CN102268225A - Permanent-suspension diamond grinding liquid - Google Patents

Permanent-suspension diamond grinding liquid Download PDF

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Publication number
CN102268225A
CN102268225A CN2011101433482A CN201110143348A CN102268225A CN 102268225 A CN102268225 A CN 102268225A CN 2011101433482 A CN2011101433482 A CN 2011101433482A CN 201110143348 A CN201110143348 A CN 201110143348A CN 102268225 A CN102268225 A CN 102268225A
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CN
China
Prior art keywords
forever
suspends
diamond abrasive
abrasive liquid
diamond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2011101433482A
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Chinese (zh)
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CN102268225B (en
Inventor
朱孟奎
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SHANGHAI BAILANDUO ELECTRONIC TECHNOLOGY CO LTD
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SHANGHAI BAILANDUO ELECTRONIC TECHNOLOGY CO LTD
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Priority to CN201110143348.2A priority Critical patent/CN102268225B/en
Publication of CN102268225A publication Critical patent/CN102268225A/en
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Publication of CN102268225B publication Critical patent/CN102268225B/en
Expired - Fee Related legal-status Critical Current
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Abstract

The invention discloses a permanent-suspension diamond grinding liquid, which is characterized in that the liquid is prepared by mixing the following components according to the ratios: 80-90% of alkanes, 1-5% of dispersion thixotropic agents, 10% of surfactants, 1-3% of pH adjusting agents, 0.1-1% of diamond micropowder; the preparation method comprises the following steps: fully stirring and mixing the alkanes, the dispersion thixotropic agents, and the surfactants according to the ratios, adding diamond micropowder into the dissolved solution, performing ultrasonic dispersion, and adjusting the pH to be neutral by the pH adjusting agent. The invention is applicable to the grinding and polishing of LED chips, LED display screens, optical crystals, silicon wafers, compound crystals, liquid crystal panels, jewels, ceramics, germanium wafers, metal workpieces and the like, can maintain a uniform suspension state for a long time, and does not generate any phenomenon of precipitation, stratification, or failure.

