CN115926747B - Concentrated aqueous grinding aid and preparation method thereof - Google Patents
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- CN115926747B CN115926747B CN202211571493.5A CN202211571493A CN115926747B CN 115926747 B CN115926747 B CN 115926747B CN 202211571493 A CN202211571493 A CN 202211571493A CN 115926747 B CN115926747 B CN 115926747B
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- 238000000227 grinding Methods 0.000 title claims abstract description 118
- 238000002360 preparation method Methods 0.000 title description 15
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 61
- 239000010432 diamond Substances 0.000 claims abstract description 61
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 23
- 239000000839 emulsion Substances 0.000 claims abstract description 20
- 239000000314 lubricant Substances 0.000 claims abstract description 19
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 18
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000000725 suspension Substances 0.000 claims abstract description 18
- 239000002994 raw material Substances 0.000 claims abstract description 17
- 239000003381 stabilizer Substances 0.000 claims abstract description 17
- 230000000844 anti-bacterial effect Effects 0.000 claims abstract description 16
- 239000003899 bactericide agent Substances 0.000 claims abstract description 16
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 16
- 235000012431 wafers Nutrition 0.000 claims abstract description 15
- 239000008367 deionised water Substances 0.000 claims abstract description 14
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 14
- 229910002601 GaN Inorganic materials 0.000 claims abstract description 12
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000002131 composite material Substances 0.000 claims abstract description 9
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 6
- 238000003756 stirring Methods 0.000 claims description 33
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 18
- 239000013530 defoamer Substances 0.000 claims description 14
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 14
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 14
- 239000004359 castor oil Substances 0.000 claims description 11
- 235000019438 castor oil Nutrition 0.000 claims description 11
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 11
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 8
- 238000004090 dissolution Methods 0.000 claims description 7
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 6
- 239000003082 abrasive agent Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 239000002202 Polyethylene glycol Substances 0.000 claims description 5
- 239000000440 bentonite Substances 0.000 claims description 5
- 229910000278 bentonite Inorganic materials 0.000 claims description 5
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 5
- 229920001223 polyethylene glycol Polymers 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 150000002191 fatty alcohols Chemical class 0.000 claims description 4
- 229920001451 polypropylene glycol Polymers 0.000 claims description 4
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 claims description 3
- 239000004354 Hydroxyethyl cellulose Substances 0.000 claims description 3
- OTPBAANTTKRERC-UHFFFAOYSA-N benzyl(dodecyl)azanium;chloride Chemical compound Cl.CCCCCCCCCCCCNCC1=CC=CC=C1 OTPBAANTTKRERC-UHFFFAOYSA-N 0.000 claims description 3
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 3
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 3
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 2
- KHSLHYAUZSPBIU-UHFFFAOYSA-M benzododecinium bromide Chemical compound [Br-].CCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 KHSLHYAUZSPBIU-UHFFFAOYSA-M 0.000 claims description 2
- 239000005543 nano-size silicon particle Substances 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 239000012530 fluid Substances 0.000 abstract description 23
- 238000012545 processing Methods 0.000 abstract description 20
- 238000005498 polishing Methods 0.000 abstract description 13
- 239000002245 particle Substances 0.000 abstract description 9
- 230000009974 thixotropic effect Effects 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 16
- 230000003746 surface roughness Effects 0.000 description 11
- 229910052580 B4C Inorganic materials 0.000 description 8
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 239000002002 slurry Substances 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005461 lubrication Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005054 agglomeration Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000002070 germicidal effect Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/10—Production of cement, e.g. improving or optimising the production methods; Cement grinding
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- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to a concentrated aqueous grinding aid which comprises the following raw materials in parts by weight: 30-50 parts of deionized water, 5-10 parts of a composite thixotropic agent, 5-10 parts of an emulsion stabilizer, 20-30 parts of a lubricant, 1-5 parts of a bactericide and 1-5 parts of a defoaming agent. The concentrated aqueous grinding aid is applied to grinding processing of silicon carbide and gallium nitride wafers, so that the processing cost of a finished product of the diamond grinding fluid directly used can be greatly reduced; at the same time, the diamond abrasive particles can be rapidly dispersed and suspended, and stable suspension with thixotropic property is formed. The lubricant can effectively reduce friction resistance in the grinding process, increase lubricity, effectively improve the quality of the grinding surface and greatly shorten the subsequent wafer polishing time in the use process.
