CN109648404A - A kind of rough polishing light technology of ceramic product - Google Patents
A kind of rough polishing light technology of ceramic product Download PDFInfo
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- CN109648404A CN109648404A CN201710942166.9A CN201710942166A CN109648404A CN 109648404 A CN109648404 A CN 109648404A CN 201710942166 A CN201710942166 A CN 201710942166A CN 109648404 A CN109648404 A CN 109648404A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The present invention provides a kind of rough polishing light technology of ceramic product, this technique uses Twp-sided polishing machine, is placed on lower polishing disk including at least by ceramic product clamping, the surface mount of upper and lower polishing disk has the polyurethane abrasive pad of oxidation-containing cerium；Polishing disk is displaced downwardly to the upper and lower surfaces for being close to ceramic product with lower polishing disk in control；It controls upper and lower polishing disk to rotate backward, while injecting polycrystalline diamond liquid；Ceramic product upper and lower surfaces are polished simultaneously by grinding pad.Product after present invention process rough polishing does not have copper dish print, and TTV 2-3um, subsequent needs 45min to throw with regard to achievable essence；Processing place to go rate can achieve 2um/min, opposite two times of copper dish improved efficiency；It only need to directly be put in common amendment wheel when repairing disk polyurethane abrasive pad is modified using technique of the invention simultaneously, this is repaired the common worker of disk technique and can operate, convenient and simple, and repairs the disk time and only need 3-5 minutes.
Description
Technical field
The present invention relates to ceramic product polishing technology fields, particularly, are related to a kind of rough polishing light technology of ceramic product.
Background technique
There are many excellent properties for zirconia material, especially have the function of toughening, thus by extensive as toughness pottery
Using, it has the characteristics that high tenacity, high anti-intensity, high hardness and wearability, more show the popularity of application, it
The industries such as machinery, electronics, petroleum, chemical industry, space flight, weaving, fine measuring instrument, precision machine tool, bioengineering and medical instrument
Have a wide range of applications, also become increasingly popular for smart phone rear cover, Watchcase, with 5G mobile phone at hand and
Charging technique is gradually popularized, and metal fuselage is just gradually being replaced by nonmetallic fuselage because of signal shielding problem.Compared to metal and glass
Material, ceramic material have strong outstanding appearance, exquisite in texture, hardness height, wear-resisting scratch-resisting, electroceramics shielding and heat dissipation performance excellent
The application advantage of the features such as different, ceramic casing highlight, and but failing on a large scale high-volume main cause is at high cost, production capacity deficiency.
It is the technique using two-sided copper dish rough polishing to zirconia ceramics hand-set lid rough polishing light technology at present, but using double
The product of face copper dish polishing has the disadvantage that: product surface has very deep copper dish print, product TTV difference in 5um or more, essence
Throwing need to throw 120min could jettisoning；The removal rate of copper dish is 0.67um/min, and one disk workpiece of processing needs 1h；Copper dish are using 3-
It needs to repair disk after 5 days, need to repair disk technology personnel with tool special and profession could operate, and repair primary disk, and upper disk needs 4 hours, under
Disk needs 4 hours, needs cleaning copper powder after repairing disk and disk of polishing, the time of cost are very long；It is easy that copper dish are expanded with heat and contract with cold in processing
Deformation, the product flatness made is unstable, undesirable to the efficiency, cost and quality of rough polishing.
Therefore, in order to meet the demand for development of ceramic product, the rough polishing light technology of ceramic product is needed to be improved to obtain height
The surface of flatness, high brightness, reduce rough polishing product big face is generated trace, became uneven situations such as so that polish production
Product flatness is good, brightness is high and polishing efficiency is high, at low cost.
Summary of the invention
Present invention aims at a kind of rough polishing light technologies of ceramic product, to solve to use terrine rough polishing pair in the prior art
Surface of ceramic products generates trace, became uneven and inefficient, the at high cost technical problem of rough polishing.
