3 carbon atoms, n and m are an integer 1 or more, n+m=3.
Specific examples thereof are monoethanolamine, diethanolamine, triethanolamine, monoisopropanclamine, diisopropanolamine, triisopropanolamine, N,N-dimethylethanol- amine, N-methylmonoethanolamine, N-methyldiethanolamine, n- butanclamine, isobutanoclamine, tert-butanolmine, 2-amino-2- methyl-1l-propanol, diethylethanclamine and ethyldiethanol- amine. (D) As the aliphatic carboxylic acid are preferable those having 6 to 24 carbon atoms. The acids may have linear, branched or cyclic hydrocarbon chain, and may have unsaturated bond or hydroxyl group. Further, polycondensated acids or dicarboxylic acids are also included. Specific examples thereof are saturated fatty acids such as caproic acid, heptylic acid, caprylic acid, pelargonic acid, capric acid, undecylic acid, hendecanoic acid, lauric acid, tridecylic acid, myristic acid, pentadecylic acid, palmitic acid, margaric acid, Stearic acid, nonadecylic acid, arachidic acid, behenic acid, ligncceric acid, unsaturated fatty acids such as sorbic acid, undecylenic acid, oleic acid, linoleic acid, linolenic acid, erucic acid, branched fatty acids such as isoheptanoic acid, isononanoic acid, isomyristic acid, isopalmitic acid, isostearic acid, isoarachic acid, dibasic fatty acids such as adipic acid, azelaic acid, sebacic acid, dodecanedioic acid, polycondensated fatty acids such as 12-hydroxystearic acid dimer, 12-hydroxystearic acid trimer, 12-hydroxystearic acid tetramer, hydroxyfatty acids such as ricinoleic acid, lactobionic acid, pantoic acid, mevalonic acid, 2,2- bis (hydroxymethyl) propionic acid, 2,2- bis (hydroxymethyl)butyric acid, deoxycholic acid, aleuritic acid, galacturonic acid, gluconic acid, quinic acid, shikimic acid, cholic acid and lactonoic acid. In the above, carbon number includes that of carbonyl carbon. Among them, preferable are aliphatic carboxylic acids having 8 to 22 carbon atoms, more preferable are those having 12 to 18 carbon atoms.
Further, polyvalent alcohols are suitably usable. As the polyvalent alcohols are exemplified polyvalent alcohol and its alkyl ether. Examples thereof are ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, butyl carbitol, hexylene glycol, butanediol, butyl diglycol, glycerin, ethylene glycol monomethyl ether, diethylene glycol dimethyl ether, ethylene glycol monoisopropyl ether, ethylene glycol moncbutyl ether, ethylene glycol dimethyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, propylene glycol monobutyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, sorbitol and sucrose.
Contents of the components (A) to (D) are not particularly limited. The cyclic oligosaccharides (a) is contained in the composition preferably in an amount of 0.1 to 40 wt.%, more preferably in 0.5 to 30 wt.%, most preferably in 1 to 15 wt.%. In case the content of the components (A) is in the above range, the polishing slurry exhibits sufficient increase of the polishing speed and improvement of the surface roughness in the processing.
Further, it is possible to reduce the residue on the surface.
The alkanolamine (C) is contained in the composition preferably in an amount of 1 to 90 wt.%, more preferably in 5 } to 85 wt.%, most preferably in 10 to 80 wt.%.
The aliphatic carboxylic acid (D) is contained in the composition preferably in an amount of 0.1 to 30 wt.%, more preferably in 1 to 15 wt.%. In case the content of the components (D) is in the above range, the acid adheres sufficiently tc the hard disk glass substrate surface and excellent lubricity is obtained at processing. In addition, stability of the lubricant composition enhances.
The content of water (B) is residue.
The polishing slurry of the invention can be prepared by dispersing abrasive grains to the present lubricant composition. Examples of the abrasive grains are diamond, aluminum oxide, titanium oxide, zirconium oxide, germanium oxide, silicon oxide, cerium oxide, tantalum oxide and like various known abrasive grains. Generally, average particle diameter of the abrasive grains is about 0.001 to 30 pm, preferably about 0.003 to 20 um, more preferably about 0.005 to 10 pm. Among them diamond abrasive is preferable and its average particle diameter is preferably about 0.01 to 1 um.
