CN1550531A - Polishing composition - Google Patents
Polishing composition Download PDFInfo
- Publication number
- CN1550531A CN1550531A CNA2004100435118A CN200410043511A CN1550531A CN 1550531 A CN1550531 A CN 1550531A CN A2004100435118 A CNA2004100435118 A CN A2004100435118A CN 200410043511 A CN200410043511 A CN 200410043511A CN 1550531 A CN1550531 A CN 1550531A
- Authority
- CN
- China
- Prior art keywords
- acid
- polishing composition
- polishing
- aluminum oxide
- promotor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 139
- 239000000203 mixture Substances 0.000 title claims abstract description 71
- 239000000758 substrate Substances 0.000 claims abstract description 33
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 21
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 150000003839 salts Chemical class 0.000 claims abstract description 11
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 10
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 8
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 8
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910000420 cerium oxide Inorganic materials 0.000 claims abstract description 7
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims abstract description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000002253 acid Substances 0.000 claims description 49
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 18
- 238000007517 polishing process Methods 0.000 claims description 18
- -1 Ba Dousuan Substances 0.000 claims description 11
- 229960001866 silicon dioxide Drugs 0.000 claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 6
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 claims description 6
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 claims description 6
- 150000007524 organic acids Chemical class 0.000 claims description 5
- LUOZTUYAYLNGTG-UHFFFAOYSA-N 1,3,2-dioxathiepane-4,7-dione Chemical compound O=C1CCC(=O)OSO1 LUOZTUYAYLNGTG-UHFFFAOYSA-N 0.000 claims description 4
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 4
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims description 4
- PVNIIMVLHYAWGP-UHFFFAOYSA-N Niacin Chemical compound OC(=O)C1=CC=CN=C1 PVNIIMVLHYAWGP-UHFFFAOYSA-N 0.000 claims description 4
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 claims description 4
- UCMIRNVEIXFBKS-UHFFFAOYSA-N beta-alanine Chemical compound NCCC(O)=O UCMIRNVEIXFBKS-UHFFFAOYSA-N 0.000 claims description 4
- 229910001593 boehmite Inorganic materials 0.000 claims description 4
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical group O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 claims description 4
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 4
- LVHBHZANLOWSRM-UHFFFAOYSA-N itaconic acid Chemical compound OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims description 4
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000011707 mineral Substances 0.000 claims description 4
- ULUAUXLGCMPNKK-UHFFFAOYSA-N Sulfobutanedioic acid Chemical compound OC(=O)CC(C(O)=O)S(O)(=O)=O ULUAUXLGCMPNKK-UHFFFAOYSA-N 0.000 claims description 3
- 230000002378 acidificating effect Effects 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 2
- IOVCWXUNBOPUCH-UHFFFAOYSA-N Nitrous acid Chemical compound ON=O IOVCWXUNBOPUCH-UHFFFAOYSA-N 0.000 claims description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 2
- MMLCSQIUZREJAT-UHFFFAOYSA-N OC(CCC(O)=O)=O.O[S-](=O)=O.[K+] Chemical compound OC(CCC(O)=O)=O.O[S-](=O)=O.[K+] MMLCSQIUZREJAT-UHFFFAOYSA-N 0.000 claims description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 2
- 235000009754 Vitis X bourquina Nutrition 0.000 claims description 2
- 235000012333 Vitis X labruscana Nutrition 0.000 claims description 2
- 240000006365 Vitis vinifera Species 0.000 claims description 2
- 235000014787 Vitis vinifera Nutrition 0.000 claims description 2
- 150000007513 acids Chemical class 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 claims description 2
- 229940000635 beta-alanine Drugs 0.000 claims description 2
- HCPOCMMGKBZWSJ-UHFFFAOYSA-N ethyl 3-hydrazinyl-3-oxopropanoate Chemical compound CCOC(=O)CC(=O)NN HCPOCMMGKBZWSJ-UHFFFAOYSA-N 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 2
- 239000004310 lactic acid Substances 0.000 claims description 2
- 235000014655 lactic acid Nutrition 0.000 claims description 2
- 229960000448 lactic acid Drugs 0.000 claims description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 2
- IWYDHOAUDWTVEP-UHFFFAOYSA-N mandelic acid Chemical compound OC(=O)C(O)C1=CC=CC=C1 IWYDHOAUDWTVEP-UHFFFAOYSA-N 0.000 claims description 2
- 229960002510 mandelic acid Drugs 0.000 claims description 2
- 239000011664 nicotinic acid Substances 0.000 claims description 2
- 229960003512 nicotinic acid Drugs 0.000 claims description 2
- 235000001968 nicotinic acid Nutrition 0.000 claims description 2
