CN104592898B - Efficiently sapphire lapping liquid and preparation method thereof - Google Patents
Efficiently sapphire lapping liquid and preparation method thereof Download PDFInfo
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- CN104592898B CN104592898B CN201510000561.6A CN201510000561A CN104592898B CN 104592898 B CN104592898 B CN 104592898B CN 201510000561 A CN201510000561 A CN 201510000561A CN 104592898 B CN104592898 B CN 104592898B
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- abrasivus
- accelerator
- suspending agent
- lapping liquid
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- 239000007788 liquid Substances 0.000 title claims abstract description 56
- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 33
- 239000010980 sapphire Substances 0.000 title claims abstract description 33
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000000375 suspending agent Substances 0.000 claims abstract description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 25
- 238000003756 stirring Methods 0.000 claims abstract description 18
- 239000000725 suspension Substances 0.000 claims abstract description 16
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 39
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 26
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 26
- 229920000058 polyacrylate Polymers 0.000 claims description 20
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 15
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 15
- 229910052580 B4C Inorganic materials 0.000 claims description 14
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 14
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 13
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 12
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 10
- -1 hydroxypropyl Chemical group 0.000 claims description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 claims description 7
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 claims description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 7
- 239000010432 diamond Substances 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000000428 dust Substances 0.000 claims description 4
- 239000004354 Hydroxyethyl cellulose Substances 0.000 claims description 3
- DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical compound [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 claims description 3
- 239000001768 carboxy methyl cellulose Substances 0.000 claims description 3
- 235000019812 sodium carboxymethyl cellulose Nutrition 0.000 claims description 3
- 229920001027 sodium carboxymethylcellulose Polymers 0.000 claims description 3
- LNAZSHAWQACDHT-XIYTZBAFSA-N (2r,3r,4s,5r,6s)-4,5-dimethoxy-2-(methoxymethyl)-3-[(2s,3r,4s,5r,6r)-3,4,5-trimethoxy-6-(methoxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6r)-4,5,6-trimethoxy-2-(methoxymethyl)oxan-3-yl]oxyoxane Chemical group CO[C@@H]1[C@@H](OC)[C@H](OC)[C@@H](COC)O[C@H]1O[C@H]1[C@H](OC)[C@@H](OC)[C@H](O[C@H]2[C@@H]([C@@H](OC)[C@H](OC)O[C@@H]2COC)OC)O[C@@H]1COC LNAZSHAWQACDHT-XIYTZBAFSA-N 0.000 claims description 2
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 claims description 2
- 239000006004 Quartz sand Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 229920002678 cellulose Polymers 0.000 claims description 2
- 239000001913 cellulose Substances 0.000 claims description 2
- 235000010980 cellulose Nutrition 0.000 claims description 2
- 229910052593 corundum Inorganic materials 0.000 claims description 2
- 239000010431 corundum Substances 0.000 claims description 2
- 239000010987 cubic zirconia Substances 0.000 claims description 2
- 229920000609 methyl cellulose Polymers 0.000 claims description 2
- 239000001923 methylcellulose Substances 0.000 claims description 2
- 235000010981 methylcellulose Nutrition 0.000 claims description 2
- 235000019422 polyvinyl alcohol Nutrition 0.000 claims description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 2
- 235000010413 sodium alginate Nutrition 0.000 claims description 2
- 239000000661 sodium alginate Substances 0.000 claims description 2
- 229940005550 sodium alginate Drugs 0.000 claims description 2
- 239000000230 xanthan gum Substances 0.000 claims description 2
- 235000010493 xanthan gum Nutrition 0.000 claims description 2
- 229920001285 xanthan gum Polymers 0.000 claims description 2
- 229940082509 xanthan gum Drugs 0.000 claims description 2
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 claims 2
- 229910052582 BN Inorganic materials 0.000 claims 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 238000001556 precipitation Methods 0.000 abstract description 2