The content of diamond abrasive in the polishing slurry is not particularly limited but is usually up to 1 wt. %, preferably 0.001 to 0.5 wt. %. The glass substrate to be polished by the present lubricant composition for polishing glass substrate and the polishing slurry is not particularly limited. Examples of the glass substrate are those containing silicic acid, alumina, sodium oxide or potassium oxide as a main component. Examples thereof are hard disk glass substrate, glass substrate for optical lens, optical lens, glass substrate for liquid crystal such as thin-film transistor (TFT) type LCD, color filter for liquid crystal TV and glass substrate for LSI photomask.
The present polishing slurry is a slurry for processing glass substrate and is distinguished from a polishing slurry for processing NiP alloy substrate, or usual water-scluble cutting solution, water-soluble grinding solution or water- soluble polishing solution for processing iron or aluminum material. In the above usual processing, the solution is usually used in circulation and is greatly different from the present slurry in the required secondary performance of preventing, for example, decay, foam and rust.
In Examples and Comparative Examples, the following polishing evaluation was conducted. The invention is not limited to Examples.
Evaluation of polishing property
An urethane pad (Nitta Haas Incorporated, ICLl000) was placed on a polishing device (Nano Factor Co., Ltd., NF-300), and a hard disk glass substrate {containing silicic acid, alumina, sodium oxide, potassium oxide, etc.) of 2.5 inches in diameter was polished by supplying a polishing slurry at speed of 20 ml/min. for 15 minutes (evaluation of polishing speed) and one minute (evaluation of surface roughness) under conditions of platen revolution of 230 rotatioms/min., head revolution of 170 rotations/min., and polishing pressure of 7.2 PSI. Evaluation of polishing was conducted by measuring polishing speed at the time of polishing, and measuring surface roughness after polishing. The followings are methods of measuring polishing speed and surface roughness.
Polishing speed:
The glass substrate was checked for weight change before and after polishing by electronic balance (SARTORIUS
K.K., LE225D) to obtain polishing amount and polishing speed.
Surface roughness: surface roughness after polishing was measured using a scanning probe microscope (SII Nano Technology Inc., SPA-400) in an AFM mode.
Surface residue:
Surface residue after polishing was measured using an optical surface analyser (CANDELA Corporation, OSA-5100).
Examples 1 to 8 and Comparative Examples 1 to 8
Lubricant compositions for hard disk glass substrate were prepared by mixing ingredients shown in Tables 1 to 4
(numerical value: weight %). Water used was purified water.
Ricinoleic acid used in Comparative Example 2 was a carboxylic acid having 16 to 40 carbon atoms used in JP 2004-306,248 A (Patent literature 2), oleic acid used in Comparative Example 5 was a fatty acid having 10 to 22 carbon atoms used in JP 2004-515,609 A (Patent literature 1). As a saccharide other than cyclodextrin, glucose 1,1 glycosidic bond disaccharide was used in Comparative Example 1.
A quantity of 17.5 g of lubricant composition was diluted with 321.5 g of pure water and thereto was added 10.9 g of diamond slurry having 1.5 wt. % of diamond and 30nm of average particle diameter [dynamic light scattering method (Otsuka electron Co., Ltd., DLS-6000HL)] to obtain a polishing slurry for hard disk glass substrate containing 0.05 wt. % of diamond abrasive grains. Using this abrasive slurry, evaluation of polishing hard disk glass substrate was conducted. The results were given in Tables 1 to 3. Table 4 shows surface residue left on glass substrate after polishing.
