CN103154178A - Lubricant composition for polishing glass substrates and polishing slurry - Google Patents
Lubricant composition for polishing glass substrates and polishing slurry Download PDFInfo
- Publication number
- CN103154178A CN103154178A CN2011800488128A CN201180048812A CN103154178A CN 103154178 A CN103154178 A CN 103154178A CN 2011800488128 A CN2011800488128 A CN 2011800488128A CN 201180048812 A CN201180048812 A CN 201180048812A CN 103154178 A CN103154178 A CN 103154178A
- Authority
- CN
- China
- Prior art keywords
- polishing
- acid
- glass substrate
- lubricating composition
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Abstract
Provided are a lubricant composition for polishing glass substrates and a polishing slurry that contain components (A) and (B), and when necessary, components (C) and/or (D). (A) A cyclic oligosaccharide (B) Water (C) An alkanolamine (D) A C6-24 aliphatic carboxylic acid.
Description
Technical field
The present invention relates to polished glass substrate with the polishing slurries of lubricating composition (below, be called the polishing lubricating composition) and use said composition.In more detail, relate in the polishing of glass substrate and to improve processing speed and to improve aspect the precision machined surface roughness all excellent polishing use lubricating composition and polishing slurries.
Background technology
In recent years, actively carry out the exploitation of electronic machine, opticinstrument, energy-efficient equipment etc.The exploitation these aspect, one of important material is glass.For example, in electronic material, the sheet glass that hard disk glass substrate, LCD panel or the OLED panel of hard disk drive are arranged, in opticinstrument, the photomask that the light rerecording device arranged is with the glass of glass, camera lens, LED illumination, in energy-efficient equipment, solar electrical energy generation is arranged with sheet glass etc.Like this, glass substrate is used for state-of-the-art various device.
These glass substrates are through various operation manufacturings, polishing process importantly in manufacturing process.For shape, the precision that obtains target, must carry out critically polishing to glass surface.Support most advanced technology by precise polished glass substrate.
As concrete example, recently, in order to improve the recording density of hard disk drive, must make the gap between magnetic head and disk become narrower.For the raising of the recording density that realizes hard disk drive, in the processing of hard disk glass substrate, to improve polishing velocity, to improve the precision machined surface roughness and reduce surperficial residue as problem.And then sheet glass, photomask also carry out polishing according to various effects on surfaces that require such as light transmissions with glass or optical lens etc.
In general, the main component of glass is silicic acid (SiO
2), add various elements to be adjusted to objective function according to desired quality.Particularly, can add boric acid, aluminum oxide, sodium oxide, potassium oxide, calcium oxide, magnesium oxide etc.
The trend of this high record density is being accelerated year by year, to discoid substrate processing with the requirement of the polishing slurries more complicated and high performance that also becomes.At first desired project is polishing velocity, and low surface roughness, there is no many-sided requirements such as surface imperfection such as little hole, microspike, microscratch.
As above-mentioned polishing lubricating composition, proposed various for improving polishing velocity and obtaining the composition for use in polishing on high-quality surface.
Polishing lubricating composition as removing " sleek (polish scratches) " and making the precision machined surface roughness become less for carrying out precision work has for example proposed to comprise the lipid acid of carbon number 10～22 and the polishing lubricating composition of various alcohol in patent documentation 1.But the lipid acid of the carbon number 10～22 that uses in patent documentation 1 is saturated, undersaturated lipid acid, does not have record to contain the lipid acid of hydroxyl fully.And then, composition as above-mentioned high-effect and high polishing velocity is provided has for example proposed to comprise Phosphorus tensio-active agent, glycol series solvent, the carboxylic acid of carbon number 16～40 or the polishing lubricating composition of dicarboxylic acid and alkanolamine with phenyl in patent documentation 2.
But the polishing fluid composition for adopting prior art except can not get sufficient polishing velocity, also can not get being suitable for high-quality hard disk glass substrate high record density, that the precision machined surface roughness is low.