- 238000000227 grinding Methods 0.000 description 28
- 235000012431 wafers Nutrition 0.000 description 20
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 19
- 229910001018 Cast iron Inorganic materials 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000005498 polishing Methods 0.000 description 7
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 6
- 229920002125 Sokalan® Polymers 0.000 description 6
- 238000001514 detection method Methods 0.000 description 6
- 239000008187 granular material Substances 0.000 description 6
- 229910017604 nitric acid Inorganic materials 0.000 description 6
- 239000004584 polyacrylic acid Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 5
- 150000001336 alkenes Chemical class 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000002270 dispersing agent Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000001866 hydroxypropyl methyl cellulose Substances 0.000 description 1
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 description 1
- 235000010979 hydroxypropyl methyl cellulose Nutrition 0.000 description 1
- UFVKGYZPFZQRLF-UHFFFAOYSA-N hydroxypropyl methyl cellulose Chemical compound OC1C(O)C(OC)OC(CO)C1OC1C(O)C(O)C(OC2C(C(O)C(OC3C(C(O)C(O)C(CO)O3)O)C(CO)O2)O)C(CO)O1 UFVKGYZPFZQRLF-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a kind of efficiently sapphire lapping liquid and preparation method thereof, this lapping liquid comprises abrasivus, suspending agent, accelerator and water, and pH value is 7 ~ 13, the weight portion of its each component is: abrasivus 3 ~ 60 parts, suspending agent 0.2 ~ 5 part, accelerator 5 ~ 30 parts, 12 ~ 70 parts of water.Its preparation method: (1) weighs abrasivus, suspending agent, accelerator and water according to weight proportion；(2) suspending agent is soluble in water, thoroughly dissolve, stir；(3) abrasivus is dispersed in the liquid in step (2) and makes suspension；(4) in suspension, add accelerator, stir；(5) regulation pH value is to 7 ~ 13.Suspension of the present invention is good, is difficult to precipitation, and clearance is high, and service life cycle is strong, can greatly improve lapping efficiency, reduces cost.
Description
Technical field
The present invention relates to lapping liquid field, particularly relate to a kind of efficiently sapphire lapping liquid and preparation method thereof.
Background technology
The grinding of the hard materials such as currently marketed sapphire mainly uses cast iron plate or copper dish, and lapping liquid is mainly adopted
With bulky grain boron carbide, carborundum or diamond dust as abrasivus, then add a certain proportion of water and dispersant composition.Due to institute
Use boron carbide, carborundum or diamond dust granule big, about 5 ~ 100 μm, and tradition dispersant weak effect ,≤1 μ can only be disperseed
The granule of m, so easily precipitating, and joined lapping liquid grinding efficiency is the highest, during attrition process, liquid film on abrasive disk
Disperse uneven, easily cause the scuffing of wafer, reduction yield rate, thus the polishing difficulty in road after increasing.
Summary of the invention
The technical problem that present invention mainly solves is to provide efficient sapphire lapping liquid and preparation method thereof, and this lapping liquid hangs
Buoyancy is good, is difficult to precipitation, and clearance is high, and service life cycle is strong, can greatly improve lapping efficiency, reduces cost.
For solving above-mentioned technical problem, the technical scheme that the present invention uses is: provide a kind of efficiently sapphire to grind
Liquid, this lapping liquid comprises abrasivus, suspending agent, accelerator and water, and pH value is 7 ~ 13, and the weight portion of its each component is: abrasivus 3
~ 60 parts, suspending agent 0.2 ~ 5 part, accelerator 5 ~ 30 parts, 12 ~ 70 parts of water.
In a preferred embodiment of the present invention, described abrasivus is boron carbide, carborundum, cubic zirconia, nitridation
Boron, aluminium oxide, quartz sand, Brown Alundum, corundum or diamond dust.
In a preferred embodiment of the present invention, the particle diameter of described abrasivus is 5 ~ 100 μm.
In a preferred embodiment of the present invention, described suspending agent is methylcellulose, sodium carboxymethyl cellulose, hydroxyl second
In base cellulose, hydroxypropyl methyl cellulose, polyvinyl alcohol, polyvinylpyrrolidone, sodium alginate and xanthan gum at least one
Kind.