To achieve the above object, the rough polishing light technology of a kind of ceramic product of the invention, the rough polishing light technology is two-sided
It completes, at least includes the following steps on polishing machine:
Step A, ceramic product clamping is placed on the lower polishing disk of Twp-sided polishing machine, the Twp-sided polishing machine it is upper,
The surface mount of lower polishing disk has grinding pad for polishing to surface of ceramic products, and the grinding pad is using oxidation-containing cerium
Polyurethane abrasive pad；
Step B, it controls upper polishing disk and is displaced downwardly to the upper and lower surfaces for being close to ceramic product with lower polishing disk；
Step C, it controls upper and lower polishing disk to rotate backward, while injecting polycrystalline diamond liquid；By polyurethane abrasive pad to pottery
Porcelain products upper and lower surfaces polish simultaneously.
Polycrystalline diamond rough surface effectively improves grinding efficiency there are a large amount of contact points between workpiece in process of lapping；It is more
Brilliant diamond has self-sharpening, can keep high removal rates；Monocrystalline diamond is compared, polycrystalline diamond can utmostly reduce abnormal draw
Wound.The hardness of the polyurethane abrasive pad of oxidation-containing cerium is bigger, and cooperation polycrystalline diamond liquid can greatly promote grinding efficiency, simultaneously
Also add the wear-resisting property of polycrystalline diamond liquid.Class polycrystalline diamond belongs to one of polycrystalline diamond, because of such polycrystalline diamond liquid
It is equally applicable to technique of the invention.
Particularly, the hardness of the polyurethane abrasive pad be not less than 97A, and in the polyurethane abrasive pad cerium oxide matter
Amount percentage is no less than 60%.
Particularly, the partial size of polycrystalline diamond micro mist is not less than 18um in the polycrystalline diamond liquid.
Particularly, 200g/cm is not less than to the pressure of upper disk pressurization in step C2, the revolving speed of upper disk be greater than 0 to
15rpm, lower disk rotating speed are 10rpm-45rpm, and the flow velocity of polycrystalline diamond liquid is 10ml/min-55ml/min.
Particularly, the pressure of upper disk is specially by 30g/cm in the step C2Gradually it is incremented by below and is depressed into 200g/cm2-
300g/cm2, lower disk rotating speed is gradually incremented by by 10rpm or less.
It particularly, further include the mistake modified to grinding pad before the polished ceramic product of step A clamping
Journey, the finishing include being modified using the planar disc amendment wheel containing bronze and diamond to grinding pad, top and bottom when finishing
Smooth amendment wheel is put into up and down between polishing disk, and when finishing is forced into 200g/cm to upper polishing disk2-600g/cm2, and control
The revolving speed of polishing disk is 15rpm-30rpm in system.
Particularly, also include the steps that modifying grinding pad after step c, so that the surface smoothness of grinding pad
Reach the requirement of polishing.
Particularly, the partial size of diamond is 800-1000 mesh in the amendment wheel, and repairing the disk time is 15min-30min.
Particularly, the polishing disk uses spheroidal graphite cast-iron disk.Spheroidal graphite cast-iron disk is not easy to generate heat during the polishing process, Bu Huiying
Ring pasting between grinding pad and polishing disk disk.
Particularly, temperature is controlled less than 45 DEG C in the step C.
The present invention at least has the advantages that
1, present invention process carries out rough polishing using polyurethane abrasive pad, and the product after rough polishing does not have copper dish print, and TTV is (thick
Spend variable quantity) be 2-3um, therefore subsequent need 45 minutes or so just achievable essence throw.
2, it is not easy to generate heat compared to polishing disk due to polyurethane abrasive pad, when polishing, the pressure of upper disk is using poly-
Urethane grinding pad is polished than using the pressure of polishing disk bigger and can choose more large-sized polycrystalline diamond liquid, therefore
2um/min can achieve using polyurethane abrasive pad rough polishing processing place to go rate, opposite two times of copper dish improved efficiency.