Description
Technical Field
The invention belongs to the technical field of ultra-precise grinding and polishing, and particularly relates to a concentrated aqueous grinding aid for processing silicon carbide and gallium nitride wafers and a preparation method thereof.
Background
The third generation semiconductor materials represented by silicon carbide and gallium nitride are considered as ideal materials for semiconductor chips because of their high voltage resistance, low loss, high efficiency, etc., and have become a new focus for global semiconductor technology research and industry competition in various countries. The ultra-precise grinding processing is a subsequent process for processing silicon carbide and gallium nitride wafers, is a key step for ensuring the ultra-smooth, defect-free and damage-free surface of the wafer, and directly determines the quality of the wafers and power devices. However, silicon carbide, gallium nitride and the like are high-hardness brittle materials, so that the processing difficulty is far greater than that of materials such as sapphire, silicon wafers, stainless steel and the like, and the problems of low removal efficiency, large surface roughness, difficult control of scratches and the like are particularly presented.
The grinding aid is a uniform and stable aid integrating functions of dispersion, suspension, wetting, lubrication and the like, can be used with abrasive materials and solvents at present, can be applied to grinding and processing silicon carbide and gallium nitride wafers, and reduces the surface roughness of the wafers.
At present, diamond grinding fluid or boron carbide and alumina powder are generally used for grinding by adding water, the diamond grinding fluid is uniformly dispersed and has certain suspension lubrication performance, the processing efficiency is high, the surface roughness is low, but the cost is high, the boron carbide and alumina abrasive material is mainly used for directly distributing water to the abrasive material, the cost is relatively low, but the processing efficiency is low and the surface roughness is large due to the lack of necessary dispersion suspension and lubrication performance. Based on this, research and development of new grinding aids are needed to meet the processing requirements of the existing silicon carbide, gallium nitride and other materials.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a concentrated aqueous grinding aid for processing silicon carbide and gallium nitride wafers, which can reduce the grinding processing cost and maintain relatively high processing efficiency and quality.
The invention also provides a preparation method of the concentrated aqueous grinding aid.
In order to achieve the above purpose, the invention adopts the following technical scheme:
The concentrated aqueous grinding aid consists of the following raw materials in parts by weight: 30-50 parts of deionized water, 5-10 parts of a composite thixotropic agent, 5-10 parts of an emulsion stabilizer, 20-30 parts of a lubricant, 1-5 parts of a bactericide and 1-5 parts of a defoaming agent.
Specifically, the composite thixotropic agent can be one or a mixture of more than two of hydrogenated castor oil, castor oil polyoxyethylene ether, water-based bentonite, nano silicon dioxide and the like.
Further, the emulsion stabilizer may be one or more than two of fatty amine polyoxyethylene ether, polyethylene glycol monomethyl ether, polypropylene glycol monomethyl ether, fatty alcohol polyoxyethylene ether and the like.
Specifically, the lubricant may be one or a mixture of more than two of propylene glycol, glycerol, polyethylene glycol, hydroxyethyl cellulose, polyvinylpyrrolidone, and the like.
Further, the germicides may be non-oxidizing germicides such as dodecylbenzyl ammonium chloride, dodecyldimethylbenzyl ammonium bromide and the like.
Specifically, the defoamer may be a silicone defoamer.
The invention provides a preparation method of the concentrated aqueous grinding aid, which comprises the following steps: and (3) taking all the raw materials according to the proportion, uniformly mixing deionized water and a lubricant, slowly adding a composite thixotropic agent and an emulsion stabilizer into the solution under the stirring condition, fully and uniformly stirring to form emulsion, and finally slowly adding a bactericide and a defoaming agent, and uniformly stirring to form the concentrated aqueous grinding aid.
The invention also provides a use method of the concentrated aqueous grinding aid, which comprises the following steps: and (3) taking the diamond abrasive and water, fully stirring and uniformly mixing, slowly adding a concentrated aqueous grinding aid accounting for 1-10wt% of the water under the stirring condition, and fully stirring and dissolving to form uniform diamond suspension, so that the diamond abrasive can be directly used for grinding silicon carbide and gallium nitride wafers.
The use method of the concentrated aqueous grinding aid comprises the step that the addition amount of the diamond abrasive is 1-10% of the water mass. Further, the amount of the concentrated aqueous grinding aid added is preferably 3 to 5% by weight based on the mass of water.