Table 1 [er [me [en [meee pologeern | | | ow
Glucese 1,1 glycosidic bond disaccharide woes | | ve | a | ve | a propre | | 0 | ow | 0 | 4 propanclamine
Polishing speed 52 289 289 117 97 (rm/ 15min)
Surface 2.03 1.48 1.89 2.81 2.11 roughness (A) zoe | nas | nev | za | 2a
Table 2
Te [maemo
Cen
Coens [| |e
Cees || |e
Monoigo- propanolamine
Polishing speed 243 256 170 210 (nm/ 15min)
Surface 2.51 4.89 5.56 | 3.44 roughness (A)
Table 3
Te [me [mo [mr Jemma] ¥- \ 7.5 7.5 7.5 7.5 poms | 75 | 7s | es [es
P ropylens 7.5 7.5 glycol
Cees acid (omen | oa
EE E20 HN eee] | ee |] , 7.5 acid
Monoiso- propanolamine
Polishing speed] ._. | ooo | oc | neo | on | oo. . 289 28% 285 287 107 210 {rm/ 15min)
Surface 1.50 2.11 1.80 0.95 5.56 3.44 roughness wy 1% | 2m | see | ois [sss | ses
Table 4 [er eer
Er EE
Monoiso- propanolamine (relative 0.65 1.00 comparison)
Table 5
I I Ct ee
Glass substrate A Glass substrate B oom a [a | [a mr | | ee | [ee glycol
Em |v [ow [ow [we propariolamine
Polishing speed | , . 257 250 289 262 228 {(rmn/ 15min)
Surface 1.5 3.19 | 2.09 | 1.02 | 1.92 2.0 roughness (A)
Table 6 [en epee mn fren
Glass substrate C Glass substrate D wen | 75 | | [rs | |]
Cm | rs re glycol rotate | 20 | %0 | 40 | a0 | 0 | sw propanclamine
Polishing speed 251 266 202 144 155 (1am/ 15min)
Surface 1.31 3.81 2.11 1.43 2.69 roughness (A)
Glass substrate A : glass substrate containing 810, as a main component and sodium oxide, alumina and potassium oxide as subcomponents
Glass substrate B : glass substrate containing Si0, as a main component and sodium oxide, alumina, potassium oxide and PQs; as stibcomponents
Glass substrate C : glass substrate containing SiO, as a main component and alumina and potassium oxide as subcomponents
Glass substrate D : glass substrate containing Sio, as a main component and alumina as a subcomponent
The present invention provides a polishing slurry excellent in processing properties which is increased in polishing speed at the time of polishing and improved in surface roughness after polishing the glass substrate.
Further, as additional effects, it is possible to reduce the residue on the surface after polishing the glass substrate.
The present lubricant composition and polishing slurry for hard disk glass substrate are applicable, for example, to polish, grind and cut glass substrate for optical lens, optical lens, glass substrate for liguid crystal such as thin-film transistor (TFT) type LCD, color filter for liquid crystal TV and glass substrate for LSI photomask, etc.
Claims (7)
1. A lubricant composition for polishing glass substrate comprising components (A) and (B). {3) a cyclic oligosaccharide and (B) water
2. A lubricant composition for polishing glass substrate comprising components (4), (B) and (C). (A) a cyclic oligosaccharide, (B) water and {C} an alkanolamine
3. A lubricant composition for polishing glass substrate comprising components (A), (B), (C) and (D). (A) a cyclic oligosaccharide, {(B) water, 5 (C) an alkanolamine and (D) an aliphatic carboxylic acid having 6 to 24 carbon atoms
4. A lubricant composition as defined in any of claims 1 to 3 wherein the cyclic oligosaccharide is @-cyclodextrin.
5. A lubricant composition as defined in any of claims 2 and 3 wherein the alkanolamine is an amine of the formula (R®) mM (-R'-OH) nn wherein R' is linear or branched alkylene group having 2 to 5 § carbon atoms, R? is hydrogen atom or alkyl group having 1 to 3 carbon atoms, nn and m are an integer 1 or more, nHun=3.
6. A lubricant composition as defined in any of claims 1 to 5 wherein the composition is consist of 0.1 to 40 weight % of (a), 1 to 90 weight % of (C), 0.1 to 30 weight % of (D) and balance of
(B).