The prior art document
Patent documentation
Patent documentation 1: special table 2004-515609 communique
Patent documentation 2: JP 2004-306248 communique
Summary of the invention
The problem that invention will solve
Problem of the present invention is to provide in the processing of glass substrate, and particularly effectively improve polishing velocity, improve the precision machined surface roughness, and then, can reduce the polishing slurries of surperficial residue and for the preparation of the polishing lubricating composition of this polishing slurries.
The inventor finds that specific polishing can solve above-mentioned problem with lubricating composition and the polishing slurries that contains the polishing abrasive particle, has so far completed the present invention.
Be used for solving the means of problem
The present invention relates to following invention.
1. polished glass substrate lubricating composition contains (A) and (B) composition,
(A) cyclic oligosaccharide
(B) water.
2. polished glass substrate lubricating composition contains (A), (B) and (C) composition,
(A) cyclic oligosaccharide
(B) water
(C) alkanolamine.
3. polished glass substrate lubricating composition contains (A), (B), (C) and (D) composition,
(A) cyclic oligosaccharide
(B) water
(C) alkanolamine
(D) aliphatic carboxylic acid of carbon number 6～24.
4. the described lubricating composition of above-mentioned any one, wherein, cyclic oligosaccharide is alpha-cylodextrin.
5. the described lubricating composition of above-mentioned any one, contain (A) 0.1～40 % by weight, (C) 1～90 % by weight, (D) 0.1～30 % by weight, (B) surplus.
6. polishing slurries, contain the described polishing of above-mentioned any one lubricating composition and polishing abrasive particle.
The invention effect
Polishing slurries of the present invention demonstrates in the processing of glass substrate particularly to the raising of polishing velocity, the effective processing characteristics of improvement of precision machined surface roughness.And then, can reduce surperficial residue.
Embodiment
Below, describe each composition that polished glass substrate of the present invention is used lubricating composition in detail.
(A) as cyclic oligosaccharide, for example can enumerate alpha-cylodextrin (α-CD, 6 glucose ring-type bondings), beta-cyclodextrin (β-CD, 7 glucose ring-type bondings), γ-cyclodextrin (γ-CD, 8 glucose ring-type bondings) etc.In these cyclic oligosaccharides, preferred alpha-cylodextrin.Wherein, the Component units of cyclic oligosaccharide does not have particular determination, and the mode of bonding does not have particular determination yet.In addition, cyclic oligosaccharide also comprises constitutional isomer, steric isomer.
(B) as water, the Purified Waters such as preferred ion exchanged water or pure water.
(C) as alkanolamine, there is no particular determination, for example can enumerate the amine that is represented by following general formula,
(R
2)mN(-R
1-OH)n
(R
1Be the straight or branched alkylidene group of carbon number 2～5, R
2The alkyl of expression hydrogen atom or carbon number 1～3.N, m are the integer more than 1, n+m=3).Specifically can enumerate monoethanolamine, diethanolamine, trolamine, monoisopropanolamine, diisopropanolamine (DIPA), tri-isopropanolamine, N, N-dimethylethanolamine, (2-hydroxyethyl)methylamine), N methyldiethanol amine, propyl carbinol amine, isobutyl hydramine, trimethyl carbinol amine, 2-amino-2-methyl-1-propanol, diethylethanolamine, ethyldiethanolamine etc.