- 239000011164 primary particle Substances 0.000 claims description 2
- KOUKXHPPRFNWPP-UHFFFAOYSA-N pyrazine-2,5-dicarboxylic acid;hydrate Chemical compound O.OC(=O)C1=CN=C(C(O)=O)C=N1 KOUKXHPPRFNWPP-UHFFFAOYSA-N 0.000 claims description 2
- ACTRVOBWPAIOHC-UHFFFAOYSA-N succimer Chemical compound OC(=O)C(S)C(S)C(O)=O ACTRVOBWPAIOHC-UHFFFAOYSA-N 0.000 claims description 2
- 229940095064 tartrate Drugs 0.000 claims description 2
- 239000008096 xylene Substances 0.000 claims description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- QLCAGXDTDCDEGN-UHFFFAOYSA-N 3-sulfanylcarbonylhexanedioic acid Chemical compound OC(=O)CCC(C(O)=S)CC(O)=O QLCAGXDTDCDEGN-UHFFFAOYSA-N 0.000 abstract 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 abstract 1
- 229910001928 zirconium oxide Inorganic materials 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 239000013543 active substance Substances 0.000 description 5
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- GVNVAWHJIKLAGL-UHFFFAOYSA-N 2-(cyclohexen-1-yl)cyclohexan-1-one Chemical compound O=C1CCCCC1C1=CCCCC1 GVNVAWHJIKLAGL-UHFFFAOYSA-N 0.000 description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 3
- 101150065749 Churc1 gene Proteins 0.000 description 3
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- 102100038239 Protein Churchill Human genes 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- 235000010755 mineral Nutrition 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 238000000197 pyrolysis Methods 0.000 description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-L succinate(2-) Chemical compound [O-]C(=O)CCC([O-])=O KDYFGRWQOYBRFD-UHFFFAOYSA-L 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- KGWDUNBJIMUFAP-KVVVOXFISA-N Ethanolamine Oleate Chemical compound NCCO.CCCCCCCC\C=C/CCCCCCCC(O)=O KGWDUNBJIMUFAP-KVVVOXFISA-N 0.000 description 2
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 2
- 229910018104 Ni-P Inorganic materials 0.000 description 2
- 229910018536 Ni—P Inorganic materials 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- JAWMENYCRQKKJY-UHFFFAOYSA-N [3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-ylmethyl)-1-oxa-2,8-diazaspiro[4.5]dec-2-en-8-yl]-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]methanone Chemical compound N1N=NC=2CN(CCC=21)CC1=NOC2(C1)CCN(CC2)C(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F JAWMENYCRQKKJY-UHFFFAOYSA-N 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 229960003330 pentetic acid Drugs 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000001103 potassium chloride Substances 0.000 description 2
- 235000011164 potassium chloride Nutrition 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- FHVDTGUDJYJELY-UHFFFAOYSA-N 6-{[2-carboxy-4,5-dihydroxy-6-(phosphanyloxy)oxan-3-yl]oxy}-4,5-dihydroxy-3-phosphanyloxane-2-carboxylic acid Chemical compound O1C(C(O)=O)C(P)C(O)C(O)C1OC1C(C(O)=O)OC(OP)C(O)C1O FHVDTGUDJYJELY-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 1
- RVGRUAULSDPKGF-UHFFFAOYSA-N Poloxamer Chemical compound C1CO1.CC1CO1 RVGRUAULSDPKGF-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229920001214 Polysorbate 60 Polymers 0.000 description 1
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229940072056 alginate Drugs 0.000 description 1
- 235000010443 alginic acid Nutrition 0.000 description 1
- 229920000615 alginic acid Polymers 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910021431 alpha silicon carbide Inorganic materials 0.000 description 1
- APUPEJJSWDHEBO-UHFFFAOYSA-P ammonium molybdate Chemical compound [NH4+].[NH4+].[O-][Mo]([O-])(=O)=O APUPEJJSWDHEBO-UHFFFAOYSA-P 0.000 description 1
- 239000011609 ammonium molybdate Substances 0.000 description 1
- 235000018660 ammonium molybdate Nutrition 0.000 description 1
- 229940010552 ammonium molybdate Drugs 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 229910001680 bayerite Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- DRVWBEJJZZTIGJ-UHFFFAOYSA-N cerium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ce+3].[Ce+3] DRVWBEJJZZTIGJ-UHFFFAOYSA-N 0.000 description 1
- 229910000421 cerium(III) oxide Inorganic materials 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 229910001648 diaspore Inorganic materials 0.000 description 1
- BLSNQVPBJDBAJJ-UHFFFAOYSA-L dipotassium;2-sulfobutanedioate Chemical compound [K+].[K+].OS(=O)(=O)C(C([O-])=O)CC([O-])=O BLSNQVPBJDBAJJ-UHFFFAOYSA-L 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 229910001679 gibbsite Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 1
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 1
- 239000000138 intercalating agent Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 1
- VLAPMBHFAWRUQP-UHFFFAOYSA-L molybdic acid Chemical compound O[Mo](O)(=O)=O VLAPMBHFAWRUQP-UHFFFAOYSA-L 0.000 description 1