Description

Diamond abrasive liquid forever suspends
Technical field
The present invention relates to a kind of lapping liquid, belong to the polishing technology field of chemical machinery, particularly a kind of diamond abrasive liquid that suspends forever.
Background technology
In semiconductor fabrication processes, initial semiconductor chip need polish, and polishing process adopts lapping liquid to carry out usually.The common composition of lapping liquid is diamond differential, aviation spirit, kerosene, transformer oil, each vegetable oil, animal oil and hydro carbons, being equipped with some emulsifier mix again makes, this lapping liquid can reach suspension in use, thereby reach the effect that abrasive material is suspended, but for the bigger abrasive material of particle, need the higher lapping liquid of suspension, above-mentioned lapping liquid normally suspends in use, promptly shake up before use, be in whipped state during use always, the wasting manpower and material resources, and not good for the macrobead suspension effect.
As Chinese patent application number is 02138718.4, and title is " uphanging buoyancy water-soluble anti-rust lapping liquid ", and its preparation method is had relatively high expectations to temperature and vacuum tightness, has improved cost.
For prior art, need a kind of lapping liquid that suspends forever on the market, after finishing, preparation can guarantee suspended state, reach a kind of " suspending forever " state, polishing effect is better in use can to make it, saves man-hour, increases work efficiency, and preserves conveniently.
Summary of the invention
For solving the problems of the technologies described above, the invention provides a kind of diamond abrasive liquid that suspends forever, preparation is finished and can be reached suspended state, and convenient the preservation need not during use to be in whipped state always, raises the efficiency, and reduces cost.
The present invention realizes by following technical scheme:
A kind of diamond abrasive liquid that suspends forever is that the material by following component and proportioning mixes:
Alkane 80~90%;
Disperse thixotropic agent 1~5%;
Tensio-active agent 10%;
PH regulator agent 1~3%;
Diamond differential 0.1~1%.
The optimal component and the proportioning of the described diamond abrasive liquid that suspends forever are:
Alkane 87%;
Disperse thixotropic agent 1%;
Tensio-active agent 10%;
PH regulator agent 1%;
Diamond differential 1%.
Described alkane is one or more mixtures in undecane, dodecane or the tridecane of straight chain.
Described dispersion thixotropic agent is one or more mixtures in polyvinyl alcohol, Vinyl Ether or the polyoxyethylene nonyl phenyl.
Described tensio-active agent is one or both mixtures in polyoxyethylene ethyl phenolic ether or epoxy third hydrocarbon.
Described pH regulator agent is a kind of in thanomin, trolamine, hydrochloric acid or the phosphoric acid.
Described diadust is that particle diameter is the diadust of 1~10 μ m.
Preparation technology of the present invention is: fully stir alkane, dispersion thixotropic agent, the tensio-active agent of aforementioned proportion fused, the diamond differential is added in the above-mentioned solution after fused, adopt ultra-sonic dispersion, ultra-sonic dispersion adopts 500 watts, jitter time is 10~20min, finish the back and transfers to neutrality, get final product to 6~8 with the pH regulator agent.
Beneficial effect of the present invention is:
Be used for led chip, LED display, the grinding and polishing of optical crystal, silicon chip, compound crystal, liquid crystal panel, jewel, pottery, germanium wafer, metal works etc.This lapping liquid can keep even suspended state for a long time, can not produce any precipitation, layering and failure phenomenon; This product is stable suspension forever, before using and in the use without any need for whipping appts can effectively guarantee the stable use of product simultaneously.
Embodiment
Below in conjunction with embodiment, the present invention will be further described.
Embodiment 1
The lapping liquid formulation selection:
Undecane 87%;
Disperse thixotropic agent (polyvinyl alcohol) 1%;
Tensio-active agent (polyoxyethylene ethyl phenolic ether) 10%;
PH regulator agent (mixture of thanomin and trolamine) 1%;
Diamond differential 1%.
Preparation method: fully stir alkane, dispersion thixotropic agent, the tensio-active agent of aforementioned proportion fused, with particle diameter is that the diamond differential of 1~10 μ m adds in the above-mentioned solution after fused, adopt ultra-sonic dispersion, ultra-sonic dispersion adopts 500 watts, jitter time is 10min, finishes the back and transfers pH to 7.8 with the mixture of thanomin and trolamine.
Use the above-mentioned polishing fluid for preparing on special glazing machine, to polish 2 inches 5 sapphire sheet, the polishing front surface is slightly released souls from purgatory about 0.05 μ m, polish pressure is 40 kilograms, the polishing disk rotating speed is 80rpm, the polishing fluid flow is 2ml/min, polishing time is 10min, and sapphire sheet surface, polishing back is slightly released souls from purgatory and become 0.008 μ m.Glazed surface does not have obvious cut, and polishing speed is 2.2 μ m/min.
Embodiment 2
The lapping liquid formulation selection:
Dodecane 85%;
Disperse thixotropic agent (polyoxyethylene nonyl phenyl) 3%;
Tensio-active agent (propylene oxide) 10%;
PH regulator agent (hydrochloric acid) 2%;
Diamond differential 1%.
Preparation method: fully stir alkane, dispersion thixotropic agent, the tensio-active agent of aforementioned proportion fused, with particle diameter is that the diamond differential of 1~10 μ m adds in the above-mentioned solution after fused, adopt ultra-sonic dispersion, ultra-sonic dispersion adopts 500 watts, jitter time is 15min, finishes the back and transfers pH to 6.8 with the mixture of thanomin and trolamine.
Use the above-mentioned polishing fluid for preparing on special glazing machine, to polish 2 inches 5 sapphire sheet, the polishing front surface is slightly released souls from purgatory about 0.05 μ m, polish pressure is 40 kilograms, the polishing disk rotating speed is 80rpm, the polishing fluid flow is 2ml/min, polishing time is 10min, and sapphire sheet surface, polishing back is slightly released souls from purgatory and become 0.009 μ m.Glazed surface does not have obvious cut, and polishing speed is 2.6 μ m/min.
Embodiment 3
The lapping liquid formulation selection:
Tridecane 82%;
Disperse thixotropic agent (Vinyl Ether and polyoxyethylene nonyl phenyl mixture) 5%;
Tensio-active agent (propylene oxide) 10%;
PH regulator agent (phosphoric acid and ethanolamine mixtures) 2%;
Diamond differential 1%.
Preparation method: fully stir alkane, dispersion thixotropic agent, the tensio-active agent of aforementioned proportion fused, with particle diameter is that the diamond differential of 1~10 μ m adds in the above-mentioned solution after fused, adopt ultra-sonic dispersion, ultra-sonic dispersion adopts 500 watts, jitter time is 20min, finishes the back and transfers pH to 7.2 with the mixture of thanomin and trolamine.
Use the above-mentioned polishing fluid for preparing on special glazing machine, to polish 2 inches 5 sapphire sheet, the polishing front surface is slightly released souls from purgatory about 0.05 μ m, polish pressure is 40 kilograms, the polishing disk rotating speed is 80rpm, the polishing fluid flow is 2ml/min, polishing time is 10min, and sapphire sheet surface, polishing back is slightly released souls from purgatory and become 0.008 μ m.Glazed surface does not have obvious cut, and polishing speed is 1.8 μ m/min.