3, it only need to directly be put in common amendment wheel when repairing disk using technique of the invention and polyurethane is ground
Mill pad is modified, this is repaired the common worker of disk technique and can operate, convenient and simple, and is repaired the disk time and only needed 3-5 minutes.
4, present invention process carries out rough polishing using polyurethane abrasive pad, since grinding pad comparison polishing disk itself is with certain
Resiliency, therefore, the deflection of product is small when polishing, quality and precision after improving product polishing.
5, main component is used to carry out rough polishing for the polyurethane abrasive pad of cerium oxide in present invention process, certainly due to cerium oxide
The characteristic of body, can be improved polishing speed, while the polyurethane abrasive pad of oxidation-containing cerium and polycrystalline diamond liquid are used cooperatively, can
To increase the wear-resisting property of polycrystalline diamond liquid, so as to reach bigger removal amount when using the Liquid diamond of same amount.
6, rough polishing is carried out to ceramic product using present invention process, overcomes the technology that grinding pad is not suitable for ceramic rough polishing
Prejudice makes process simplification, has saved the time, improves efficiency and final product quality is high.
Other than objects, features and advantages described above, there are also other objects, features and advantages by the present invention.
Below with reference to embodiment, the present invention is described in further detail.
Specific embodiment
The embodiment of the present invention is described in detail with reference to embodiments, but the present invention can be according to claim
It limits and the multitude of different ways of covering is implemented.
Embodiment 1
A kind of two-sided rough polishing light technology of zirconia ceramics cover board, using the twin grinder of model 13Bor16B,
Middle polishing disk uses spheroidal graphite cast-iron disk, and grinding pad uses high density, the biggish polyurethane abrasive pad of hardness, and wherein the polyurethane is ground
The mass percent of cerium oxide is no less than 60% in mill pad, and hardness is not less than 97A, and polishing fluid uses polycrystalline diamond liquid, and polycrystalline
Polycrystalline diamond grain size of micropowder is 18um in Liquid diamond, is included the following steps:
Step 1: lagging.
Preparation before lagging: it is cleaned using acetone or isopropanol and scrapes the residue glue on polishing disk with blade, finally
Use non-dust cloth wiped clean.The disk of grinder if excessively coarse using No. 1000 lapped faces of sand paper after reuse, it is no
Then influence gum firmness；Ensure disk flatness, cannot there is a breakage, disk and its edge cannot jagged and pit, otherwise
It will lead to polishing fluid and penetrate into glue back from edge；Disk burr position needs to be polished with oilstone；Disk has to thoroughly clean up,
There cannot be the impurity such as residue glue, aqueous vapor, grease stain and dust, otherwise will lead to gum and paste loosely；And for being possible to band in equipment
The dust, crystal and liquid etc. for entering mill, clean out, lagging are avoided to bring into gum, in advance as far as possible in lagging
When have to first will polishing liquid pipe remove, and will polishing liquid pipe drying, otherwise liquid can flow into gum.
Patch lower wall: confirmation polishing disk disk is thoroughly clean and keeps drying, and grinding pad back bakelized paper is torn and is taken off
One fritter of paper, grinding pad are laid in lower wall and check whether inner circle has been accurately positioned, and confirm that no bubble exists and disk and back
Between glue, gummed paper is then opened on one side, grinding pad is smoothed with hand on one side and pastes in disk, while true with pole rolling grinding pad
It protects gum and tentatively pastes jail with mill, and there is no bubble between confirmation, if the method using rolling still cannot remove bubble removing,
Needle need to be used to puncture bubble, then gas is driven out of using rolling stick simultaneously, goes through mill skin after stickup again
Whether everywhere has bubble (protruding point).