The concentrated aqueous grinding aid is applied to grinding processing of silicon carbide and gallium nitride wafers, so that the processing cost of a finished product of the diamond grinding fluid directly used can be greatly reduced; at the same time, the diamond abrasive particles can be rapidly dispersed and suspended, and stable suspension with thixotropic property is formed. The lubricant can effectively reduce friction resistance in the grinding process, increase lubricity, effectively improve the quality of the grinding surface and greatly shorten the subsequent wafer polishing time in the use process.
Compared with the prior art, the invention has the following beneficial effects:
In order to reduce the grinding processing cost and maintain relatively high processing efficiency and quality, the invention provides a concentrated aqueous grinding aid, wherein the composite thixotropic agent with a net structure uniformly locks and suspends abrasive particles in a solution, and meanwhile, the emulsion stabilizer can keep a limit concentrated system stable for a long time. The concentrated aqueous grinding aid can be used with diamond abrasive materials and solvents at present, is applied to grinding processing of silicon carbide and gallium nitride wafers, can rapidly disperse and suspend diamond abrasive particles while greatly reducing cost, and can form thixotropic stable suspension with a space network structure, so that long-term suspension of the abrasive materials is maintained, friction resistance in the grinding process can be reduced in the use process of the lubricant, lubricity is increased, grinding surface quality is effectively improved, surface roughness is rapidly reduced, and subsequent polishing time is shortened. The invention provides a preparation process and a use method of a concentrated aqueous grinding aid, which greatly reduce the cost of the existing finished product of directly using diamond grinding fluid and improve the grinding effect of directly using boron carbide and alumina powder to be mixed with water.
Drawings
FIG. 1 is a photograph of a diamond slurry prepared in example 3 under a 100-fold microscope;
FIG. 2 is a photograph of the diamond slurry prepared in comparative example 1 at 100 times of magnification under a micromirror;
FIG. 3 is a photograph of a 100 times mirror of the silicon carbide surface after polishing with the polishing liquid of example 3;
FIG. 4 is a photograph of a 100-fold mirror of the silicon carbide surface after polishing with the polishing liquid of comparative example 3.
Detailed Description
The following describes the technical scheme of the present invention in further detail with reference to examples, but the scope of the present invention is not limited thereto.
In the examples below, the starting materials used are either commercially available products which are commercially available as such or can be prepared according to methods conventional in the art. For example, hydrogenated castor oil is purchased from basf, germany, hydrogenated castor oil CO40; the aqueous bentonite is purchased from Zhejiang Kangbaixin New material Co., ltd; the bactericide is purchased from dodecyl benzyl ammonium chloride of Jinan Ming chemical Co., ltd; the defoamer was purchased from MY-208 silicone defoamer, inc. of Shandong Meiyu chemical Co.
Example 1
The concentrated aqueous grinding aid consists of the following raw materials in parts by weight: 50g of deionized water, 20g of propylene glycol lubricant, 10g of hydrogenated castor oil thixotropic agent, 10g of laurylamine polyoxyethylene ether emulsion stabilizer, 5g of bactericide and 5g of defoamer.
The concentrated aqueous grinding aid is prepared by the following steps: and (3) uniformly mixing deionized water and a lubricant, slowly adding a composite thixotropic agent and an emulsion stabilizer into the solution in sequence under the stirring condition, fully and uniformly stirring to form emulsion, slowly adding a bactericide and a defoaming agent, and uniformly stirring to form the concentrated aqueous grinding aid.
The application method of the concentrated aqueous grinding aid for preparing the diamond grinding fluid comprises the following steps: 50g of diamond abrasive (granularity of 4.5 mu m) and 1000g of water are taken and evenly stirred and mixed, 10g of concentrated aqueous grinding aid is slowly added under the stirring condition, and after full stirring and dissolution, uniform diamond suspension is formed.
Example 2
The concentrated aqueous grinding aid consists of the following raw materials in parts by weight: 50g of deionized water, 30g of propylene glycol lubricant, 8g of hydrogenated castor oil thixotropic agent, 8g of laurylamine polyoxyethylene ether emulsion stabilizer, 2g of bactericide and 2g of defoamer.
The preparation method of the concentrated aqueous grinding aid is described in example 1.