- KELHQGOVULCJSG-UHFFFAOYSA-N n,n-dimethyl-1-(5-methylfuran-2-yl)ethane-1,2-diamine Chemical compound CN(C)C(CN)C1=CC=C(C)O1 KELHQGOVULCJSG-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000006353 oxyethylene group Chemical group 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 description 1
- 229920005646 polycarboxylate Polymers 0.000 description 1
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 1
- KVOIJEARBNBHHP-UHFFFAOYSA-N potassium;oxido(oxo)alumane Chemical compound [K+].[O-][Al]=O KVOIJEARBNBHHP-UHFFFAOYSA-N 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- TVXXNOYZHKPKGW-UHFFFAOYSA-N sodium molybdate (anhydrous) Chemical compound [Na+].[Na+].[O-][Mo]([O-])(=O)=O TVXXNOYZHKPKGW-UHFFFAOYSA-N 0.000 description 1
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000003206 sterilizing agent Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- GQUJEMVIKWQAEH-UHFFFAOYSA-N titanium(III) oxide Chemical compound O=[Ti]O[Ti]=O GQUJEMVIKWQAEH-UHFFFAOYSA-N 0.000 description 1
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/04—Aqueous dispersions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention relates to a polishing composition more suitable for use in polishing a substrate for a magnetic disk. The polishing composition contains an abrasive which contains at least one component selected from the group consisting of aluminum oxide, silicon dioxide, cerium oxide, zirconium oxide, titanium oxide; silicon carbide, and silicon nitride, a polishing accelerator which contains at least one component selected from the group consisting of carboxyethyl thiosuccinic acid and its salts, and water.
Description
Technical field
The present invention relates to a kind of polishing composition that is used to polish such as magnetic disk substrate or analogue.
Disk for as the hard disk that serves as the Computer Storage element requires it must possess very high recording density.Therefore, the used substrate of disk requires to possess good surface property.
Background technology
Publication number is the polishing composition that the Japanese patent gazette of N0.2000-1665 has disclosed a kind of improvement, to satisfy the as above requirement of substrate.This polishing composition contains: abrasive (as aluminum oxide), succsinic acid or succinate (as polishing promotor), and water.
But, this polishing composition still has problems: although the defective that succsinic acid or succinate have quickened polishing and prevented to exist on the polishing substrate surface, but succsinic acid or succinate have little effect for the little line that reduces substrate surface, and can not fully improve the slickness of substrate surface.
Summary of the invention
In view of the above, the object of the present invention is to provide a kind of polishing composition, it more is applicable to the polishing of magnetic disk substrate.
According to purpose of the present invention, in order to achieve the above object and other purpose, provide a kind of polishing composition.Polishing composition contains: abrasive, and it contains at least and is selected from a kind of in the following component: aluminum oxide, silicon-dioxide, cerium oxide, zirconium white, titanium oxide, silicon carbide, silicon nitride; Polishing promotor, it contains at least and is selected from a kind of in the following component: propyloic sulfo-succsinic acid, propyloic thio succinate; And water.
The present invention also provides a kind of method of polishing object, and this method comprises the above-mentioned polishing composition of preparation and with this polishing composition body surface polished.
Other aspects and advantages of the present invention will be in conjunction with principle of the present invention being described for example and being explained and embody
Embodiment
Embodiment of various details.
According to present embodiment, polishing composition contains: (a) abrasive, and it contains at least and is selected from a kind of in the following component: aluminum oxide, silicon-dioxide, cerium oxide, zirconium white, titanium oxide, silicon carbide, silicon nitride; (b) polishing promotor, it contains a kind of following component at least: propyloic sulfo-succsinic acid, propyloic thio succinate; And (c) water.
Polishing composition can be used for polishing the object such as magnetic disk substrate, and substrate can be to be placed on the aluminium alloy blank and formed by nickel-phosphorus electroless plating, also can be the substrate of nickeliferous-iron, norbide or carbon.
Abrasive works in to object mechanical polishing process, and abrasive preferably contains at least a aluminum oxide or silicon-dioxide.More preferably salic.Aluminum oxide and silicon-dioxide are very effective for the little line that reduces the polishing object surface, and aluminum oxide possesses very high mechanical polishing ability.