It sticks disk: grinding pad gum being laid on lower wall upwardly and tears whole back bakelized papers, check that inner circle is accurately positioned, drop
Upper disk makes grinding pad be affixed on disk and applies board maximum pressure holding 120min, and it is true to roll grinding pad for disk pole in rise
Protecting between gum and mill does not have bubble (operating method is identical as patch lower wall), it is ensured that do not have bubble (behaviour between gum and mill
It is identical as patch lower wall to make method).
After having pasted polyurethane abrasive pad, the disk flatness control of the polishing disk is less than 10um.
Step 2: pressure skin.
After upper and lower grinding pad is all posted, bubble is checked out, then can start to carry out weight with equipment opposite grinding skin.
In order to avoid in the enclosing and place of groove has no idea to overwhelm, use the sponge of a 10mm thickness as intermediary,
It is clipped among upper lower burrs, can play the role of passing to pressure, so that inner ring and polishing fluid apertures also can be overwhelmed sufficiently.
Press skin during, in drop disk and apply board maximum pressure holding 120min.
Step 3: upper polishing disk opens polishing fluid apertures and finishing grinding pad edge.
It is sealed off, and is cut along the place of aperture using 30 degree of acute angle cutters more by fluid apertures is polished using electric iron
Remaining grinding pad, while disk inside and outside circle redundance being cropped, the grinding pad for polishing plate edge up and down is cut using 45 degree of angles
Cutter.
30 degree of acute angle knife roundings must be used by polishing the mill skin at fluid apertures, grinding pad residual avoided, to hinder to polish
The phenomenon that liquid stream goes out, while preventing constantly washing away due to Liquid diamond, and Liquid diamond enters gum, eventually leads to degumming.It is to be confirmed
After the completion of polishing fluid apertures whole cutting, falls disk and apply board maximum pressure holding 60min.
Step 4: grinding pad is modified.
Make 4 mark lines in upper and lower grinding pad respectively using permanent pen, the mark line divides grinding pad equally, using containing
Bronze and granularity be 800 mesh diamond sintering amendment wheel, by the smooth amendment wheel in top and bottom be put into up and down polishing disk it
Between, 400g/cm is forced into upper polishing disk when repairing disk2, and the revolving speed for controlling upper polishing disk is 30rpm.
New grinding pad is modified 20 minutes for the first time since uneven place is more, observes the abrasion condition of mark line
To judge grinding pad, whether reconditioning is smooth, and mark line even wearing then represents grinding pad, and repeated reconditioning is smooth, if some ground
Side is not worn, then continues to repeat 10min, until finishing is completed.Finishing front and back is both needed to use hairbrush that grinding pad is clean, keeps away
Exempt from polishing fluid crystallization and other impurities remain in grinding pad and polishing fluid pipeline.
Step 5: polishing.
Basic step are as follows: after the completion of polyurethane abrasive pad finishing, ceramic product clamping is placed on Twp-sided polishing machine
On lower polishing disk；Polishing disk is displaced downwardly to the upper and lower surfaces for being close to ceramic product with lower polishing disk in control；The upper and lower polishing of control
Disk rotates backward, while injecting polycrystalline diamond liquid；Ceramic product upper and lower surfaces are polished simultaneously by polyurethane abrasive pad.
In polishing, the speed of adjustment flow type peristaltic pump is 25ml/min-45ml/min, i.e., injects in polishing more
The flow velocity of brilliant Liquid diamond is 25ml/min-45ml/min, and the polishing fluid inner diameter of polishing fluid bottle to intake chute is 2mm, outer diameter
For 4mm, the polishing fluid hose uses transparent silicon sebific duct.Since the distance of polishing fluid bottle to intake chute is intake chute to polishing disk
Three times of distance of fluid apertures are polished in disk, if therefore polishing fluid hose size it is too big, be not easy to seal, will cause into empty
Gas makes polishing fluid stop, while the too thick flow for being also difficult to control polishing fluid of polishing fluid hose.
