CN103059810A - Grinding fluid - Google Patents
Grinding fluid Download PDFInfo
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- CN103059810A CN103059810A CN2012105541955A CN201210554195A CN103059810A CN 103059810 A CN103059810 A CN 103059810A CN 2012105541955 A CN2012105541955 A CN 2012105541955A CN 201210554195 A CN201210554195 A CN 201210554195A CN 103059810 A CN103059810 A CN 103059810A
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Abstract
The invention relates to a grinding material. The grinding material comprises 35-45 parts of aluminum oxide, 15-25 parts of silicon oxide, 10-15 parts of tripolycyanamide, 5-10 parts of sodium polystyrenesulfonate, 2-5 parts of lanthanum oxide, 11-15 parts of cerium oxide, 3-9 parts of methacrylic acid, 2-5 parts of sodium silicate, 1-3 parts of zirconium oxide, 4-9 parts of ethyl acetate, 4-13 parts of octadecyl trimethyl ammonium bromide, 1-8 parts of polydiallyl dimethyl ammonium chloride, 2-7 parts of polyoxyethylene ether, 4-8 parts of dimethyl sulfoxide cyclohexane, and 3-6 parts of hydroxymethyl cellulose. The grinding material disclosed by the invention is very high in both grinding precision and grinding efficiency.
Description
Technical field
The present invention relates to a kind of lapping liquid.
Background technology
Along with becoming more meticulous of existing life development, glossing is widely used, particularly at microelectronic, and day by day frivolous along with a large amount of device volumes, more and more higher on the contrary to the requirement of its performance, accordingly the requirement of glossing also further improved.
Abrasive substance is the requisite of polishing technology, important component for grinding Liquid composition, also more and more stricter to its performance requriements, at present, the abrasive substance that generally adopts is generally aluminum oxide, zirconium white, diamond, silicon oxide, cerium oxide, titanium oxide, silicon nitride etc., but in actual applications, the particle diameter of existing particle is little, surfactivity is large, the particle Interaction Force is strong, and scattered nanoparticle is easily reunited, and affects the performance of grinding Liquid composition; Simultaneous grinding particle such as Nano diamond, aluminium sesquioxide, zirconium white, silicon nitride etc., hardness is all larger, in the polishing process damage of effects on surface more serious, not only cause surfaceness larger, also be prone to the surface imperfection such as polishing cut, pit; The polishing speed of the material such as dispersiveness, stable preferably silicon oxide is lower again simultaneously, can not satisfy the requirement of prior art.
Prior art also has by modification, the preparation composite grinding material, improve the performance of abrasive substance each side, for example use the coated with silica aluminium sesquioxide, be lower than the hardness of aluminum oxide by the hardness of the silicon oxide that coats, thereby can reduce the roughness of polishing thing, but the polishing precision is still inadequate, still can not satisfies the demand for development of prior art.Prior art generally coats the aluminium sesquioxide composite grinding material by particle growth legal system prepared silicon dioxide simultaneously, but the coating layer of preparation is also inhomogeneous, the size distribution of composite grinding material is too wide, easily causes the offending problem of polishing, affects the quality of product.
Summary of the invention
The present invention is in order to solve the not high problem of abrasive substance precision of prior art preparation, and all higher abrasive substances of a kind of grinding precision and mill efficiency are provided.
A kind of abrasive substance, aluminum oxide 35-45 part, silicon oxide 15-25 part, trimeric cyanamide 10-15 part, sodium polystyrene sulfonate 5-10 part, lanthanum trioxide 2-5 part, cerium oxide 11-15 part, methacrylic acid 3-9 part, water glass 2-5 part, zirconium white 1-3 part, ethyl acetate 4-9 part, octadecyl trimethylammonium amine bromide 4-13 part, diallyl dimethyl ammoniumchloride 1-8 part, Soxylat A 25-7 2-7 part, methyl-sulphoxide hexanaphthene 4-8 part, Walocel MT 20.000PV 3-6 part.
Above-mentioned raw materials is blended in to stir under the 100-120 ° of C obtains lapping liquid, the particle diameter of solid material is 40-130nm.
Preparation method of the present invention is simple, easily realizes, grinding precision and the mill efficiency of the abrasive substance of the present invention's preparation are all very high.