Aluminum oxide can be Alpha-alumina, δ-aluminum oxide, θ-aluminum oxide, κ-aluminum oxide or pyrolysis method aluminum oxide; Silicon-dioxide can be silica gel or pyrogenic silica; Cerium oxide can be cerium dioxide or cerous oxide, and it can also be hexagonal system, tesseral system or centroid cubic crystal system; Zirconium white can be oblique system or tetragonal system, also can be amorphous oxidation zirconium, or the pyrolysis method zirconium white; Titanium oxide can be titanium monoxide, titanium sesquioxide, titanium dioxide or pyrolysis method titanium oxide.Silicon carbide can be alpha-silicon carbide, silicon B-carbide or amorphous carborundum.Silicon nitride can be can be α-Dan Huagui, beta-silicon nitride or amorphous silicon nitride.
If what abrasive was used is aluminum oxide, zirconium white, titanium oxide, silicon carbide or silicon nitride.Then the abrasive median size of being measured by the laser diffraction and scattering method is preferably between 0.05~2.0 μ m, more preferably between 0.1~1.5 μ m; If what abrasive was used is silicon-dioxide, then the primary particle median size of the abrasive of being measured by BET specific surface area method is preferably between 0.005~0.5 μ m, more preferably between 0.01~0.3 μ m; If what abrasive was used is cerium oxide, then the median size of being measured by scanning electronic microscope (SEM) is preferably between 0.01~0.5 μ m, more preferably between 0.05~0.45 μ m.If the median size of abrasive is too small, the mechanical polishing scarce capacity of abrasive then, if the median size of abrasive is excessive, then abrasive may be in polishing composition precipitation, and produce scratch at polished body surface.
In the polishing composition, between preferred 0.1~40% (weight) of the content of abrasive, more preferably between 1~25% (weight).If the content of abrasive is lower than 0.1% (weight), then the polishing speed of polishing composition can reduce; If content is higher than 40% (weight), then owing to the gathering of abrasive, the stability of polishing composition will be lowered, and cause in the polishing composition to deposit, and simultaneously, it is very high that the viscosity of polishing composition also becomes.
Polishing promotor role is the mechanical polishing that promotes abrasive, and reduces little line of polished body surface, and this can think because polishing promotor has been eliminated little line by its chemical rightenning effect.Term " little line " here refers to: under given wavelength, by the small degree of irregularity that the surface roughness tester device is measured, represent with its height ().Except propyloic sulfo-succsinic acid and salt thereof, also have many other polishing promotor, still, they almost can not reduce little line of polished body surface.
The molecular formula of propyloic sulfo-succsinic acid is shown in following general formula 1, and the propyloic thio succinate can be an an alkali metal salt, as sylvite, ammonium salt, amine salt (as monoethanolamine salt).Polishing promotor is preferably contained propyloic sulfo-succsinic acid, propyloic sulfo-succsinic acid sylvite, propyloic sulfo-mono succinate thanomin, because they, have the very strong ability that the little line of glazed surface is eliminated by the chemical rightenning effect.
General formula 1
HOOC-CH
2-CH
2-S-CH(CH
2COOH)-COOH
In the polishing composition, the content of polishing promotor is preferably in 0.001~10% (weight), more preferably 0.003~5% (weight), most preferably 0.01~2% (weight).If the content of polishing promotor is lower than 0.001% (weight), then little line of glazed surface can not fully be eliminated, and this will cause the polishing speed of polishing composition to reduce; If the content of polishing promotor is higher than 10% (weight), then can produce surface imperfection such as dimpling or nick and so on polished surface.
Water role in polishing composition is as medium, other component outside dissolving and dispersion dewater.Preferred impure the least possible water, more specifically preferred pure water, ultrapure water or distilled water.
According to present embodiment, the preparation of polishing composition is to be mixed by abrasive, polishing promotor and water.In mixing process, the interpolation of various components is arbitrarily in proper order, also can add all components simultaneously.
When using polishing composition such as present embodiment that the surface of magnetic disk substrate is polished, in the time of with polishing pad friction substrate surface, the surface that polishing composition should be added to substrate.
The polishing composition of present embodiment is suitable for makes the first road polishing process in required many polishing processes in the substrate process.The first road polishing process is generally used for eliminating little line and surface imperfection (as the big scratch of substrate surface and uneven), and they are difficult to be eliminated in follow-up polishing process.On the other hand, last polishing process is normally regulated meeting the requirements the substrate surface roughness, and eliminates surface imperfection and the previous indelible surface imperfection of polishing process that produces in the previous polishing process.
Present embodiment has following advantage:
According to present embodiment, contain in the polishing composition: abrasive, can carry out mechanical polishing to object; Polishing promotor can promote the mechanical polishing of abrasive.Therefore, this polishing composition can high speed polishing object surface, especially polishes magnetic disk substrate, and in other words, the polishing composition of present embodiment has high polishing speed to substrate.