(D) as aliphatic carboxylic acid, the aliphatic carboxylic acid of preferred carbon number 6～24, hydrocarbon chain can be straight chain, side chain or ring-type, also can have unsaturated link(age) and/or hydroxyl, can also be their polycondensate or diprotic acid.for example can enumerate caproic acid, enanthic acid, sad, n-nonanoic acid, capric acid, undecanoic acid (undecylic acid), undeeanoic acid (hendecanoic acid), dodecylic acid, tridecanoic acid, tetradecanoic acid, pentadecylic acid, palmitinic acid, margaric acid, stearic acid, nondecylic acid, eicosanoic acid, docosoic acid, the saturated fatty acids such as Lignoceric acid, Sorbic Acid, undecylenic acid, oleic acid, linolic acid, linolenic acid, the unsaturated fatty acidss such as erucic acid, isoamyl acetic acid, different n-nonanoic acid, different tetradecanoic acid, different palmitinic acid, Unimac 5680, the branched chain fatty acids such as different eicosanoic acid, hexanodioic acid, nonane diacid, sebacic acid, the binary of fatty acids such as dodecanedioic acid, 12-oxystearic acid dipolymer, 12-oxystearic acid trimer, the polycondensation lipid acid such as 12-oxystearic acid tetramer, ricinolic acid, lactobionic acid, pantoic acid, mevalonic acid, two (methylol) propionic acid of 2,2-, two (methylol) butyric acid of 2,2-, deoxidation but acid, aleuritic acid, galacturonic acid, glyconic acid, quinic acid, shikimic acid, cholic acid, the hydroxy fatty acids such as lactonic acid etc.Wherein, carbon number is the carbon number that comprises carbonyl carbon.In these aliphatic carboxylic acids, preferred carbon number 8～22, the more preferably aliphatic carboxylic acid of carbon number 12～18.
And then, except these compositions, can also suitably adopt polyalcohols.As polyalcohols, can enumerate the alkyl oxide of polyvalent alcohol and polyvalent alcohol, such as enumerating ethylene glycol, glycol ether, triglycol, propylene glycol, dipropylene glycol, tripropylene glycol, diethylene glycol monobutyl ether, hexylene glycol, butyleneglycol, butyldiglycol, glycerine, glycol monomethyl methyl ether, diethylene glycol dimethyl ether, glycol monomethyl isopropyl ether, ethylene glycol monobutyl ether, ethylene glycol dimethyl ether, propylene glycol monomethyl ether, DPGME, propylene glycol single-butyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl ether, Sorbitol Powder, sucrose etc.
The content of the composition in lubricating composition (A)～(D) does not have particular determination, as the content of cyclic oligosaccharide (A), is preferably 0.1～40 % by weight, and more preferably 0.5～30 % by weight, most preferably be 1～15 % by weight.As long as the content of composition (A) just can obtain adding the effect that fully improves polishing velocity man-hour and improve the precision machined surface roughness in above-mentioned scope.And then, can also reduce surperficial residue.
As the content of alkanolamine (C), be preferably 1～90 % by weight, more preferably 5～85 % by weight, most preferably be 10～80 % by weight.
As the content of aliphatic carboxylic acid (D), be preferably 0.1～30 % by weight, more preferably 1～15 % by weight.As long as the content of composition (D) is in above-mentioned scope the time, this acid just can fully be adsorbed onto the hard disk glass baseplate surface, and obtains sufficient oilness man-hour adding.In addition, the stability of lubricating composition is also good.
The content of water (B) is surplus.
By the polishing abrasive particle is dispersed in lubricating composition of the present invention, can obtain polishing slurries of the present invention.As the polishing abrasive particle, such as using the various known polishing abrasive particles such as diamond, aluminum oxide, titanium oxide, zirconium white, germanium oxide, silicon oxide, cerium oxide, tantalum oxide.As the size of polishing abrasive particle, in general, median size is 0.001～30 μ m, be preferably 0.003～20 μ m, 0.005～10 μ m left and right more preferably.Wherein, as the polishing abrasive particle, preferred diamond abrasive grain, as its size, median size is preferably about 0.01～1 μ m.The content of the diamond abrasive grain in polishing slurries does not have particular determination, be generally 1 % by weight following, be preferably 0.001～0.5 % by weight.