The application method of the concentrated aqueous grinding aid for preparing the diamond grinding fluid comprises the following steps: 50g of diamond abrasive (granularity of 4.5 mu m) and 1000g of water are taken and evenly stirred and mixed, 30g of concentrated aqueous grinding aid is slowly added under the stirring condition, and after full stirring and dissolution, uniform diamond suspension is formed.
Example 3
The concentrated aqueous grinding aid consists of the following raw materials in parts by weight: 50g of deionized water, 20g of polyethylene glycol lubricant, 10g of aqueous bentonite thixotropic agent, 10g of polypropylene glycol monomethyl ether emulsion stabilizer, 5g of bactericide and 5g of defoamer.
The preparation method of the concentrated aqueous grinding aid is described in example 1.
The application method of the concentrated aqueous grinding aid for preparing the diamond grinding fluid comprises the following steps: 50g of diamond abrasive (granularity of 4.5 mu m) and 1000g of water are taken and evenly stirred and mixed, 50g of concentrated aqueous grinding aid is slowly added under the stirring condition, and after full stirring and dissolution, uniform diamond suspension is formed.
FIG. 1 shows a 100-fold magnification of a diamond slurry prepared in example 3; as can be seen in fig. 1: the diamond grinding fluid prepared by the grinding aid of the invention has uniform dispersion of abrasive particles and no agglomeration phenomenon of the abrasive particles.
Example 4
The concentrated aqueous grinding aid consists of the following raw materials in parts by weight: 50g of deionized water, 30g of polyvinylpyrrolidone lubricant, 8g of water-based bentonite thixotropic agent, 8g of polypropylene glycol monomethyl ether emulsion stabilizer, 2g of bactericide and 2g of defoamer.
The preparation method of the concentrated aqueous grinding aid is described in example 1.
The application method of the concentrated aqueous grinding aid for preparing the diamond grinding fluid comprises the following steps: 50g of diamond abrasive (granularity of 4.5 mu m) and 1000g of water are taken and evenly stirred and mixed, 100g of concentrated aqueous grinding aid is slowly added under the stirring condition, and after full stirring and dissolution, uniform diamond suspension is formed.
Example 5
The concentrated aqueous grinding aid consists of the following raw materials in parts by weight of 50g of deionized water, 30g of glycerol lubricant, 5g of castor oil polyoxyethylene ether thixotropic agent, 5g of fatty alcohol polyoxyethylene ether emulsion stabilizer, 5g of bactericide and 5g of defoamer.
The preparation method of the concentrated aqueous grinding aid is described in example 1.
The application method of the concentrated aqueous grinding aid for preparing the diamond grinding fluid comprises the following steps: 50g of diamond abrasive (granularity of 4.5 mu m) and 1000g of water are taken and evenly stirred and mixed, 50g of concentrated aqueous grinding aid is slowly added under the stirring condition, and after full stirring and dissolution, uniform diamond suspension is formed.
Example 6
The concentrated aqueous grinding aid consists of the following raw materials in parts by weight of 50g of deionized water, 25g of hydroxyethyl cellulose lubricant, 10g of castor oil polyoxyethylene ether thixotropic agent, 5g of fatty alcohol polyoxyethylene ether emulsion stabilizer, 5g of bactericide and 5g of defoamer.
The preparation method of the concentrated aqueous grinding aid is described in example 1.
The application method of the concentrated aqueous grinding aid for preparing the diamond grinding fluid comprises the following steps: taking 50g of diamond abrasive (with the granularity of 4.5 mu m) and 1000g of water, stirring and mixing uniformly, slowly adding 50g of concentrated aqueous grinding aid under the stirring condition, and stirring and dissolving fully to form uniform diamond suspension.
Comparative example 1
The diamond grinding fluid consists of the following raw materials in parts by weight: 50g of diamond abrasive (particle size 4.5 μm), 1000g of water. The preparation method comprises the following steps: and (3) taking 50g of diamond abrasive and 1000g of water, and stirring and mixing uniformly by ultrasonic to form the diamond grinding liquid.
FIG. 2 shows a 100-fold magnification of a diamond slurry prepared in comparative example 1; as can be seen in fig. 2: the grinding liquid without the grinding aid of the invention has uneven dispersion of abrasive particles and serious agglomeration.
Comparative example 2
Commercially available conventional W-4.5-MA type diamond grinding fluid.