Propyloic sulfo-succsinic acid and salt thereof have the ability of eliminating the little line of polished body surface, therefore, use the polishing composition that contains propyloic sulfo-succsinic acid or its salt to improve the smooth degree on polishing object surface.
This should be conspicuous for those skilled in the art, and under the aim that does not deviate from the scope of the invention, the present invention can implement by other multiple specific form.Especially it should be understood that the present invention can implement in the following manner.
Polishing promotor can further contain and is selected from least a in the following component: the salt that organic acid, mineral acid or these acid form comprises propyloic sulfo-succsinic acid and salt thereof.The preferred organic acid of other component and the mineral acid that are increased in the polishing promotor are because they possess very strong chemical rightenning ability.Polishing increases other component of containing more preferably oxysuccinic acid, oxyacetic acid, succsinic acid, citric acid, toxilic acid, methylene-succinic acid, propanedioic acid, iminodiethanoic acid, grape acid, lactic acid, amygdalic acid, tartrate, Ba Dousuan, nicotinic acid, acetic acid, Padil, Beta Alanine, methylsulfonic acid, Phenylsulfonic acid, toluenesulphonic acids, xylene monosulfonic acid, thioacetic acid, dimercaptosuccinic acid, nitrous acid aluminium, Tai-Ace S 150 in the promotor.Most preferably oxysuccinic acid, oxyacetic acid, succsinic acid, citric acid or iminodiethanoic acid.
In polishing composition, be included in the polishing promotor preferred 0.001~0.5% (weight) of other components contents that increases newly, more preferably 0.005~0.3% (weight).If its content is lower than 0.001% (weight), then the polishing speed of polishing composition can not obviously improve; And if its content is higher than 0.5% (weight), other component that then polished object surfaces can be increased corrodes, and causes that the little line of polished body surface worsens, and produces the surface imperfection of nick one class.
Polishing composition can further contain tensio-active agent; Alumina sol; Molybdic acid; Molybdate (as potassium aluminate, Sodium orthomolybdate, ammonium molybdate); Sterilizing agent (as sodiun alginate and saleratus); Intercalating agent is as NTA nitrile triacetic acid (NTA), ethylenediamine tetraacetic acid (EDTA) (EDTA), diethylenetriamine pentaacetic acid (DTPA), teiethylene tetramine-hexacetic acid (TTHA); Water soluble cellulose is as hydroxylated cellulose, hydroxypropylcellulose, Walocel MT 20.000PV; Higher fatty acid amine; Sulfonic acid; Rust-preventive agent; Defoamer and work oil.
Tensio-active agent can improve the dispersing property of polishing composition, and can effectively suppress polished body surface generation of defects.Tensio-active agent can be a non-ionic type, also can be anionic, the preferred polyoxyethylene polyoxypropylene alkane of nonionic surface active agent ether, and its molecular formula is seen general formula 2; Poloxalkol, its molecular formula is seen general formula 3 or 4; Polyoxyethylene sorbitan fatty acid ester, polyoxyethylene sorbitol fatty acid ester, or polyurethane kind tensio-active agent, its molecular formula is seen general formula 5.The preferred polycarboxylate of aniorfic surfactant is as sodium polyacrylate; Or polymkeric substance, as isoprene sulfonic acid and acrylic acid multipolymer, it contains the monomeric unit of deriving out from isoprene sulfonic acid or its salt.When containing aforesaid nonionic surface active agent or aniorfic surfactant in the polishing composition, polish the surface of magnetic disk substrate with it, can improve the smoothness of substrate surface, because having a down dip, the surface at substrate outward flange position has been suppressed.
General formula 2
R-O-(CH
2C(CH
3)HO)
l(CH
2CH
2O)
mH
In general formula 2, R represents an alkyl, and l and m represent an integer respectively.
General formula 3
HO(CH
2CH
2O)
n((CH
3)CHCH
2O)
o(CH
2CH
2O)
pH
In general formula 3, n, o and p represent an integer respectively.
General formula 4
HO((CH
3)CHCH
2O)
q(CH
2CH
2O)
r((CH
3)CHCH
2O)
sH
In general formula 4, q, r and s represent an integer respectively.
General formula 5
X-(CO-NH-Y-NH-CO-(OCH
2CH
2)u-Z)
t
In general formula 5, x represents the residue of polyether polyol, it is derived from the compound with active oxygen atom and epoxy alkane and gets (oxyethylene group that polyether segment contains 20~90% (weight)), t represents the integer (this number equals contained hydroxyl value in the above-mentioned polyether polyol molecule) between 2~8, Y represents the hydroxyl of divalence, Z representative has the residue of the unit price compound of active oxygen atom, and u represents 3 or bigger integer.