Come the glass substrate of polishing there is no particular determination by polished glass substrate of the present invention with lubricating composition and polishing slurries, such as the glass substrate that can enumerate take silicic acid, aluminum oxide, sodium oxide, potassium oxide etc. as chief component.Such as can enumerate hard disk glass substrate, optical lens with liquid crystal such as glass substrate, optical lens, thin film transistor (TFT) type LCD with glass substrates, liquid crystal display television by using spectral filter, LSI photomask with glass substrate etc.
Polishing slurries of the present invention is the polishing slurries for the processed glass substrate, with the polishing slurries that is used for processing NiP alloy substrate or commonly have any different for processing iron or the water-soluble cutting processing of aluminum, water-soluble ground finish, water-soluble polishing liquid.In above-mentioned common processing, liquid generally recycles, and is large with polishing slurries of the present invention difference on anticorrosion, froth breaking, the desired performances such as secondary performance such as antirust.
Embodiment
In embodiment and comparative example shown below, carry out polishing evaluation shown below.But the present invention is not limited to these embodiment.
The polishing evaluating characteristics
Urethane pad (the Nitta Haas IC1000 processed of company) is arranged in burnishing device (the Nano Factor NF-300 processed of company), supply with polishing slurries with the speed of 20ml/ minute under the condition of rotation number 230 rev/min, s' of dish (platen) 170 rev/mins of rotation numbers, polish pressure 7.2PSI, the hard disk glass substrate (glass that contains silicic acid, aluminum oxide, sodium oxide, potassium oxide etc.) of 2.5 inches of diameters is carried out the polishing evaluation that polishing time is 15 minutes (polishing velocity evaluation) and 1 minute (surfaceness evaluation).Polishing velocity during by the evaluation polishing and the surfaceness after polishing are carried out the polishing evaluation.Be explained, the measuring method of polishing velocity and surfaceness is measured by the following method.
Polishing velocity
By the changes in weight of the glass substrate before and after the polishing of electronic balance (the SARTORIUS LE225D processed of K.K. Corp.) mensuration, obtain polished amount and polishing velocity.
Surfaceness
Surfaceness after polishing is used Scanning Probe Microscopy (the SII Nano Technology SPA-400 processed of company), measures by the AFM pattern.
The surface residue
Surperficial residue after polishing is measured by optical surface analytical equipment (the Candela OSA-5100 processed of company).
Embodiment 1～8 and comparative example 1～8
Mix the composition shown in following table 1～4 (numerical value is % by weight), preparation hard disk glass substrate lubricating fluid.Water uses Purified Water.The ricinolic acid of comparative example 2 is the carboxylic acid of the carbon number 16～40 of use in JP 2004-306248 communique (patent documentation 2), and the oleic acid of comparative example 5 is the lipid acid of the middle carbon number 10～22 that uses of special table 2004-515609 communique (patent documentation 1).Be explained, as the sugar beyond cyclodextrin, use glucose 1,1-glycosidic link disaccharides in comparative example 1.
The hard disk glass substrate prepares by the following method with polishing slurries: after the 17.5g lubricating composition is diluted with the 321.5g pure water, by adding diamond concentration: the diamond slurry 10.9g of 1.5 % by weight and median size: 30nm (measuring with dynamic light scattering method (DLS-6000HL processed of Otsuka Electronics Co., Ltd.)), the content that obtains diamond abrasive grain is the polishing slurries of 0.05 % by weight.Use this polishing slurries, carry out the polishing evaluation of hard disk glass substrate.Result is as shown in table 1～3.Table 4 expression remains in the surperficial residue on glass substrate after polishing.
[table 1]
[table 2]
[table 3]
[table 4]
| ? | Embodiment 5 | Comparative example 8 |
| Alpha-cylodextrin | 7.5 | ? |
| Propylene glycol | ? | 7.5 |
| Ricinolic acid | 7.5 | 7.5 |
| Monoisopropanolamine | 40 | 40 |
| Water | Surplus | Surplus |
| Surface residue (relatively) | 0.65 | 1.00 |
Note: with the physics residue of comparative example 8 and organic detritus sum (surperficial residue) as 1.