Claims (7)

1. diamond abrasive liquid that suspends forever is characterized in that it being that material by following component and proportioning mixes:
Alkane 80~90%;
Disperse thixotropic agent 1~5%;
Tensio-active agent 10%;
PH regulator agent 1~3%;
Diamond differential 0.1~1%.
2. the diamond abrasive liquid that suspends forever as claimed in claim 1 is characterized in that the optimal component of the described diamond abrasive liquid that suspends forever and proportioning are:
Alkane 87%;
Disperse thixotropic agent 1%;
Tensio-active agent 10%;
PH regulator agent 1%;
Diamond differential 1%.
3. the diamond abrasive liquid that suspends forever as claimed in claim 1 is characterized in that described alkane is one or more mixtures in undecane, dodecane or the tridecane of straight chain.
4. the diamond abrasive liquid that suspends forever as claimed in claim 1 is characterized in that described dispersion thixotropic agent is one or more mixtures in polyvinyl alcohol, Vinyl Ether or the polyoxyethylene nonyl phenyl.
5. the diamond abrasive liquid that suspends forever as claimed in claim 1 is characterized in that described tensio-active agent is one or both mixtures in polyoxyethylene ethyl phenolic ether or epoxy third hydrocarbon.
6. the diamond abrasive liquid that suspends forever as claimed in claim 1 is characterized in that described pH regulator agent is a kind of in thanomin, trolamine, hydrochloric acid or the phosphoric acid.
7. the diamond abrasive liquid that suspends forever as claimed in claim 1 is characterized in that described diadust is that particle diameter is the diadust of 1~10 μ m.
CN201110143348.2A 2011-05-30 2011-05-30 Permanent-suspension diamond grinding liquid Expired - Fee Related CN102268225B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110143348.2A CN102268225B (en) 2011-05-30 2011-05-30 Permanent-suspension diamond grinding liquid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110143348.2A CN102268225B (en) 2011-05-30 2011-05-30 Permanent-suspension diamond grinding liquid

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CN102268225A true CN102268225A (en) 2011-12-07
CN102268225B CN102268225B (en) 2014-03-26