In the polishing composition, preferred 0.001~0.5% (weight) of the content of tensio-active agent, more preferably 0.005~0.3% (weight).If it is the content of promoting agent is lower than 0.001% (weight), then not enough to the inhibition that the surface has a down dip; If content is higher than 0.5% (weight), then polishing speed can be lowered, because the polishing accelerating effect is weakened, and may causes precipitation and produce foam.
Alumina sol can suppress the surface imperfection (as dimpling and nick) on the polished body surface.This can think because alumina sol attaches to the surface of abrasive, thereby promotes the mechanical polishing ability of abrasive.And because alumina sol is scattered in the polishing composition with colloidal state, it can improve the dispersing property of abrasive, thereby prevents the abrasive precipitation, and in polishing process, it can make abrasive be easy to polished pad maintenance.
Alumina sol should contain at least and is selected from a kind of in the following component: promptly be scattered in hydrated aluminum oxide and oxide hydroxide in the acidic aqueous solution with colloidal state.Hydrated aluminum oxide can be boehmite, pseudobochmite, diaspore, gibbsite, bayerite.Acidic aqueous solution system transfers to acidity by organic acid, mineral acid or these sour salt with the pH value of water and makes.Alumina sol can contain the hydrated aluminum oxide of two or more clocks.Suitable hydrated aluminum oxide is boehmite and pseudobochmite, because boehmite has the ability that relative higher inhibition surface imperfection produced and reduced polished body surface roughness with pseudobochmite.
Polishing composition can be before use immediately the dilute with water material solution make.
The polishing of magnetic disk substrate can be finished by single polishing process, at this moment, can use described polishing composition in single polishing process.
Polishing composition can also be used for other polishing process except can be used for the first road polishing process, such as, described polishing composition can be used for last one polishing process.
Polishing composition also can be used for the polishing of other object except magnetic disk substrate, and other object except that magnetic disk substrate can be the object of tungstenic, copper, silicon, glass or pottery, and in particular, polishing object can be semiconductor wafer or optical mirror slip.
Below, with reference to embodiment and comparative example, the present invention is made a more detailed description.
In embodiment 1-16 and comparative example 1-8, polishing composition gets by abrasive, polishing promotor and water are mixed.Abrasive in each polishing composition is an aluminum oxide, and its median size is 0.8 μ m, and the median size of aluminum oxide is measured by laser diffraction and scattering type particle size analyzer (LS-230, coulter company makes).In each polishing composition, the content of aluminum oxide is 6% (weight).The concrete component of the polishing promotor in each polishing composition sees Table 1.
Use each polishing composition, the surface of magnetic disk substrate is polished by following polishing condition.
<polishing condition 〉
Polished substrate: electroless Ni-P substrate, 3.5 inches of diameters
Polishing machine: the fixed base diameter is the Twp-sided polishing machine of 720mm
Polishing pad: Polyurethane pad (BELLATRIX N0048, Kanebo company limited makes)
Polishing load: 100g/cm
2
Top fixed base rotating speed: 24rpm
Bottom fixed base rotating speed: 16rpm
Polishing composition feed amount: 150ml/min
Cutting output: 3 μ m, represent with the process redundancy of both sides
After polishing finishes, with contactless surface roughness tester (micro XAM, phaseshift company makes, eyepiece: 10 *, spectral filter: Gauss's band leads to (Gaussian Bandpass), and the Ra value of measuring little line is between 80~450 μ m, and the test of little line size is pressed Three Estate and divided: the Ra value is less than 4.5 (good), the Ra value greater than 4.5 but less than 5.0 (in), the Ra value is greater than 5.0 (poor).Its test result sees Table 1 " little line " hurdle.
For the polishing process that carries out under these conditions, its polishing speed calculates by following equation.The polishing speed that calculates also is divided into Three Estate: polishing speed is not less than 0.5 μ m/min (good), polishing speed be lower than 0.5 μ m/min but be not less than 0.45 μ m/min (in), polishing speed is lower than 0.45 μ m/min (poor).It the results are shown in Table 1 " polishing speed " hurdle.