The polishing velocity of the embodiment 1 of table 1 is low, but shows the improvement of excellent surfaceness, can be used for the polishing process of terminal stage.Can be confirmed by embodiment 2～3 and comparative example 1～2, what cyclic oligosaccharide can have sufficient polishing velocity and surfaceness concurrently improves both.And then, the alpha-cylodextrin of most preferred embodiment 1～2.
Can be confirmed by table 2, comparative example 3～5 is difficult to take into account polishing velocity and surfaceness, and in contrast to this, what embodiment 4 can take into account sufficient polishing velocity and surfaceness improves both.
The propylene glycol as prior art for the comparative example 6～7 of table 3 is difficult to take into account polishing velocity and surfaceness, and in contrast to this, what embodiment 4～7 can take into account sufficient polishing velocity and surfaceness improves both.Can confirm, even further change aliphatic carboxylic acid, also can bring into play its effect, take into account sufficient polishing velocity and surfaceness.
Can be confirmed by table 4, by utilizing the present invention, can reduce residual physics residue and organic detritus on the glass substrate after polishing.
Embodiment 9～12 and comparative example 9～16
Mix the composition shown in following table 5～6 (numerical value is % by weight), preparation glass substrate lubricating fluid, in addition, operation similarly to Example 1, preparation polishing slurries.Use this polishing slurries, use the different various glass substrates of ingredient to carry out the polishing evaluation, the results are shown in table 5～6.
[table 5]
[table 6]
Glass substrate A: with silicic acid (SiO
2) be principal constituent, glass substrate take sodium oxide, aluminum oxide, potassium oxide as subcomponent.
Glass substrate B: with silicic acid (SiO
2) be principal constituent, with sodium oxide, aluminum oxide, potassium oxide, P
2O
5Glass substrate for subcomponent.
Glass substrate C: with silicic acid (SiO
2) be principal constituent, glass substrate take aluminum oxide, potassium oxide as subcomponent.
Glass substrate D: with silicic acid (SiO
2) be principal constituent, the glass substrate take aluminum oxide as subcomponent.
Industrial applicability
According to the present invention, the polishing slurries of the effective processing characteristics excellence of improvement of the polishing velocity excellence in the time of can providing polishing, the precision machined surface roughness of the glass substrate after polishing.And then, as subsidiary effect of the present invention, can reduce the residue of the glass baseplate surface after polishing.
In addition, polished glass substrate of the present invention with lubricating composition and polishing slurries can be used for optical lens with liquid crystal such as glass substrate or optical lens, thin film transistor (TFT) type LCD with polishing, grinding and the cutting etc. with glass substrate of glass substrate, liquid crystal display television by using spectral filter, LSI photomask.
Claims (7)
1. polished glass substrate lubricating composition contains (A) and (B) composition,
(A) cyclic oligosaccharide
(B) water.
2. polished glass substrate lubricating composition contains (A), (B) and (C) composition,
(A) cyclic oligosaccharide
(B) water
(C) alkanolamine.
3. polished glass substrate lubricating composition contains (A), (B), (C) and (D) composition,
(A) cyclic oligosaccharide
(B) water
(C) alkanolamine
(D) aliphatic carboxylic acid of carbon number 6～24.
4. the described lubricating composition of claim 1～3 any one, wherein, cyclic oligosaccharide is alpha-cylodextrin.
5. the described lubricating composition of claim 2～3 any one, wherein, the amine of alkanolamine for being represented by following general formula,
(R
2)mN(-R
1-OH)n
Wherein, R
1Be the alkylidene group of the straight or branched of carbon number 2～5, R
2The alkyl of expression hydrogen atom or carbon number 1～3, n, m are the integer more than 1, n+m=3.
6. the described lubricating composition of claim 1～5 any one, contain (A) 0.1～40 % by weight, (C) 1～90 % by weight, (D) 0.1～30 % by weight, (B) surplus.