Comparative example 3
The boron carbide grinding fluid consists of the following raw materials in parts by weight: 200g of boron carbide abrasive (granularity 5 μm), 1000g of water. The preparation method comprises the following steps: 200g of diamond abrasive and 1000g of water are taken and stirred evenly by ultrasonic agitation, and boron carbide grinding liquid is formed.
Comparative example 4
The grinding aid consists of the following raw materials in parts by weight: 60g of deionized water, 20g of propylene glycol lubricant, 10g of laurylamine polyoxyethylene ether emulsion stabilizer, 5g of bactericide and 5g of defoamer.
The preparation method of the grinding aid is described in example 1.
The application method of the diamond grinding liquid prepared by the grinding aid comprises the following steps: 50g of diamond abrasive (granularity of 4.5 mu m) and 1000g of water are taken and evenly stirred and mixed, 10g of concentrated aqueous grinding aid is slowly added under the stirring condition, and after full stirring and dissolution, uniform diamond suspension is formed.
Comparative example 5
The grinding aid consists of the following raw materials in parts by weight: 31g of deionized water, 30g of propylene glycol lubricant, 20g of hydrogenated castor oil thixotropic agent, 15g of laurylamine polyoxyethylene ether emulsion stabilizer, 2g of bactericide and 2g of defoamer.
The preparation method of the grinding aid is described in example 1.
The application method of the concentrated aqueous grinding aid for preparing the diamond grinding fluid comprises the following steps: taking 50g of diamond abrasive (with the granularity of 4.5 mu m) and 1000g of water, stirring and mixing uniformly, slowly adding 30g of concentrated aqueous grinding aid under the stirring condition, and stirring and dissolving fully to form uniform diamond suspension.
The 4-inch diameter silicon carbide substrate sheets were subjected to polishing processing using the diamond polishing liquids in examples 1 to 6 and comparative examples 1 to 5 above. A YM-18LX single-sided grinder was used, the pressure was 200g/cm2, the rotational speed was 45rpm, the flow rate of the diamond slurry was 5ml/min, and the grinding time was 30min. The efficiency detection is calculated by measuring thickness changes before and after grinding by using a ten-thousandth meter, the surface roughness is measured by using a roughness meter, and the scratch detection is observed under a naked eye strong light. The specific test results are shown in the following table:
table 1 comparative table of polishing application properties
As can be seen from table 1: the abrasive particles of the diamond grinding fluid prepared by the grinding aid of the invention are uniformly dispersed, the grinding efficiency is highest when the addition amount is 5%, the surface roughness is not more than 1.35 mu m/min, the surface roughness is not more than 0.013 mu m, the diamond grinding fluid is free from scratches, and the diamond grinding fluid is obviously superior to the commercial finished diamond grinding fluid in comparative example 2. When the grinding aid of the present invention was not added, the diamond slurry of comparative example 1 had uneven dispersion of abrasive, a removal efficiency of only 0.88 μm/min, and a surface roughness of 0.046 μm, and also had scratches. When the boron carbide abrasive described in comparative example 3 was used with water directly, the removal efficiency was only 0.75 μm/min, the surface roughness was 0.063 μm, and the level of processing was significantly lower than that of the diamond suspension formulated in the present invention. When the partial raw material of the present invention is not added or when the partial raw material is excessively added (as in comparative examples 4 and 5), the removal rate is significantly lowered, the surface roughness is increased, and scratches are generated, resulting in deterioration of the surface quality.
Figures 3 and 4 show 100 times of the images of the silicon carbide surface after grinding the grinding liquid of the example 3 and the comparative example 3 respectively. As can be seen from fig. 3 and 4: the diamond grinding fluid prepared by the grinding aid has uniform and consistent grains after the silicon carbide surface is ground, no scratch is generated, and the grinding fluid in comparative example 3 has disordered grinding grains and obvious scratch after the silicon carbide surface is ground.
To sum up, the concentrated aqueous polishing auxiliary formulation of the present invention is an organic whole, and exceeding the system results in poor polishing effect. Meanwhile, the data show that the concentrated aqueous grinding aid greatly reduces the cost of the existing finished product of the diamond grinding fluid directly, improves the grinding effect of directly using boron carbide and alumina powder to mix water, can obviously improve the grinding efficiency and the surface quality, and the addition amount of the concentrated aqueous grinding aid is preferably 3-5%.