It is 5 ~ 100 μm bulky grain abrasivuss for particle diameter, tradition dispersant polyacrylamide, polyacrylic acid, polyacrylic acid
Salt, poly-methyl acrylate etc. has not had good dispersion effect, the Coulomb repulsion that now zeta current potential is brought to bulky grain
Effect cannot stop the sinking of granule.On the premise of not affecting clearance, add sodium carboxymethyl cellulose, ethoxy fibre
The method of the increase liquid viscosities such as dimension element, gelatinum oxhide slows down the sinking of granule, effectively improves the suspension of lapping liquid；And
And during attrition process, make abrasivus granule effectively stick to abrasive disk surface, it is difficult to throw away easily, carries greatly
High working (machining) efficiency, and decrease wafer and contact brought scuffing with the direct of abrasive disk.
In a preferred embodiment of the present invention, described accelerator be Polyethylene Glycol, polyacrylate, acrylate gather
In compound, ethanolamine, diethanolamine, triethanolamine, propylene glycol, glycerol, polyvinyl alcohol and nonyl phenol polyethenoxy ether
Several.
For solving above-mentioned technical problem, another technical solution used in the present invention is: provide a kind of efficiently sapphire to grind
The preparation method of mill liquid, comprises the following steps:
(1) abrasivus, suspending agent, accelerator and water are weighed according to weight proportion；
(2) suspending agent is soluble in water, thoroughly dissolve, stir；
(3) abrasivus is dispersed in the liquid in step (2) and makes suspension；
(4) in suspension, add accelerator, stir；
(5) regulation pH value is to 7 ~ 13.
The invention has the beneficial effects as follows: the lapping liquid of the present invention is uniformly dispersed, stable, whole preparation technology is simple, be prone to
Operation, convenient production, production efficiency is high, constant product quality；During attrition process, during recycling, abrasivus is difficult to sink
Amass at robot base, and lapping liquid liquid film can preferably stick on abrasive disk, is difficult to throw away because rotating speed is excessive, effectively
Improve lapping efficiency, the scuffing that prevention wafer directly contacts with abrasive disk and causes, simultaneous grinding liquid removal rate is high,
Life-span is long, can effectively shorten process time, raising efficiency.
Detailed description of the invention
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described enforcement
Example is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, this area is common
All other embodiments that technical staff is obtained under not making creative work premise, broadly fall into the model of present invention protection
Enclose.
Comparative example 1
Prepare six parts of lapping liquid A, B, C, D, E, F:
70 parts, 69 parts, 68 parts, 67 parts, 66 parts, 65 parts of water are separately added into 0 part, 1 part, 2 parts, 3 parts, 4 parts, 5 parts of hydroxyls
Ethyl cellulose, after stirring, adds the boron carbide that 30 parts of particle diameters are 320 mesh (40 ~ 50 μm), forms stable suspension,
It is subsequently adding nitric acid or sodium hydroxide regulation pH to 7.5, configures six parts of lapping liquid A, B, C, D, E, F.
The preparation of lapping liquid G: traditional suspending agent use for sodium polyacrylate, 67 parts of water adds 3 parts of polypropylene
Acid sodium suspending agent, is stirring evenly and then adding into the boron carbide that 30 parts of particle diameters are 320 mesh (40 ~ 50 μm), adds nitric acid or hydroxide
Sodium regulation pH value is 7.5, is configured to lapping liquid G.
Being ground on space crystalline substance YJ2M16B-5L twin grinder by obtained sample, lower pressure: 0.5psi, upper lower burrs rotating speed is equal
For 50RPM, lapping liquid flow: 300mL/min, abrasive disk is cast iron plate, and grinding wafers is sapphire sheet.Sapphire sheet after grinding
Surface tear detection is naked eyes, owing to after grinding, wafer surface roughness is higher, slightly scratches invisible, in testing result
The scuffing standard of display is macroscopic severe and scratches.This sapphire grinding and polishing the results are shown in Table 1.
Table 1
Table 1 grinds result and shows, is not added with the boron carbide lapping liquid of suspending agent, grinds clearance relatively low, and because of abrasivus
Granule dispersion is uneven and causes being ground Sapphire wafer surface and produces a large amount of scuffing.Along with the addition of hydroxyethyl cellulose increases
Greatly, viscosity is gradually increased, and suspension is greatly improved, and clearance has slight lifting, and scuffing greatly reduces.And rely on increase
Zeta current potential, increases the addition that electrostatic repulsion improves the conventional polypropylene acid sodium suspending agent of suspension, and clearance is without too
Big change, and still have more scuffing to produce.