7. A polishing slurry comprising a lubricant composition of any of claims 1 to 6, and abrasive grains.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010236786 | 2010-10-21 | ||
| PCT/JP2011/074602 WO2012053660A1 (en) | 2010-10-21 | 2011-10-19 | Lubricant composition for polishing glass substrates and polishing slurry |
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|---|---|
| SG188621A1 true SG188621A1 (en) | 2013-04-30 |
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| SG2013020862A SG188621A1 (en) | 2010-10-21 | 2011-10-19 | Lubricant composition for polishing glass substrates and polishing slurry |
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| Country | Link |
|---|---|
| JP (1) | JP5429397B2 (en) |
| CN (1) | CN103154178B (en) |
| SG (1) | SG188621A1 (en) |
| WO (1) | WO2012053660A1 (en) |
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| JP6015259B2 (en) * | 2012-09-06 | 2016-10-26 | 旭硝子株式会社 | Manufacturing method of glass substrate for information recording medium and manufacturing method of magnetic disk |
| JP2014199688A (en) * | 2013-03-29 | 2014-10-23 | 東邦化学工業株式会社 | Cleaning agent for magnetic disk substrate |
| CN115135278A (en) * | 2020-02-17 | 2022-09-30 | 福尔顿控股公司 | Cyclodextrins as tooth cleaning powders |
Family Cites Families (12)
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|---|---|---|---|---|
| JP2002110596A (en) * | 2000-10-02 | 2002-04-12 | Mitsubishi Electric Corp | Polishing agent for semiconductor processing, dispersant used therefor, and method of manufacturing semiconductor device using the same polishing agent |
| AU2002221120A1 (en) * | 2000-12-15 | 2002-06-24 | Showa Denko K K | Composition for texturing process |
| US6641630B1 (en) * | 2002-06-06 | 2003-11-04 | Cabot Microelectronics Corp. | CMP compositions containing iodine and an iodine vapor-trapping agent |
| US20040058623A1 (en) * | 2002-09-20 | 2004-03-25 | Lam Research Corporation | Polishing media for chemical mechanical planarization (CMP) |
| JP4039214B2 (en) * | 2002-11-05 | 2008-01-30 | Ｊｓｒ株式会社 | Polishing pad |
| JP4675049B2 (en) * | 2003-03-25 | 2011-04-20 | 株式会社ネオス | Lubricating liquid composition for texturing |
| US7635290B2 (en) * | 2007-08-15 | 2009-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Interpenetrating network for chemical mechanical polishing |
| CN101235103B (en) * | 2007-12-26 | 2010-06-16 | 广州大学 | Cyclodextrin-nano diamond derivatives, preparation method and use thereof |
| JP2009158810A (en) * | 2007-12-27 | 2009-07-16 | Toshiba Corp | Slurry for chemical-mechanical polishing and manufacturing method of semiconductor device |
| JP5250796B2 (en) * | 2008-03-06 | 2013-07-31 | 株式会社不二製作所 | Method for producing gel abrasive and gel abrasive |
| JP5314329B2 (en) * | 2008-06-12 | 2013-10-16 | 富士フイルム株式会社 | Polishing liquid |
| EP2500929B1 (en) * | 2009-11-11 | 2018-06-20 | Kuraray Co., Ltd. | Slurry for chemical mechanical polishing and polishing method for substrate using same |
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2011
- 2011-10-19 CN CN201180048812.8A patent/CN103154178B/en not_active Expired - Fee Related
- 2011-10-19 JP JP2012539790A patent/JP5429397B2/en not_active Expired - Fee Related
- 2011-10-19 SG SG2013020862A patent/SG188621A1/en unknown
- 2011-10-19 WO PCT/JP2011/074602 patent/WO2012053660A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| JP5429397B2 (en) | 2014-02-26 |
| JPWO2012053660A1 (en) | 2014-02-24 |
| CN103154178A (en) | 2013-06-12 |
| WO2012053660A1 (en) | 2012-04-26 |
| CN103154178B (en) | 2015-02-25 |
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