Embodiment
Embodiment 1
A kind of abrasive substance, 35 parts in aluminum oxide, 15 parts of silicon oxide, 10 parts of trimeric cyanamides, 5 parts of sodium polystyrene sulfonates, 2 parts of lanthanum trioxides, 11 parts of cerium oxide, 3 parts of methacrylic acids, 2 parts of water glass, 1 part of zirconium white, 4 parts of ethyl acetates, 4 parts of octadecyl trimethylammonium amine bromides, 1 part of diallyl dimethyl ammoniumchloride, 2 parts of Soxylat A 25-7s, 4 parts of methyl-sulphoxide hexanaphthenes, 3 parts of Walocel MT 20.000PVs.
Embodiment 2
A kind of abrasive substance, 45 parts in aluminum oxide, 25 parts of silicon oxide, 15 parts of trimeric cyanamides, 10 parts of sodium polystyrene sulfonates, 5 parts of lanthanum trioxides, 15 parts of cerium oxide, 9 parts of methacrylic acids, 5 parts of water glass, 3 parts of zirconium whites, 9 parts of ethyl acetates, 13 parts of octadecyl trimethylammonium amine bromides, 8 parts of diallyl dimethyl ammoniumchloride, 7 parts of Soxylat A 25-7s, 8 parts of methyl-sulphoxide hexanaphthenes, 6 parts of Walocel MT 20.000PVs.
Embodiment 3
A kind of abrasive substance, 38 parts in aluminum oxide, 16 parts of silicon oxide, 13 parts of trimeric cyanamides, 7 parts of sodium polystyrene sulfonates, 3 parts of lanthanum trioxides, 14 parts of cerium oxide, 8 parts of methacrylic acids, 4 parts of water glass, 2 parts of zirconium whites, 5 parts of ethyl acetates, 8 parts of octadecyl trimethylammonium amine bromides, 6 parts of diallyl dimethyl ammoniumchloride, 6 parts of Soxylat A 25-7s, 5 parts of methyl-sulphoxide hexanaphthenes, 4 parts of Walocel MT 20.000PVs.
Claims (1)
1. abrasive substance, it is characterized in that, described material is comprised of the component of following weight part, aluminum oxide 35-45 part, silicon oxide 15-25 part, trimeric cyanamide 10-15 part, sodium polystyrene sulfonate 5-10 part, lanthanum trioxide 2-5 part, cerium oxide 11-15 part, methacrylic acid 3-9 part, water glass 2-5 part, zirconium white 1-3 part, ethyl acetate 4-9 part, octadecyl trimethylammonium amine bromide 4-13 part, diallyl dimethyl ammoniumchloride 1-8 part, Soxylat A 25-7 2-7 part, methyl-sulphoxide hexanaphthene 4-8 part, Walocel MT 20.000PV 3-6 part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210554195.5A CN103059810B (en) | 2012-12-19 | 2012-12-19 | Grinding fluid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210554195.5A CN103059810B (en) | 2012-12-19 | 2012-12-19 | Grinding fluid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103059810A true CN103059810A (en) | 2013-04-24 |
| CN103059810B CN103059810B (en) | 2014-07-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210554195.5A Active CN103059810B (en) | 2012-12-19 | 2012-12-19 | Grinding fluid |
Country Status (1)
| Country | Link |
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| CN (1) | CN103059810B (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103709939A (en) * | 2013-12-31 | 2014-04-09 | 镇江市港南电子有限公司 | Silicon wafer grinding fluid |
| CN105349099A (en) * | 2015-12-31 | 2016-02-24 | 王丽萍 | Non-corrosive abrasive for metal workpieces |
| CN105419729A (en) * | 2015-12-31 | 2016-03-23 | 王璐 | Improved metal workpiece grinding agent |
| CN106634833A (en) * | 2016-12-16 | 2017-05-10 | 安徽宝恒新材料科技有限公司 | Grinding liquid for stainless steel mirror plate and preparation method thereof |
| CN106833519A (en) * | 2016-12-16 | 2017-06-13 | 安徽宝恒新材料科技有限公司 | A kind of 8k plates |
| CN107022311A (en) * | 2017-05-19 | 2017-08-08 | 南通华兴石油仪器有限公司 | A kind of oil instrument rare earth lapping liquid |
| CN107118743A (en) * | 2017-05-19 | 2017-09-01 | 南通华兴石油仪器有限公司 | A kind of oil instrument polishing special-purpose grinding fluid |
| CN107365560A (en) * | 2017-08-04 | 2017-11-21 | 安徽宽居电器有限公司 | A kind of efficient polishing fluid of glass processing |
| CN110499103A (en) * | 2019-09-12 | 2019-11-26 | 江苏吉星新材料有限公司 | A kind of sapphire lapping liquid and preparation method thereof |