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102690606A (en) * 2012-05-10 2012-09-26 宁波晨阳光电科技有限公司 Polishing agent used for optical fiber ferrule
CN103756573A (en) * 2014-01-23 2014-04-30 上海百兰朵电子科技有限公司 Low-scratch diamond grinding fluid
CN105273638A (en) * 2015-10-14 2016-01-27 盐城工学院 Anti-cleavage suspended grinding fluid for gallium oxide wafer and preparation method thereof
CN107438647A (en) * 2015-04-13 2017-12-05 嘉柏微电子材料股份公司 The slurry based on diamond of speed and surface roughness is removed with improved sapphire
CN109648404A (en) * 2017-10-11 2019-04-19 蓝思科技(长沙)有限公司 A kind of rough polishing light technology of ceramic product
CN114686171A (en) * 2022-05-19 2022-07-01 中国振华集团云科电子有限公司 Suspensible diamond grinding fluid and preparation process thereof
CN115926747A (en) * 2022-12-08 2023-04-07 郑州磨料磨具磨削研究所有限公司 Concentrated aqueous grinding aid and preparation method thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6270393B1 (en) * 1998-10-05 2001-08-07 Tdk Corporation Abrasive slurry and preparation process thereof
WO2002081123A2 (en) * 2001-04-04 2002-10-17 Vesuvius Crucible Company Improved regulation of a stream of molten metal
US20040152309A1 (en) * 2003-02-03 2004-08-05 Cabot Microelectronics Corporation Method of polishing a silicon-containing dielectric
CN1560161A (en) * 2004-03-01 2005-01-05 长沙矿冶研究院 Water-based nano diamond polishing solution and preparation method thereof
CN1651544A (en) * 2005-01-07 2005-08-10 清华大学 Grinding liquid used for grinding back surface of storage hard disk magnetic head
WO2007111813A2 (en) * 2006-03-23 2007-10-04 Cabot Microelectronics Corporation Iodate-containing chemical-mechanical polishing compositions and methods
CN101831243A (en) * 2010-04-30 2010-09-15 中国计量学院 High-precision non-water-based nano-diamond grinding fluid and preparation method and application thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6270393B1 (en) * 1998-10-05 2001-08-07 Tdk Corporation Abrasive slurry and preparation process thereof
WO2002081123A2 (en) * 2001-04-04 2002-10-17 Vesuvius Crucible Company Improved regulation of a stream of molten metal
US20040152309A1 (en) * 2003-02-03 2004-08-05 Cabot Microelectronics Corporation Method of polishing a silicon-containing dielectric
CN1560161A (en) * 2004-03-01 2005-01-05 长沙矿冶研究院 Water-based nano diamond polishing solution and preparation method thereof
CN1651544A (en) * 2005-01-07 2005-08-10 清华大学 Grinding liquid used for grinding back surface of storage hard disk magnetic head
WO2007111813A2 (en) * 2006-03-23 2007-10-04 Cabot Microelectronics Corporation Iodate-containing chemical-mechanical polishing compositions and methods
CN101831243A (en) * 2010-04-30 2010-09-15 中国计量学院 High-precision non-water-based nano-diamond grinding fluid and preparation method and application thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102690606A (en) * 2012-05-10 2012-09-26 宁波晨阳光电科技有限公司 Polishing agent used for optical fiber ferrule
CN103756573A (en) * 2014-01-23 2014-04-30 上海百兰朵电子科技有限公司 Low-scratch diamond grinding fluid
CN107438647A (en) * 2015-04-13 2017-12-05 嘉柏微电子材料股份公司 The slurry based on diamond of speed and surface roughness is removed with improved sapphire
CN105273638A (en) * 2015-10-14 2016-01-27 盐城工学院 Anti-cleavage suspended grinding fluid for gallium oxide wafer and preparation method thereof
CN109648404A (en) * 2017-10-11 2019-04-19 蓝思科技(长沙)有限公司 A kind of rough polishing light technology of ceramic product
CN114686171A (en) * 2022-05-19 2022-07-01 中国振华集团云科电子有限公司 Suspensible diamond grinding fluid and preparation process thereof
CN115926747A (en) * 2022-12-08 2023-04-07 郑州磨料磨具磨削研究所有限公司 Concentrated aqueous grinding aid and preparation method thereof

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