And the width of intake chute and depth are changed it is small, be changed on slot along width be 20mm, groove bottom width 5mm, groove depth
Degree is 10mm, polish on intake chute to disk the perfusion tube between fluid apertures the use of internal diameter is 4mm, the transparent silica gel that outer diameter is 6mm
Hose, the catheter that the perfusion tube between fluid apertures needs size slightly larger is polished on intake chute to disk is rapidly injected polishing fluid
Mill.The two sides installation scraper plate of intake chute prevents polishing fluid heavy fixed and polishing fluid is facilitated quickly to flow, and disk polishes fluid apertures and silicon
Glue hose leakproofness will be got well, and the blender in polishing fluid bottle will be opened, so that Liquid diamond keeps suspension, polishing fluid will not led
Liquid bath precipitating, can flow into rapidly mill.
200g/cm is not less than to the pressure of upper disk pressurization during the polishing process2, the revolving speed of upper disk is greater than 0 to 15rpm,
Lower disk rotating speed is 10rpm-45rpm.
In specific implementation, by the pressure of upper disk by 30g/cm2It is gradually incremented to 200-300g/cm below2, lower disk rotating speed
It is gradually to be incremented by by 10rpm or less, upper disk rotating speed is also gradually to be incremented by by static, and pressure, revolving speed after polishing is waited to advise again by front
Rule is successively decreased back, plays a buffering repair to product in this way.
During the polishing process, diamond flow quantity first uses low discharge 25ml/min, if it find that removal rate is not enough or brilliant
Piece surface grinding trace then tunes up flow to 45ml/min than heavier.
Present invention process polishing disk temperature must be controlled at 45 DEG C hereinafter, can cause polyurethane polishing pad heat expansion more than 45 DEG C
Shrinkage and the flatness for influencing product.
During polishing, the number of teeth and modulus of erratic star wheel will be with board centre tooth and the ratcheting matching of outer gear ring, You Xin
Wheel should cannot have tilting image that should check after being put into lower wall there are certain ratcheting space, the high revolving speed of ratcheting tension polishing process
A possibility that erratic star wheel being made to shake in disk, frying machine, is big, and workpiece hole location should expose polishing disk inner circle and outer circle 2mm, not
In place under the premise of influence erratic star wheel intensity to open polishing fluid apertures, workpiece surface can have sufficient polishing when guaranteeing grinding
Liquid contact.
After polishing 4-5 disk, in order to cool and keep grinding pad flatness need to grinding pad be cleaned and be modified,
Disk parameter is repaired with the 4th step.At this point, the cutting output of grinding is opposite since grinding pad has already passed through the grinding between ceramic product
It is lined with reduction in the grinding newly pasted, therefore repair the disk time only to need 3-5min.
In the present embodiment, polishing time 20min, the TTV of product is 2-3um after the completion of polishing.
Comparative example 1
A kind of two-sided rough polishing light technology of zirconia ceramics product, using the twin grinder of model 13Bor16B,
Middle polishing disk uses copper dish, includes the following steps:
Product is placed in erratic star wheel an actor's rendering of an operatic tune of grinder, the gear teeth on erratic star wheel respectively with the gear ring of twin grinder
It is engaged with sun gear, and is passed through Liquid diamond to ceramic product upper and lower surface during the polishing process, the partial size of the Liquid diamond is 2-
3um。
It is during the polishing process 150g/cm to the pressure of upper disk pressurization2-250g/cm2, the revolving speed of upper disk be greater than 0 to
20rpm, lower disk rotating speed are 20rpm-45rpm.
By the pressure of upper disk by 30g/cm2It is gradually incremented to 150g/cm below2-250g/cm2, lower disk rotating speed be also by
20rpm or less is gradually incremented to target value, and upper disk rotating speed is also gradually to be incremented to target value by static, waits pressure after polishing, turns
Speed is successively decreased back by front rule again.
This comparative example technique polishing disk pressure cannot generate greatly very much scratch to prevent harder due to copper dish or destroy product；
The partial size of Liquid diamond can not be too big in this comparative example technique, if partial size too great Yi causes copper dish to be generated heat, to influence to polish matter
Amount.