| CN116063929A (en) * | 2023-01-03 | 2023-05-05 | 广东粤港澳大湾区黄埔材料研究院 | A-direction sapphire substrate polishing solution and preparation method thereof |
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| JP2001089749A (en) * | 1999-09-21 | 2001-04-03 | Fujimi Inc | Composition for polishing |
| WO2003014251A1 (en) * | 2001-08-09 | 2003-02-20 | Hitachi Maxell, Ltd. | Non-magnetic particles having a plate shape and method for production thereof, abrasive material, polishing article and abrasive fluid comprising such particles |
| CN1550531A (en) * | 2003-05-09 | 2004-12-01 | 福吉米株式会社 | Polishing composition |
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| CN102533127A (en) * | 2010-12-09 | 2012-07-04 | 花王株式会社 | Polishing liquid composition |
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2012
- 2012-12-19 CN CN201210554195.5A patent/CN103059810B/en active Active
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| JP2001089749A (en) * | 1999-09-21 | 2001-04-03 | Fujimi Inc | Composition for polishing |
| WO2003014251A1 (en) * | 2001-08-09 | 2003-02-20 | Hitachi Maxell, Ltd. | Non-magnetic particles having a plate shape and method for production thereof, abrasive material, polishing article and abrasive fluid comprising such particles |
| CN1550531A (en) * | 2003-05-09 | 2004-12-01 | 福吉米株式会社 | Polishing composition |
| CN1860198A (en) * | 2003-07-09 | 2006-11-08 | 迪纳化学公司 | Non-polymeric organic particles for chemical mechanical planarization |
| WO2006004258A1 (en) * | 2004-03-29 | 2006-01-12 | Hanwha Chemical Corporation | Chemical mechanical polishing slurry composition for shallow trench isolation process of semiconductor |
| CN101831243A (en) * | 2010-04-30 | 2010-09-15 | 中国计量学院 | High-precision non-water-based nano-diamond grinding fluid and preparation method and application thereof |
| CN102533127A (en) * | 2010-12-09 | 2012-07-04 | 花王株式会社 | Polishing liquid composition |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103709939A (en) * | 2013-12-31 | 2014-04-09 | 镇江市港南电子有限公司 | Silicon wafer grinding fluid |
| CN105349099A (en) * | 2015-12-31 | 2016-02-24 | 王丽萍 | Non-corrosive abrasive for metal workpieces |
| CN105419729A (en) * | 2015-12-31 | 2016-03-23 | 王璐 | Improved metal workpiece grinding agent |
| CN106634833A (en) * | 2016-12-16 | 2017-05-10 | 安徽宝恒新材料科技有限公司 | Grinding liquid for stainless steel mirror plate and preparation method thereof |
| CN106833519A (en) * | 2016-12-16 | 2017-06-13 | 安徽宝恒新材料科技有限公司 | A kind of 8k plates |
| CN106634833B (en) * | 2016-12-16 | 2018-07-24 | 安徽宝恒新材料科技有限公司 | A kind of stainless steel mirror board lapping liquid and preparation method thereof |
| CN107022311A (en) * | 2017-05-19 | 2017-08-08 | 南通华兴石油仪器有限公司 | A kind of oil instrument rare earth lapping liquid |
| CN107118743A (en) * | 2017-05-19 | 2017-09-01 | 南通华兴石油仪器有限公司 | A kind of oil instrument polishing special-purpose grinding fluid |
| CN107365560A (en) * | 2017-08-04 | 2017-11-21 | 安徽宽居电器有限公司 | A kind of efficient polishing fluid of glass processing |
| CN110499103A (en) * | 2019-09-12 | 2019-11-26 | 江苏吉星新材料有限公司 | A kind of sapphire lapping liquid and preparation method thereof |
| CN116063929A (en) * | 2023-01-03 | 2023-05-05 | 广东粤港澳大湾区黄埔材料研究院 | A-direction sapphire substrate polishing solution and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103059810B (en) | 2014-07-16 |
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Inventor after: Sheng Yanqin Inventor before: Feng Yilin Inventor before: Li Ye Inventor before: Song Fulai Inventor before: Cao Liang |
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Effective date of registration: 20170228 Address after: 314499 Haining City, Zhejiang Province Road No. 18 Patentee after: Zhejiang Hongxiang Landscaping Engineering Co. Ltd. Address before: 266061 Shandong, Laoshan, Hongkong East Road, No. Pioneering Park, biological park, room 248, No. 239 Patentee before: Qingdao Wenchuang Science & Technology Co., Ltd. |