Claims (4)
1. The use method of the concentrated aqueous grinding aid is characterized in that diamond abrasive materials and water are taken and stirred uniformly, the concentrated aqueous grinding aid accounting for 1-10wt% of the water mass is added under the stirring condition, and after stirring and dissolution, uniform diamond suspension is formed and is directly used for grinding silicon carbide and gallium nitride wafers;
The concentrated aqueous grinding aid consists of the following raw materials in parts by weight: 30-50 parts of deionized water, 5-10 parts of a composite thixotropic agent, 5-10 parts of an emulsion stabilizer, 20-30 parts of a lubricant, 1-5 parts of a bactericide and 1-5 parts of a defoaming agent;
The composite thixotropic agent is one or a mixture of more than two of hydrogenated castor oil, castor oil polyoxyethylene ether, water-based bentonite and nano silicon dioxide;
the emulsion stabilizer is one or a mixture of more than two of fatty amine polyoxyethylene ether, polyethylene glycol monomethyl ether, polypropylene glycol monomethyl ether and fatty alcohol polyoxyethylene ether;
the lubricant is one or a mixture of more than two of propylene glycol, glycerol, polyethylene glycol, hydroxyethyl cellulose and polyvinylpyrrolidone;
the bactericide is one or two of dodecyl benzyl ammonium chloride and dodecyl dimethyl benzyl ammonium bromide.
2. The method of claim 1, wherein the diamond abrasive is added in an amount of 1-10% by weight of water.
3. The method of using a concentrated aqueous grinding aid of claim 1, wherein the defoamer is a silicone defoamer.
4. The method for preparing the concentrated aqueous grinding aid according to claim 1, comprising the following steps: mixing the raw materials according to a certain proportion, uniformly mixing deionized water and a lubricant, adding a composite thixotropic agent and an emulsion stabilizer into the solution under the stirring condition, uniformly stirring to form emulsion, finally adding a bactericide and a defoaming agent, and uniformly stirring to obtain the product.
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101050339A (en) * | 2007-05-17 | 2007-10-10 | 中国地质大学（武汉） | Diamond polishing paste in high purity, and preparation method |
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| CN111548737A (en) * | 2020-06-04 | 2020-08-18 | 湖南圣高机械科技有限公司 | Diamond grinding fluid and preparation method thereof |
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| CN113621346A (en) * | 2021-07-29 | 2021-11-09 | 浙江奥首材料科技有限公司 | Suspension auxiliary agent applied to large-size silicon wafer grinding, preparation method and application thereof |
| CN114231251A (en) * | 2021-12-27 | 2022-03-25 | 河南联合精密材料股份有限公司 | Diamond grinding fluid for coarse grinding of silicon carbide wafer and preparation method thereof |
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2022
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| CN101050339A (en) * | 2007-05-17 | 2007-10-10 | 中国地质大学（武汉） | Diamond polishing paste in high purity, and preparation method |
| CN102268225A (en) * | 2011-05-30 | 2011-12-07 | 上海百兰朵电子科技有限公司 | Permanent-suspension diamond grinding liquid |
| CN104293205A (en) * | 2013-07-16 | 2015-01-21 | 鸿富锦精密工业（深圳）有限公司 | Water-based diamond polishing solution and preparation method thereof |
| CN103756573A (en) * | 2014-01-23 | 2014-04-30 | 上海百兰朵电子科技有限公司 | Low-scratch diamond grinding fluid |
| CN108219678A (en) * | 2016-12-21 | 2018-06-29 | 蓝思科技（长沙）有限公司 | A kind of diamond grinding fluid and preparation method thereof |
| CN111548737A (en) * | 2020-06-04 | 2020-08-18 | 湖南圣高机械科技有限公司 | Diamond grinding fluid and preparation method thereof |
| CN112592663A (en) * | 2020-12-22 | 2021-04-02 | 郑州磨料磨具磨削研究所有限公司 | Nano-diamond polishing solution for processing SiC substrate and preparation method thereof |
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| CN113621346A (en) * | 2021-07-29 | 2021-11-09 | 浙江奥首材料科技有限公司 | Suspension auxiliary agent applied to large-size silicon wafer grinding, preparation method and application thereof |
| CN114231251A (en) * | 2021-12-27 | 2022-03-25 | 河南联合精密材料股份有限公司 | Diamond grinding fluid for coarse grinding of silicon carbide wafer and preparation method thereof |
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| CN115926747A (en) | 2023-04-07 |
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