7. polishing slurries, contain the described polishing of claim 1～6 any one lubricating composition and polishing abrasive particle.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010236786 | 2010-10-21 | ||
| JP2010-236786 | 2010-10-21 | ||
| PCT/JP2011/074602 WO2012053660A1 (en) | 2010-10-21 | 2011-10-19 | Lubricant composition for polishing glass substrates and polishing slurry |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103154178A true CN103154178A (en) | 2013-06-12 |
| CN103154178B CN103154178B (en) | 2015-02-25 |
Family
ID=45975363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180048812.8A Expired - Fee Related CN103154178B (en) | 2010-10-21 | 2011-10-19 | Lubricant composition for polishing glass substrates and polishing slurry |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5429397B2 (en) |
| CN (1) | CN103154178B (en) |
| SG (1) | SG188621A1 (en) |
| WO (1) | WO2012053660A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6015259B2 (en) * | 2012-09-06 | 2016-10-26 | 旭硝子株式会社 | Manufacturing method of glass substrate for information recording medium and manufacturing method of magnetic disk |
| JP2014199688A (en) * | 2013-03-29 | 2014-10-23 | 東邦化学工業株式会社 | Cleaning agent for magnetic disk substrate |
| EP4087517A1 (en) * | 2020-02-17 | 2022-11-16 | Ferton Holding S.A. | Cyclodextrins as dental cleaning powders |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020039875A1 (en) * | 2000-10-02 | 2002-04-04 | Mitsubishi Denki Kabushiki Kaisha | Polishing agent for processing semiconductor, dispersant used therefor and process for preparing semiconductor device using above polishing agent for processing semiconductor |
| US6641630B1 (en) * | 2002-06-06 | 2003-11-04 | Cabot Microelectronics Corp. | CMP compositions containing iodine and an iodine vapor-trapping agent |
| US20040058623A1 (en) * | 2002-09-20 | 2004-03-25 | Lam Research Corporation | Polishing media for chemical mechanical planarization (CMP) |
| CN1498723A (en) * | 2002-11-05 | 2004-05-26 | Jsr株式会社 | Polishing pad |
| JP2004306248A (en) * | 2003-03-25 | 2004-11-04 | Neos Co Ltd | Texture processing lubricant composition |
| CN101235103A (en) * | 2007-12-26 | 2008-08-06 | 广州大学 | Cyclodextrin-nano diamond derivatives, preparation method and use thereof |
| CN101367204A (en) * | 2007-08-15 | 2009-02-18 | 罗门哈斯电子材料Cmp控股股份有限公司 | Interpenetrating network for chemical mechanical polishing |
| US20090176372A1 (en) * | 2007-12-27 | 2009-07-09 | Gaku Minamihaba | Chemical mechanical polishing slurry and semiconductor device manufacturing method |
| US20090311864A1 (en) * | 2008-06-12 | 2009-12-17 | Fujifilm Corporation | Polishing slurry |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002047868A1 (en) * | 2000-12-15 | 2002-06-20 | Showa Denko K.K. | Composition for texturing process |
| JP5250796B2 (en) * | 2008-03-06 | 2013-07-31 | 株式会社不二製作所 | Method for producing gel abrasive and gel abrasive |
| KR101359092B1 (en) * | 2009-11-11 | 2014-02-05 | 가부시키가이샤 구라레 | Slurry for chemical mechanical polishing and polishing method for substrate using same |
-
2011
- 2011-10-19 WO PCT/JP2011/074602 patent/WO2012053660A1/en active Application Filing
- 2011-10-19 SG SG2013020862A patent/SG188621A1/en unknown
- 2011-10-19 CN CN201180048812.8A patent/CN103154178B/en not_active Expired - Fee Related
- 2011-10-19 JP JP2012539790A patent/JP5429397B2/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020039875A1 (en) * | 2000-10-02 | 2002-04-04 | Mitsubishi Denki Kabushiki Kaisha | Polishing agent for processing semiconductor, dispersant used therefor and process for preparing semiconductor device using above polishing agent for processing semiconductor |