Embodiment 1
Prepare six parts of lapping liquid A, B, C, D, E, F:
Weigh abrasivus, suspending agent, accelerator and water according to weight proportion, 35 parts, 40 parts, 45 parts, 50 parts, 55 parts,
Each in 60 parts of water add 0.2 part of hydroxyethyl cellulose, thoroughly dissolve, stir, be subsequently adding 30 parts of particle diameters be 320 mesh (40 ~
50 μm) boron carbide, make suspension after stirring and respectively add 30 parts, 25 parts, 20 parts, 15 parts, 10 parts, 5 parts of accelerators, add nitre
Acid or sodium hydroxide regulation pH value are 7.5, configure six parts of lapping liquids A, B, C, D, E, F, and wherein, accelerator includes polyacrylic acid
Salt, acrylate polymer, ethanolamine, triethanolamine, propylene glycol, polyvinyl alcohol and nonyl phenol polyethenoxy ether, weight is joined
Ratio is: polyacrylate: acrylate polymer: ethanolamine: triethanolamine: propylene glycol: polyvinyl alcohol: nonyl phenol polyoxy second
Alkene ether=0.6:6:1:1:2:3:1.
Being ground on space crystalline substance YJ2M16B-5L twin grinder by obtained sample, lower pressure: 0.5psi, upper lower burrs rotating speed is equal
For 50RPM, lapping liquid flow: 300mL/min, abrasive disk is cast iron plate, and grinding wafers is sapphire sheet.Sapphire sheet after grinding
Surface tear detection is naked eyes, owing to after grinding, wafer surface roughness is higher, slightly scratches invisible, in testing result
The scuffing standard of display is macroscopic severe and scratches.This sapphire grinding and polishing the results are shown in Table 2.
Table 2
Table 2 result shows, adds the suspending agent of 0.2 part, and Sapphire wafer surface still has slight scuffing.Along with acceleration
Being gradually increased of dosage, clearance is increase tendency, and accelerator is 25 parts when, and clearance reaches optimum.
Embodiment 2
Prepare six parts of lapping liquid A, B, C, D, E, F:
Weigh abrasivus, suspending agent, accelerator and water according to weight proportion, 37 parts, 42 parts, 47 parts, 52 parts, 57 parts,
In 62 parts of water, 3 parts of hydroxyethyl celluloses of each addition, thoroughly dissolve, stir, and being subsequently adding 30 parts of particle diameters is 320 mesh (40 ~ 50
μm) boron carbide, make suspension after stirring and respectively add 30 parts, 25 parts, 20 parts, 15 parts, 10 parts, 5 parts of accelerators, add nitric acid
Or sodium hydroxide regulation pH value is 7.5, configures six parts of lapping liquids A, B, C, D, E, F, and wherein, accelerator includes polyacrylic acid
Salt, acrylate polymer, ethanolamine, triethanolamine, propylene glycol, polyvinyl alcohol and nonyl phenol polyethenoxy ether, weight is joined
Ratio is: polyacrylate: acrylate polymer: ethanolamine: triethanolamine: propylene glycol: polyvinyl alcohol: nonyl phenol polyoxy second
Alkene ether=0.6:6:1:1:2:3:1.
Being ground on space crystalline substance YJ2M16B-5L twin grinder by obtained sample, lower pressure: 0.5psi, upper lower burrs rotating speed is equal
For 50RPM, lapping liquid flow: 300mL/min, abrasive disk is cast iron plate, and grinding wafers is sapphire sheet.Sapphire sheet after grinding
Surface tear detection is naked eyes, owing to after grinding, wafer surface roughness is higher, slightly scratches invisible, in testing result
The scuffing standard of display is macroscopic severe and scratches.This sapphire grinding and polishing the results are shown in Table 3.
Table 3
Table 3 data show, when suspending agent increases to 3 parts, Sapphire wafer surface does not the most scratch, and clearance has
Slight raising.