Equation:
The substrate quantity (g) that reduces in polishing speed (the μ m/min)=polishing process/polished long-pending (cm of substrate surface
2Density (the g/cm of) * Ni-P electrolytic coating
3) * polishing time (min) * 10
4
Table 1
Polishing promotor | Little line | Polishing speed | ||||
Kind | Content (wt%) | Kind | Content (wt%) | |||
Embodiment 1 | ????A1 | ????0.1 | Good | In | ||
Embodiment 2 | ????A1 | ????0.2 | Good | In | ||
Embodiment 3 | ????A1 | ????0.5 | Good | In | ||
Embodiment 4 | ????A1 | ????1.0 | Good | In | ||
Embodiment 5 | ????A2 | ????0.2 | Good | In | ||
Embodiment 6 | ????A3 | ????0.2 | Good | Difference | ||
Embodiment 7 | ????A4 | ????0.2 | Good | Difference | ||
Embodiment 8 | ????A5 | ????0.2 | Good | Difference | ||
Embodiment 9 | ????A1 | ????0.2 | Citric acid | ????0.1 | Good | Good |
Embodiment 10 | ????A1 | ????0.2 | Succsinic acid | ????0.1 | Good | Good |
Embodiment 11 | ????A1 | ????0.2 | Oxysuccinic acid | ????0.1 | Good | Good |
Embodiment 12 | ????A1 | ????0.2 | Iminodiethanoic acid | ????0.1 | Good | Good |
Embodiment 13 | ????A1 | ????0.2 | Oxyacetic acid | ????0.1 | Good | Good |
Embodiment 14 | ????A1 | ????0.2 | Padil | ????0.1 | Good | Good |
Embodiment 15 | ????A1 | ????0.2 | Methylsulfonic acid | ????0.1 | Good | Good |
Embodiment 16 | ????A1 | ????0.2 | Tai-Ace S 150 | ????0.1 | Good | Good |
The comparative example 1 | Citric acid | ????0.2 | Difference | In | ||
The comparative example 2 | Succsinic acid | ????0.2 | In | In | ||
The comparative example 3 | Oxysuccinic acid | ????0.2 | Difference | In | ||
The comparative example 4 | Iminodiethanoic acid | ????0.2 | In | In | ||
The comparative example 5 | Oxyacetic acid | ????0.2 | Difference | Difference | ||
The comparative example 6 | Padil | ????0.2 | Difference | Difference | ||
The comparative example 7 | Methylsulfonic acid | ????0.2 | In | In | ||
The comparative example 8 | Tai-Ace S 150 | ????0.2 | Difference | Difference |
In table 1, propyloic sulfo-succsinic acid represents that with A1 propyloic sulfo-mono succinate potassium represents that with A2 propyloic sulfo-potassium succinate represents that with A3 propyloic sulfo-succsinic acid tripotassium represents that with A4 propyloic sulfo-mono succinate thanomin is represented with A5.
As shown in table 1, little line test result of embodiment 1-16 is good, and among the embodiment 9-16, owing to except propyloic sulfo-succsinic acid and salt thereof, also added organic acid and inorganic acid salt, the result is good for its polishing speed.On the contrary, the little line of comparative example 1-8 and polishing speed result are bad.
It is exemplary with nonrestrictive that the foregoing description and embodiment should be considered to, and the present invention is not limited by detailed description given herein, and can change in the scope of the claim of enclosing and equivalence.
Claims (17)
1. a polishing composition is characterized in that, comprising:
A kind of abrasive, it contains at least a following component: aluminum oxide, silicon-dioxide, cerium oxide, zirconium white, titanium oxide, silicon carbide, silicon nitride;
A kind of polishing promotor, it contains at least and is selected from a kind of in the following component. propyloic sulfo-succsinic acid, propyloic thio succinate; And
Water.
2. polishing composition as claimed in claim 1 is characterized in that described abrasive contains a kind of of aluminum oxide and silicon-dioxide at least.
3. polishing composition as claimed in claim 1 is characterized in that described abrasive contains aluminum oxide.
4. polishing composition as claimed in claim 1 is characterized in that, the median size of described aluminum oxide, zirconium white, titanium oxide, silicon carbide, silicon nitride comprises 0.05 μ m and 2.0 μ m between 0.05~2.0 μ m.
5. polishing composition as claimed in claim 1, the median size of primary particle that it is characterized in that silicon-dioxide comprises 0.005 μ m and 0.5 μ m between 0.005~0.5 μ m.
6. polishing composition as claimed in claim 1 is characterized in that, the median size of described cerium oxide comprises 0.01 μ m and 0.5 μ m between 0.01~0.5 μ m.
7. polishing composition as claimed in claim 1 is characterized in that, in the described polishing composition, the content of abrasive comprises 0.1% weight and 40% weight between 0.1~40% weight.
8. polishing composition as claimed in claim 1 is characterized in that, described polishing promotor is contained at least and is selected from a kind of in the following component: propyloic sulfo-succsinic acid, propyloic sulfo-potassium succinate or propyloic sulfo-mono succinate amine acetate.
9. polishing composition as claimed in claim 1 is characterized in that, described polishing promotor is also contained and is selected from least a of following component: salt of organic acid, mineral acid or these acid formation except propyloic sulfo-succsinic acid and salt thereof.