| US6641630B1 (en) * | 2002-06-06 | 2003-11-04 | Cabot Microelectronics Corp. | CMP compositions containing iodine and an iodine vapor-trapping agent |
| US20040058623A1 (en) * | 2002-09-20 | 2004-03-25 | Lam Research Corporation | Polishing media for chemical mechanical planarization (CMP) |
| CN1498723A (en) * | 2002-11-05 | 2004-05-26 | Jsr株式会社 | Polishing pad |
| JP2004306248A (en) * | 2003-03-25 | 2004-11-04 | Neos Co Ltd | Texture processing lubricant composition |
| CN101367204A (en) * | 2007-08-15 | 2009-02-18 | 罗门哈斯电子材料Cmp控股股份有限公司 | Interpenetrating network for chemical mechanical polishing |
| CN101235103A (en) * | 2007-12-26 | 2008-08-06 | 广州大学 | Cyclodextrin-nano diamond derivatives, preparation method and use thereof |
| US20090176372A1 (en) * | 2007-12-27 | 2009-07-09 | Gaku Minamihaba | Chemical mechanical polishing slurry and semiconductor device manufacturing method |
| US20090311864A1 (en) * | 2008-06-12 | 2009-12-17 | Fujifilm Corporation | Polishing slurry |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5429397B2 (en) | 2014-02-26 |
| JPWO2012053660A1 (en) | 2014-02-24 |
| WO2012053660A1 (en) | 2012-04-26 |
| CN103154178B (en) | 2015-02-25 |
| SG188621A1 (en) | 2013-04-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101925170B1 (en) | Additive mixture and composition and method for polishing glass substrates | |
| JP6273281B2 (en) | How to polish sapphire surface | |
| US9896604B2 (en) | Methods of polishing sapphire surfaces | |
| TW467794B (en) | Polishing liquid composition | |
| JP2017034264A (en) | Polishing composition and polishing method | |
| CN112908834B (en) | Quick green environment-friendly double-side polishing method for silicon wafer substrate | |
| KR20110102215A (en) | Polishing composition and polishing method using the same | |
| CN103154178B (en) | Lubricant composition for polishing glass substrates and polishing slurry | |
| CN104321850A (en) | Polishing solution composition for wafers | |
| CN105273638B (en) | Anti- cleavage suspension lapping liquid of gallium oxide wafer and preparation method thereof | |
| CN101642893A (en) | Precise polishing method of stainless steel substrate | |
| US20110275286A1 (en) | Method and System for Polishing Materials Using a Nonaqueous Magnetorheological Fluid | |
| US20180305580A1 (en) | Polishing composition | |
| JP5365522B2 (en) | Glass substrate polishing method and manufacturing method | |
| CN103180902A (en) | Process for manufacturing glass hard disc substrates | |
| CN102766406A (en) | Polishing composition for removing surface defect of semiconductor silicon wafer and preparation method thereof | |
| TWI755467B (en) | Abrasive composition | |
| KR20140019327A (en) | Polishing composition and polishing method using same | |
| CN102399496A (en) | Abrasive composition for rough polishing of wafers | |
| CN104530987A (en) | Composition for finishing polish of silicon wafer and preparation method of composition | |
| JP5690609B2 (en) | Polishing composition | |
| JP5531236B2 (en) | Glass substrate polishing composition and polishing slurry | |
| JP5621157B2 (en) | Lubricating liquid composition for polishing hard disk glass substrate and polishing slurry | |
| CN102834480B (en) | Polishing fluid composition for glass hard disc substrates | |
| CN115011254A (en) | Chemical mechanical polishing solution for glass wafer and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150225 Termination date: 20151019 |
|
| EXPY | Termination of patent right or utility model |