Embodiment 3
Prepare six parts of lapping liquid A, B, C, D, E, F:
Weigh abrasivus, suspending agent, accelerator and water according to weight proportion, 35 parts, 40 parts, 45 parts, 50 parts, 55 parts,
In 60 parts of water, 5 parts of hydroxyethyl celluloses of each addition, thoroughly dissolve, stir, and being subsequently adding 30 parts of particle diameters is 320 mesh (40 ~ 50
μm) boron carbide, make suspension after stirring and respectively add 30 parts, 25 parts, 20 parts, 15 parts, 10 parts, 5 parts of accelerators, add nitric acid
Or sodium hydroxide regulation pH value is 7.5, configures six parts of lapping liquids A, B, C, D, E, F, and wherein, accelerator includes polyacrylic acid
Salt, acrylate polymer, ethanolamine, triethanolamine, propylene glycol, polyvinyl alcohol and nonyl phenol polyethenoxy ether, weight is joined
Ratio is: polyacrylate: acrylate polymer: ethanolamine: triethanolamine: propylene glycol: polyvinyl alcohol: nonyl phenol polyoxy second
Alkene ether=0.6:6:1:1:2:3:1.
Being ground on space crystalline substance YJ2M16B-5L twin grinder by obtained sample, lower pressure: 0.5psi, upper lower burrs rotating speed is equal
For 50RPM, lapping liquid flow: 300mL/min, abrasive disk is cast iron plate, and grinding wafers is sapphire sheet.Sapphire sheet after grinding
Surface tear detection is naked eyes, owing to after grinding, wafer surface roughness is higher, slightly scratches invisible, in testing result
The scuffing standard of display is macroscopic severe and scratches.This sapphire grinding and polishing the results are shown in Table 4.
Table 4
Table 4 result shows, when suspending agent increases to 5 parts, relative to 3 parts without significant change.
Embodiment 4
Prepare seven parts of lapping liquid A, B, C, D, E, F, G:
Weigh abrasivus, suspending agent, accelerator and water according to weight proportion, 69 parts, 62 parts, 52 parts, 42 parts, 32 parts,
22 parts, each in 12 parts of water add 3 parts of hydroxyethyl celluloses, thoroughly dissolve, stir, each add 3 parts, 10 parts, 20 parts, 30
Part, 40 parts, 50 parts, 60 parts of boron carbides, make suspension and respectively add 25 parts of accelerators, add nitric acid or sodium hydroxide after stirring
Regulation pH value is 7.5, configures seven parts of lapping liquids A, B, C, D, E, F, G, and wherein, accelerator includes polyacrylate, acrylate
Polymer, ethanolamine, triethanolamine, propylene glycol, polyvinyl alcohol and nonyl phenol polyethenoxy ether, weight proportion is: polypropylene
Hydrochlorate: acrylate polymer: ethanolamine: triethanolamine: propylene glycol: polyvinyl alcohol: nonyl phenol polyethenoxy ether=0.6:6:
1:1:2:3:1。
Being ground on space crystalline substance YJ2M16B-5L twin grinder by obtained sample, lower pressure: 0.5psi, upper lower burrs rotating speed is equal
For 50RPM, lapping liquid flow: 300mL/min, abrasive disk is cast iron plate, and grinding wafers is sapphire sheet.Sapphire sheet after grinding
Surface tear detection is naked eyes, owing to after grinding, wafer surface roughness is higher, slightly scratches invisible, in testing result
The scuffing standard of display is macroscopic severe and scratches.This sapphire grinding and polishing the results are shown in Table 5.
Table 5
Table 5 result shows, in the case of suspending agent and acceleration dosage are constant, along with the increase of boron carbide amount, clearance
In increasing trend.But in the case of boron carbide content is less, owing to numbers of particles is few, thus cause lapping liquid liquid film relatively thin,
Sapphire wafer likely directly contacts with cast iron plate, thus causes scratching, and when boron carbide content reaches 20 parts when, scratches
Disappear.