10. polishing composition as claimed in claim 1, it is characterized in that described polishing promotor is also contained at least a of following component: oxysuccinic acid, oxyacetic acid, succsinic acid, citric acid, toxilic acid, methylene-succinic acid, propanedioic acid, iminodiethanoic acid, grape acid, lactic acid, amygdalic acid, tartrate, Ba Dousuan, nicotinic acid, acetic acid, Padil, Beta Alanine, methylsulfonic acid, Phenylsulfonic acid, toluenesulphonic acids, xylene monosulfonic acid, thioacetic acid, dimercaptosuccinic acid, nitrous acid aluminium, Tai-Ace S 150.
11. polishing composition as claimed in claim 1 is characterized in that, described polishing promotor is also contained at least a of following component: oxysuccinic acid, oxyacetic acid, succsinic acid, citric acid or iminodiethanoic acid.
12. polishing composition as claimed in claim 1 is characterized in that, in the described polishing composition, the content of polishing promotor comprises 0.001% weight and 10% weight between 0.001~10% weight.
13. polishing composition as claimed in claim 1 is characterized in that, comprises alumina sol.
14. polishing composition as claimed in claim 13 is characterized in that, described alumina sol contains and is selected from least a of following component: be scattered in hydrated aluminum oxide and oxide hydroxide in the acidic aqueous solution with colloidal state.
15. polishing composition as claimed in claim 14 is characterized in that, described hydrated aluminum oxide is boehmite or pseudobochmite.
16., it is characterized in that described polishing composition is used to polish magnetic disk substrate as each described polishing composition among the claim 1-15.
17. a method of polishing magnetic disk substrate is characterized in that,
Preparation is as any one described polishing composition among the claim 1-15;
Use polishing composition that substrate surface is polished.
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GB2384003B (en) * | 1998-06-15 | 2003-09-03 | Fujimi Inc | Polishing composition |
JP3998813B2 (en) * | 1998-06-15 | 2007-10-31 | 株式会社フジミインコーポレーテッド | Polishing composition |
JP4003116B2 (en) * | 2001-11-28 | 2007-11-07 | 株式会社フジミインコーポレーテッド | Polishing composition for magnetic disk substrate and polishing method using the same |
JP4095833B2 (en) * | 2002-05-30 | 2008-06-04 | 株式会社フジミインコーポレーテッド | Polishing composition |
-
2003
- 2003-05-09 JP JP2003132313A patent/JP4068499B2/en not_active Expired - Fee Related
-
2004
- 2004-05-07 GB GB0410212A patent/GB2401370B/en not_active Expired - Fee Related
- 2004-05-07 MY MYPI20041723A patent/MY139093A/en unknown
- 2004-05-09 CN CN200410043511.8A patent/CN100547045C/en not_active Expired - Fee Related
Cited By (11)
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WO2013067696A1 (en) * | 2011-11-09 | 2013-05-16 | Rhodia (China) Co., Ltd. | Additive mixture and composition and method for polishing glass substrates |
EP2776523A4 (en) * | 2011-11-09 | 2015-07-08 | Rhodia Operations | Additive mixture and composition and method for polishing glass substrates |
CN102990503A (en) * | 2012-11-09 | 2013-03-27 | 中国电子科技集团公司第四十六研究所 | Polishing method applied to CdS wafer |
CN102990503B (en) * | 2012-11-09 | 2015-07-29 | 中国电子科技集团公司第四十六研究所 | For the finishing method of CdS wafer |
CN103059810A (en) * | 2012-12-19 | 2013-04-24 | 青岛博益特生物材料有限公司 | Grinding fluid |
CN107109195A (en) * | 2014-12-26 | 2017-08-29 | 福吉米株式会社 | The manufacture method of composition for polishing, Ginding process and ceramics part processed |
CN106019418A (en) * | 2016-05-13 | 2016-10-12 | 郑海东 | Resin eyeglass processing method |
CN106019418B (en) * | 2016-05-13 | 2019-10-25 | 郑海东 | A kind of processing method of resin eyeglass |
CN106366939A (en) * | 2016-08-30 | 2017-02-01 | 东兴华鸿光学科技有限公司 | Polishing solution for optics lens |
WO2022212155A1 (en) * | 2021-03-29 | 2022-10-06 | Entegris, Inc. | Suspension for chemical mechanical planarization (cmp) and method employing the same |
CN114574105A (en) * | 2022-04-06 | 2022-06-03 | 江西华丽丰光电有限公司 | Glass polishing material and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
JP2004331887A (en) | 2004-11-25 |
GB2401370B (en) | 2007-12-05 |
GB2401370A (en) | 2004-11-10 |
MY139093A (en) | 2009-08-28 |
CN100547045C (en) | 2009-10-07 |
JP4068499B2 (en) | 2008-03-26 |
GB0410212D0 (en) | 2004-06-09 |
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