Copper dish need to repair disk after using 3-5 days, and the reparation of copper dish need to repair disk technology personnel with tool special and profession, and repair
Primary disk, upper disk need 4h, and lower wall needs 4h, need cleaning copper powder and disk of polishing after repairing disk.
In this comparative example, polishing time 60min, the TTV of product is 5um or more, and product surface after the completion of polishing
There is very deep copper dish print.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of rough polishing light technology of ceramic product, which is characterized in that the rough polishing light technology is completed on Twp-sided polishing machine, until
Less the following steps are included:
Step A, ceramic product clamping is placed on the lower polishing disk of Twp-sided polishing machine, the upper and lower throwing of the Twp-sided polishing machine
The surface mount of CD has grinding pad for polishing to surface of ceramic products, and the grinding pad uses the poly- ammonia of oxidation-containing cerium
Ester grinding pad；
Step B, it controls upper polishing disk and is displaced downwardly to the upper and lower surfaces for being close to ceramic product with lower polishing disk；
Step C, it controls upper and lower polishing disk to rotate backward, while injecting polycrystalline diamond liquid；Ceramics are produced by polyurethane abrasive pad
Product upper and lower surfaces polish simultaneously.
2. a kind of rough polishing light technology of ceramic product according to claim 1, which is characterized in that the polyurethane abrasive pad
Hardness be not less than 97A, and the mass percent of cerium oxide is no less than 60% in the polyurethane abrasive pad.
3. a kind of rough polishing light technology of ceramic product according to claim 1, which is characterized in that in the polycrystalline diamond liquid
The partial size of polycrystalline diamond micro mist is not less than 18um.
4. a kind of rough polishing light technology of ceramic product according to claim 1, which is characterized in that add in step C to upper disk
The pressure of pressure is not less than 200g/cm2, the revolving speed of upper disk is greater than 0 to 15rpm, and lower disk rotating speed is 10rpm-45rpm, and polycrystalline bores
The flow velocity of stone liquid is 10ml/min-55ml/min.
5. a kind of rough polishing light technology of ceramic product according to claim 4, which is characterized in that upper disk in the step C
Pressure be specially by 30g/cm2It is gradually incremented to 200g/cm below2-300g/cm2, lower disk rotating speed gradually passed by 10rpm or less
Increase.
6. a kind of rough polishing light technology of ceramic product according to claim 1, which is characterized in that in the step A clamping
It further include the process modified to grinding pad before polished ceramic product, the finishing includes using containing bronze and Jin Gang
The planar disc amendment wheel of stone modifies grinding pad, when finishing the smooth amendment wheel in top and bottom be put into up and down polishing disk it
Between, when finishing, is forced into 200g/cm to upper polishing disk2-600g/cm2, and the revolving speed for controlling upper polishing disk is 15rpm-30rpm.
7. a kind of rough polishing light technology of ceramic product according to claim 6, which is characterized in that after the step C
Also include the steps that modifying grinding pad.
8. a kind of rough polishing light technology of ceramic product according to claim 6, which is characterized in that Buddha's warrior attendant in the amendment wheel
The granularity of stone is 800-1000 mesh, and repairing the disk time is 15min-30min.
9. a kind of rough polishing light technology of ceramic product according to claim 1, which is characterized in that the polishing disk uses ball
Black cast iron plate.
10. a kind of rough polishing light technology of ceramic product according to claim 1, which is characterized in that in the step C medium temperature
Degree control is less than 45 DEG C.
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| CN112643516A (en) * | 2020-12-15 | 2021-04-13 | 蓝思科技（长沙）有限公司 | Polishing method for concave surface of inverted product |
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| CN112643516A (en) * | 2020-12-15 | 2021-04-13 | 蓝思科技（长沙）有限公司 | Polishing method for concave surface of inverted product |
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