Embodiment 5
Prepare six parts of lapping liquid A, B, C, D, E, F:
Weigh abrasivus, suspending agent, accelerator and water according to weight proportion, 37 parts, 42 parts, 47 parts, 52 parts, 57 parts,
In 62 parts of water, 3 parts of hydroxyethyl celluloses of each addition, thoroughly dissolve, stir, and being subsequently adding 30 parts of particle diameters is 320 mesh (40 ~ 50
μm) carborundum, make suspension after stirring and respectively add 30 parts, 25 parts, 20 parts, 15 parts, 10 parts, 5 parts of accelerators, add nitric acid
Or sodium hydroxide regulation pH value is 7.5, configures six parts of lapping liquids A, B, C, D, E, F, and wherein, accelerator includes polyacrylic acid
Salt, acrylate polymer, ethanolamine, triethanolamine, propylene glycol, polyvinyl alcohol and nonyl phenol polyethenoxy ether, weight is joined
Ratio is: polyacrylate: acrylate polymer: ethanolamine: triethanolamine: propylene glycol: polyvinyl alcohol: nonyl phenol polyoxy second
Alkene ether=0.6:6:1:1:2:3:1.
Being ground on space crystalline substance YJ2M16B-5L twin grinder by obtained sample, lower pressure: 0.5psi, upper lower burrs rotating speed is equal
For 50RPM, lapping liquid flow: 300mL/min, abrasive disk is cast iron plate, and grinding wafers is sapphire sheet.Sapphire sheet after grinding
Surface tear detection is naked eyes, owing to after grinding, wafer surface roughness is higher, slightly scratches invisible, in testing result
The scuffing standard of display is macroscopic severe and scratches.This sapphire grinding and polishing the results are shown in Table 6.
Table 6
Table 6 grinds result and shows, carborundum lapping liquid is low relative to boron carbide lapping liquid clearance, but this accelerator for
Carborundum abrasivus also has good acceleration.
The lapping liquid of the present invention is uniformly dispersed, stablizes, and whole preparation technology is simple, easily operated, convenient production, produces effect
Rate is high, constant product quality；During attrition process, during recycling, abrasivus is difficult to be deposited on robot base, and grinds
Liquid liquid film can preferably stick on abrasive disk, is difficult to throw away because rotating speed is excessive, effectively raises lapping efficiency,
The scuffing stoping wafer directly to contact with abrasive disk and to cause, simultaneous grinding liquid removal rate is high, and the life-span is long, can effectively shorten and add
Between man-hour, raising efficiency.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this
Equivalent structure or equivalence flow process that bright description is made convert, or are directly or indirectly used in other relevant technology neck
Territory, is the most in like manner included in the scope of patent protection of the present invention.
Claims (3)
1. an efficient sapphire lapping liquid, it is characterised in that this lapping liquid is made up of abrasivus, suspending agent, accelerator and water,
Its pH value is 7 ~ 13, and the weight portion of its each component is: abrasivus 3 ~ 60 parts, suspending agent 0.2 ~ 5 part, accelerator 5 ~ 30 parts, water 12 ~
70 parts, wherein, described abrasivus be boron carbide, carborundum, cubic zirconia, boron nitride, aluminium oxide, quartz sand, Brown Alundum,
Corundum or diamond dust, described suspending agent is methylcellulose, sodium carboxymethyl cellulose, hydroxyethyl cellulose, hydroxypropyl first
At least one in base cellulose, polyvinyl alcohol, polyvinylpyrrolidone, sodium alginate and xanthan gum, described accelerator bag
Include polyacrylate, acrylate polymer, ethanolamine, triethanolamine, propylene glycol, polyvinyl alcohol and nonyl phenol polyethenoxy
Ether, weight proportion is: polyacrylate: acrylate polymer: ethanolamine: triethanolamine: propylene glycol: polyvinyl alcohol: nonane
Base phenol polyethenoxy ether=0.6:6:1:1:2:3:1.
Efficient sapphire lapping liquid the most according to claim 1, it is characterised in that the particle diameter of described abrasivus is 5 ~
100μm。
The preparation method of efficient sapphire lapping liquid the most according to claim 1, it is characterised in that comprise the following steps:
(1) abrasivus, suspending agent, accelerator and water are weighed according to weight proportion；
(2) suspending agent is soluble in water, thoroughly dissolve, stir；
(3) abrasivus is dispersed in the liquid in step (2) and makes suspension；
(4) in suspension, add accelerator, stir；
(5) regulation pH value is to 7 ~ 13.
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